TW201737772A - Printed wiring board - Google Patents

Abstract

A printed wiring board 10 of the present invention is provided with: a substrate 11 including a component mounting region 13, in which a first electronic component 40 or a second electronic component 50 is selectively mounted; a first conductor 20, to which a first terminal 41 of the first electronic component 40 or a first terminal 51 of the second electronic component 50 is connected; and a resist layer 12 formed on the surface of the substrate 11. The first conductor 20 includes pads 21-23, which are formed by covering a part of the first conductor 20 with the resist layer 12, the pad 21 of the first conductor 20 is formed in a shape that defines the position of the first terminal 41 of the first electronic component 40 in the cases where the first electronic component 40 is mounted in the component mounting region 13, and each of the pads 22, 23 of the first conductor 20 is formed in a shape that defines the position of the first terminal 51 of the second electronic component 50 in the case where the second electronic component 50 is mounted in the component mounting region 13.

Description

Printed wiring substrate

The present invention relates to a printed wiring substrate.

As an example of a technique for mounting an electronic component on a printed wiring board, soldering with a reflow method is generally known. In the solder which is attached to the reflow soldering method, the gel-like solder provided between the spacer on the surface of the printed wiring board and the terminal of the electronic component is melted in the reflow furnace and then melted. When the solder is solidified by cooling, the terminals of the electronic component are soldered to the pads of the printed wiring board.

When the solder is attached to the terminal of the electronic component of the pad of the printed wiring board, the size, shape, and the like are substantially the same when they are the same electronic component. However, even if the same electronic component is different from the manufacturer, for example, the position, size, shape, and the like of the terminal may be slightly different. Furthermore, even if it is the same electronic component of the same manufacturer, the position, size, shape, and the like of the terminal may be changed by design change, specification change, or the like. In such a case, the position, size, and shape of the spacer having the printed wiring board do not conform to the position, size, shape, and the like of the terminals of the electronic component.

Further, in the position of the pad of the printed wiring board, the size and shape do not conform to the position, size, shape, and the like of the terminal of the electronic component, and in the reflow furnace, the pad of the printed wiring substrate and the terminal of the electronic component are printed. When the solder between the two melts, there is a possibility that the electronic component moves on the molten solder and the mounting position is shifted. Further, when the mounting position of the electronic component is shifted, for example, the electronic component contacts the other adjacent electronic components, and the contact failure of the terminal occurs, and the circuit is short-circuited or the like. In this case, for example, in the process before the printed wiring board is placed in the reflow furnace, the electronic component is fixed to the printed wiring board by resin or the like, and the offset of the mounting position can be prevented. However, when an electronic component is fixed to a printed wiring board by a resin or the like, the manufacturing cost is increased by increasing the number of parts thereof, which is not preferable. In such a case, for example, in the case of a manufacturer who changes an electronic component, or a design change or a specification change of an electronic component, it is necessary to change the design of the printed wiring board every time. The increase in manufacturing costs.

In addition, for example, when a printed wiring board used for an electronic device having different specifications can be used as a common, and an electronic component of the same type having different electrical characteristics is selected in accordance with the specifications of the electronic device, the manufacturing can be reduced. cost. However, even in the case of the same type of electronic component, the position, size, shape, and the like of the terminal may be different for different electrical characteristics. In addition, when a plurality of wiring boards are required to be used in response to the electronic components having different positions, sizes, shapes, and the like of the terminals, the cost of commonalization via the printed wiring boards is hindered. reduce.

As an example of a conventional technique for solving such a problem, it is known that two spacers are disposed to face each other, and the opposing sides of the two spacers are short sides, and the opposite sides are long. A printed wiring board in which the maximum and minimum outer dimensions of a predetermined wafer member having a short side and a long side are mounted in accordance with the interval between the two spacers (see, for example, Patent Document 1) .

[Previous Technical Literature] [Patent Literature]

[Patent Document 1] Japanese Patent Laid-Open No. 09-199841

However, the above-mentioned conventional technology is a wafer member standardized by JIS (Japanese Industrial Standards) or EIA (Electronic Industries Alliance), that is, the position, size, shape, etc. of the terminals are required to be electric. A wafer member having a similar shape and a different ratio in terms of sexual characteristics is constituted as an object. That is, the above-described prior art is a technique that can be used only for a wafer member that is substantially normalized. For example, an electronic component such as a position, a size, a shape, or the like of a terminal that is not standardized can be almost incompatible.

In view of such a situation, the object of the present invention is to achieve a position, a size, a shape, and the like for mounting an unnormalized terminal. A commonality of printed wiring boards of electronic components.

<First aspect of the present invention>

According to a first aspect of the present invention, a substrate including a component mounting range in which a first electronic component or a second electronic component is selectively mounted is provided, and the first electronic component or the first electrode is connected to the component mounting range. a first conductor of the first terminal of the electronic component; and a photoresist layer formed on the surface of the substrate; wherein the first conductive system includes a first pad portion formed by covering the one portion of the first conductor with the photoresist layer And the second shim portion; the first shim portion of the first conductor is configured to define a position of the first terminal of the first electronic component when the first electronic component portion is mounted in the component mounting range; In the second gasket portion of the first conductor, a printed wiring board having a shape defining a position of the first terminal of the second electronic component is formed when the second electronic component portion is mounted in the component mounting range.

The first spacer portion and the second spacer portion of the first conductor are formed by coating a part of the first conductor with a photoresist layer. Accordingly, the first spacer portion and the second spacer portion of the first conductor are both part of the first conductor, and are electrically connected to each other. Further, the position, size, and shape of the first spacer portion and the second spacer portion of the first conductor can be freely set by adjusting the range in which the photoresist layer is formed.

Further, the first spacer portion of the first conductor defines the first electronic component when the first electronic component is mounted on the component mounting range. The position of the first terminal. On the other hand, the second spacer portion of the first conductor defines the position of the first terminal of the second electronic component when the second electronic component is mounted in the component mounting range. In other words, the first conductor of the first terminal to which the first electronic component or the second electronic component is connected is formed with a first spacer corresponding to the position, size, shape, and the like of the first terminal of the first electronic component. And a second spacer portion corresponding to the position, size, shape, and the like of the first terminal of the second electronic component.

When the first electronic component is mounted in the component mounting range, the position of the first terminal of the first electronic component can be set to a specific position via the first spacer portion of the first conductor, so that the first position can be mounted. The electronic component is at a specific location within the component mounting range. In the case where the second electronic component is mounted in the component mounting range, the second terminal portion of the first conductor can be used to define the position of the first terminal of the second electronic component at a specific position, so that the second position can be mounted. The electronic component is at a specific location within the component mounting range. Accordingly, the first electronic component or the second electronic component having different positions, sizes, shapes, and the like of the first terminal can be selectively mounted in the component mounting range.

According to the first aspect of the present invention, it is possible to obtain the effect of the commonality of the printed wiring board of the electronic component which can be mounted as the position, size, shape, and the like of the standardized terminal.

<Second aspect of the invention>

According to a second aspect of the present invention, in the first aspect of the present invention, the first spacer portion of the first conductor is mounted on the first electronic component In the case of the above-described component mounting range, the end portion of the first terminal of the first electronic component in the X direction is defined to have a shape of the first X-direction position defining portion, and the second spacer of the first conductor. In the case where the second electronic component is mounted in the component mounting range, the second electronic component has a shape in which the second X-direction position defining portion is defined at one end position in the X direction of the first terminal of the second electronic component. Printed wiring board.

According to the second aspect of the present invention, when the first electronic component is mounted in the component mounting range, the first X-direction position defining portion can be placed on one side of the first terminal of the first electronic component in the X direction. End position, specified in a specific location. In the case where the second electronic component is mounted in the component mounting range, the second X-direction position defining unit can define the end position of the first terminal in the X direction of the second electronic component at a specific position. By.

<Third aspect of the present invention>

According to a third aspect of the present invention, in the second aspect of the present invention, the first spacer portion of the first conductor is configured to cross the front portion when the first electronic component is mounted on the component mounting range. The first terminal of the first terminal of the first electronic component in the Y direction of the X direction has a shape of a first Y-direction position defining portion, and the second pad portion of the first conductor is attached to the second electronic component. In the case of the above-described component mounting range, the second Y-direction position defining portion is defined at both end positions in the Y direction of the first terminal of the second electronic component. A printed wiring board of a shape.

According to the third aspect of the present invention, when the first electronic component is mounted in the component mounting range, the first Y-direction position defining portion can be placed at both ends of the first terminal of the first electronic component in the Y direction. Location, specified at a specific location. In the case where the second electronic component is mounted in the component mounting range, the position of both ends in the Y direction of the first terminal of the second electronic component can be defined at a specific position via the second Y-direction position defining portion. .

<Fourth Aspect of the Invention>

According to a fourth aspect of the present invention, in the first aspect to the third aspect of the present invention, the first conductor of the component mounting range is provided in the X direction. a second conductor that connects the first electronic component or the second terminal of the second electronic component to a position on one side, and the second conductive system includes a portion of the second conductor covered by the photoresist layer The first spacer portion and the second spacer portion are formed, and the first spacer portion of the second conductor is configured to define the first electronic component when the first electronic component is mounted in the component mounting range. In the shape of the position of the second terminal, the second spacer portion of the second conductor is configured to define the position of the second terminal of the second electronic component when the second electronic component is mounted in the component mounting range. Printed wiring board.

The first spacer portion and the second spacer portion of the second conductor are formed by coating a part of the second conductor with a photoresist layer. Followed by the second conductor The first spacer portion and the second spacer portion are both part of the second conductor, and are electrically connected to each other. Further, the position, size, and shape of the first spacer portion and the second spacer portion of the second conductor can be freely set by adjusting the range in which the photoresist layer is formed.

Further, the first spacer portion of the second conductor defines the position of the second terminal of the first electronic component when the first electronic component is mounted in the component mounting range. On the other hand, in the second spacer portion of the second conductor, the position of the second terminal of the second electronic component is defined when the second electronic component is mounted in the component mounting range. In other words, the second conductor of the second terminal to which the first electronic component or the second electronic component is connected is formed with a first spacer having a position, a size, a shape, and the like corresponding to the second terminal of the first electronic component. And a second spacer portion corresponding to the position, size, shape, and the like of the second terminal of the second electronic component.

When the first electronic component is mounted in the component mounting range, the position of the first terminal of the first electronic component can be defined at a specific position via the first spacer portion of the first conductor. In the second spacer portion of the second conductor, the position of the second terminal of the first electronic component is set to a specific position, and the first electronic component can be mounted at a specific position of the component mounting range. In the case where the second electronic component is mounted in the component mounting range, the position of the first terminal of the second electronic component can be set to a specific position via the second spacer portion of the first conductor. The position of the second terminal of the second electronic component can be set to a specific position via the second spacer portion of the second conductor, and the second electronic component can be attached to a specific position of the component mounting range. Then, optional The first electronic component or the second electronic component having different positions, sizes, shapes, and the like of the first terminal and the second terminal are selectively mounted in the component mounting range.

<Fifth aspect of the invention>

According to a fifth aspect of the present invention, in the fourth aspect of the present invention, the first spacer portion of the second conductor is configured to be in the first aspect when the first electronic component is mounted on the component mounting range. The other end position of the second terminal of the electronic component in the X direction has a shape of a third X-direction position defining portion, and the second spacer of the second conductor is attached to the second electronic component to the member. In the case of the mounting range, the printed wiring board having the shape of the fourth X-direction position defining portion is defined at the other end position in the X direction of the second terminal of the second electronic component.

According to the fourth aspect of the present invention, when the first electronic component is mounted in the component mounting range, the third X-direction position defining portion can be placed on the other side of the second terminal of the first electronic component in the X direction. The end position is specified in a specific location. In the case where the second electronic component is mounted in the component mounting range, the other end position in the X direction of the second terminal of the second electronic component can be specified by the fourth X-direction position defining unit. Location.

<Sixth aspect of the invention>

According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the first spacer portion of the second conductor is mounted on the first electronic component In the case of the above-described component mounting range, the second terminal portion of the second conductor is defined in the position of the third Y-direction position defining portion at the both end positions in the Y direction of the second terminal of the first electronic component, and the second spacer portion of the second conductor. In the case where the second electronic component is mounted in the above-described component mounting range, the printed wiring board having the shape of the fourth Y-direction position defining portion is defined at both ends in the Y direction of the second terminal of the second electronic component. .

According to the sixth aspect of the present invention, when the first electronic component is mounted in the component mounting range, the second Y-direction position defining portion can be placed at both ends of the second terminal of the first electronic component in the Y direction. Location, specified at a specific location. In the case where the second electronic component is mounted in the component mounting range, the position of the both ends of the second terminal of the second electronic component in the Y direction can be specified at a specific position via the fourth Y-direction position defining portion. .

According to the present invention, it is possible to realize a commonality of a printed wiring board of an electronic component mounted as a position, a size, a shape, or the like of a standardized terminal.

10‧‧‧Printed wiring substrate

11‧‧‧Substrate

12‧‧‧Photoresist layer

13‧‧‧Component installation range

20‧‧‧1st conductor

21~24‧‧‧1st conductor gasket

30‧‧‧2nd conductor

31~34‧‧‧2nd conductor gasket

40‧‧‧1st electronic component

41, 51‧‧‧1st terminal

42, 52‧‧‧2nd terminal

50‧‧‧2nd electronic component

FIG. 1 is a side view showing a state in which the first electronic component is mounted on the printed wiring board of the first embodiment.

FIG. 2 is a plan view showing a state in which the first electronic component is mounted on the printed wiring board of the first embodiment.

FIG. 3 is a side view showing a state in which the second electronic component is mounted on the printed wiring board of the first embodiment.

4 is a plan view showing a state in which the second electronic component is mounted on the printed wiring board of the first embodiment.

Fig. 5 is a plan view showing, in an enlarged manner, a first conductor in a state in which the first electronic component is mounted.

Fig. 6 is a plan view showing, in an enlarged manner, a first conductor in a state in which the second electronic component is mounted.

Fig. 7 is a plan view showing, in an enlarged manner, a second conductor in a state in which the first electronic component is mounted.

Fig. 8 is a plan view showing, in an enlarged manner, a second conductor in a state in which the second electronic component is mounted.

Fig. 9 is a plan view showing the first conductor of the printed wiring board of the second embodiment in an enlarged manner.

Fig. 10 is a plan view showing the second conductor of the printed wiring board of the second embodiment in an enlarged manner.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.

However, the present invention is not particularly limited to the embodiments described below, but may of course be made within the scope of the invention described in the scope of the patent application. Kind of deformer.

<First Embodiment>

The first embodiment of the printed wiring board 10 according to the present invention will be described with reference to Figs. 1 to 8 at the same time.

FIG. 1 is a side view showing a state in which the first electronic component 40 is mounted on the printed wiring board 10 of the first embodiment. FIG. 2 is a plan view showing a state in which the first electronic component 40 is mounted on the printed wiring board 10 of the first embodiment. FIG. 3 is a side view showing a state in which the second electronic component 50 is mounted on the printed wiring board 10 of the first embodiment. FIG. 4 is a plan view showing a state in which the second electronic component 50 is mounted on the printed wiring board 10 of the first embodiment.

The printed wiring board 10 of the present invention includes a substrate 11 and a photoresist layer 12, a first conductor 20, and a second conductor 30.

The substrate 11 is a rigid substrate such as a glass polyester substrate, such as a single-sided or double-sided substrate or a multilayer substrate. The substrate 11 includes a wiring pattern formed on the surface layer or the inner layer, metal pads, spacers, and through holes (not shown), and constitutes a specific electronic circuit via mounting of the electronic member. The substrate 11 includes a component mounting range 13 in which the first electronic component 40 or the second electronic component 50 is selectively mounted. The photoresist layer 12 is formed, for example, as a solder resist or the like, and is coated on the surface of the substrate 11 to be formed on the surface of the substrate 11.

Here, the first electronic component 40 or the second electronic component 50 is, for example, a surface mounting member having the same outer dimensions, and has different electrical characteristics. Kind of electronic components. More specifically, the first electronic component 40 or the second electronic component 50 is, for example, an inductor (coil) member having different electrical characteristics. Further, the first terminal 41 and the second terminal 42 of the first electronic component 40 are the same in size and shape. Similarly, the first terminal 51 and the second terminal 52 of the second electronic component 50 are the same in size and shape. On the other hand, the position, size, and shape of the first terminal 41 and the second terminal 42 of the first electronic component 40 are different from the positions, sizes, and shapes of the first terminal 51 and the second terminal 52 of the second electronic component 50.

The first conductor 20 is provided in the component mounting range 13 and is connected to the wiring pattern of the substrate 11. When the first electronic component 40 is mounted on the component mounting range 13 , the first conductor 20 is connected to the first terminal 41 of the first electronic component 40 by attaching solder, and the second electronic component 50 is mounted on the component. In the case of the range 13, the first terminal 51 of the second electronic component 50 is connected via the solder.

The first conductor 20 includes three spacers 21 to 23 formed by the photoresist layer 12 covering one of the first conductors 20. The three pads 21 to 23 of the first conductor 20 are all part of the first conductor 20, and are electrically connected to each other. Further, the position, size, and shape of the three spacers 21 to 23 of the first conductor 20 can be freely set by adjusting the range in which the photoresist layer 12 is formed.

When the first electronic component 40 is mounted in the component mounting range 13, the first electronic component is in a state in which the solder between the first terminal 41 and the spacer 21 of the first electronic component 40 is melted in the reflow furnace. The position of the first terminal 41 of 40 is via the surface tension of the molten solder. It is limited to the range of the shape of the outer shape of the spacer 21. The gasket 21 as the "first gasket portion of the first conductor" is configured to define the position of the first terminal 41 of the first electronic component 40 when the first electronic component 40 is attached to the component mounting range 13 ( figure 2).

On the other hand, when the second electronic component 50 is mounted in the component mounting range 13, in the reflow furnace, the solder between the first terminal 51 and the pads 21 to 23 of the second electronic component 50 is melted. The position of the first terminal 51 of the second electronic component 50 is limited to the outer shape of the spacer 22 and the spacer 23 by the surface tension of the molten solder. The spacer 22 and the spacer 23 as the "second spacer portion of the first conductor" are configured to define the first terminal 51 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13. The shape of the position (Figure 4).

In other words, the first conductor 20 is formed with a gasket 21 corresponding to the position, size, shape, and the like of the first terminal 41 of the first electronic component 40, and the position of the first terminal 51 corresponding to the second electronic component 50. The gasket 22 and the gasket 23 of the size, shape and the like. The position, size, and shape of the spacer 21 are determined such that the position of the first terminal 41 of the first electronic component 40 is determined at a specific position in accordance with the position, size, shape, and the like of the first terminal 41 of the first electronic component 40. At the same time, the amount of solder of the spacer 21 is determined by the amount of solder to be appropriate. The position, size, and shape of each of the spacers 22 and the spacers 23 are such that the position of the first terminal 51 of the second electronic component 50 is specified in accordance with the position, size, shape, and the like of the first terminal 51 of the second electronic component 50. Position to determine the same In addition, the amount of solder of the spacer 22 and the spacer 23 is determined by an appropriate amount of solder.

The second conductor 30 is provided in the member mounting range 13, and more specifically, the first conductor 20 is provided at a position spaced apart from one side in the X direction (on the side indicated by the symbol X1). The second conductor 30 is connected to the wiring pattern of the substrate 11. When the first electronic component 40 is mounted on the component mounting range 13 , the second conductor 30 is connected to the second terminal 42 of the first electronic component 40 by soldering, and the second electronic component 50 is mounted on the component. In the case of the range 13, the second terminal 52 of the second electronic component 50 is connected by attaching solder.

The second conductor 30 includes three spacers 31 to 33 formed by coating the photoresist layer 12 on one of the second conductors 30. The three pads 31 to 33 of the second conductor 30 are all part of the second conductor 30 and are electrically connected to each other. Further, the position, size, and shape of the three spacers 31 to 33 of the second conductor 30 can be freely set by adjusting the range in which the photoresist layer 12 is formed.

When the first electronic component 40 is mounted in the component mounting range 13, the first electronic component is in a state in which the solder between the second terminal 42 of the first electronic component 40 and the spacer 31 is melted in the reflow furnace. The position of the second terminal 42 of 40 is limited to the outer shape of the spacer 31 by the surface tension of the molten solder. The spacer 31 as the "first spacer portion of the second conductor" is configured to define the first electronic member 40 when the first electronic component 40 is mounted on the component mounting range 13. The shape of the position of the second terminal 42 (Fig. 2).

On the other hand, when the second electronic component 50 is mounted in the component mounting range 13, in the reflow furnace, the solder between the second terminal 52 of the second electronic component 50 and the pads 31 to 33 is melted. The position of the second terminal 52 of the second electronic component 50 is limited to the outer shape of the spacer 32 and the spacer 33 by the surface tension of the molten solder. The spacer 32 and the spacer 33 as the "second spacer portion of the second conductor" are configured to define the second terminal 52 of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13. The shape of the position (Figure 4).

In other words, the second conductor 30 is formed with the spacer 31 corresponding to the position, size, shape, and the like of the second terminal 42 of the first electronic component 40, and the position of the second terminal 52 corresponding to the second electronic component 50. The gasket 32 and the gasket 33 of the size, shape and the like. The position, size, and shape of the spacer 31 are determined in accordance with the position, size, shape, and the like of the second terminal 42 of the first electronic component 40, and the position of the second terminal 42 of the first electronic component 40 is determined at a specific position. At the same time, the amount of solder of the spacer 31 is determined by the amount of solder to be appropriate. The position, size, and shape of each of the spacers 32 and the spacers 33 are such that the position of the second terminal 52 of the second electronic component 50 is specified in accordance with the position, size, shape, and the like of the second terminal 52 of the second electronic component 50. The position is determined, and the amount of solder of the spacer 32 and the spacer 33 is determined by an appropriate amount of solder.

The printed wiring board 10 of the present invention thus constituted is When the first electronic component 40 is mounted in the component mounting range 13, the position of the first terminal 41 of the first electronic component 40 can be defined by the spacer 21 of the first conductor 20 at a specific position, and the second conductor can be passed. The spacer 31 of 30 defines the position of the second terminal 42 of the first electronic component 40 at a specific position. When the first electronic component 40 is mounted on the component mounting range 13 via this, the first electronic component 40 can be mounted at a specific position of the component mounting range 13.

On the other hand, when the second electronic component 50 is mounted in the component mounting range 13 , the position of the first terminal 51 of the second electronic component 50 can be defined at a specific position via the spacer 22 and the spacer 23 of the first conductor 20 . At the same time, the position of the second terminal 52 of the second electronic component 50 can be defined at a specific position via the spacer 32 and the spacer 33 of the second conductor 30. When the second electronic component 50 is mounted in the component mounting range 13 via this, the second electronic component 50 can be mounted at a specific position of the component mounting range 13.

As described above, in the printed wiring board 10 of the present invention, the first electronic component 40 or the second electronic component 50 can be selectively mounted in the component mounting range 13. According to the present invention, it is possible to realize the commonality of the printed wiring board 10 in which the electronic components such as the position, size, and shape of the unstandardized terminal are mounted.

FIG. 5 is a plan view showing the first conductor 20 in a state in which the first electronic component 40 is mounted on the component mounting range 13 in an enlarged manner. Fig. 6 is a plan view showing the first conductor 20 in a state in which the second electronic component 50 is mounted in the component mounting range 13 in an enlarged manner.

The first terminal 41 of the first electronic component 40 has a rectangular shape of a horizontal width L1 and a vertical width L2. On the other hand, the first terminal 51 of the second electronic component 50 has a rectangular shape of a horizontal width L3 and a vertical width L4. For example, in this embodiment, the lateral width L1 of the first terminal 41 is shorter than the lateral width L3 of the first terminal 51. Further, the vertical width L2 of the first terminal 41 is longer than the vertical width L4 of the first terminal 51. Further, the first terminal 41 of the first electronic component 40 is located closer to the other side (the direction indicated by the symbol X2) than the first terminal 51 of the second electronic component 50.

The spacer 21 of the first conductor 20 has a substantially trapezoidal shape including an upper bottom side 211, a first oblique side 212, and a second oblique side 213. The upper bottom side 211 of the spacer 21 as the "first X-direction position defining portion" is defined in the X direction of the first terminal 41 of the first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 The position of the end portion 411 on one side (the end in the direction indicated by the symbol X1) (Fig. 5). The first oblique side 212 of the spacer 21 of the "first Y-direction defining portion" is defined so as to intersect the first electronic member 40 when the first electronic component 40 is attached to the component mounting range 13 in the first oblique portion 213. The position of both end portions 412, 413 in the Y direction of the first terminal 41 in the X direction (FIG. 5).

However, for example, the lateral width L1 of the first terminal 41 of the first electronic component 40 is only lengthened within the range of manufacturing tolerances, and is on one side of the first terminal 41 of the first electronic component 40 in the X direction. The position of the end 411 (the end in the direction indicated by the symbol X1) can be defined by the first oblique side 212 and the second oblique side 213 of the spacer 21.

The spacer 22 of the first conductor 20 includes an end portion 221 and a beveled edge 222, and the first oblique side 212 of the spacer 21 has a shape that is slightly parallel. The spacer 23 of the first conductor 20 includes an end portion 231 and a beveled edge 232, and the second oblique side 213 of the spacer 21 is formed in a slightly parallel shape. The end portion 221 of the spacer 22 and the end portion 231 of the spacer 23 in the "second X-direction position defining portion" are defined as the second electronic member 50 in the case where the second electronic component 50 is attached to the component mounting range 13. The position of one end 511 (the end in the direction indicated by the symbol X1) of one terminal 51 in the X direction (Fig. 6). The oblique side 222 of the spacer 22 and the oblique side 232 of the spacer 23 in the "second Y-direction position defining portion" are defined as the second electronic member 50 in the case where the second electronic component 50 is attached to the component mounting range 13 The position of both ends 512, 513 of the 1 terminal 51 in the Y direction (Fig. 6).

However, for example, the lateral width L3 of the first terminal 51 of the second electronic component 50 is only lengthened within the range of manufacturing tolerances, and is on one side of the first terminal 51 of the second electronic component 50 in the X direction. The position of the end 511 (the end in the direction indicated by the symbol X1) can be defined by the beveled edge 222 of the spacer 22 and the beveled edge 232 of the spacer 23.

FIG. 7 is a plan view showing the second conductor 30 in a state in which the first electronic component 40 is mounted on the component mounting range 13 in an enlarged manner. FIG. 8 is a plan view showing the second conductor 30 in a state in which the second electronic component 50 is mounted on the component mounting range 13 in an enlarged manner.

Similarly to the first terminal 41, the second terminal 42 of the first electronic component 40 has a rectangular shape with a lateral width L1 and a vertical width L2. another In the same manner as the first terminal 51, the second terminal 52 of the second electronic component 50 has a rectangular shape with a lateral width L3 and a vertical width L4. For example, in this embodiment, the lateral width L1 of the second terminal 42 is shorter than the lateral width L3 of the second terminal 52. Further, the vertical width L2 of the second terminal 42 is longer than the vertical width L4 of the second terminal 52. Further, the second terminal 42 of the first electronic component 40 is located closer to the second terminal 52 of the second electronic component 50 than to the one side in the X direction (the direction indicated by the symbol X1).

The spacer 31 of the second conductor 30 is formed in a substantially trapezoidal shape including an upper bottom side 311, a first oblique side 312, and a second oblique side 313. The upper bottom side 311 of the spacer 31 as the "third X-direction position defining portion" is defined in the X direction of the second terminal 42 of the first electronic component 40 when the first electronic component 40 is mounted on the component mounting range 13 The position of the other end 421 (the end in the direction indicated by the symbol X2) (Fig. 7). The first oblique side 312 of the spacer 31 of the "third Y-direction position defining portion" is defined so as to intersect the first electronic member 40 when the first electronic component 40 is attached to the component mounting range 13 . The position of both ends 422, 423 of the second terminal 42 in the Y direction (Fig. 7).

However, for example, the lateral width L1 of the second terminal 42 of the first electronic component 40 is only lengthened within the range of manufacturing tolerances, and the other side of the second terminal 42 of the first electronic component 40 in the X direction. The position of the end 421 (the end in the direction indicated by the symbol X2) can be defined by the first oblique side 312 and the second oblique side 313 of the spacer 31.

The spacer 32 of the second conductor 30 includes an end portion 321 and a bevel 322, and the first oblique side 312 of the spacer 31 is formed to be slightly parallel. shape. The spacer 33 of the second conductor 30 includes an end portion 331 and a beveled edge 332, and the second oblique side 313 of the spacer 31 has a shape that is slightly parallel. The end portion 321 of the spacer 32 and the end portion 331 of the spacer 33 as the "fourth X-direction defining portion" are defined as the second member of the second electronic component 50 when the second electronic component 50 is mounted on the component mounting range 13. The position of the other end 521 of the terminal 52 in the X direction (the end in the direction indicated by the symbol X2) (Fig. 8). The oblique side 322 of the spacer 32 and the oblique side 332 of the spacer 33 in the "fourth Y-direction position defining portion" are defined as the second electronic member 50 in the case where the second electronic component 50 is mounted on the component mounting range 13 The position of the two ends 522, 523 of the two terminals 52 in the Y direction (Fig. 8).

However, for example, the lateral width L3 of the second terminal 52 of the second electronic component 50 is only lengthened within the range of manufacturing tolerances, and the other side of the second terminal 52 of the second electronic component 50 in the X direction. The position of the end 521 (the end in the direction indicated by the symbol X2) can be defined by the bevel 322 of the spacer 32 and the bevel 332 of the spacer 33.

<Second embodiment>

A second embodiment of the printed wiring board 10 according to the present invention will be described with reference to Figs. 9 and 10 at the same time.

Fig. 9 is a plan view showing the first conductor 20 of the printed wiring board 10 of the second embodiment in an enlarged manner. FIG. 10 is a plan view showing the second conductor 30 of the printed wiring board 10 of the second embodiment.

The printed wiring board 10 of the second embodiment is a first conductor 20 is added to the spacers 21 to 23, and the point including the spacer 24 is different from that of the first embodiment. In addition, the printed wiring board 10 of the second embodiment is different from the first embodiment in that the second conductor 30 is applied to the spacers 31 to 33 and further includes the spacer 34. The same components as those in the first embodiment are denoted by the same reference numerals, and the detailed description thereof will be omitted.

The spacer 24 of the first conductor 20 is connected to the other side of the pads 21 to 23 of the first conductor 20 in the X direction (the direction indicated by the symbol X2) as shown in the figure. Set it up (Figure 9). In addition, the spacer 34 of the second conductor 30 is connected to the one of the pads 31 to 33 of the second conductor 30 in the X direction (the direction indicated by the symbol X1). Set it to ground (Figure 10). Therefore, when the first conductor 20 of the second embodiment is attached with solder to the first terminal 41 of the first electronic component 40 or the first terminal 51 of the second electronic component 50, the amount of solder is larger than that of the first embodiment. . Similarly, when the second conductor 30 of the second embodiment is attached with solder to the second terminal 42 of the first electronic component 40 or the second terminal 52 of the second electronic component 50, the amount of solder is smaller than that of the first embodiment. many. In this manner, the spacer structure of the first conductor 20 and the second conductor 30 is also considered to be appropriate for the amount of solder, and the second terminal member 41 and the second terminal 42 of each of the first electronic components 40 are used. The position, size, shape, and the like of the first terminal 51 and the second terminal 52 are preferably set to an appropriate position, size, and shape.

10‧‧‧Printed wiring substrate

11‧‧‧Substrate

12‧‧‧Photoresist layer

13‧‧‧Component installation range

20‧‧‧1st conductor

21~23‧‧‧1st conductor gasket

30‧‧‧2nd conductor

31~33‧‧‧2nd conductor gasket

40‧‧‧1st electronic component

41‧‧‧1st terminal

42‧‧‧2nd terminal

Claims (6)

A printed wiring board comprising: a substrate including a component mounting range in which a first electronic component or a second electronic component is selectively mounted, and a first mounting member, a first electronic component or the aforementioned a first conductor of the first terminal of the second electronic component; and a photoresist layer formed on the surface of the substrate; wherein the first conductive system includes a first pad formed by covering a portion of the first conductor with the photoresist layer The first spacer portion of the first conductor is configured to define a position of the first terminal of the first electronic component when the first electronic component is mounted in the component mounting range. The second spacer portion of the first conductor is configured to define a position of the first terminal of the second electronic component when the second electronic component is mounted in the component mounting range. The printed wiring board according to the first aspect of the invention, wherein the first spacer of the first conductor is configured to be provided in the first electronic component when the first electronic component is mounted in the component mounting range. The shape of the first X-direction position defining portion at the position of one end of the first terminal in the X direction, and the second spacer portion of the first conductor are configured to have the second electronic component attached to the component mounting range. The shape of the second X-direction position defining portion at the position of one end of the first terminal of the second electronic component in the X direction is defined. The printed wiring board according to the second aspect of the invention, wherein the first spacer portion of the first conductor is configured to have a predetermined crossover in the first mounting portion of the first electronic component. a shape of a first Y-direction position defining portion at a position of both ends of the X-direction in the Y direction of the first terminal of the electronic component, and a second spacer portion of the first conductor is attached to the second electronic component in the component mounting range In the case of the second Y-direction position defining portion that is defined at the both ends of the first terminal of the second electronic component in the Y direction. The printed wiring board according to any one of claims 1 to 3, further comprising: the first conductor is disposed on the one side of the X direction in the component mounting range a second conductor to which the first electronic component or the second terminal of the second electronic component is connected, wherein the second conductive system includes a portion in which the photoresist layer covers one of the second conductors a spacer portion and a second spacer portion; wherein the first spacer portion of the second conductor is configured to define a position of the second terminal of the first electronic component when the first electronic component is mounted in the component mounting range The second spacer portion of the second conductor is configured to define a position of the second terminal of the second electronic component when the second electronic component is mounted in the component mounting range. The printed wiring board according to claim 4, wherein the first spacer portion of the second conductor is mounted on the first electronic structure In the case of the component mounting range, the third X-direction position defining portion having a position defined by the other end of the second terminal of the first electronic component in the X direction is formed, and the second pad of the second conductor is formed. In the case where the second electronic component is mounted in the component mounting range, the shape of the fourth X-direction position defining portion that defines the position of the other end of the second terminal of the second electronic component in the X direction is formed. . The printed wiring board according to the fifth aspect of the invention, wherein the first spacer of the second conductor is configured to be provided in the first electronic component when the first electronic component is mounted in the component mounting range. a shape of a third Y-direction position defining portion at a position of both ends of the second terminal in the Y direction; and a second spacer portion of the second conductor is configured to have a second electronic component attached to the component mounting range The shape of the fourth Y-direction position defining portion at the position of both ends in the Y direction of the second terminal of the second electronic component is defined.