JPH06326446A - Board and manufacture thereof - Google Patents

Abstract

PURPOSE:To adequately mount a component on a board at a soldering effective spot even if a resist mask deviates from a copper foil land in a process and to enable a board to be protected against troubles such as solder bridges or imperfect soldering and improved in yield by a method wherein a component is mounted on the board on the basis of a reference position mark provided onto the board. CONSTITUTION:In a process wherein a resist mask is provided onto a copper foil pattern of a board 1, a resist, mask where a reference position mark 4 of prescribed shape is punched is provided onto a position detecting copper foil land 2 formed on the board 1 at two or more different prescribed positions.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a mounting substrate in which a resist mask is applied to a copper foil pattern portion to perform so-called narrowing down and a substrate thereof, and particularly, to a relatively high density. It is suitable for a substrate which is required to be mounted and in which a chip component or the like is surface-mounted on a pattern portion called a copper foil land of the substrate and a method for manufacturing the substrate.

[0002]

2. Description of the Related Art A technique of surface-mounting so-called chip parts on a substrate is known as the density of a mounting substrate increases. FIG. 5 is a perspective view showing an example of a surface mount board. As shown in this figure, a pattern of copper foil lands 10 formed through an etching process or the like is formed on the surface of the board 1. Reference numeral 11 is a chip component, and electrodes 1 are provided on both ends of the main body.
It has a shape provided with 1a and 11a. These chip parts 11 have copper foil lands 1 as shown by broken lines in the figure.
After the electrodes 11a and 11a are mounted so as to be positioned with respect to 0 and 10, the chip component 1 shown on the leftmost side of the drawing
The copper foil lands 10 and 10 and the electrodes 11a and 11a are soldered with the solder 12 as in No. 1 to be mounted on the substrate.

In such a surface mounting board, adjacent pattern portions are often in close proximity to each other due to the requirement of high density mounting. For this reason, in order to prevent bridging between the adjacent copper foil lands 10 and the chip parts 11 and the like, resist printing is performed on the substrate so that a non-solderable portion called a resist mask is formed on the outer periphery of the copper foil lands 10. Then, there is known a so-called narrowing-down technique for reducing the effective soldering area of the copper foil land 10. For example, FIG. 6A shows the copper foil land 10 formed on the substrate. In the case of this figure, the space between the copper foil lands 10 at the top and bottom is narrowed as shown by the arrow. Therefore, as shown in FIG. 6B, a resist mask 9 is applied to these copper foil lands 10 as indicated by diagonal lines to form a soldering effective portion 10a of the copper foil lands 10 having a predetermined area. As a result, substantially the upper and lower intervals of the copper foil lands 10 are widened as shown by the arrows in the figure. The electrodes 11a, 11a of the chip component 11 are connected to the soldering effective portion 10a as shown by the broken line in the figure.
After mounting the chip component so as to be positioned with respect to, soldering is performed. By soldering the chip parts after applying the resist mask 9 in this way, it is possible to prevent accidents such as solder bridges between the adjacent copper foil lands 10.

When the chip component 11 is mounted on the substrate, for example, it is automatically performed by a robot. At this time, the robot can mount the chip component 11 at an appropriate position. It is necessary to detect the reference position. FIG. 7A is a perspective view showing an example of a reference position detection method when automatically mounting a chip component. As shown in the figure, the board 1 is placed at a predetermined position on the component mounting table 8. However, the board 1 is already formed with patterns such as copper foil lands for connecting electronic parts and chip parts when they are connected, but in this case, the pattern on the board 1 is not shown. is doing.
A pair of reference marks 14 provided at the diagonal corners of the substrate 1 is a reference mark for detecting a reference position. As shown in the enlarged perspective view of FIG. 7B, these reference marks 14, 14 are, for example, circular shapes of a predetermined size and are formed of copper foil. That is, it is formed simultaneously with the pattern in the step of forming the pattern such as the copper foil land on the substrate 1. Reference numerals 5 and 6 are reference position detection cameras, and in this case, two reference marks 14 and 14 are provided according to the number of reference marks 14 and 14.

When mounting the chip parts, first, the reference position detecting cameras 5 and 6 are moved to the reference mark 14 and the reference mark 14 on the substrate 1, respectively.
The center position C of 14 (shown in FIG. 7B) is read to detect the displacement of the substrate position. And the reference marks 14, 1
The relative positions of the board 1 and the component mounting position are matched with each other with respect to the respective center positions C of 4 and the chip component 11 is mounted on the copper foil land (not shown) on the substrate 1 from the component supply port (not shown) or the like. It will be. As a result, FIG.
As shown in (b), the chip component 11 is mounted on the copper foil land 10 at an appropriate position.

[0006]

However, in the step of applying the resist mask 9 to the copper foil land 10 as described above, the resist mask 9 is not printed at a proper position with respect to the copper foil land 10 and a slight misalignment occurs. There is a case where it is printed and held. Further, when the reference position is detected by the method described with reference to FIG. 7 and the chip component 11 is mounted, as described above, the chip component 11 is mounted at an appropriate position with the copper foil land 10 as the reference position. .

Therefore, when the chip component 11 is to be mounted on the substrate 1 on which the resist mask 9 is displaced and printed by the method shown in FIG. 7, as shown in the plan view of FIG. Positions of the electrodes 11a, 11a of 11 and the actual soldering effective portion 10a are displaced. In particular, since the resist mask 9 is usually printed all together on the pattern of the substrate, the mounting positions of the chip components may be displaced at the reference position detection stage. Means that there is a deviation in. When the soldering process is started from this state, the electrodes 11a, 11a are properly
And the soldering effective portion 10a is not soldered, and there is a great possibility that an accident such as unsoldered or bridge occurs.
As a result, the yield of products is significantly reduced.

[0008]

Therefore, in order to solve the above-mentioned problems, the present invention solves the above-mentioned problems by applying two or more resist masks on the substrate in the step of applying a resist mask for reducing the soldering effective area of the copper foil pattern portion on the substrate. The substrate is manufactured by a method of applying a resist mask in which a reference position mark having a predetermined shape is punched to the position detecting copper foil portion formed at the predetermined position.

[0009]

When the step of applying a resist mask to the copper foil pattern portion of the substrate, the resist mask in which the reference position marks are punched out on the position detecting copper foil portions formed at two or more predetermined positions on the substrate at the same time By performing the step, the reference position at the time of mounting the component coincides with the soldering effective portion formed by the resist mask.

[0010]

Embodiments of the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a part of a substrate 1 according to the present embodiment. This substrate 1 has been subjected to a process in which a pattern such as a copper foil land has already been formed, but a chip component is soldered. The pattern of copper foil lands or the like on the substrate 1 is not shown.

2 provided at the corner of the substrate 1
Is a copper foil land for detecting the position of the reference position and is formed together with other copper foil patterns. In this case, it is a square of a predetermined size, but may have another shape. Three
Shows a resist mask for reference position detection printed on the copper foil land 2 for position detection, and it is a square of a predetermined size smaller than the copper foil land 2 for position detection by one size, but other shapes are used. You may have it. A circular reference mark 4 having a predetermined size is punched out at the center of the reference position detecting resist mask 3. The shape of the reference mark 4 is not limited to a circle as long as the center position C described later can be detected, but the circle is the easiest to detect the center position and the shape thereof is easy to form. Therefore, in this embodiment, the reference mark 4 has a circular shape.

The substrate 1 is subjected to the above-described step of narrowing down with the resist mask, but the reference position detecting resist mask 3 is drawn in the print pattern of this narrowing down, and the reference position detecting resist mask 3 is positioned at the same time as the narrowing down step. It is printed on the copper foil land 2 for detection. Therefore, the reference mark 4 of this embodiment is formed at the same time as another resist mask in the step of narrowing down, and it is not necessary to add another step, which is advantageous from the viewpoint of cost.

FIG. 2 is a plan view showing a state in which the reference position detecting resist mask 3 is printed on the position detecting copper foil lands 2 of the substrate 1. Other copper foil lands and other patterns are not shown. is doing. As shown in this figure, when the reference position detecting resist mask 3 is printed on the position detecting copper foil land 2, the copper foil is exposed at the reference mark 4. Then, as will be described next, the portion of the reference mark 4 where the copper foil is exposed becomes an object of reference position detection when the component is mounted. In this figure, the reference position detecting resist mask 3 is shown in a state of being printed with being displaced from the position detecting copper foil land 2, which will be described later.

FIG. 3 is a perspective view showing a mounting position detecting method when mounting a chip component on the substrate 1 on which the reference mark 4 is formed as described above. The board 1 is arranged at a predetermined position on the component mounting table 8. As can be seen from the figure, the reference marks 4 described in FIG. 2 are formed on the board 1 at three corners. There is. By thus arranging the reference marks 4 on the substrate 1 as far as possible from each other, the accuracy of position detection is improved. Further, it is possible to detect the position by using at least two reference marks 4, but by further adding one reference mark 4 to form three on the substrate 1, similarly, the accuracy of position detection is improved. be able to. Reference numerals 5, 6, and 7 are reference position detection cameras, and in this case, the reference mark 4
Are formed in three places, three are provided accordingly.

When mounting the chip parts, first, the reference position detecting cameras 5, 6 and 7 respectively have center positions C (see FIG. 3) of the reference marks 4, 4 and 4 in which the copper foil portions are exposed in a circular shape.
(Shown in the enlarged perspective view of (b)) is read to detect the positional deviation of the substrate 1. Then, the position detected in this way is used as a reference position for component mounting to correct the deviation, and the chip component 11 is mounted at a prescribed mounting position on the substrate 1 from a component supply port (not shown) or the like.

At this time, when the reference position detecting resist mask 3 is printed with a displacement on the position detecting copper foil land 2 as shown in FIG. 2, as shown in FIG. The resist mask applied to the other copper foil lands 10 to be soldered is also displaced. However, when the reference position is detected by the above-described method, the mounting position of the chip component 11 is the same as that of the conventional example shown in FIG.
Instead of mounting the chip component on the basis of the copper foil land 10 as shown in FIG. 2, the chip component 11 is mounted on the basis of the pattern of the resist mask 9 printed on the copper foil land 10. Therefore, the chip component 11 to be mounted is, as shown by the broken line in FIG. 4, effective soldering portions 10a and 10a formed by the resist mask 9 printed with a shift.
The electrodes 11a and 11a are positioned with respect to the. After that, the soldering process is performed, but since the positions of the electrodes 11a and 11a with respect to the effective soldering portions 10a and 10a are proper, reliable soldering is performed, and an accident such as a bridge or unsoldering occurs. Can be prevented.

Although the case where the chip component is surface-mounted has been described in the above embodiment, the resist mask is applied not only to the pattern of the copper foil land or the like but also to the perforated substrate or the like having another wiring pattern. As long as the processing is performed, the method for detecting the component mounting position using the substrate according to the present invention can be applied.

[0018]

As described above, according to the present invention, when the resist mask for reducing the effective soldering area of the copper foil pattern portion on the substrate is applied, the reference position mark is punched out on the detection copper foil portion. Even if the resist mask is printed with a deviation from the copper foil land, the effective soldering area can be achieved by manufacturing a substrate with a resist mask and mounting parts based on the reference marks formed on this substrate. It is now possible to properly mount the chip component.
This makes it possible to prevent bridging, unsoldering, etc., which has the advantage of improving the yield of products. Further, since the reference mark is formed at the same time as another resist mask in the narrowing down process, no other special process is required, so that the problem can be solved at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing a substrate on which a reference mark is formed in an embodiment of the present invention.

FIG. 2 is a plan view showing a substrate on which a reference mark is formed in this embodiment.

FIG. 3 is a perspective view showing a component mounting position detecting method in the present embodiment.

FIG. 4 is a plan view showing a state in which a chip component is mounted in this embodiment.

FIG. 5 is a perspective view showing a state in which a chip component is mounted in a conventional example.

FIG. 6 is a plan view showing a step of applying a resist mask.

FIG. 7 is a perspective view showing a component mounting position detecting method in a conventional example.

FIG. 8 is a plan view showing a state in which a chip component is mounted on a substrate on which a resist mask is displaced and printed in a conventional example.

[Explanation of symbols]

 1 substrate 2 position detection copper foil land 3 reference position detection resist mask 4 reference marks 5, 6, 7 reference position detection camera 8 component mounting table 9 resist mask 10 copper foil land 10a soldering effective portion 11 chip component 11a electrode

Claims (2)

[Claims] 1. A position detecting copper foil portion formed at two or more predetermined positions on the substrate in a step of applying a resist mask for reducing a soldering effective area of a copper foil pattern portion formed on the substrate. A method of manufacturing a substrate, wherein a resist mask in which a reference position mark having a predetermined shape is punched is applied to the substrate. 2. A position detecting copper formed at two or more predetermined positions on the substrate in a step of applying a resist mask for reducing a soldering effective area of a copper foil pattern portion formed on the substrate. A substrate, wherein a resist mask in which a reference position mark having a predetermined shape is punched is applied to the foil portion.