JP2020004772A - Printed circuit board with jumper portion - Google Patents

Abstract

To solve a problem in which, when a printed wiring board is designed, as the size of the printed wiring board is reduced, it is necessary to form a jumper portion that blocks a part of a printed pattern and solder a chip jumper and the like to make the jumper portion conductive later, and as the size of the printed wiring board is reduced, the number of such jumper portions increases, and therefore, the number of steps for soldering the chip jumpers also increases.SOLUTION: A printed circuit board on which an electronic component is mounted is used as a main board, and a sub-board is provided separately from the main board, and a printed pattern for a jumper portion that connects the jumper portions to each other is formed on the sub-board, and the jumper portions are made to conduct with each other by soldering the sub-board to the main board.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed wiring board having a printed pattern made of a conductor on the surface of a main board, and having a jumper portion that is electrically interrupted on the printed pattern.

  When a circuit is designed, a printed pattern made of a conductive copper foil or the like is designed on the surface of the substrate based on the designed circuit. If the size of the substrate is not limited, the printed pattern can be freely designed, but as the size of the substrate is reduced, the restriction on the design of the printed pattern increases. As a result, a case may occur in which two systems of patterns must intersect.

  In such a case, one of the two intersecting systems is cut off to form a jumper portion, and another member such as a chip jumper is used to electrically connect the cut off jumper portion to thereby form a crossover. There is a case where two systems cross each other without short-circuiting (for example, see Patent Document 1).

JP 2013-120894 A (FIGS. 3 to 6)

  When the number of jumpers is small, the number of steps for soldering chip jumpers for each jumper is small, but as the number of jumpers increases, the number of steps for soldering chip jumpers etc. increases, and Creation costs increase.

  In view of the above problems, it is an object of the present invention to provide a printed wiring board having a jumper section in which the number of steps for electrically connecting each jumper section is reduced even if the number of jumper sections is large.

  In order to solve the above-mentioned problems, a printed wiring board having a jumper according to the present invention includes a printed pattern made of a conductor on the surface of a main board. And a jumper member for electrically connecting the plurality of jumper portions to the printed pattern of the main board. Forming one sub-substrate adhered to the above as a jumper member, and soldering the one sub-substrate to the main substrate to conduct a plurality of jumpers of the printed pattern of the main substrate. It is characterized by.

  According to the above configuration, a plurality of jumpers can be electrically connected by one sub-board.

  Various electronic components are mounted on the main board, and when the sub-board is soldered to the main board, the sub-board may interfere with the mounted electromagnetic components. In this case, a cutout for avoiding an electronic component mounted on the surface of the main board may be formed in the sub-board.

  By the way, if the main substrate and the sub-substrate are formed of different materials, the coefficients of linear expansion of the two are different. Therefore, when heating and cooling are repeated, stress acts on the soldered portion, and the soldered portion peels off. May occur. In order to prevent such a problem from occurring, it is desirable that both the main substrate and the sub-substrate are formed of the same material.

  As is apparent from the above description, according to the present invention, since a plurality of jumpers can be electrically connected by one sub-board, even if the number of jumpers is large, each jumper can be electrically connected. Man-hours for connection do not increase.

FIG. 1 is a diagram showing a configuration of an embodiment of the present invention. Partial sectional view showing the structure of the soldered portion

  Referring to FIG. 1, reference numeral 1 denotes a main board, on which a plurality of electronic components 12 are mounted. In order to electrically connect the plurality of electronic components 12 to form a circuit, a pattern made of copper foil is formed. This pattern is provided with a plurality of jumpers 11 which should be connected but are interrupted. These jumpers 11 are electrically connected to each other by soldering a sub-substrate 2 to be described later, so that an electronic circuit is completed.

  The sub-board 2 is provided with a printed pattern 3 for jumpers for electrically connecting the jumpers 11 provided on the main board 1 to each other. In the present embodiment, three printed patterns 3 are provided on the sub-board 2.

  Each print pattern 3 includes soldering portions 31 at both ends and a conductive portion 32 connecting both soldering portions 31. When the sub-board 2 is soldered to the main board 1, the soldering portion 31 and the jumper portion 11 are soldered to each other, so that the pair of jumper portions 11 conduct through the conduction portion 32. Will be.

  In addition, a window hole 21 which is a cutout portion is formed in the sub-board 2 in order to avoid interference with the electronic component 12. When soldering the sub-substrate 2 to the main substrate 1, the spacers 22 were attached so that a predetermined gap was formed between them.

  In the present embodiment, when the electronic component 12 is soldered to the main substrate 1, a solder paste is applied to the surface of the main substrate 1, and the electronic component 12 is placed on the applied solder paste. The electronic components 12 are mounted on the main substrate 1 by heating the solder paste to melt the solder paste, and then cooling the solder paste.

  The sub-board 2 is soldered at the same time that the electronic component 12 is mounted on the main board 1. Referring to FIG. 2, as described above, soldering section 31 is soldered to jumper section 11 on main board 1 side. Therefore, a plurality of small ball-shaped solder balls 4 are attached to the soldering portion 31 in advance, and the soldering portion 31 and the jumper portion 11 are combined and heated in this state, so that the solder balls 4 are melted and both are melted. We decided to solder each other. At this time, since a predetermined gap is secured between the main substrate 1 and the sub-substrate 2 by the spacer 22, the molten solder does not protrude to the periphery.

  As described above, when the sub-substrate 2 is soldered to the main substrate 1 at a plurality of locations, if the linear expansion coefficients of the main substrate 1 and the sub-substrate 2 are different after heating and cooling, the expansion and contraction amount However, stress acts on the soldered portion. Therefore, the same material is used for the main substrate 1 and the sub-substrate 2 so that the linear expansion coefficients are the same.

  The present invention is not limited to the above-described embodiment, and various changes may be made without departing from the gist of the present invention.

DESCRIPTION OF SYMBOLS 1 Main board 2 Sub-board 3 Print pattern (for jumper) 4 Solder ball 22 Spacer

Claims (3)

  A printed wiring board comprising a printed pattern made of a conductor on the surface of the main board, the printed pattern having a jumper portion electrically interrupted and a jumper member for electrically conducting the jumper portion. The printed pattern is provided with a plurality of jumpers, and one sub-substrate having a surface on which a jumper printed pattern for conducting each of the plurality of jumpers is formed as the jumper member. A printed wiring board having a jumper section, wherein a plurality of jumper sections of a printed pattern of the main board are electrically connected by soldering one sub-board to the main board.   The printed wiring board having a jumper according to claim 1, wherein the sub-board is formed with a cutout for avoiding an electronic component mounted on a surface of the main board.   3. The printed wiring board having a jumper according to claim 1, wherein the main board and the sub board are formed of the same material.

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