JP3404682B2 - Photo solder resist mask alignment method - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for aligning a photo solder resist mask in a printed wiring board manufacturing process. 2. Description of the Related Art Conventionally, the alignment accuracy between a printed wiring board 1 and a printing mask 2 in a photo solder resist mask alignment operation in a printed wiring board manufacturing process has been confirmed at an arbitrary position on the printed wiring board 1. After aligning a reference hole (not shown) formed in the reference hole with a reference pin (not shown) inserted in a reference hole (not shown) formed in an arbitrary position on the baking mask 2, the baking mask is used. 2 Visually from above FIG.
As shown in (2), a portion where the emulsion corresponding to that position on the printing mask 2 with the through-hole land 3 at an arbitrary position on the printed wiring board 1 is hardened and remains black (hereinafter referred to as clearance 4) ). However, in this method, when the positional accuracy is visually checked from above the baking mask 2, the diameter of the through-hole land 3 on the printed wiring board 1 is small, and it is difficult to determine the deviation. In 11 (2), the diameter of the clearance 4 on the baking mask 2 is equal to or larger than the diameter of the through-hole land 3 on the printed wiring board 1. There are drawbacks such as not being able to confirm that they are aligned. Therefore, as shown in FIG. 12, after the photo solder resist is developed, the printed wiring board 1 is formed by using the through-hole land 3 and the clearance 4 on the printed wiring board 1.
It is determined that the positioning of the printing mask 2 is properly performed. However, in the above-mentioned conventional example, the diameter of the clearance 4 on the printing mask 2 is larger than the diameter of the through-hole land 3 on the printed wiring board 1. When the clearance 4 is matched with the through-hole land 3 on the printed wiring board 1 from above the baking mask 2, it becomes invisible as shown in FIG. [0008] Therefore, as shown in FIG. 13 (2), the value varies between the diameter of the through hole land 3 on the printed wiring board 1 and the diameter of the clearance 4 on the printing mask 2. Further, it is difficult and almost impossible to confirm the positional accuracy required for a high-density printed wiring board by visual observation based on the diameter of the through-hole land 3 on the printed wiring board 1. SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned drawbacks, and provides a method for aligning a photo solder resist mask on a printed wiring board so that the alignment accuracy between the printed wiring board and a printing mask can be confirmed and corrected before exposure work. It is intended to do so. [0008] To achieve the above object, according to an aspect of the present invention is provided with a wiring board-side position accuracy check mark at any position on the printed circuit board, prior to the baking mask <br/> SL is provided a mask-side position accuracy check mark corresponding to the position of the wiring board-side position accuracy check mark, in performing the printed wiring board and the alignment accuracy of the check and correction of baking mask, the wiring board photo solder Regis aligning and said the side position accuracy check mark mask-side position accuracy check mark
The mask-side position accuracy
Mark on the wiring board side position accuracy confirmation mark
It is characterized in that the shape when the shapes are matched is a caliper scale . With this method, the position accuracy confirmation mark on the wiring board side on the printed wiring board is aligned with the position accuracy confirmation mark on the mask side on the printing mask, so that the positions of the printed wiring board and the printing mask can be adjusted. The alignment accuracy can be checked and corrected before the exposure work, which leads to the improvement of the alignment accuracy between the printed wiring board and the baking mask in the work of aligning the photo solder resist mask and the correction, and prevents the occurrence of defective products such as misprinting. Can be. An embodiment of the present invention will be described below in detail with reference to the drawings shown in FIGS. In addition, in the following drawings, the same as those in FIGS.
Or, corresponding portions are denoted by the same reference numerals. In the drawings, reference numeral 1 denotes a printed wiring board, 2 denotes a printing mask, 5 denotes a mark (copper foil) on the printed wiring board 1 on the wiring board side, and 6 denotes a mask-side positional accuracy on the printing mask 2. Mark (light-shielding portion, transmitting portion). As shown in FIGS. 2A and 2B, the mask-side position accuracy confirmation mark 6 provided on the printing mask 2 is
There are types, and the mask-side position accuracy confirmation mark 6 shown in (1)
Are for the horizontal direction, and the mask-side position accuracy confirmation mark 6 shown in (2) is for the vertical direction. The shape of the mask-side position accuracy confirmation mark 6 is comb-shaped, and the hatched portion is
The other portion is a light transmitting portion and has a slit 11. One line width of the slit 11 is w1,
The pitch between the two slits 11 is p1, the slits 11 are evenly arranged, and there is a slit 11a whose line length is changed every five from the first one. There are two types of wiring board side position accuracy marks 5 provided on the printed wiring board 1 as shown in FIGS. 3A and 3B, and the wiring board side position accuracy confirmation mark 5 shown in FIG. For the direction, the wiring board side position accuracy confirmation mark 5 shown in (2) is for the vertical direction. The wiring board side position accuracy confirmation mark 5 is formed by arranging several rods 12, and the rods 12 are copper foil on the printed wiring board 1. One width of the rod 12 is W1
And the pitch between the two bars 12 is P1,
Are uniformly arranged, and there is a bar 12a whose line length is changed every five lines from the first one. The contrast between the wiring board side position accuracy confirmation mark 5 and the mask side position accuracy confirmation mark 6 is expressed as w1 =
W1, p1 × 9 = P1 × 10. In FIG. 4, reference numerals 7 and 7 ′ denote positions at which positional accuracy marks are formed on the printing mask 2 and the printed wiring board 1.
Reference numeral 7 'denotes a position accuracy confirmation mark forming position obtained by changing the angle of FIG. 2 and FIG. 3 by 90 degrees. Then, a printing mask 2 having a mask-side position accuracy confirmation mark 6 formed at the position accuracy confirmation mark forming positions 7 and 7 'shown in FIG. 4, and a mask-side position accuracy confirmation mark 6 on the printing mask 2 A printed wiring board 1 having a photo solder resist film on which a wiring board side position accuracy confirmation mark 5 is formed at a position corresponding to the above is prepared. After preparing the above materials and aligning the printed wiring board 1 and the printing mask 2 during the photo solder resist exposure operation, the wiring board side position accuracy confirmation mark 5 and the printing mask 2 on the printed wiring board 1 are aligned. When visually confirming the alignment accuracy of the upper mask side position accuracy confirmation mark 6 from above, the shape of the mask side position accuracy confirmation mark 6 on the printing mask 2 and the wiring board side position on the printed wiring board 1 When the accuracy check mark 5 is aligned with a vernier caliper as shown in FIG. 5, if the scale is shifted by one scale as shown in FIG.
Is shifted from the slit 11 a of the mask-side position accuracy confirmation mark 6. In this case, there is a shift amount of p1 / 10. As shown in FIGS. 6A and 6B, the shifted state is corrected so that the rod 12a of the wiring board side position accuracy mark 5 coincides with the slit 11a of the mask side position accuracy confirmation mark 6. . That is, FIG. 6A shows a mask for printing a horizontal mark, and FIG.
When the printed wiring board 1 is aligned with the printed wiring board 1, there is no positional deviation seen from above, and the wiring board side position accuracy mark 5
By aligning the rod 12a with the slit 11a of the mask-side position accuracy confirmation mark 6, the amount of displacement in the vertical and horizontal directions can be quantitatively confirmed before exposure, and the position can be corrected easily and quickly. can do. FIGS. 7 to 10 show another embodiment of the present invention. In this case, a mask-side positional accuracy confirmation mark 6 as shown in FIG. 7 on the printing mask 2 and a wiring board-side positional accuracy mark 5 as shown in FIG. 8 on the printed wiring board 1 are formed at the positions shown in FIG. Used. The shape of the mask-side position accuracy confirmation mark 6 provided on the printing mask 2 includes a plurality of rectangular slits 13 as light transmitting portions. The line width of one of the rectangular slits 13 is w1, the pitch between the two of the rectangular slits 13 is p1, and the rectangular slits 13 are evenly arranged. There is a right-angled slit 13a having a different length. The wiring board side position accuracy mark 5 provided on the printed wiring board 1 is formed by arranging several right angle rods 14 as shown in FIG. 8, and the right angle rod 14 is a copper foil on the printed wiring board 1. . The width of one of the right-angled bars 14 is W1,
The pitch between the two rods is P1, the right-angled rods 14 are arranged uniformly, and there is a right-angled rod 14a whose line length is changed every five lines from the first one. The comparison between the wiring board side position accuracy confirmation mark 5 and the mask side position accuracy confirmation mark 6 is w
1 = W1, p1 × 9 = P1 × 10. When the position accuracy marks 5 and 6 are aligned, the result is as shown in FIG.
4a horizontal portion 15a and right angle slit 13 horizontal portion 16
From the amount of deviation from “a”, the amount of deviation in the horizontal direction
a vertical portion 15b and the vertical portion 16b of the rectangular slit 13
Can be quantitatively confirmed at the same time from the amount of deviation. The position of this deviation is corrected so that the right-angle bar 14a of the wiring board-side position accuracy mark 5 coincides with the right-angle slit 13a of the mask-side position accuracy confirmation mark 6, as shown in FIG. As described above, the amount of displacement in the vertical and horizontal directions can be quantitatively confirmed before exposure, and the position can be corrected easily and quickly. [0025] As has been described above in detail, the present invention is provided with a wiring board-side position accuracy check mark at any position on the printed circuit board, before Symbol wiring plate side positioning accuracy on the baking mask provided mask-side position accuracy check mark corresponding to the position of the check marks, when performing the printed wiring board and the alignment accuracy of the check and correction of baking mask, the mask-side position and the wiring board-side position accuracy check mark Photo solder resist mask alignment method to match the accuracy check mark
The shape of the mask-side position accuracy confirmation mark
Shape when matching the shape of the wire plate side position accuracy confirmation mark
The calibration accuracy of the printed wiring board and the baking mask can be confirmed and corrected before the exposure work by making the caliper scale shape of This leads to an improvement in correction, and can prevent occurrence of defective products such as misalignment in printing.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 (1) is a side view of an embodiment of an alignment accuracy and correction method of a printed wiring board and a printing mask in the method of the present invention. (2) It is the same top view. FIG. 2A is an explanatory view of a mask-side position accuracy confirmation mark for a lateral direction of a printing mask. (2) is an explanatory view of a mask-side position accuracy confirmation mark for the vertical direction of the printing mask. FIG. 3 (1) is an explanatory view of a wiring board side position accuracy confirmation mark for a horizontal direction of a printed wiring board. (2) is an explanatory view of a wiring board side position accuracy confirmation mark for the vertical direction of the printed wiring board. FIG. 4 is an explanatory diagram of a position for forming a position accuracy confirmation mark on a printing mask and a printed wiring board. FIG. 5 is an explanatory view of a state when the mask-side position accuracy confirmation mark of the printing mask is aligned with the wiring board-side position accuracy confirmation mark of the printed wiring board, as viewed from above; FIG. 6 (1) shows a state when viewed from above when there is no misalignment when the mask-side positional accuracy confirmation mark for the lateral direction of the printing mask is aligned with the wiring board-side positional accuracy confirmation mark of the printed wiring board. FIG. (2) is an explanatory diagram of a state seen from above when there is no displacement when a vertical position mask-side position accuracy check mark of a printing mask is aligned with a wiring board-side position accuracy check mark of a printed wiring board; . FIG. 7 is an explanatory diagram of another embodiment of a mark for confirming the positional accuracy of a printing mask on the mask side. FIG. 8 is an explanatory view of another embodiment of the position accuracy confirmation mark on the wiring board side of the printed wiring board. FIG. 9 is an explanatory view of another embodiment of a position for forming a position accuracy confirmation mark of a printing mask and a printed wiring board. FIG. 10 is an explanatory view of another embodiment in a state where the mask-side position accuracy confirmation mark of the printing mask and the wiring board-side position accuracy confirmation mark of the printed wiring board are aligned and viewed from above. FIG. 11A is a side view of a conventional method for checking the alignment accuracy between a printed wiring board and a printing mask. (2) It is the same top view. FIG. 12 is an explanatory diagram of through-hole lands and clearance for confirming positional accuracy after developing a photo solder resist. FIGS. 13 (1) and (2) are explanatory diagrams of a difference in variation according to a conventional alignment accuracy checking method. [Description of Signs] 1 Printed wiring board 2 Baking mask 5 Wiring board side position accuracy confirmation mark 6 Mask side position accuracy confirmation mark

────────────────────────────────────────────────── ─── Continuation of the front page (56) References JP-A-5-88380 (JP, A) JP-A-4-68591 (JP, A) JP-A-5-232714 (JP, A) (58) Field (Int.Cl. ⁷ , DB name) H05K 3/00 G03F 9/00

Claims (1)

(57) provided with a wiring board-side position accuracy check mark at any position Patent Claims 1. A printed circuit board on the position of the front Symbol wiring board-side position accuracy check mark on baking mask A corresponding mark on the mask side position accuracy confirmation mark is provided to confirm and correct the alignment accuracy between the printed wiring board and the printing mask.
Photo solder resist Ma for aligning said mask-side position accuracy check mark and the wiring board-side position accuracy check mark
In the mask alignment method, the shape of the mask-side position accuracy confirmation mark
When the shape of the side position accuracy confirmation mark is
A method for aligning a photo solder resist mask, wherein the mask is formed in a graduated scale .