TWI645757B - Printed wiring board - Google Patents
Printed wiring board Download PDFInfo
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- TWI645757B TWI645757B TW106102440A TW106102440A TWI645757B TW I645757 B TWI645757 B TW I645757B TW 106102440 A TW106102440 A TW 106102440A TW 106102440 A TW106102440 A TW 106102440A TW I645757 B TWI645757 B TW I645757B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
- H05K3/3442—Leadless components having edge contacts, e.g. leadless chip capacitors, chip carriers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/111—Pads for surface mounting, e.g. lay-out
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
本發明係一種印刷配件基板,其中,本發明之印刷配線基板(10)係具備:含有選擇性地安裝有第1電子構件(40)或第2電子構件(50)之構件安裝範圍(13)的基板(11),和加以連接有第1電子構件(40)之第1端子(41)或第2電子構件(50)之第1端子(51)的第1導體(20),和加以形成於基板(11)表面之光阻層(12);第1導體(20)係包含由光阻層(12)被覆前述第1導體(20)之一部分所形成之墊片(21~23);第1導體(20)的墊片(21)係對於安裝第1電子構件部(40)於構件安裝範圍(13)之情況,構成規定第1電子構件(40)之第1端子(41)的位置之形狀,而第1導體(20)的墊片(22,23)係對於安裝第2電子構件(50)於構件安裝範圍(13)之情況,構成規定第2電子構件(50)之第1端子(51)的位置之形狀。 The present invention is a printed accessory board, wherein the printed wiring board (10) of the present invention includes: a component mounting range (13) including a first electronic component (40) or a second electronic component (50) selectively mounted Substrate (11), and the first conductor (20) to which the first terminal (41) of the first electronic component (40) or the first terminal (51) of the second electronic component (50) is connected and formed A photoresist layer (12) on the surface of the substrate (11); the first conductor (20) includes spacers (21 ~ 23) formed by the photoresist layer (12) covering a part of the first conductor (20); The pad (21) of the first conductor (20) constitutes the first terminal (41) that defines the first terminal (41) of the first electronic component (40) when the first electronic component part (40) is mounted on the component mounting range (13) The shape of the position, and the pads (22, 23) of the first conductor (20) are for the case of mounting the second electronic component (50) in the component mounting range (13), constituting the second 1 The shape of the position of the terminal (51).
Description
本發明係有關印刷配線基板。 The present invention relates to a printed wiring board.
作為安裝電子構件於印刷配線基板之技術的一例,一般被廣泛知道有迴焊方式之附上焊錫。在迴焊方式之附上焊錫中,在迴焊爐內而加熱加以設置於於印刷配線基板的表面之墊片與電子構件之端子之間的凝膠狀之焊錫而使其熔融之後,經由進行冷卻而使焊錫固化之時,於印刷配線基板的墊片加以焊錫附上電子構件的端子。 As an example of a technique for mounting an electronic component on a printed wiring board, solder attachment is generally known as a reflow method. In the attached solder of the reflow method, the gel-like solder that is placed between the pad on the surface of the printed wiring board and the terminal of the electronic component is heated and melted in the reflow furnace, and then passed through When cooling to solidify the solder, the terminals of the electronic component are attached to the pads of the printed wiring board with solder.
加以焊錫附上於印刷配線基板的墊片之電子構件的端子之位置,尺寸,形狀等係如為同一之電子構件時,基本上為完全相同。但即使為同一電子構件,例如經由製造廠商不同,亦可能有端子的位置,尺寸,形狀等些微不同者。更且,即使為同一製造廠商的同一電子構件,經由設計變更或規格變更等,亦可能有加以變更端子的位置,尺寸,形狀等情況。如此之情況,有著印刷配線基板之墊片的位置,尺寸,形狀則不符合於電子構件之端子的位置,尺寸,形狀等狀態之可能性。 The position, size, shape, etc. of the terminals of the electronic components that are soldered to the pads of the printed wiring board are basically the same when they are the same electronic components. However, even if it is the same electronic component, for example, different manufacturers, there may be slightly different positions, sizes, shapes, etc. of the terminals. Moreover, even if it is the same electronic component of the same manufacturer, the position, size, shape, etc. of the terminal may be changed through design changes or specification changes. In this case, there is a possibility that the position, size, and shape of the pad of the printed wiring board do not conform to the position, size, and shape of the terminal of the electronic component.
並且,在印刷配線基板之墊片的位置,尺寸,形狀則不符合於電子構件之端子的位置,尺寸,形狀等狀態中,在迴焊爐中,印刷配線基板之墊片與電子構件的端子之間的焊錫產生熔融時,有著在熔融的焊錫上,電子構件產生移動而安裝位置偏移之可能性。並且,當電子構件的安裝位置產生偏移時,有著經由此而例如,其電子構件所則接觸於所鄰接之其他的電子構件,以及產生有端子之接觸不良,電路短路等之虞。此情況,例如在將印刷配線基板放入至迴焊爐之前的工程,由以樹脂等而將電子構件固定於印刷配線基板者,亦可防止安裝位置之偏移者。但當追加以樹脂等而將電子構件固定於印刷配線基板之工程時,由增加其工程部分而造成製造成本上升之故,而並不理想。從如此情況,例如,對於變更電子構件的製造廠商之情況,或者有著電子構件之設計變更或規格變更等情況,係每次,必須有印刷配線基板之設計變更之可能性,而經由此產生有製造成本增加之虞。 In addition, in the position, size, and shape of the pad of the printed wiring board does not match the position, size, shape, etc. of the terminal of the electronic component, in the reflow furnace, the pad of the printed wiring board and the terminal of the electronic component When the solder in between is melted, there is a possibility that the electronic component moves on the molten solder and the mounting position is shifted. Moreover, when the mounting position of the electronic component is shifted, for example, the electronic component may be in contact with other electronic components adjacent to it, and there may be a poor contact of the terminal or a short circuit of the circuit. In this case, for example, before the printed wiring board is put into the reflow furnace, if the electronic component is fixed to the printed wiring board with resin or the like, it is possible to prevent the mounting position from shifting. However, when a process of fixing an electronic component to a printed circuit board with resin or the like is added, the manufacturing cost increases due to the increase of the engineering part, which is not ideal. From this situation, for example, for the case of changing the manufacturer of the electronic component, or there is a change in the design or specification of the electronic component, etc., every time, there must be a possibility of design change of the printed wiring board, and there is Increased manufacturing costs.
另外,例如,如可作為呈將使用於規格不同之電子機器的印刷配線基板作為共通化,而因應其電子機器的規格,選擇電性特性不同之同種的電子構件進行安裝時,成為可削減製造成本。但即使為同種的電子構件,對於電性特性不同之情況,係仍亦有可能端子之位置,尺寸,形狀等不同之情況。並且,當作為必須因應端子之位置,尺寸,形狀等不同之電子構件之這些而設計複數之配線基板時,成為阻礙了經由印刷配線基板之共通化的成本 削減。 In addition, for example, if the printed wiring board used in electronic equipment with different specifications can be used as a common, and the same type of electronic components with different electrical characteristics are selected and mounted according to the specifications of the electronic equipment, it can be reduced in manufacturing. cost. However, even if they are the same kind of electronic components, it is still possible that the position, size, shape, etc. of the terminals are different for the case where the electrical characteristics are different. Moreover, when a plurality of wiring boards have to be designed as electronic components having different positions, sizes, shapes, etc. of the terminals, it becomes a cost that hinders the commonality of printed wiring boards reduce.
作為將解決如此課題為目的之以往技術的一例,周知有:具備加以對向配置之2個墊片,而其2個墊片係相互的對向側為短邊,而其相反側則成為長邊之略台形,依據其2個墊片之間隔,加以搭載有短邊及長邊之尺寸之預定的晶片構件的最大及最小外形尺寸而加以決定的印刷配線基板(例如,參照專利文獻1)。 As an example of a conventional technique aimed at solving such a problem, it is well known that there are two shims arranged oppositely, and the two shims are opposite sides of each other as short sides, while the opposite side becomes long The shape of the edge is slightly mesa-shaped, and the printed circuit board is determined based on the distance between the two pads and the maximum and minimum external dimensions of the predetermined wafer member on which the size of the short side and the long side are mounted (for example, see Patent Document 1) .
[專利文獻1]日本特開平09-199841號公報 [Patent Document 1] Japanese Patent Laid-Open No. 09-199841
但上述之以往技術,係將以JIS(Japanese Industrial Standards:日本工業規格)或EIA(Electronic Industries Alliance:電子工業會)所規格化之晶片構件,即,端子之位置,尺寸,形狀等則因應電性特性的不同而以相似形,比例上不同之晶片構件,作為對象之構成。也就是,上述之以往技術係只可使用於實質上被規格化之晶片構件之技術,例如,對於未加以規格化端子之位置,尺寸,形狀等之電子構件,係有幾乎無法對應之課題。 However, the above-mentioned conventional technology will be based on JIS (Japanese Industrial Standards: Japanese Industrial Standards) or EIA (Electronic Industries Alliance: Electronic Industry Association) standardized wafer components, that is, the position, size, shape, etc. of the terminal in accordance with the power The wafer structure with similar shapes and different proportions as the object of the different sexual characteristics. That is, the above-mentioned conventional technology is a technology that can only be used for substantially standardized wafer components. For example, for electronic components whose positions, sizes, and shapes of terminals are not standardized, there is a problem that it is almost impossible to respond.
有鑑於如此之狀況而作為本發明之構成,其目的係實現安裝未加以規格化端子之位置,尺寸,形狀等 之電子構件的印刷配線基板之共通化者。 In view of such a situation, the structure of the present invention aims to realize the position, size, shape, etc. of the terminal where the terminal is not standardized. The generalization of printed circuit boards for electronic components.
本發明之第1形態係具備:含有選擇性地安裝有第1電子構件或第2電子構件之構件安裝範圍的基板,和加以設置於前述構件安裝範圍,連接有前述第1電子構件或前述第2電子構件之第1端子的第1導體,和加以形成於前述基板表面之光阻層;前述第1導體係包含由前述光阻層被覆前述第1導體之一部分所形成之第1墊片部及第2墊片部;前述第1導體的第1墊片部係對於安裝前述第1電子構件部於前述構件安裝範圍之情況,構成規定前述第1電子構件之第1端子的位置之形狀,而前述第1導體的第2墊片部係對於安裝前述第2電子構件部於前述構件安裝範圍之情況,構成規定前述第2電子構件之第1端子的位置之形狀的印刷配線基板。 A first aspect of the present invention includes: a substrate including a component mounting range where a first electronic component or a second electronic component is selectively mounted, and a board provided in the component mounting range, to which the first electronic component or the first electronic component is connected 2 The first conductor of the first terminal of the electronic component and the photoresist layer formed on the surface of the substrate; the first conductor system includes a first pad portion formed by covering a part of the first conductor with the photoresist layer And the second pad part; the first pad part of the first conductor is a shape that defines the position of the first terminal of the first electronic component when the first electronic component part is mounted on the component mounting range, The second pad portion of the first conductor constitutes a printed wiring board that defines the shape of the position of the first terminal of the second electronic component when the second electronic component portion is mounted on the component mounting range.
第1導體的第1墊片部與第2墊片部係由光阻層被覆第1導體的一部分而加以形成。隨之,第1導體的第1墊片部與第2墊片部係均為第1導體的一部分,而相互加以電性連接。另外,第1導體的第1墊片部與第2墊片部之位置,尺寸,形狀係可由調整形成光阻層之範圍而自由地進行設定。 The first pad portion and the second pad portion of the first conductor are formed by covering a part of the first conductor with a photoresist layer. Along with this, the first pad portion and the second pad portion of the first conductor are both part of the first conductor, and are electrically connected to each other. In addition, the position, size, and shape of the first pad portion and the second pad portion of the first conductor can be freely set by adjusting the range in which the photoresist layer is formed.
並且,第1導體之第1墊片部係對於安裝有第1電子構件於構件安裝範圍之情況,規定第1電子構件 之第1端子的位置。另一方,第1導體之第2墊片部係對於安裝有第2電子構件於構件安裝範圍之情況,規定第2電子構件之第1端子的位置。也就是對於連接有第1電子構件或第2電子構件的第1端子之第1導體,係各加以形成有對應於第1電子構件之第1端子的位置,尺寸,形狀等之第1墊片部,及對應於第2電子構件之第1端子的位置,尺寸,形狀等之第2墊片部。 In addition, the first pad portion of the first conductor defines the first electronic component when the first electronic component is mounted on the component mounting range Of the first terminal. On the other hand, the second pad portion of the first conductor specifies the position of the first terminal of the second electronic component when the second electronic component is mounted on the component mounting range. That is, for the first conductor to which the first terminal of the first electronic component or the second electronic component is connected, each is formed with a first pad corresponding to the position, size, shape, etc. of the first terminal of the first electronic component Part, and the second pad part corresponding to the position, size, shape, etc. of the first terminal of the second electronic component.
對於經由此而安裝第1電子構件於構件安裝範圍之情況,因可經由第1導體之第1墊片部而規定第1電子構件之第1端子的位置於特定位置之故,可安裝第1電子構件於構件安裝範圍的特定位置者。另一方,對於安裝第2電子構件於構件安裝範圍之情況,因可經由第1導體之第2墊片部而規定第2電子構件之第1端子的位置於特定位置之故,可安裝第2電子構件於構件安裝範圍的特定位置者。隨之,可選擇性地安裝第1端子之位置,尺寸,形狀等不同之第1電子構件或第2電子構件於構件安裝範圍者。 In the case where the first electronic component is mounted on the component mounting range through this, since the position of the first terminal of the first electronic component can be specified at a specific position through the first pad portion of the first conductor, the first electronic component can be mounted The electronic component is in a specific position in the component installation range. On the other hand, in the case of mounting the second electronic component in the component mounting range, since the position of the first terminal of the second electronic component can be specified at a specific position through the second pad portion of the first conductor, the second The electronic component is in a specific position in the component installation range. Along with this, it is possible to selectively mount the first electronic component or the second electronic component with different positions, sizes, shapes, etc. of the first terminal in the component mounting range.
經由此,如根據本發明之第1形態時,加以得到可實現安裝為規格化端子的位置,尺寸,形狀等之電子構件的印刷配線基板的共通化之作用效果。 As a result, as in the first aspect of the present invention, the effect of achieving the commonality of printed circuit boards that can be mounted as electronic components of standardized terminal positions, sizes, shapes, etc. is obtained.
本發明之第2形態係在前述之本發明的第1形態中,前述第1導體之第1墊片部係對於安裝前述第1電子構件 於前述構件安裝範圍之情況,構成規定在前述第1電子構件的第1端子之X方向的一方側的端位置,具有第1X方向位置規定部的形狀,而前述第1導體之第2墊片部係對於安裝前述第2電子構件於前述構件安裝範圍之情況,構成規定在前述第2電子構件的第1端子之前述X方向的一方側的端位置,具有第2X方向位置規定部的形狀之印刷配線基板。 According to a second aspect of the present invention, in the aforementioned first aspect of the present invention, the first pad portion of the first conductor is for mounting the first electronic component In the case of the above-mentioned component mounting range, it is configured to define the end position of the first terminal of the first electronic component on the one side in the X direction, and has the shape of the position defining portion in the first X direction, and the second pad of the first conductor For mounting the second electronic component in the component mounting range, the portion is configured to define an end position on one side of the first terminal of the second electronic component in the X direction, and has a shape of a position defining portion in the second X direction Printed wiring board.
如根據本發明之第2形態時,對於安裝第1電子構件於構件安裝範圍之情況,係可經由第1X方向位置規定部,將在第1電子構件的第1端子之X方向的一方側的端位置,規定於特定位置者。另一方,對於安裝第2電子構件於構件安裝範圍之情況,係可經由第2X方向位置規定部,將在第2電子構件的第1端子之X方向的一方側的端位置,規定於特定位置者。 According to the second aspect of the present invention, in the case of mounting the first electronic component in the component mounting range, the first terminal of the first electronic component in the X direction can be placed on the side of the X direction through the first X-direction position specifying portion End position, specified in a specific position. On the other hand, in the case of mounting the second electronic component in the component mounting range, the end position on the one side in the X direction of the first terminal of the second electronic component can be specified at a specific position through the second X-direction position specifying portion By.
本發明之第3形態係在前述之本發明的第2形態中,前述第1導體之第1墊片部係對於安裝前述第1電子構件於前述構件安裝範圍之情況,構成規定在交叉於前述第1電子構件的第1端子之前述X方向的Y方向之兩端位置,具有第1Y方向位置規定部的形狀,而前述第1導體之第2墊片部係對於安裝前述第2電子構件於前述構件安裝範圍之情況,構成規定在前述第2電子構件的第1端子之前述Y方向的兩端位置,具有第2Y方向位置規定部的 形狀之印刷配線基板。 A third aspect of the present invention is that in the second aspect of the present invention described above, the first pad portion of the first conductor is configured to intersect the foregoing with respect to the case where the first electronic component is mounted on the component mounting range. Both ends of the first terminal of the first electronic component in the X direction and the Y direction have the shape of a position defining portion in the first Y direction, and the second pad portion of the first conductor is for mounting the second electronic component in In the case of the aforementioned component mounting range, the structure is defined at the both end positions of the first terminal of the second electronic component in the Y direction, and has a second Y direction position specifying portion Shaped printed circuit board.
如根據本發明之第3形態時,對於安裝第1電子構件於構件安裝範圍之情況,係更可經由第1Y方向位置規定部,將在第1電子構件的第1端子之Y方向的兩端位置,規定於特定位置者。另一方,對於安裝第2電子構件於構件安裝範圍之情況,係更可經由第2Y方向位置規定部,將在第2電子構件的第1端子之Y方向的兩端位置,規定於特定位置者。 According to the third aspect of the present invention, for mounting the first electronic component in the component mounting range, the first terminal of the first electronic component can be placed at both ends of the first electronic component in the Y direction Location, specified in a specific location. On the other hand, in the case of mounting the second electronic component in the component mounting range, the position of both ends in the Y direction of the first terminal of the second electronic component can be specified at a specific position through the second Y-direction position specifying portion .
本發明之第4形態係在前述之本發明的第1至第3形態之任一中,更具備:對於前述構件安裝範圍之前述第1導體而言,加以設置於離間於在前述X方向之一方側的位置,加以連接前述第1電子構件或前述第2電子構件之第2端子的第2導體,而前述第2導體係包含:由前述光阻層被覆前述第2導體之一部分者而加以形成之第1墊片部及第2墊片部,而前述第2導體之第1墊片部係對於安裝前述第1電子構件於前述構件安裝範圍之情況,構成規定前述第1電子構件的第2端子之位置的形狀,而前述第2導體之第2墊片部係對於安裝前述第2電子構件於前述構件安裝範圍之情況,構成規定前述第2電子構件的第2端子之位置的形狀之印刷配線基板。 The fourth aspect of the present invention is any one of the aforementioned first to third aspects of the present invention, further comprising: the first conductor in the member mounting range is provided at a distance between the X direction and the At one side, a second conductor connected to the second terminal of the first electronic component or the second terminal of the second electronic component, and the second conductive system includes: a part of the second conductor covered by the photoresist layer The first pad portion and the second pad portion are formed, and the first pad portion of the second conductor is configured to define the first electronic component in the case where the first electronic component is mounted on the component mounting range. The shape of the position of the 2 terminal, and the second pad portion of the second conductor is a shape that defines the position of the second terminal of the second electronic component in the case of mounting the second electronic component in the component mounting range Printed wiring board.
第2導體的第1墊片部與第2墊片部係由光阻層被覆第2導體的一部分而加以形成。隨之,第2導體 的第1墊片部與第2墊片部係均為第2導體的一部分,而相互加以電性連接。另外,第2導體的第1墊片部與第2墊片部之位置,尺寸,形狀係可由調整形成光阻層之範圍而自由地進行設定。 The first pad portion and the second pad portion of the second conductor are formed by covering a part of the second conductor with a photoresist layer. Following this, the second conductor The first pad part and the second pad part are both part of the second conductor, and are electrically connected to each other. In addition, the position, size, and shape of the first pad portion and the second pad portion of the second conductor can be freely set by adjusting the range in which the photoresist layer is formed.
並且,第2導體之第1墊片部係對於安裝有第1電子構件於構件安裝範圍之情況,規定第1電子構件之第2端子的位置。另一方,第2導體之第2墊片部係對於安裝有第2電子構件於構件安裝範圍之情況,規定第2電子構件之第2端子的位置。也就是對於連接有第1電子構件或第2電子構件的第2端子之第2導體,係各加以形成有對應於第1電子構件之第2端子的位置,尺寸,形狀等之第1墊片部,及對應於第2電子構件之第2端子的位置,尺寸,形狀等之第2墊片部。 In addition, the first pad portion of the second conductor defines the position of the second terminal of the first electronic component when the first electronic component is mounted on the component mounting range. On the other hand, the second pad portion of the second conductor specifies the position of the second terminal of the second electronic component when the second electronic component is mounted on the component mounting range. That is, for the second conductor to which the first electronic component or the second terminal of the second electronic component is connected, each is formed with a first pad corresponding to the position, size, shape, etc. of the second terminal of the first electronic component Part, and a second pad part corresponding to the position, size, shape, etc. of the second terminal of the second electronic component.
對於經由此而加以安裝第1電子構件於構件安裝範圍之情況,可經由第1導體之第1墊片部而將第1電子構件的第1端子之位置規定於特定位置之同時,可經由第2導體之第1墊片部而將第1電子構件的第2端子之位置規定於特定位置之故,而可安裝第1電子構件於構件安裝範圍之特定位置者。另一方,對於經由此而加以安裝第2電子構件於構件安裝範圍之情況,可經由第1導體之第2墊片部而將第2電子構件的第1端子之位置規定於特定位置之同時,可經由第2導體之第2墊片部而將第2電子構件的第2端子之位置規定於特定位置之故,而可安裝第2電子構件於構件安裝範圍之特定位置者。隨之,可選 擇性地安裝第1端子及第2端子之位置,尺寸,形狀等不同之第1電子構件或第2電子構件於構件安裝範圍者。 For the case where the first electronic component is mounted on the component mounting range through this, the position of the first terminal of the first electronic component can be specified at a specific position through the first pad portion of the first conductor, and the The first pad part of the 2 conductor defines the position of the second terminal of the first electronic component at a specific position, and the first electronic component can be mounted at a specific position in the component mounting range. On the other hand, for the case where the second electronic component is mounted on the component mounting range through this, the position of the first terminal of the second electronic component can be specified at a specific position through the second pad portion of the first conductor, The position of the second terminal of the second electronic component can be specified at a specific position through the second pad portion of the second conductor, and the second electronic component can be mounted at a specific position in the component mounting range. With that, optional Selectively install the first electronic component or the second electronic component with different positions, sizes, shapes, etc. of the first terminal and the second terminal in the component mounting range.
本發明之第5形態係在前述之本發明的第4形態中,前述第2導體之第1墊片部係對於安裝前述第1電子構件於前述構件安裝範圍之情況,構成規定在前述第1電子構件的第2端子之前述X方向的另一方側的端位置,具有第3X方向位置規定部的形狀,而前述第2導體之第2墊片部係對於安裝前述第2電子構件於前述構件安裝範圍之情況,構成規定在前述第2電子構件的第2端子之前述X方向的另一方側的端位置,具有第4X方向位置規定部的形狀之印刷配線基板。 According to a fifth aspect of the present invention, in the fourth aspect of the present invention described above, the first pad portion of the second conductor is configured for the case where the first electronic component is mounted on the component mounting range, and the structure is defined in the first The end position of the second terminal of the electronic component on the other side in the X direction has a shape of a predetermined position in the 3X direction, and the second pad portion of the second conductor is for mounting the second electronic component on the component In the case of the mounting range, a printed wiring board having a shape of a predetermined portion in the fourth X-direction position is defined at an end position of the second terminal of the second electronic component on the other side in the X-direction.
如根據本發明之第4形態時,對於安裝第1電子構件於構件安裝範圍之情況,係可經由第3X方向位置規定部,將在第1電子構件的第2端子之X方向的另一方側的端位置,規定於特定位置者。另一方,對於安裝第2電子構件於構件安裝範圍之情況,係可經由第4X方向位置規定部,將在第2電子構件的第2端子之X方向的另一方側的端位置,規定於特定位置者。 According to the fourth aspect of the present invention, in the case of mounting the first electronic component in the component mounting range, the second terminal of the first electronic component in the X direction can be placed on the other side of the X terminal through the third X-direction position specifying portion The end position is specified in a specific position. On the other hand, in the case of mounting the second electronic component in the component mounting range, the end position on the other side in the X direction of the second terminal of the second electronic component can be specified to be specific Positioner.
本發明之第6形態係在前述之本發明的第5形態中,前述第2導體之第1墊片部係對於安裝前述第1電子構件 於前述構件安裝範圍之情況,構成規定在前述第1電子構件的第2端子之前述Y方向的兩端位置,具有第3Y方向位置規定部的形狀,而前述第2導體之第2墊片部係對於安裝前述第2電子構件於前述構件安裝範圍之情況,構成規定在前述第2電子構件的第2端子之前述Y方向的兩端位置,具有第4Y方向位置規定部的形狀之印刷配線基板。 According to a sixth aspect of the present invention, in the fifth aspect of the present invention described above, the first pad portion of the second conductor is for mounting the first electronic component In the case of the aforementioned component mounting range, the second terminal portion of the first electronic component has a shape that defines a position defining portion in the third Y direction, and the second pad portion of the second conductor In the case where the second electronic component is mounted on the component mounting range, a printed wiring board having a shape of a predetermined portion in the fourth Y direction position is defined at both end positions of the second terminal of the second electronic component in the Y direction .
如根據本發明之第6形態時,對於安裝第1電子構件於構件安裝範圍之情況,係更可經由第3Y方向位置規定部,將在第1電子構件的第2端子之Y方向的兩端位置,規定於特定位置者。另一方,對於安裝第2電子構件於構件安裝範圍之情況,係更可經由第4Y方向位置規定部,將在第2電子構件的第2端子之Y方向的兩端位置,規定於特定位置者。 According to the sixth aspect of the present invention, for the case of mounting the first electronic component in the component mounting range, it is possible to place the second terminal of the first electronic component in the Y direction through the third Y direction position specifying portion Location, specified in a specific location. On the other hand, in the case of mounting the second electronic component in the component mounting range, the position of both ends in the Y direction of the second terminal of the second electronic component can be specified at a specific position via the 4th direction position specifying portion .
如根據本發明,可實現安裝為規格化端子之位置,尺寸,形狀等之電子構件的印刷配線基板之共通化者。 According to the present invention, it is possible to realize commonization of printed wiring boards mounted as electronic components of standardized terminal positions, sizes, shapes, and the like.
10‧‧‧印刷配線基板 10‧‧‧ printed wiring board
11‧‧‧基板 11‧‧‧ substrate
12‧‧‧光阻層 12‧‧‧Photoresist layer
13‧‧‧構件安裝範圍 13‧‧‧Component installation scope
20‧‧‧第1導體 20‧‧‧The first conductor
21~24‧‧‧第1導體之墊片 21 ~ 24‧‧‧ First Gasket
30‧‧‧第2導體 30‧‧‧ 2nd conductor
31~34‧‧‧第2導體之墊片 31 ~ 34‧‧‧Second Conductor Gasket
40‧‧‧第1電子構件 40‧‧‧The first electronic component
41、51‧‧‧第1端子 41, 51‧‧‧ First terminal
42、52‧‧‧第2端子 42、52‧‧‧2nd terminal
50‧‧‧第2電子構件 50‧‧‧The second electronic component
圖1係圖示安裝第1電子構件於第1實施例的印刷配線基板之狀態的側面圖。 FIG. 1 is a side view illustrating a state where the first electronic component is mounted on the printed wiring board of the first embodiment.
圖2係圖示安裝第1電子構件於第1實施例的印刷配線基板之狀態的平面圖。 2 is a plan view illustrating a state where the first electronic component is mounted on the printed wiring board of the first embodiment.
圖3係圖示安裝第2電子構件於第1實施例的印刷配線基板之狀態的側面圖。 3 is a side view illustrating a state where the second electronic component is mounted on the printed circuit board of the first embodiment.
圖4係圖示安裝第2電子構件於第1實施例的印刷配線基板之狀態的平面圖。 4 is a plan view illustrating a state where the second electronic component is mounted on the printed circuit board of the first embodiment.
圖5係擴大圖示在安裝第1電子構件的狀態之第1導體的平面圖。 FIG. 5 is an enlarged plan view of the first conductor in a state where the first electronic component is mounted.
圖6係擴大圖示在安裝第2電子構件的狀態之第1導體的平面圖。 6 is an enlarged plan view of the first conductor in a state where the second electronic component is mounted.
圖7係擴大圖示在安裝第1電子構件的狀態之第2導體的平面圖。 7 is an enlarged plan view showing the second conductor in a state where the first electronic component is mounted.
圖8係擴大圖示在安裝第2電子構件的狀態之第2導體的平面圖。 8 is an enlarged plan view showing the second conductor in a state where the second electronic component is mounted.
圖9係擴大圖示第2實施例之印刷配線基板之第1導體的平面圖。 9 is an enlarged plan view of the first conductor of the printed wiring board of the second embodiment.
圖10係擴大圖示第2實施例之印刷配線基板之第2導體的平面圖。 10 is an enlarged plan view of the second conductor of the printed wiring board of the second embodiment.
以下,對於本發明之實施形態,參照圖面之同時加以說明。 Hereinafter, the embodiments of the present invention will be described with reference to the drawings.
然而,本發明係未特別加以限定於以下說明之實施例,而當然可在記載於申請專利範圍之發明的範圍內做種 種的變形者。 However, the present invention is not particularly limited to the embodiments described below, but of course it can be planted within the scope of the invention described in the patent application Kind of deformer.
對於有關本發明之印刷配線基板10之第1實施例,參照圖1~圖8同時進行說明。 The first embodiment of the printed wiring board 10 of the present invention will be described simultaneously with reference to FIGS. 1 to 8.
圖1係圖示安裝第1電子構件40於第1實施例的印刷配線基板10之狀態的側面圖。圖2係圖示安裝第1電子構件40於第1實施例的印刷配線基板10之狀態的平面圖。圖3係圖示安裝第2電子構件50於第1實施例的印刷配線基板10之狀態的側面圖。圖4係圖示安裝第2電子構件50於第1實施例的印刷配線基板10之狀態的平面圖。 FIG. 1 is a side view illustrating a state where the first electronic component 40 is mounted on the printed circuit board 10 of the first embodiment. 2 is a plan view illustrating a state where the first electronic component 40 is mounted on the printed wiring board 10 of the first embodiment. 3 is a side view illustrating a state where the second electronic component 50 is mounted on the printed circuit board 10 of the first embodiment. 4 is a plan view illustrating a state where the second electronic component 50 is mounted on the printed circuit board 10 of the first embodiment.
有關本發明之印刷配線基板10係具備:基板11,和光阻層12,和第1導體20,和第2導體30。 The printed circuit board 10 according to the present invention includes a substrate 11, a photoresist layer 12, a first conductor 20, and a second conductor 30.
基板11係單面或兩面基板或是多層基板等,而為玻璃聚酯基板等之剛性基板。基板11係包含加以形成於表層或內層之配線圖案,金屬銲點,墊片,貫孔(未圖示),經由安裝電子構件而構成特定的電子電路。基板11係包含選擇性地加以安裝第1電子構件40或第2電子構件50之構件安裝範圍13。光阻層12係例如為抗焊劑等,呈被覆基板11之表面地加以塗佈等,形成於基板11的表面。 The substrate 11 is a single-sided or double-sided substrate or a multilayer substrate, etc., and is a rigid substrate such as a glass polyester substrate. The substrate 11 includes wiring patterns formed on the surface layer or the inner layer, metal pads, pads, and through holes (not shown), and constitutes a specific electronic circuit by mounting electronic components. The substrate 11 includes a component mounting range 13 where the first electronic component 40 or the second electronic component 50 is selectively mounted. The photoresist layer 12 is, for example, a solder resist or the like, is applied so as to cover the surface of the substrate 11, and is formed on the surface of the substrate 11.
在此,第1電子構件40或第2電子構件50係例如為外形尺寸相同之面安裝構件,電性特性不同之同 種的電子構件。更具體而言,第1電子構件40或第2電子構件50,例如電性特性不同之感應器(線圈)構件。另外,第1電子構件40之第1端子41與第2端子42係其尺寸及形狀係為相同。同樣地,第2電子構件50之第1端子51與第2端子52係其尺寸及形狀係為相同。另一方,第1電子構件40之第1端子41與第2端子42之位置,尺寸,形狀係與第2電子構件50之第1端子51與第2端子52之位置,尺寸,形狀不同。 Here, the first electronic component 40 or the second electronic component 50 is, for example, a surface mounting component having the same external dimensions, and the electrical characteristics are different. Kinds of electronic components. More specifically, the first electronic member 40 or the second electronic member 50 is, for example, an inductor (coil) member having different electrical characteristics. In addition, the first terminal 41 and the second terminal 42 of the first electronic component 40 have the same size and shape. Similarly, the size and shape of the first terminal 51 and the second terminal 52 of the second electronic component 50 are the same. On the other hand, the position, size, and shape of the first terminal 41 and the second terminal 42 of the first electronic component 40 are different from those of the first terminal 51 and the second terminal 52 of the second electronic component 50.
第1導體20係加以設置於構件安裝範圍13,加以連接於基板11之配線圖案。第1導體20係對於安裝第1電子構件40於構件安裝範圍13之情況,係經由附上焊錫而加以連接第1電子構件40之第1端子41,而對於安裝第2電子構件50於構件安裝範圍13之情況,係經由附上焊錫而加以連接第2電子構件50之第1端子51。 The first conductor 20 is provided in the component mounting range 13 and connected to the wiring pattern of the substrate 11. The first conductor 20 is connected to the first terminal 41 of the first electronic component 40 by attaching solder to the case where the first electronic component 40 is mounted on the component mounting area 13, and the component mounting area is used to mount the second electronic component 50 In the case of the range 13, the first terminal 51 of the second electronic component 50 is connected by attaching solder.
第1導體20係包含由光阻層12被覆第1導體20之一部分者所加以形成之3個墊片21~23。第1導體20之3個墊片21~23係均為第1導體20之一部分,而相互加以電性連接。另外,第1導體20的3個墊片21~23之位置,尺寸,形狀係可由調整形成光阻層12之範圍而自由地進行設定。 The first conductor 20 includes three pads 21 to 23 formed by covering a part of the first conductor 20 with the photoresist layer 12. The three pads 21 to 23 of the first conductor 20 are all part of the first conductor 20 and are electrically connected to each other. In addition, the positions, sizes, and shapes of the three pads 21 to 23 of the first conductor 20 can be freely set by adjusting the range in which the photoresist layer 12 is formed.
加以安裝第1電子構件40於構件安裝範圍13之情況,在迴焊爐內,第1電子構件40之第1端子41與墊片21之間的焊錫產生熔融的狀態中,其第1電子構件40之第1端子41的位置係經由熔融之焊錫的表面張力而 加以限制為墊片21之外形形狀的範圍內。作為「第1導體之第1墊片部」之墊片21係對於安裝有第1電子構件40於構件安裝範圍13之情況,構成規定第1電子構件40之第1端子41的位置的形狀(圖2)。 In the case where the first electronic component 40 is mounted on the component mounting range 13, the first electronic component is in a state where the solder between the first terminal 41 of the first electronic component 40 and the pad 21 melts in the reflow furnace The position of the first terminal 41 of 40 is determined by the surface tension of the molten solder It is limited to the outer shape of the gasket 21. The pad 21 as the "first pad portion of the first conductor" is a shape that defines the position of the first terminal 41 of the first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 ( figure 2).
另一方,加以安裝第2電子構件50於構件安裝範圍13之情況,在迴焊爐內,第2電子構件50之第1端子51與墊片21~23之間的焊錫產生熔融的狀態中,其第2電子構件50之第1端子51的位置係經由熔融之焊錫的表面張力而加以限制為墊片22及墊片23之外形形狀的範圍內。作為「第1導體之第2墊片部」之墊片22及墊片23係對於安裝有第2電子構件50於構件安裝範圍13之情況,構成規定第2電子構件50之第1端子51的位置的形狀(圖4)。 On the other hand, when the second electronic component 50 is mounted on the component mounting range 13, the solder between the first terminal 51 of the second electronic component 50 and the pads 21 to 23 is melted in the reflow furnace, The position of the first terminal 51 of the second electronic component 50 is restricted to the range of the outer shape of the pad 22 and the pad 23 by the surface tension of the molten solder. The pad 22 and the pad 23 as the "second pad part of the first conductor" constitute the first terminal 51 that defines the first terminal 51 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The shape of the location (Figure 4).
也就是,對於第1導體20係各加以形成有對應第1電子構件40之第1端子41的位置,尺寸,形狀等之墊片21,及對應第2電子構件50之第1端子51的位置,尺寸,形狀等之墊片22及墊片23。墊片21之位置,尺寸,形狀係因應第1電子構件40之第1端子41的位置,尺寸,形狀等,呈規定第1電子構件40之第1端子41的位置於特定位置地加以決定之同時,更且墊片21之焊錫量則呈成為適當之焊錫量地加以決定。各墊片22及墊片23之位置,尺寸,形狀係因應第2電子構件50之第1端子51的位置,尺寸,形狀等,呈規定第2電子構件50之第1端子51的位置於特定位置地加以決定之同 時,更且墊片22及墊片23之焊錫量則呈成為適當之焊錫量地加以決定。 That is, the first conductor 20 is formed with the pad 21 corresponding to the position, size, shape, etc. of the first terminal 41 of the first electronic component 40 and the position corresponding to the first terminal 51 of the second electronic component 50 , Size, shape and other gasket 22 and gasket 23. The position, size, and shape of the spacer 21 are determined in accordance with the position, size, shape, etc. of the first terminal 41 of the first electronic component 40 so as to specify the position of the first terminal 41 of the first electronic component 40 at a specific position At the same time, the amount of solder of the spacer 21 is determined to be an appropriate amount of solder. The position, size, and shape of each pad 22 and pad 23 correspond to the position, size, shape, etc. of the first terminal 51 of the second electronic component 50, and the position of the first terminal 51 of the second electronic component 50 is specified Determined by location At this time, the solder amount of the pad 22 and the pad 23 is determined to be an appropriate solder amount.
第2導體30係加以設置於構件安裝範圍13,更具體而言係對於第1導體20而言,加以設置於離間於在X方向之一方側(以符號X1所示之方向側)的位置。第2導體30係加以連接於基板11之配線圖案。第2導體30係對於安裝第1電子構件40於構件安裝範圍13之情況,係經由附上焊錫而加以連接第1電子構件40之第2端子42,而對於安裝第2電子構件50於構件安裝範圍13之情況,係經由附上焊錫而加以連接第2電子構件50之第2端子52。 The second conductor 30 is provided in the component mounting range 13, more specifically, the first conductor 20 is provided at a position spaced apart on one side in the X direction (direction side indicated by symbol X1). The second conductor 30 is connected to the wiring pattern of the substrate 11. The second conductor 30 is connected to the second terminal 42 of the first electronic component 40 by attaching solder to the case where the first electronic component 40 is mounted on the component mounting range 13, and the component mounting area is used to mount the second electronic component 50 In the case of the range 13, the second terminal 52 of the second electronic component 50 is connected by attaching solder.
第2導體30係包含由光阻層12被覆第2導體30之一部分者所加以形成之3個墊片31~33。第2導體30之3個墊片31~33係均為第2導體30之一部分,而相互加以電性連接。另外,第2導體30的3個墊片31~33之位置,尺寸,形狀係可由調整形成光阻層12之範圍而自由地進行設定。 The second conductor 30 includes three pads 31 to 33 formed by covering a part of the second conductor 30 with the photoresist layer 12. The three pads 31 to 33 of the second conductor 30 are all part of the second conductor 30 and are electrically connected to each other. In addition, the positions, sizes, and shapes of the three pads 31 to 33 of the second conductor 30 can be freely set by adjusting the range in which the photoresist layer 12 is formed.
加以安裝第1電子構件40於構件安裝範圍13之情況,在迴焊爐內,第1電子構件40之第2端子42與墊片31之間的焊錫產生熔融的狀態中,其第1電子構件40之第2端子42的位置係經由熔融之焊錫的表面張力而加以限制為墊片31之外形形狀的範圍內。作為「第2導體之第1墊片部」之墊片31係對於安裝有第1電子構件40於構件安裝範圍13之情況,構成規定第1電子構件40 之第2端子42的位置的形狀(圖2)。 When the first electronic component 40 is mounted on the component mounting range 13, the first electronic component is in a state where the solder between the second terminal 42 of the first electronic component 40 and the pad 31 melts in the reflow furnace The position of the second terminal 42 of 40 is limited to the range of the outer shape of the pad 31 by the surface tension of the molten solder. The pad 31 as the "first pad portion of the second conductor" constitutes a prescribed first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 The shape of the position of the second terminal 42 (FIG. 2).
另一方,加以安裝第2電子構件50於構件安裝範圍13之情況,在迴焊爐內,第2電子構件50之第2端子52與墊片31~33之間的焊錫產生熔融的狀態中,其第2電子構件50之第2端子52的位置係經由熔融之焊錫的表面張力而加以限制為墊片32及墊片33之外形形狀的範圍內。作為「第2導體之第2墊片部」之墊片32及墊片33係對於安裝有第2電子構件50於構件安裝範圍13之情況,構成規定第2電子構件50之第2端子52的位置的形狀(圖4)。 On the other hand, when the second electronic component 50 is mounted on the component mounting range 13, in the reflow furnace, the solder between the second terminal 52 of the second electronic component 50 and the pads 31 to 33 is molten, The position of the second terminal 52 of the second electronic component 50 is restricted to the outer shape of the pad 32 and the pad 33 by the surface tension of the molten solder. The pad 32 and the pad 33 as the "second pad portion of the second conductor" constitute the second terminal 52 that defines the second terminal 52 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The shape of the location (Figure 4).
也就是,對於第2導體30係各加以形成有對應第1電子構件40之第2端子42的位置,尺寸,形狀等之墊片31,及對應第2電子構件50之第2端子52的位置,尺寸,形狀等之墊片32及墊片33。墊片31之位置,尺寸,形狀係因應第1電子構件40之第2端子42的位置,尺寸,形狀等,呈規定第1電子構件40之第2端子42的位置於特定位置地加以決定之同時,更且墊片31之焊錫量則呈成為適當之焊錫量地加以決定。各墊片32及墊片33之位置,尺寸,形狀係因應第2電子構件50之第2端子52的位置,尺寸,形狀等,呈規定第2電子構件50之第2端子52的位置於特定位置地加以決定之同時,更且墊片32及墊片33之焊錫量則呈成為適當之焊錫量地加以決定。 That is, the second conductor 30 is formed with a pad 31 corresponding to the position, size, shape, etc. of the second terminal 42 of the first electronic component 40 and a position corresponding to the second terminal 52 of the second electronic component 50 , Size, shape, gasket 32 and gasket 33. The position, size, and shape of the spacer 31 are determined in accordance with the position, size, shape, etc. of the second terminal 42 of the first electronic component 40 so as to specify the position of the second terminal 42 of the first electronic component 40 at a specific position At the same time, the amount of solder of the pad 31 is determined to be an appropriate amount of solder. The position, size, and shape of each pad 32 and pad 33 correspond to the position, size, shape, etc. of the second terminal 52 of the second electronic component 50, and the position of the second terminal 52 of the second electronic component 50 is specified While the position is determined, the solder amount of the pad 32 and the pad 33 is determined to be an appropriate solder amount.
有關如此構成之本發明的印刷配線基板10係 對於安裝第1電子構件40於構件安裝範圍13之情況,可經由第1導體20之墊片21而規定第1電子構件40之第1端子41的位置於特定位置之同時,可經由第2導體30之墊片31而規定第1電子構件40之第2端子42的位置於特定位置。對於經由此而安裝第1電子構件40於構件安裝範圍13之情況,可於構件安裝範圍13之特定位置,安裝第1電子構件40者。 The printed wiring board 10 of the present invention thus constituted For the case where the first electronic component 40 is mounted on the component mounting range 13, the position of the first terminal 41 of the first electronic component 40 can be specified at a specific position through the pad 21 of the first conductor 20, and can be passed through the second conductor The spacer 31 of 30 defines the position of the second terminal 42 of the first electronic component 40 at a specific position. In the case where the first electronic component 40 is mounted on the component mounting range 13 through this, the first electronic component 40 can be mounted on a specific position of the component mounting range 13.
另一方,對於安裝第2電子構件50於構件安裝範圍13之情況,可經由第1導體20之墊片22及墊片23而規定第2電子構件50之第1端子51的位置於特定位置之同時,可經由第2導體30之墊片32及墊片33而規定第2電子構件50之第2端子52的位置於特定位置。對於經由此而安裝第2電子構件50於構件安裝範圍13之情況,可於構件安裝範圍13之特定位置,安裝第2電子構件50者。 On the other hand, for the case where the second electronic component 50 is mounted on the component mounting range 13, the position of the first terminal 51 of the second electronic component 50 can be specified at a specific position through the pad 22 and the pad 23 of the first conductor 20 At the same time, the position of the second terminal 52 of the second electronic component 50 can be specified at a specific position through the pad 32 and the pad 33 of the second conductor 30. In the case where the second electronic component 50 is mounted on the component mounting range 13 through this, the second electronic component 50 can be mounted on a specific position of the component mounting range 13.
由如此作為,有關本發明之印刷配線基板10係可選擇性地安裝第1電子構件40或第2電子構件50於構件安裝範圍13者。隨之如根據本發明時,可實現安裝未規格化端子之位置,尺寸,形狀等之電子構件的印刷配線基板10之共通化者。 In this way, the printed wiring board 10 according to the present invention can selectively mount the first electronic component 40 or the second electronic component 50 in the component mounting range 13. Along with this, according to the present invention, it is possible to realize the commonization of the printed wiring board 10 where electronic components such as the position, size, shape, etc. of unstandardized terminals are mounted.
圖5係擴大顯示在安裝第1電子構件40於構件安裝範圍13之狀態的第1導體20之平面圖。圖6係擴大顯示在安裝第2電子構件50於構件安裝範圍13之狀態的第1導體20之平面圖。 FIG. 5 is an enlarged plan view of the first conductor 20 in a state where the first electronic component 40 is mounted on the component mounting range 13. 6 is an enlarged plan view showing the first conductor 20 in a state where the second electronic component 50 is mounted on the component mounting range 13.
第1電子構件40之第1端子41係構成橫寬L1,縱寬L2之矩形形狀。另一方,第2電子構件50之第1端子51係構成橫寬L3,縱寬L4之矩形形狀。例如,在該實施例中,第1端子41之橫寬L1係較第1端子51之橫寬L3為短。另外,第1端子41之縱寬L2係較第1端子51之縱寬L4為長。更且,第1電子構件40之第1端子41係較第2電子構件50之第1端子51,位於偏移於在X方向之另一方側(以符號X2所示之方向側)的位置。 The first terminal 41 of the first electronic component 40 has a rectangular shape with a width L1 and a length L2. On the other hand, the first terminal 51 of the second electronic component 50 has a rectangular shape with a width L3 and a length L4. For example, in this embodiment, the lateral width L1 of the first terminal 41 is shorter than the lateral width L3 of the first terminal 51. In addition, the length L2 of the first terminal 41 is longer than the length L4 of the first terminal 51. Furthermore, the first terminal 41 of the first electronic component 40 is located at a position offset from the first terminal 51 of the second electronic component 50 on the other side in the X direction (direction side indicated by symbol X2).
第1導體20之墊片21係構成包含上底邊211,第1斜邊212,第2斜邊213之略台形形狀。作為「第1X方向位置規定部」之墊片21的上底邊211係對於安裝第1電子構件40於構件安裝範圍13之情況,規定在第1電子構件40之第1端子41之X方向的一方側之端部411(以符號X1所示之方向的端)之位置(圖5)。作為「第1Y方向規定部」之墊片21的第1斜邊212,第2斜邊213係對於安裝第1電子構件40於構件安裝範圍13之情況,規定在交叉於第1電子構件40之第1端子41之X方向之Y方向的兩端部412,413之位置(圖5)。 The pad 21 of the first conductor 20 is formed in a slightly truncated shape including an upper bottom side 211, a first oblique side 212, and a second oblique side 213. The upper bottom edge 211 of the spacer 21 as the "first X-direction position defining portion" is defined in the X direction of the first terminal 41 of the first electronic component 40 for the case where the first electronic component 40 is mounted on the component mounting range 13 The position of the end 411 (the end in the direction indicated by symbol X1) on one side (FIG. 5). The first beveled edge 212 and the second beveled edge 213 of the spacer 21 as the "first Y direction defining portion" are defined to cross the first electronic member 40 when the first electronic member 40 is mounted on the component mounting range 13 The positions of both ends 412, 413 of the first terminal 41 in the X direction and the Y direction (FIG. 5).
然而,例如第1電子構件40之第1端子41的橫寬L1則如為在製造公差的範圍內僅變長之情況,在第1電子構件40之第1端子41之X方向的一方側之端411(以符號X1所示之方向的端)之位置,係可經由墊片21之第1斜邊212及第2斜邊213而加以規定。 However, for example, if the lateral width L1 of the first terminal 41 of the first electronic component 40 only becomes longer within the manufacturing tolerance, on the side of the first terminal 41 of the first electronic component 40 in the X direction The position of the end 411 (the end in the direction indicated by the symbol X1) can be specified by the first beveled edge 212 and the second beveled edge 213 of the gasket 21.
第1導體20之墊片22係包含端部221,斜邊222,而對於墊片21之第1斜邊212,構成沿著略平行之形狀。第1導體20之墊片23係包含端部231,斜邊232,而對於墊片21之第2斜邊213,構成沿著略平行之形狀。作為「第2X方向位置規定部」之墊片22的端部221及墊片23之端部231係對於安裝第2電子構件50於構件安裝範圍13之情況,規定在第2電子構件50之第1端子51之X方向的一方側之端511(以符號X1所示之方向的端)之位置(圖6)。作為「第2Y方向位置規定部」之墊片22的斜邊222及墊片23之斜邊232係對於安裝第2電子構件50於構件安裝範圍13之情況,規定在第2電子構件50之第1端子51之Y方向的兩端512,513之位置(圖6)。 The pad 22 of the first conductor 20 includes an end 221 and a beveled edge 222, and the first beveled edge 212 of the pad 21 is formed along a slightly parallel shape. The pad 23 of the first conductor 20 includes an end 231 and a beveled edge 232, and the second beveled edge 213 of the pad 21 is formed along a slightly parallel shape. The end portion 221 of the gasket 22 and the end portion 231 of the gasket 23 as the "second position defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 1 The position of the end 511 (the end in the direction indicated by the symbol X1) on the one side in the X direction of the terminal 51 (FIG. 6). The beveled edge 222 of the spacer 22 and the beveled edge 232 of the spacer 23 as the "second position defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 1 The positions of both ends 512, 513 in the Y direction of the terminal 51 (FIG. 6).
然而,例如第2電子構件50之第1端子51的橫寬L3則如為在製造公差的範圍內僅變長之情況,在第2電子構件50之第1端子51之X方向的一方側之端511(以符號X1所示之方向的端)之位置,係可經由墊片22之斜邊222及墊片23之斜邊232而加以規定。 However, for example, if the width L3 of the first terminal 51 of the second electronic component 50 only becomes longer within the manufacturing tolerance range, on the side in the X direction of the first terminal 51 of the second electronic component 50 The position of the end 511 (the end in the direction indicated by symbol X1) can be specified by the beveled edge 222 of the gasket 22 and the beveled edge 232 of the gasket 23.
圖7係擴大顯示在安裝第1電子構件40於構件安裝範圍13之狀態的第2導體30之平面圖。圖8係擴大顯示在安裝第2電子構件50於構件安裝範圍13之狀態的第2導體30之平面圖。 7 is an enlarged plan view showing the second conductor 30 in a state where the first electronic component 40 is mounted on the component mounting range 13. 8 is an enlarged plan view showing the second conductor 30 in a state where the second electronic component 50 is mounted on the component mounting range 13.
第1電子構件40之第2端子42係與第1端子41同樣地,構成橫寬L1,縱寬L2之矩形形狀。另一 方,第2電子構件50之第2端子52係與第1端子51同樣地,構成橫寬L3,縱寬L4之矩形形狀。例如,在該實施例中,第2端子42之橫寬L1係較第2端子52之橫寬L3為短。另外,第2端子42之縱寬L2係較第2端子52之縱寬L4為長。更且,第1電子構件40之第2端子42係較第2電子構件50之第2端子52,位於偏移於在X方向之一方側(以符號X1所示之方向側)的位置。 Like the first terminal 41, the second terminal 42 of the first electronic component 40 has a rectangular shape with a width L1 and a length L2. another The second terminal 52 of the second electronic component 50 has a rectangular shape with a width L3 and a length L4, similar to the first terminal 51. For example, in this embodiment, the lateral width L1 of the second terminal 42 is shorter than the lateral width L3 of the second terminal 52. In addition, the length L2 of the second terminal 42 is longer than the length L4 of the second terminal 52. Furthermore, the second terminal 42 of the first electronic component 40 is located at a position offset to one side in the X direction (direction side indicated by symbol X1) than the second terminal 52 of the second electronic component 50.
第2導體30之墊片31係構成包含上底邊311,第1斜邊312,第2斜邊313之略台形形狀。作為「第3X方向位置規定部」之墊片31的上底邊311係對於安裝第1電子構件40於構件安裝範圍13之情況,規定在第1電子構件40之第2端子42之X方向的另一方側之端421(以符號X2所示之方向的端)之位置(圖7)。作為「第3Y方向位置規定部」之墊片31的第1斜邊312,第2斜邊313係對於安裝第1電子構件40於構件安裝範圍13之情況,規定在交叉於第1電子構件40之第2端子42之Y方向的兩端422,423之位置(圖7)。 The pad 31 of the second conductor 30 has a slightly truncated shape including an upper bottom side 311, a first oblique side 312, and a second oblique side 313. The upper bottom edge 311 of the gasket 31 as the "third position determining portion in the X direction" is defined in the X direction of the second terminal 42 of the first electronic component 40 for the case of mounting the first electronic component 40 in the component mounting range 13 The position of the end 421 (the end in the direction indicated by symbol X2) on the other side (FIG. 7). The first beveled edge 312 and the second beveled edge 313 of the spacer 31 as the "third Y-direction position defining portion" are defined to cross the first electronic member 40 when the first electronic member 40 is mounted on the component mounting range 13 The positions of the ends 422, 423 of the second terminal 42 in the Y direction (FIG. 7).
然而,例如第1電子構件40之第2端子42的橫寬L1則如為在製造公差的範圍內僅變長之情況,在第1電子構件40之第2端子42之X方向的另一方側之端421(以符號X2所示之方向的端)之位置,係可經由墊片31之第1斜邊312及第2斜邊313而加以規定。 However, for example, if the width L1 of the second terminal 42 of the first electronic component 40 only becomes longer within the manufacturing tolerance, on the other side in the X direction of the second terminal 42 of the first electronic component 40 The position of the end 421 (the end in the direction indicated by the symbol X2) can be specified by the first oblique side 312 and the second oblique side 313 of the gasket 31.
第2導體30之墊片32係包含端部321,斜邊322,而對於墊片31之第1斜邊312,構成沿著略平行之 形狀。第2導體30之墊片33係包含端部331,斜邊332,而對於墊片31之第2斜邊313,構成沿著略平行之形狀。作為「第4X方向規定部」之墊片32的端部321及墊片33之端部331係對於安裝第2電子構件50於構件安裝範圍13之情況,規定在第2電子構件50之第2端子52之X方向的另一方側之端521(以符號X2所示之方向的端)之位置(圖8)。作為「第4Y方向位置規定部」之墊片32的斜邊322及墊片33之斜邊332係對於安裝第2電子構件50於構件安裝範圍13之情況,規定在第2電子構件50之第2端子52之Y方向的兩端522,523之位置(圖8)。 The pad 32 of the second conductor 30 includes an end 321 and a beveled edge 322, and the first beveled edge 312 of the pad 31 is formed along a slightly parallel shape. The pad 33 of the second conductor 30 includes an end 331 and a beveled edge 332, and the second beveled edge 313 of the pad 31 is formed along a slightly parallel shape. The end portion 321 of the spacer 32 and the end portion 331 of the spacer 33 as the "4th direction defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The position of the end 521 (the end in the direction indicated by symbol X2) on the other side of the terminal 52 in the X direction (FIG. 8). The beveled edge 322 of the spacer 32 and the beveled edge 332 of the spacer 33 as the "4th direction position defining portion" are specified in the second 2 The positions of the two ends 522, 523 in the Y direction of the terminal 52 (FIG. 8).
然而,例如第2電子構件50之第2端子52的橫寬L3則如為在製造公差的範圍內僅變長之情況,在第2電子構件50之第2端子52之X方向的另一方側之端521(以符號X2所示之方向的端)之位置,係可經由墊片32之斜邊322及墊片33之斜邊332而加以規定。 However, for example, if the width L3 of the second terminal 52 of the second electronic component 50 only becomes longer within the manufacturing tolerance range, on the other side in the X direction of the second terminal 52 of the second electronic component 50 The position of the end 521 (the end in the direction indicated by the symbol X2) can be specified by the inclined side 322 of the gasket 32 and the inclined side 332 of the gasket 33.
對於有關本發明之印刷配線基板10之第2實施例,參照圖9及圖10同時進行說明。 The second embodiment of the printed wiring board 10 of the present invention will be described simultaneously with reference to FIGS. 9 and 10.
圖9係擴大圖示第2實施例之印刷配線基板10之第1導體20的平面圖。圖10係擴大圖示第2實施例之印刷配線基板10之第2導體30的平面圖。 9 is an enlarged plan view of the first conductor 20 of the printed wiring board 10 of the second embodiment. 10 is an enlarged plan view of the second conductor 30 of the printed wiring board 10 of the second embodiment.
第2實施例之印刷配線基板10係在第1導體 20則加上於墊片21~23,更且包含墊片24的點,與第1實施例不同。另外,第2實施例之印刷配線基板10係在第2導體30則加上於墊片31~33,更且包含墊片34的點,與第1實施例不同。對於此以外之構成,係與第1實施例同樣之故,對於同一之構成要素附上同一符號,省略詳細的說明。 The printed wiring board 10 of the second embodiment is attached to the first conductor 20 is added to the gaskets 21 to 23 and further includes the gasket 24, which is different from the first embodiment. In addition, the printed wiring board 10 of the second embodiment is added to the pads 31 to 33 in the second conductor 30, and further includes the pad 34, which is different from the first embodiment. The rest of the configuration is the same as in the first embodiment, and the same components are given the same symbols, and detailed explanations are omitted.
第1導體20之墊片24係如圖示,在第1導體20之墊片21~23的X方向之另一方側(以符號X2所示之方向側),呈連結墊片21~23地加以設置(圖9)。另外,第2導體30之墊片34係如圖示,在第2導體30之墊片31~33的X方向之一方側(以符號X1所示之方向側),呈連結墊片31~33地加以設置(圖10)。因此,第2實施例之第1導體20係附上焊錫在第1電子構件40之第1端子41或第2電子構件50之第1端子51時之焊錫量則成為較第1實施例為多。同樣地,第2實施例之第2導體30係附上焊錫在第1電子構件40之第2端子42或第2電子構件50之第2端子52時之焊錫量則成為較第1實施例為多。如此,第1導體20及第2導體30之墊片構成係亦考慮適當之焊錫量的觀點,而因應各第1電子構件40之第1端子41及第2端子42,第2電子構件50之第1端子51,第2端子52之位置,尺寸,形狀等,而適宜設定為適當之位置,尺寸,形狀者為佳。 As shown, the pad 24 of the first conductor 20 is connected to the pads 21 to 23 on the other side of the pads 21 to 23 of the first conductor 20 in the X direction (direction side indicated by the symbol X2). Set it up (Figure 9). In addition, as shown in the figure, the pad 34 of the second conductor 30 is connected to the pads 31 to 33 on one side of the pads 31 to 33 of the second conductor 30 in the X direction (direction side indicated by the symbol X1). To be set (Figure 10). Therefore, when the first conductor 20 of the second embodiment is soldered to the first terminal 41 of the first electronic component 40 or the first terminal 51 of the second electronic component 50, the amount of solder becomes larger than that of the first embodiment. . Similarly, when the second conductor 30 of the second embodiment is soldered to the second terminal 42 of the first electronic component 40 or the second terminal 52 of the second electronic component 50, the amount of solder becomes higher than that of the first embodiment. many. In this way, the pad configuration of the first conductor 20 and the second conductor 30 also considers the appropriate amount of solder, and in response to the first terminal 41 and the second terminal 42 of each first electronic component 40, the second electronic component 50 The position, size, shape, etc. of the first terminal 51 and the second terminal 52 are preferably set to an appropriate position, size, and shape.
Claims (6)
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JP2016-071036 | 2016-03-31 | ||
JP2016071036A JP6694311B2 (en) | 2016-03-31 | 2016-03-31 | Printed wiring board |
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TW201737772A TW201737772A (en) | 2017-10-16 |
TWI645757B true TWI645757B (en) | 2018-12-21 |
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KR (1) | KR102138992B1 (en) |
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Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294553A (en) * | 1997-04-18 | 1998-11-04 | Tec Corp | Circuit board |
JP2004022734A (en) * | 2002-06-14 | 2004-01-22 | Matsushita Electric Ind Co Ltd | Component-mounted board |
TW200707671A (en) * | 2005-06-03 | 2007-02-16 | Shinko Electric Ind Co | Electronic device and method of manufacturing the same |
TW200803674A (en) * | 2006-06-01 | 2008-01-01 | Phoenix Prec Technology Corp | Method for fabricating circuit board with electrically connected structure |
TW201132895A (en) * | 2010-03-25 | 2011-10-01 | Radiant Opto Electronics Corp | LED light bar and backlight module including the same |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH05102648A (en) * | 1991-10-04 | 1993-04-23 | Hitachi Ltd | Printed board |
JPH09199841A (en) | 1996-01-19 | 1997-07-31 | Fuji Xerox Co Ltd | Printed-wiring board |
JPH09331146A (en) * | 1996-06-12 | 1997-12-22 | Saitama Nippon Denki Kk | General-purpose surface mounting component land |
JP2007080969A (en) * | 2005-09-12 | 2007-03-29 | Sony Corp | Printed wiring board and its manufacturing method |
JP5326823B2 (en) * | 2009-05-28 | 2013-10-30 | 株式会社デンソー | Wiring board and electronic component mounting structure using the same |
JP5895374B2 (en) * | 2011-06-24 | 2016-03-30 | 株式会社村田製作所 | Electronic components |
CN204598464U (en) * | 2015-04-24 | 2015-08-26 | 广州视源电子科技股份有限公司 | Circuit board |
-
2016
- 2016-03-31 JP JP2016071036A patent/JP6694311B2/en active Active
-
2017
- 2017-01-16 WO PCT/JP2017/001212 patent/WO2017168952A1/en active Application Filing
- 2017-01-16 CN CN201780020575.1A patent/CN108886875B/en not_active Expired - Fee Related
- 2017-01-16 KR KR1020187027709A patent/KR102138992B1/en active IP Right Grant
- 2017-01-23 TW TW106102440A patent/TWI645757B/en active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10294553A (en) * | 1997-04-18 | 1998-11-04 | Tec Corp | Circuit board |
JP2004022734A (en) * | 2002-06-14 | 2004-01-22 | Matsushita Electric Ind Co Ltd | Component-mounted board |
TW200707671A (en) * | 2005-06-03 | 2007-02-16 | Shinko Electric Ind Co | Electronic device and method of manufacturing the same |
TW200803674A (en) * | 2006-06-01 | 2008-01-01 | Phoenix Prec Technology Corp | Method for fabricating circuit board with electrically connected structure |
TW201132895A (en) * | 2010-03-25 | 2011-10-01 | Radiant Opto Electronics Corp | LED light bar and backlight module including the same |
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WO2017168952A1 (en) | 2017-10-05 |
TW201737772A (en) | 2017-10-16 |
CN108886875B (en) | 2021-02-26 |
KR20180116392A (en) | 2018-10-24 |
JP2017183597A (en) | 2017-10-05 |
KR102138992B1 (en) | 2020-07-28 |
CN108886875A (en) | 2018-11-23 |
JP6694311B2 (en) | 2020-05-13 |
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