TWI645757B - Printed wiring board - Google Patents

Abstract

The present invention is a printed accessory board, wherein the printed wiring board (10) of the present invention includes: a component mounting range (13) including a first electronic component (40) or a second electronic component (50) selectively mounted Substrate (11), and the first conductor (20) to which the first terminal (41) of the first electronic component (40) or the first terminal (51) of the second electronic component (50) is connected and formed A photoresist layer (12) on the surface of the substrate (11); the first conductor (20) includes spacers (21 ~ 23) formed by the photoresist layer (12) covering a part of the first conductor (20); The pad (21) of the first conductor (20) constitutes the first terminal (41) that defines the first terminal (41) of the first electronic component (40) when the first electronic component part (40) is mounted on the component mounting range (13) The shape of the position, and the pads (22, 23) of the first conductor (20) are for the case of mounting the second electronic component (50) in the component mounting range (13), constituting the second 1 The shape of the position of the terminal (51).

Description

Printed wiring board

The present invention relates to a printed wiring board.

As an example of a technique for mounting an electronic component on a printed wiring board, solder attachment is generally known as a reflow method. In the attached solder of the reflow method, the gel-like solder that is placed between the pad on the surface of the printed wiring board and the terminal of the electronic component is heated and melted in the reflow furnace, and then passed through When cooling to solidify the solder, the terminals of the electronic component are attached to the pads of the printed wiring board with solder.

The position, size, shape, etc. of the terminals of the electronic components that are soldered to the pads of the printed wiring board are basically the same when they are the same electronic components. However, even if it is the same electronic component, for example, different manufacturers, there may be slightly different positions, sizes, shapes, etc. of the terminals. Moreover, even if it is the same electronic component of the same manufacturer, the position, size, shape, etc. of the terminal may be changed through design changes or specification changes. In this case, there is a possibility that the position, size, and shape of the pad of the printed wiring board do not conform to the position, size, and shape of the terminal of the electronic component.

In addition, in the position, size, and shape of the pad of the printed wiring board does not match the position, size, shape, etc. of the terminal of the electronic component, in the reflow furnace, the pad of the printed wiring board and the terminal of the electronic component When the solder in between is melted, there is a possibility that the electronic component moves on the molten solder and the mounting position is shifted. Moreover, when the mounting position of the electronic component is shifted, for example, the electronic component may be in contact with other electronic components adjacent to it, and there may be a poor contact of the terminal or a short circuit of the circuit. In this case, for example, before the printed wiring board is put into the reflow furnace, if the electronic component is fixed to the printed wiring board with resin or the like, it is possible to prevent the mounting position from shifting. However, when a process of fixing an electronic component to a printed circuit board with resin or the like is added, the manufacturing cost increases due to the increase of the engineering part, which is not ideal. From this situation, for example, for the case of changing the manufacturer of the electronic component, or there is a change in the design or specification of the electronic component, etc., every time, there must be a possibility of design change of the printed wiring board, and there is Increased manufacturing costs.

In addition, for example, if the printed wiring board used in electronic equipment with different specifications can be used as a common, and the same type of electronic components with different electrical characteristics are selected and mounted according to the specifications of the electronic equipment, it can be reduced in manufacturing. cost. However, even if they are the same kind of electronic components, it is still possible that the position, size, shape, etc. of the terminals are different for the case where the electrical characteristics are different. Moreover, when a plurality of wiring boards have to be designed as electronic components having different positions, sizes, shapes, etc. of the terminals, it becomes a cost that hinders the commonality of printed wiring boards reduce.

As an example of a conventional technique aimed at solving such a problem, it is well known that there are two shims arranged oppositely, and the two shims are opposite sides of each other as short sides, while the opposite side becomes long The shape of the edge is slightly mesa-shaped, and the printed circuit board is determined based on the distance between the two pads and the maximum and minimum external dimensions of the predetermined wafer member on which the size of the short side and the long side are mounted (for example, see Patent Document 1) .

[Prior Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 09-199841

However, the above-mentioned conventional technology will be based on JIS (Japanese Industrial Standards: Japanese Industrial Standards) or EIA (Electronic Industries Alliance: Electronic Industry Association) standardized wafer components, that is, the position, size, shape, etc. of the terminal in accordance with the power The wafer structure with similar shapes and different proportions as the object of the different sexual characteristics. That is, the above-mentioned conventional technology is a technology that can only be used for substantially standardized wafer components. For example, for electronic components whose positions, sizes, and shapes of terminals are not standardized, there is a problem that it is almost impossible to respond.

In view of such a situation, the structure of the present invention aims to realize the position, size, shape, etc. of the terminal where the terminal is not standardized. The generalization of printed circuit boards for electronic components.

<The first aspect of the present invention>

A first aspect of the present invention includes: a substrate including a component mounting range where a first electronic component or a second electronic component is selectively mounted, and a board provided in the component mounting range, to which the first electronic component or the first electronic component is connected 2 The first conductor of the first terminal of the electronic component and the photoresist layer formed on the surface of the substrate; the first conductor system includes a first pad portion formed by covering a part of the first conductor with the photoresist layer And the second pad part; the first pad part of the first conductor is a shape that defines the position of the first terminal of the first electronic component when the first electronic component part is mounted on the component mounting range, The second pad portion of the first conductor constitutes a printed wiring board that defines the shape of the position of the first terminal of the second electronic component when the second electronic component portion is mounted on the component mounting range.

The first pad portion and the second pad portion of the first conductor are formed by covering a part of the first conductor with a photoresist layer. Along with this, the first pad portion and the second pad portion of the first conductor are both part of the first conductor, and are electrically connected to each other. In addition, the position, size, and shape of the first pad portion and the second pad portion of the first conductor can be freely set by adjusting the range in which the photoresist layer is formed.

In addition, the first pad portion of the first conductor defines the first electronic component when the first electronic component is mounted on the component mounting range Of the first terminal. On the other hand, the second pad portion of the first conductor specifies the position of the first terminal of the second electronic component when the second electronic component is mounted on the component mounting range. That is, for the first conductor to which the first terminal of the first electronic component or the second electronic component is connected, each is formed with a first pad corresponding to the position, size, shape, etc. of the first terminal of the first electronic component Part, and the second pad part corresponding to the position, size, shape, etc. of the first terminal of the second electronic component.

In the case where the first electronic component is mounted on the component mounting range through this, since the position of the first terminal of the first electronic component can be specified at a specific position through the first pad portion of the first conductor, the first electronic component can be mounted The electronic component is in a specific position in the component installation range. On the other hand, in the case of mounting the second electronic component in the component mounting range, since the position of the first terminal of the second electronic component can be specified at a specific position through the second pad portion of the first conductor, the second The electronic component is in a specific position in the component installation range. Along with this, it is possible to selectively mount the first electronic component or the second electronic component with different positions, sizes, shapes, etc. of the first terminal in the component mounting range.

As a result, as in the first aspect of the present invention, the effect of achieving the commonality of printed circuit boards that can be mounted as electronic components of standardized terminal positions, sizes, shapes, etc. is obtained.

<Second aspect of the invention>

According to a second aspect of the present invention, in the aforementioned first aspect of the present invention, the first pad portion of the first conductor is for mounting the first electronic component In the case of the above-mentioned component mounting range, it is configured to define the end position of the first terminal of the first electronic component on the one side in the X direction, and has the shape of the position defining portion in the first X direction, and the second pad of the first conductor For mounting the second electronic component in the component mounting range, the portion is configured to define an end position on one side of the first terminal of the second electronic component in the X direction, and has a shape of a position defining portion in the second X direction Printed wiring board.

According to the second aspect of the present invention, in the case of mounting the first electronic component in the component mounting range, the first terminal of the first electronic component in the X direction can be placed on the side of the X direction through the first X-direction position specifying portion End position, specified in a specific position. On the other hand, in the case of mounting the second electronic component in the component mounting range, the end position on the one side in the X direction of the first terminal of the second electronic component can be specified at a specific position through the second X-direction position specifying portion By.

<The third aspect of the present invention>

A third aspect of the present invention is that in the second aspect of the present invention described above, the first pad portion of the first conductor is configured to intersect the foregoing with respect to the case where the first electronic component is mounted on the component mounting range. Both ends of the first terminal of the first electronic component in the X direction and the Y direction have the shape of a position defining portion in the first Y direction, and the second pad portion of the first conductor is for mounting the second electronic component in In the case of the aforementioned component mounting range, the structure is defined at the both end positions of the first terminal of the second electronic component in the Y direction, and has a second Y direction position specifying portion Shaped printed circuit board.

According to the third aspect of the present invention, for mounting the first electronic component in the component mounting range, the first terminal of the first electronic component can be placed at both ends of the first electronic component in the Y direction Location, specified in a specific location. On the other hand, in the case of mounting the second electronic component in the component mounting range, the position of both ends in the Y direction of the first terminal of the second electronic component can be specified at a specific position through the second Y-direction position specifying portion .

<Fourth Aspect of the Invention>

The fourth aspect of the present invention is any one of the aforementioned first to third aspects of the present invention, further comprising: the first conductor in the member mounting range is provided at a distance between the X direction and the At one side, a second conductor connected to the second terminal of the first electronic component or the second terminal of the second electronic component, and the second conductive system includes: a part of the second conductor covered by the photoresist layer The first pad portion and the second pad portion are formed, and the first pad portion of the second conductor is configured to define the first electronic component in the case where the first electronic component is mounted on the component mounting range. The shape of the position of the 2 terminal, and the second pad portion of the second conductor is a shape that defines the position of the second terminal of the second electronic component in the case of mounting the second electronic component in the component mounting range Printed wiring board.

The first pad portion and the second pad portion of the second conductor are formed by covering a part of the second conductor with a photoresist layer. Following this, the second conductor The first pad part and the second pad part are both part of the second conductor, and are electrically connected to each other. In addition, the position, size, and shape of the first pad portion and the second pad portion of the second conductor can be freely set by adjusting the range in which the photoresist layer is formed.

In addition, the first pad portion of the second conductor defines the position of the second terminal of the first electronic component when the first electronic component is mounted on the component mounting range. On the other hand, the second pad portion of the second conductor specifies the position of the second terminal of the second electronic component when the second electronic component is mounted on the component mounting range. That is, for the second conductor to which the first electronic component or the second terminal of the second electronic component is connected, each is formed with a first pad corresponding to the position, size, shape, etc. of the second terminal of the first electronic component Part, and a second pad part corresponding to the position, size, shape, etc. of the second terminal of the second electronic component.

For the case where the first electronic component is mounted on the component mounting range through this, the position of the first terminal of the first electronic component can be specified at a specific position through the first pad portion of the first conductor, and the The first pad part of the 2 conductor defines the position of the second terminal of the first electronic component at a specific position, and the first electronic component can be mounted at a specific position in the component mounting range. On the other hand, for the case where the second electronic component is mounted on the component mounting range through this, the position of the first terminal of the second electronic component can be specified at a specific position through the second pad portion of the first conductor, The position of the second terminal of the second electronic component can be specified at a specific position through the second pad portion of the second conductor, and the second electronic component can be mounted at a specific position in the component mounting range. With that, optional Selectively install the first electronic component or the second electronic component with different positions, sizes, shapes, etc. of the first terminal and the second terminal in the component mounting range.

<Fifth Aspect of the Invention>

According to a fifth aspect of the present invention, in the fourth aspect of the present invention described above, the first pad portion of the second conductor is configured for the case where the first electronic component is mounted on the component mounting range, and the structure is defined in the first The end position of the second terminal of the electronic component on the other side in the X direction has a shape of a predetermined position in the 3X direction, and the second pad portion of the second conductor is for mounting the second electronic component on the component In the case of the mounting range, a printed wiring board having a shape of a predetermined portion in the fourth X-direction position is defined at an end position of the second terminal of the second electronic component on the other side in the X-direction.

According to the fourth aspect of the present invention, in the case of mounting the first electronic component in the component mounting range, the second terminal of the first electronic component in the X direction can be placed on the other side of the X terminal through the third X-direction position specifying portion The end position is specified in a specific position. On the other hand, in the case of mounting the second electronic component in the component mounting range, the end position on the other side in the X direction of the second terminal of the second electronic component can be specified to be specific Positioner.

<Sixth Aspect of the Invention>

According to a sixth aspect of the present invention, in the fifth aspect of the present invention described above, the first pad portion of the second conductor is for mounting the first electronic component In the case of the aforementioned component mounting range, the second terminal portion of the first electronic component has a shape that defines a position defining portion in the third Y direction, and the second pad portion of the second conductor In the case where the second electronic component is mounted on the component mounting range, a printed wiring board having a shape of a predetermined portion in the fourth Y direction position is defined at both end positions of the second terminal of the second electronic component in the Y direction .

According to the sixth aspect of the present invention, for the case of mounting the first electronic component in the component mounting range, it is possible to place the second terminal of the first electronic component in the Y direction through the third Y direction position specifying portion Location, specified in a specific location. On the other hand, in the case of mounting the second electronic component in the component mounting range, the position of both ends in the Y direction of the second terminal of the second electronic component can be specified at a specific position via the 4th direction position specifying portion .

According to the present invention, it is possible to realize commonization of printed wiring boards mounted as electronic components of standardized terminal positions, sizes, shapes, and the like.

10‧‧‧ printed wiring board

11‧‧‧ substrate

12‧‧‧Photoresist layer

13‧‧‧Component installation scope

20‧‧‧The first conductor

21 ~ 24‧‧‧ First Gasket

30‧‧‧ 2nd conductor

31 ~ 34‧‧‧Second Conductor Gasket

40‧‧‧The first electronic component

41, 51‧‧‧ First terminal

42、52‧‧‧2nd terminal

50‧‧‧The second electronic component

FIG. 1 is a side view illustrating a state where the first electronic component is mounted on the printed wiring board of the first embodiment.

2 is a plan view illustrating a state where the first electronic component is mounted on the printed wiring board of the first embodiment.

3 is a side view illustrating a state where the second electronic component is mounted on the printed circuit board of the first embodiment.

4 is a plan view illustrating a state where the second electronic component is mounted on the printed circuit board of the first embodiment.

FIG. 5 is an enlarged plan view of the first conductor in a state where the first electronic component is mounted.

6 is an enlarged plan view of the first conductor in a state where the second electronic component is mounted.

7 is an enlarged plan view showing the second conductor in a state where the first electronic component is mounted.

8 is an enlarged plan view showing the second conductor in a state where the second electronic component is mounted.

9 is an enlarged plan view of the first conductor of the printed wiring board of the second embodiment.

10 is an enlarged plan view of the second conductor of the printed wiring board of the second embodiment.

Hereinafter, the embodiments of the present invention will be described with reference to the drawings.

However, the present invention is not particularly limited to the embodiments described below, but of course it can be planted within the scope of the invention described in the patent application Kind of deformer.

<First embodiment>

The first embodiment of the printed wiring board 10 of the present invention will be described simultaneously with reference to FIGS. 1 to 8.

FIG. 1 is a side view illustrating a state where the first electronic component 40 is mounted on the printed circuit board 10 of the first embodiment. 2 is a plan view illustrating a state where the first electronic component 40 is mounted on the printed wiring board 10 of the first embodiment. 3 is a side view illustrating a state where the second electronic component 50 is mounted on the printed circuit board 10 of the first embodiment. 4 is a plan view illustrating a state where the second electronic component 50 is mounted on the printed circuit board 10 of the first embodiment.

The printed circuit board 10 according to the present invention includes a substrate 11, a photoresist layer 12, a first conductor 20, and a second conductor 30.

The substrate 11 is a single-sided or double-sided substrate or a multilayer substrate, etc., and is a rigid substrate such as a glass polyester substrate. The substrate 11 includes wiring patterns formed on the surface layer or the inner layer, metal pads, pads, and through holes (not shown), and constitutes a specific electronic circuit by mounting electronic components. The substrate 11 includes a component mounting range 13 where the first electronic component 40 or the second electronic component 50 is selectively mounted. The photoresist layer 12 is, for example, a solder resist or the like, is applied so as to cover the surface of the substrate 11, and is formed on the surface of the substrate 11.

Here, the first electronic component 40 or the second electronic component 50 is, for example, a surface mounting component having the same external dimensions, and the electrical characteristics are different. Kinds of electronic components. More specifically, the first electronic member 40 or the second electronic member 50 is, for example, an inductor (coil) member having different electrical characteristics. In addition, the first terminal 41 and the second terminal 42 of the first electronic component 40 have the same size and shape. Similarly, the size and shape of the first terminal 51 and the second terminal 52 of the second electronic component 50 are the same. On the other hand, the position, size, and shape of the first terminal 41 and the second terminal 42 of the first electronic component 40 are different from those of the first terminal 51 and the second terminal 52 of the second electronic component 50.

The first conductor 20 is provided in the component mounting range 13 and connected to the wiring pattern of the substrate 11. The first conductor 20 is connected to the first terminal 41 of the first electronic component 40 by attaching solder to the case where the first electronic component 40 is mounted on the component mounting area 13, and the component mounting area is used to mount the second electronic component 50 In the case of the range 13, the first terminal 51 of the second electronic component 50 is connected by attaching solder.

The first conductor 20 includes three pads 21 to 23 formed by covering a part of the first conductor 20 with the photoresist layer 12. The three pads 21 to 23 of the first conductor 20 are all part of the first conductor 20 and are electrically connected to each other. In addition, the positions, sizes, and shapes of the three pads 21 to 23 of the first conductor 20 can be freely set by adjusting the range in which the photoresist layer 12 is formed.

In the case where the first electronic component 40 is mounted on the component mounting range 13, the first electronic component is in a state where the solder between the first terminal 41 of the first electronic component 40 and the pad 21 melts in the reflow furnace The position of the first terminal 41 of 40 is determined by the surface tension of the molten solder It is limited to the outer shape of the gasket 21. The pad 21 as the "first pad portion of the first conductor" is a shape that defines the position of the first terminal 41 of the first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 ( figure 2).

On the other hand, when the second electronic component 50 is mounted on the component mounting range 13, the solder between the first terminal 51 of the second electronic component 50 and the pads 21 to 23 is melted in the reflow furnace, The position of the first terminal 51 of the second electronic component 50 is restricted to the range of the outer shape of the pad 22 and the pad 23 by the surface tension of the molten solder. The pad 22 and the pad 23 as the "second pad part of the first conductor" constitute the first terminal 51 that defines the first terminal 51 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The shape of the location (Figure 4).

That is, the first conductor 20 is formed with the pad 21 corresponding to the position, size, shape, etc. of the first terminal 41 of the first electronic component 40 and the position corresponding to the first terminal 51 of the second electronic component 50 , Size, shape and other gasket 22 and gasket 23. The position, size, and shape of the spacer 21 are determined in accordance with the position, size, shape, etc. of the first terminal 41 of the first electronic component 40 so as to specify the position of the first terminal 41 of the first electronic component 40 at a specific position At the same time, the amount of solder of the spacer 21 is determined to be an appropriate amount of solder. The position, size, and shape of each pad 22 and pad 23 correspond to the position, size, shape, etc. of the first terminal 51 of the second electronic component 50, and the position of the first terminal 51 of the second electronic component 50 is specified Determined by location At this time, the solder amount of the pad 22 and the pad 23 is determined to be an appropriate solder amount.

The second conductor 30 is provided in the component mounting range 13, more specifically, the first conductor 20 is provided at a position spaced apart on one side in the X direction (direction side indicated by symbol X1). The second conductor 30 is connected to the wiring pattern of the substrate 11. The second conductor 30 is connected to the second terminal 42 of the first electronic component 40 by attaching solder to the case where the first electronic component 40 is mounted on the component mounting range 13, and the component mounting area is used to mount the second electronic component 50 In the case of the range 13, the second terminal 52 of the second electronic component 50 is connected by attaching solder.

The second conductor 30 includes three pads 31 to 33 formed by covering a part of the second conductor 30 with the photoresist layer 12. The three pads 31 to 33 of the second conductor 30 are all part of the second conductor 30 and are electrically connected to each other. In addition, the positions, sizes, and shapes of the three pads 31 to 33 of the second conductor 30 can be freely set by adjusting the range in which the photoresist layer 12 is formed.

When the first electronic component 40 is mounted on the component mounting range 13, the first electronic component is in a state where the solder between the second terminal 42 of the first electronic component 40 and the pad 31 melts in the reflow furnace The position of the second terminal 42 of 40 is limited to the range of the outer shape of the pad 31 by the surface tension of the molten solder. The pad 31 as the "first pad portion of the second conductor" constitutes a prescribed first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 The shape of the position of the second terminal 42 (FIG. 2).

On the other hand, when the second electronic component 50 is mounted on the component mounting range 13, in the reflow furnace, the solder between the second terminal 52 of the second electronic component 50 and the pads 31 to 33 is molten, The position of the second terminal 52 of the second electronic component 50 is restricted to the outer shape of the pad 32 and the pad 33 by the surface tension of the molten solder. The pad 32 and the pad 33 as the "second pad portion of the second conductor" constitute the second terminal 52 that defines the second terminal 52 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The shape of the location (Figure 4).

That is, the second conductor 30 is formed with a pad 31 corresponding to the position, size, shape, etc. of the second terminal 42 of the first electronic component 40 and a position corresponding to the second terminal 52 of the second electronic component 50 , Size, shape, gasket 32 and gasket 33. The position, size, and shape of the spacer 31 are determined in accordance with the position, size, shape, etc. of the second terminal 42 of the first electronic component 40 so as to specify the position of the second terminal 42 of the first electronic component 40 at a specific position At the same time, the amount of solder of the pad 31 is determined to be an appropriate amount of solder. The position, size, and shape of each pad 32 and pad 33 correspond to the position, size, shape, etc. of the second terminal 52 of the second electronic component 50, and the position of the second terminal 52 of the second electronic component 50 is specified While the position is determined, the solder amount of the pad 32 and the pad 33 is determined to be an appropriate solder amount.

The printed wiring board 10 of the present invention thus constituted For the case where the first electronic component 40 is mounted on the component mounting range 13, the position of the first terminal 41 of the first electronic component 40 can be specified at a specific position through the pad 21 of the first conductor 20, and can be passed through the second conductor The spacer 31 of 30 defines the position of the second terminal 42 of the first electronic component 40 at a specific position. In the case where the first electronic component 40 is mounted on the component mounting range 13 through this, the first electronic component 40 can be mounted on a specific position of the component mounting range 13.

On the other hand, for the case where the second electronic component 50 is mounted on the component mounting range 13, the position of the first terminal 51 of the second electronic component 50 can be specified at a specific position through the pad 22 and the pad 23 of the first conductor 20 At the same time, the position of the second terminal 52 of the second electronic component 50 can be specified at a specific position through the pad 32 and the pad 33 of the second conductor 30. In the case where the second electronic component 50 is mounted on the component mounting range 13 through this, the second electronic component 50 can be mounted on a specific position of the component mounting range 13.

In this way, the printed wiring board 10 according to the present invention can selectively mount the first electronic component 40 or the second electronic component 50 in the component mounting range 13. Along with this, according to the present invention, it is possible to realize the commonization of the printed wiring board 10 where electronic components such as the position, size, shape, etc. of unstandardized terminals are mounted.

FIG. 5 is an enlarged plan view of the first conductor 20 in a state where the first electronic component 40 is mounted on the component mounting range 13. 6 is an enlarged plan view showing the first conductor 20 in a state where the second electronic component 50 is mounted on the component mounting range 13.

The first terminal 41 of the first electronic component 40 has a rectangular shape with a width L1 and a length L2. On the other hand, the first terminal 51 of the second electronic component 50 has a rectangular shape with a width L3 and a length L4. For example, in this embodiment, the lateral width L1 of the first terminal 41 is shorter than the lateral width L3 of the first terminal 51. In addition, the length L2 of the first terminal 41 is longer than the length L4 of the first terminal 51. Furthermore, the first terminal 41 of the first electronic component 40 is located at a position offset from the first terminal 51 of the second electronic component 50 on the other side in the X direction (direction side indicated by symbol X2).

The pad 21 of the first conductor 20 is formed in a slightly truncated shape including an upper bottom side 211, a first oblique side 212, and a second oblique side 213. The upper bottom edge 211 of the spacer 21 as the "first X-direction position defining portion" is defined in the X direction of the first terminal 41 of the first electronic component 40 for the case where the first electronic component 40 is mounted on the component mounting range 13 The position of the end 411 (the end in the direction indicated by symbol X1) on one side (FIG. 5). The first beveled edge 212 and the second beveled edge 213 of the spacer 21 as the "first Y direction defining portion" are defined to cross the first electronic member 40 when the first electronic member 40 is mounted on the component mounting range 13 The positions of both ends 412, 413 of the first terminal 41 in the X direction and the Y direction (FIG. 5).

However, for example, if the lateral width L1 of the first terminal 41 of the first electronic component 40 only becomes longer within the manufacturing tolerance, on the side of the first terminal 41 of the first electronic component 40 in the X direction The position of the end 411 (the end in the direction indicated by the symbol X1) can be specified by the first beveled edge 212 and the second beveled edge 213 of the gasket 21.

The pad 22 of the first conductor 20 includes an end 221 and a beveled edge 222, and the first beveled edge 212 of the pad 21 is formed along a slightly parallel shape. The pad 23 of the first conductor 20 includes an end 231 and a beveled edge 232, and the second beveled edge 213 of the pad 21 is formed along a slightly parallel shape. The end portion 221 of the gasket 22 and the end portion 231 of the gasket 23 as the "second position defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 1 The position of the end 511 (the end in the direction indicated by the symbol X1) on the one side in the X direction of the terminal 51 (FIG. 6). The beveled edge 222 of the spacer 22 and the beveled edge 232 of the spacer 23 as the "second position defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 1 The positions of both ends 512, 513 in the Y direction of the terminal 51 (FIG. 6).

However, for example, if the width L3 of the first terminal 51 of the second electronic component 50 only becomes longer within the manufacturing tolerance range, on the side in the X direction of the first terminal 51 of the second electronic component 50 The position of the end 511 (the end in the direction indicated by symbol X1) can be specified by the beveled edge 222 of the gasket 22 and the beveled edge 232 of the gasket 23.

7 is an enlarged plan view showing the second conductor 30 in a state where the first electronic component 40 is mounted on the component mounting range 13. 8 is an enlarged plan view showing the second conductor 30 in a state where the second electronic component 50 is mounted on the component mounting range 13.

Like the first terminal 41, the second terminal 42 of the first electronic component 40 has a rectangular shape with a width L1 and a length L2. another The second terminal 52 of the second electronic component 50 has a rectangular shape with a width L3 and a length L4, similar to the first terminal 51. For example, in this embodiment, the lateral width L1 of the second terminal 42 is shorter than the lateral width L3 of the second terminal 52. In addition, the length L2 of the second terminal 42 is longer than the length L4 of the second terminal 52. Furthermore, the second terminal 42 of the first electronic component 40 is located at a position offset to one side in the X direction (direction side indicated by symbol X1) than the second terminal 52 of the second electronic component 50.

The pad 31 of the second conductor 30 has a slightly truncated shape including an upper bottom side 311, a first oblique side 312, and a second oblique side 313. The upper bottom edge 311 of the gasket 31 as the "third position determining portion in the X direction" is defined in the X direction of the second terminal 42 of the first electronic component 40 for the case of mounting the first electronic component 40 in the component mounting range 13 The position of the end 421 (the end in the direction indicated by symbol X2) on the other side (FIG. 7). The first beveled edge 312 and the second beveled edge 313 of the spacer 31 as the "third Y-direction position defining portion" are defined to cross the first electronic member 40 when the first electronic member 40 is mounted on the component mounting range 13 The positions of the ends 422, 423 of the second terminal 42 in the Y direction (FIG. 7).

However, for example, if the width L1 of the second terminal 42 of the first electronic component 40 only becomes longer within the manufacturing tolerance, on the other side in the X direction of the second terminal 42 of the first electronic component 40 The position of the end 421 (the end in the direction indicated by the symbol X2) can be specified by the first oblique side 312 and the second oblique side 313 of the gasket 31.

The pad 32 of the second conductor 30 includes an end 321 and a beveled edge 322, and the first beveled edge 312 of the pad 31 is formed along a slightly parallel shape. The pad 33 of the second conductor 30 includes an end 331 and a beveled edge 332, and the second beveled edge 313 of the pad 31 is formed along a slightly parallel shape. The end portion 321 of the spacer 32 and the end portion 331 of the spacer 33 as the "4th direction defining portion" are specified at the second position of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13 The position of the end 521 (the end in the direction indicated by symbol X2) on the other side of the terminal 52 in the X direction (FIG. 8). The beveled edge 322 of the spacer 32 and the beveled edge 332 of the spacer 33 as the "4th direction position defining portion" are specified in the second 2 The positions of the two ends 522, 523 in the Y direction of the terminal 52 (FIG. 8).

However, for example, if the width L3 of the second terminal 52 of the second electronic component 50 only becomes longer within the manufacturing tolerance range, on the other side in the X direction of the second terminal 52 of the second electronic component 50 The position of the end 521 (the end in the direction indicated by the symbol X2) can be specified by the inclined side 322 of the gasket 32 and the inclined side 332 of the gasket 33.

<Second Embodiment>

The second embodiment of the printed wiring board 10 of the present invention will be described simultaneously with reference to FIGS. 9 and 10.

9 is an enlarged plan view of the first conductor 20 of the printed wiring board 10 of the second embodiment. 10 is an enlarged plan view of the second conductor 30 of the printed wiring board 10 of the second embodiment.

The printed wiring board 10 of the second embodiment is attached to the first conductor 20 is added to the gaskets 21 to 23 and further includes the gasket 24, which is different from the first embodiment. In addition, the printed wiring board 10 of the second embodiment is added to the pads 31 to 33 in the second conductor 30, and further includes the pad 34, which is different from the first embodiment. The rest of the configuration is the same as in the first embodiment, and the same components are given the same symbols, and detailed explanations are omitted.

As shown, the pad 24 of the first conductor 20 is connected to the pads 21 to 23 on the other side of the pads 21 to 23 of the first conductor 20 in the X direction (direction side indicated by the symbol X2). Set it up (Figure 9). In addition, as shown in the figure, the pad 34 of the second conductor 30 is connected to the pads 31 to 33 on one side of the pads 31 to 33 of the second conductor 30 in the X direction (direction side indicated by the symbol X1). To be set (Figure 10). Therefore, when the first conductor 20 of the second embodiment is soldered to the first terminal 41 of the first electronic component 40 or the first terminal 51 of the second electronic component 50, the amount of solder becomes larger than that of the first embodiment. . Similarly, when the second conductor 30 of the second embodiment is soldered to the second terminal 42 of the first electronic component 40 or the second terminal 52 of the second electronic component 50, the amount of solder becomes higher than that of the first embodiment. many. In this way, the pad configuration of the first conductor 20 and the second conductor 30 also considers the appropriate amount of solder, and in response to the first terminal 41 and the second terminal 42 of each first electronic component 40, the second electronic component 50 The position, size, shape, etc. of the first terminal 51 and the second terminal 52 are preferably set to an appropriate position, size, and shape.

Claims (6)

A printed wiring board is characterized by comprising: a substrate including a component mounting range where either the first electronic component or the second electronic component is selectively mounted, and a substrate provided in the component mounting range, in which the first electronic component is mounted When the component is connected, the first end is connected, and when the second electronic component is mounted, the first conductor connected to the first terminal and the photoresist layer formed on the surface of the substrate; the first conductive system includes: The photoresist layer covers the first pad part and the second pad part formed by a part of the first conductor; the periphery of the first pad part is surrounded by the photoresist layer, and the second pad part The periphery is surrounded by the photoresist layer; the first pad portion of the first conductor is configured to define the position of the first terminal of the first electronic component when the first electronic component is mounted on the mounting area of the component In the shape, the second pad portion of the first conductor is configured to define the position of the first terminal of the second electronic component when the second electronic component is mounted on the component mounting range. The printed wiring board as described in item 1 of the scope of the patent application, wherein the first pad portion of the first conductor is configured to be included in the first electronic component when the first electronic component is mounted on the component mounting range The position of the first terminal in the X-direction of the first terminal is defined in the shape of the first X-direction position, and the second pad portion of the first conductor is provided when the second electronic component is mounted on the component mounting range. The shape of the second X-direction position specifying portion at the position of the one side end in the X direction of the first terminal of the second electronic component is specified. The printed wiring board as described in item 2 of the patent application scope, wherein the first pad portion of the first conductor is configured to cross the first The first Y terminal position of the first terminal of the electronic component in the X direction and the Y direction position defines the shape of the portion, and the second pad portion of the first conductor is attached to the second electronic component in the component mounting range In this case, it is configured to have a shape of a second Y-direction position specifying portion that defines the positions of both ends of the first terminal of the second electronic component in the Y direction. The printed wiring board as described in any one of claims 1 to 3, further comprising: the first conductor is provided on the one side of the X direction in the space between the member mounting ranges Is connected to the second conductor of the first electronic component or the second terminal of the second electronic component, the second conductor system includes: a portion formed by covering a part of the second conductor with the photoresist layer 1 pad portion and second pad portion; the first pad portion of the second conductor is configured to position the second terminal of the first electronic component when the first electronic component is mounted on the component mounting range The second pad portion of the second conductor is a shape that defines the position of the second terminal of the second electronic component when the second electronic component is mounted on the component mounting range. The printed wiring board as described in item 4 of the patent application scope, wherein the first pad portion of the second conductor is configured to be included in the first electronic component when the first electronic component is mounted on the component mounting range Of the second terminal of the second side of the X-direction, the position of the third X-direction position defining portion; the second pad portion of the second conductor is when the second electronic component is mounted on the component mounting range, The configuration has a shape of a fourth X-direction position specifying portion that defines the position of the second terminal of the second electronic component in the X-direction. The printed wiring board as described in item 5 of the patent application scope, wherein the first pad portion of the second conductor is configured to be included in the first electronic component when the first electronic component is mounted on the component mounting range The second terminal of the Y-direction at both ends of the Y-direction, the position of the third Y-direction defines the shape of the portion; The shape of the fourth Y-direction position specifying portion is defined at the positions of both ends of the second terminal of the second electronic component in the Y direction.