JP2004022734A - Component-mounted board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mount board whereby a plurality of kinds of electronic components can selectively be mounted on a minimum area so as to be reduced in size, the soldered state is stabilized to be strong without positional deviation, when soldering at a reduced manufacturing cost. <P>SOLUTION: The component-mount board is provided with a common land resulting from sharing parts of lands for a plurality of electronic components, in order to selectively mount some of a plurality of the electronic components, and the common land includes exclusive regions 31A, 31B which each of a plurality of the electronic components requires, a common region 31C which any one of a plurality of the electronic components needs, and a partitioning means 31D to avoid solder for soldering mounted electronic components from flowing to the exclusive region 31A or 31B for the unmounted electronic components from the common region 31C. <P>COPYRIGHT: (C)2004,JPO

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a component mounting board provided with a common land that shares a part of a land for selectively mounting a plurality of electronic components.
[0002]
[Prior art]
Various electronic devices have been developed and used in various fields. As is well known, the electronic devices are formed by combining various electronic components. Normally, the electronic components are mounted on a printed board provided inside the housing, and are electrically connected via required pattern wiring provided on the board surface or the like.
In addition, such electronic devices may have different types, specifications, shapes, and the like of electronic components to be mounted according to, for example, specifications and standards of each destination. If, for example, the shape of the electronic component, especially the position of the pin, is different, the shape of the land provided on the board on which the electronic component is mounted is also different, and usually, the dedicated land is provided in a different pattern so as to correspond to each. Need to be provided separately.
[0003]
Such a situation is not limited to the case where the electronic components to be mounted according to the destination described above are properly used. For example, depending on the environment (eg, temperature, etc.) of the region in which the electronic device is used, electronic devices that selectively use electronic components, electronic components that are mounted because their service lives are different, and electronic components that are selectively used according to this, or depending on the model. The same problem arises when electronic components to be mounted are used for different functions or electronic components whose shapes and sizes are slightly different depending on manufacturers.
[0004]
This will be described with reference to FIG.
For example, when shipping to the country A or the region A, the first electronic component A having the 6-pin terminals (A1 to A6) shown in FIG. In the case where the second electronic component B of the 4-pin terminal (B1 to B4) shown in FIG. If different, the layout pattern of the lands, which is the mounting area on the substrate side, differs depending on which electronic component is mounted.
[0005]
Therefore, as shown in FIG. 7A, for example, when a mounting board 103 configured to selectively mount one of these electronic components is formed, the mounting board 103 is provided on the mounting board 103. Two types of dedicated mounting portions, each including a first mounting portion S1 and a second mounting portion S2 in which lands are disposed in two different patterns according to the arrangement and arrangement of the pins of the electronic component, are provided in separate areas. Need to be formed.
[0006]
For example, when the electronic component 101 is mounted on the substrate, as shown in FIG. 7B, the electronic component 101 is mounted on the land using six lands of the mounting portion S1. Electrical connection. On the other hand, here, the land is not used in the second mounting portion S2 which is the mounting portion of the electronic component 102 which is not mounted (OPEN).
[0007]
Conversely, when the electronic component 102 is mounted on the substrate, as shown in FIG. 7C, the electronic component 102 is mounted on the land using four lands of the mounting portion S2. Electrical connection. On the other hand, in the first mounting portion S1, which is the mounting portion of the electronic component 101 not mounted (OPEN), the land remains unused.
[0008]
[Problems to be solved by the invention]
By the way, recently, in various electronic devices, the tendency of miniaturization is increasing, but when using the mounting board having the above-described configuration, even when either electronic component is mounted, substantially, A mounting area for mounting two electronic components is required, and the mounting area is increasing. In addition, since the unmounted area forms a dead space, a part of the mounting substrate is wasted, which is an obstacle to miniaturization and an extra area is formed on the substrate. However, there is a problem that the cost is increased.
It is also conceivable to match the two component lands so that two electronic components can be mounted. However, in this case, the cream solder spreads, and there is a problem in that the mounted components are displaced and the bonding strength cannot be maintained. I was holding it.
[0009]
The present invention has been made in order to solve the conventional problems, and it is possible to selectively mount a plurality of types of electronic components in a minimum mounting area. It is an object of the present invention to provide a component mounting board that can be firmly and stably joined without a risk of displacement during joining by soldering and that can reduce manufacturing costs.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the component mounting board according to the present invention includes a common land in which a part of the lands of the plurality of electronic components is shared in order to selectively mount any one of the plurality of electronic components. Component mounting board,
In the common land,
A dedicated area required by each of the plurality of electronic components,
A shared area required by any of the plurality of electronic components,
Partition means for preventing the solder for joining the electronic components to be mounted from flowing out of the shared area to the dedicated area for the electronic components not mounted is provided.
[0011]
With this configuration, it is possible to selectively mount a plurality of types of electronic components in a minimum mounting area, and it is possible to reduce the size of the board and to reduce the possibility of displacement during soldering, and to maintain the bonding state. Strong and stable. Further, the manufacturing cost can be reduced.
[0012]
In the component mounting board according to the present invention, the partitioning means may be provided so as to straddle at least the common area in the common land, or to extend over the common area and partially to the dedicated area immediately adjacent to the common area. Configuration.
With this configuration, it is possible to secure a large and stable bonding force in the minimum mounting area.
[0013]
Further, the component mounting board of the present invention has a configuration in which the partitioning means surrounds part or all of the common area inside.
With this configuration, the degree of freedom in designing the shape of the mounting pattern can be increased.
[0014]
Further, the component mounting board of the present invention has a configuration in which the partition means is formed of a resist.
With this configuration, a material used in manufacturing the substrate can also be used.
[0015]
The component mounting board of the present invention has a configuration in which the partitioning means is formed of silk.
With this configuration, a material used in manufacturing the substrate can also be used.
[0016]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.
FIG. 1 shows a component mounting board 1 according to an embodiment of the present invention. The component mounting board 1 has two electronic components (that is, a first electronic component A or a second electronic component B) on a substrate 10. ), The first mounting region R1 for mounting the first electronic component A and the second mounting region R2 for mounting the second electronic component B overlap each other. The two lands 2 of the common land 3 and the dedicated land 4 are formed in the overlapping first mounting region R1 and second mounting region R2.
[0017]
The first electronic component A is the same as the first electronic component 101 shown in FIG. That is, in the first electronic component A, the same terminals as the terminals of the first electronic component 101, that is, the first terminal A1 to the sixth terminal A6 are provided in the same portion as in the case of the first electronic component 101. The first to sixth terminals A1 to A6 are connected by soldering to lands provided on the substrate 10 corresponding to the first mounting region R1.
[0018]
Similarly, in the second electronic component B, the same terminals as the terminals shown in FIG. 6B, that is, the first terminal B1 to the fourth terminal B4 are provided in the same part, and the first terminals B1 to the fourth terminal B4 are provided. The terminal B4 is connected to a land provided on the substrate 10 corresponding to the second mounting region R2 by soldering.
[0019]
The land 2 includes a common land 3 formed for selectively connecting any of the terminals of the first electronic component A and the second electronic component B, and a dedicated land 4 for connecting only the terminal of the first electronic component A. And Of these, the common land 3 is composed of four lands, that is, a first land 31, a third land 33, a fourth land 34, and a sixth land 36 provided at four locations in the upper, lower, left, and right directions in FIG.
[0020]
As shown in FIG. 2, the first land 31 has a substantially inverted L-shaped outer dedicated area 31A, a substantially L-shaped inner dedicated area 31B, a rectangular shared area 31C, and these three areas. There is provided a partitioning means 31D for dividing, and the remaining third land 33, fourth land 34, and sixth land 36 in FIG. 1 also have the same configuration. The upper surface (front surface) of the outer dedicated area 31A, the shared area 31C, and the inner dedicated area 31B is separated by the partitioning means 31D. However, in the lower part than the installation level of the partitioning means 31D, 31A, 31B, 31C have a shape electrically connected to each other and physically connected to each other.
When the first electronic component A is mounted, the outer dedicated region 31A is provided with the first terminal A1 of the first electronic component A on the outer dedicated land 31A and the overlapping land 31C, and the electrical connection with the substrate 1 side is established. It is intended. That is, the outer dedicated area 31A is configured to be electrically connected to the first terminal A1 of the first electronic component A simultaneously with the shared area 31C.
For this reason, when the first electronic component A is mounted, cream solder H (see FIG. 5) is applied to the outside dedicated area 31A, the overlapping land 31C, and a part of the partitioning means 31D. When heated in a reflow furnace (not shown), the cream solder applied further on the partitioning means 31D formed higher than the other is melted, and the outer exclusive area 31A or It flows into one of the common areas 31C by the action of gravity.
The outside dedicated areas 33A, 34A, 36A provided on the remaining third land 33, fourth land 34, and sixth land 36 respectively have the same configuration.
[0022]
When the second electronic component B is mounted, the inner dedicated region 31B is provided with the first terminal B1 of the second electronic component B mounted on the inner dedicated region 31B and the shared region 31C, and the electrical connection with the substrate 1 is established. It is intended. That is, the middle dedicated area 31B is configured to be electrically connected to the first terminal B1 of the second electronic component B simultaneously with the shared area 31C.
Therefore, when the second electronic component B is mounted, cream solder H is applied to the inner dedicated area 31B, the common area 31C, and a part of the partitioning means 31D, and is also heated in a reflow furnace. Then, the cream solder applied to the partition means 31D which is higher in position is melted and flows into either the inner dedicated area 31B or the shared area 31C. The inner dedicated areas 33B, 34B, and 36B provided on the remaining third land 33, fourth land 34, and sixth land 36 have the same configuration.
[0023]
As described above, the shared area 31C constitutes a solder application area to which cream solder is applied when mounting either the first electronic component A or the second electronic component B. Therefore, the common area 31C has a compatible wiring configuration so that the wiring path of the electric signal can be shared by any of the first electronic component A and the second electronic component B.
Although the shape of the common area 31C is rectangular in this embodiment, various shapes can be applied depending on the shape of the common land and the dedicated area, or the shape of the partitioning means.
[0024]
The partitioning means 31D is for preventing the solder for selectively mounting one of the electronic components from flowing out to the other (other side) dedicated area through the shared area 31C when the solder is in a molten state. And is made of a resist (for example, an insulating resin or the like). In order to prevent the partitioning means 31D from flowing out of the shared area to the adjacent dedicated area beyond the shared area, at least the length d extends from the dedicated area so as to surround the shared area (FIG. 2), and at a height (film thickness) at which cream solder H can be prevented from flowing out to the other (other side) dedicated area at the time of melting.
[0025]
The partitioning means 31D is formed by applying a resist for the partitioning means 31D at the same time as applying the resist. Further, in this embodiment, the shape is formed in a square shape, but various shapes are applicable as in the case of the shared area, such as the shape of the dedicated area constituting the shared land.
[0026]
For example, as shown in FIG. 3, in the case of two circular lands 3A and 3B partially overlapping each other, the common area 3C has a substantially elliptical shape, and the partitioning means 3D has the substantially elliptical shape. A shape in which two surrounding arc portions are joined may be used (see FIG. 3A).
In a configuration in which one of the lands 3A and 3B is partially overlapped with one another in a circular shape, the common area 3C has a substantially half-moon shape, and the partitioning means 3D surrounds the substantially half-moon shape. The shape may be a combination of a chord and an arc (see FIG. 3B).
Further, in a configuration in which the lands 3A and 3B, one of which is circular and the other of which is rhombic, are partially overlapped, the common area 3C has a fan shape, and the partitioning means 3D has an isosceles surrounding the fan shape. A triangular shape in which the base of the triangle is replaced by an arc may be used (see FIG. 3C).
[0027]
The exclusive land 4 is composed of two lands, a second land 32 and a fifth land 35 provided at two upper and lower locations in FIG.
[0028]
The second land 32 is formed in a square shape so that the second terminal A2 of the first electronic component A is connected to the second land 32. Therefore, when the first electronic component A is mounted on the substrate 10, The cream solder H is applied to almost the entire area of the second land 32. On the other hand, when the second electronic component B is mounted on the substrate 10, the cream solder H is not applied to the second lands 32.
The remaining fifth lands 35 also have the same configuration as the second lands 32.
[0029]
Next, a state in which an electronic component is mounted using the component mounting board of this embodiment will be described with reference to FIG.
As shown in FIG. 4A, when the first electronic component A is mounted on the land 2 of the substrate 10, as shown in FIG. 4B, each of the first land 31 to the sixth land 36 is formed. The first terminal A1 to the sixth terminal A6 are mounted on the land 2, respectively, and these terminals are fixed and connected with solder.
[0030]
In particular, for the common land 3, that is, the first land 31, the third land 33, the fourth land 34, and the sixth land 36, the outer exclusive regions 31A, 33A, 34A, 36A and the common regions 31C, 33C, 34C, respectively. , 36C, the solder H is spread over the entire common land by the partitioning means even if the solder H is in a heated and molten state. Therefore, since the solidified solder H forms a thick layer, stable soldering can be performed, and it is possible to prevent the solder strength from weakening and the bonding strength of the components from becoming weak.
[0031]
On the other hand, as for the second electronic component B, as shown in FIG. 4C, the first land B1, the second land 34, the fourth land 34, and the sixth land 36 have the first terminal B1 and the second terminal B1, respectively. The terminal B2, the third terminal B3, and the fourth terminal B4 are respectively mounted, and these terminals are fixed and connected with solder.
Therefore, as with the first electronic component A, the cream solder H is applied only to the inner dedicated areas 31B, 33B, 34B, 36B and the common areas 31C, 33C, 34C, 36C, as in the first electronic component A. The partitioning means 31D prevents the solder H from spreading over the entire common land 3. For this reason, similarly, since the solidified solder H forms a thick layer, stable soldering can be performed, and it is possible to prevent the solder strength from weakening and the bonding strength of the components from becoming weak.
[0032]
Next, a method of manufacturing a component mounting board according to the present invention will be described with reference to FIG. Here, the case where the second electronic component B is mounted will be described, but the first electronic component A can be mounted in the same manner. In FIG. 4, the fourth common land 34 will be described, but the same applies to other common lands.
(1) First, in a resist coating step, a resist is applied to the common land partitioning means 34D to a required thickness t by using a mask (not shown) formed and prepared in advance ( FIG. 5 (A)).
(2) Next, cream solder is applied to a predetermined area, that is, a part of the inner dedicated area 34B, the shared area 34C, and a part of the partitioning means 34D (resist at a boundary between the inner dedicated area 34B and the shared area 34C). H is applied. That is, the cream solder H is not applied to the outer exclusive area 34A (see FIG. 5B).
(3) Then, the second electronic component B is mounted at a predetermined position. In other words, for the terminals placed on each common land 3, a part of the inner dedicated area 34 B, the shared area 34 C, and a part of the partitioning means 34 D (resist at a boundary portion between the inner dedicated area 34 B and the shared area 34 C) Installed within the range that fits.
(4) Thereafter, the cream solder H on the component mounting board 1 that passes through a reflow furnace (not shown) is heated to a temperature equal to or higher than the solder melting temperature and melts. Therefore, the cream solder H applied on the resist constituting the partitioning means 34D. H flows out towards the lower part. In other words, the cream solder H on the partitioning means 34D flows only into the inner dedicated area 34B or the common area 34C, and tries to flow into the outer dedicated area 34A only when the partitioning means is sandwiched between the shared area 34C and the outer dedicated area 34A. Blocked at 34D. That is, the resist of the partitioning means 34D functions as a weir, and the outflow of the molten solder H can be prevented.
As a result, as described above, since the solder H can be prevented from spreading significantly, the thick layer of the solidified solder H can be retained.
In the present embodiment, a case has been described in which one of the two electronic components is selected and mounted, but the present invention is also applicable to three or more electronic components.
Also, it is possible to use silk instead of resist for the partition means 34D of the common land.
[0033]
【The invention's effect】
As described above, the present invention provides a component mounting board including a common land in which some of the lands of the plurality of electronic components are shared in order to selectively mount any one of the plurality of electronic components. In the common land, the dedicated area required by each of the plurality of electronic components, the common area required by each of the plurality of electronic components, and the solder for joining the electronic components to be mounted are separated from the common area. By providing a partitioning means for preventing the unmounted electronic components from flowing into the dedicated area, it is possible to selectively mount a plurality of types of electronic components in the minimum mounting area, and to reduce the size of the board. It is also possible to realize a component mounting board in which the bonding state is strong and stable without the risk of displacement during soldering, and it is possible to reduce the manufacturing cost of the component mounting board. It is capable of providing component mounting board having cormorants effect.
[Brief description of the drawings]
FIG. 1 is a plan view showing a part of a component mounting board according to an embodiment of the present invention.
FIG. 2 is an explanatory view showing a main part of the component mounting board of the present invention shown in FIG. 1;
FIGS. 3A to 3C are explanatory diagrams each showing a modification of the common land of the component mounting board of the present invention shown in FIG. 1;
4A and 4B show the component mounting board of the present invention shown in FIG. 1, wherein FIG. 4A shows a state before mounting an electronic component, FIG. 4B shows a mounting state of a first electronic component, and FIG. It is each explanatory drawing which shows the mounting state of a 2nd electronic component.
5A and 5B show a manufacturing process of the component mounting board of the present invention shown in FIG. 1, wherein FIG. 5A is a plan view and a side view showing a state in which a resist as a partitioning means is applied, and FIG. (C) is a plan view and a side view showing a state in which electronic components are mounted on a common land, and (D) is a state in which cream solder is heated in a reflow furnace. It is the top view and side view which show a state.
6A is an explanatory diagram showing an arrangement of terminals for connection of a first electronic component, and FIG. 6B is an explanatory diagram showing an arrangement of terminals for connection of a second electronic component.
FIGS. 7A and 7B show a conventional component mounting board, in which FIG. 7A shows a state before mounting an electronic component, FIG. 7B shows a mounting state of a first electronic component, and FIG. It is each explanatory drawing which shows a mounting state.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Component mounting board 10 Substrate 2 Land 3 Shared land 3A Outside dedicated area 3B Inside dedicated area 3C Shared area 3D Partition means 31 First land 31A Outside dedicated area 31B Inside dedicated area 31C Shared area 31D Partition means 32 Second land 33 Third Land 33A Outside dedicated area 33B Inside dedicated area 33C Shared area 33D Partition means 34 Fourth land 34A Outside dedicated area 34B Inside dedicated area 34C Shared area 34D Partition means 35 Fifth land 36 Sixth land 36A Outside dedicated area 36B Inside dedicated area 36C Common area 36D Partitioning means 4 Dedicated land A First electronic component B Second electronic component A1 First terminal A6 Sixth terminal R1 First mounting area (for mounting first electronic component A)
R2 Second mounting area (for mounting second electronic component B)
B1 to B4 1st terminal 4th terminal H (cream) solder

Claims (5)

In order to selectively mount any one of the plurality of electronic components, a component mounting board including a shared land that shares a part of the lands of the plurality of electronic components,
In the common land,
A dedicated area required by each of the plurality of electronic components,
A shared area required by any of the plurality of electronic components,
A component mounting board, comprising: partition means for preventing a solder for joining an electronic component to be mounted from flowing out of the shared area to a dedicated area for an electronic component that is not mounted. 2. The partitioning means according to claim 1, wherein the partitioning means is provided so as to straddle at least the common area in the common land, or to extend partially beyond the common area and to the dedicated area immediately adjacent to the common area. The component mounting board described. The component mounting board according to claim 1, wherein the partitioning unit surrounds part or all of the common area inside. The component mounting board according to claim 1, wherein the partitioning unit is formed of a resist. The component mounting board according to claim 1, wherein the partitioning unit is formed of silk.

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