JP2018129464A - Printed circuit board and printed circuit device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board with sufficient current capacity secured.SOLUTION: A printed circuit board 1 includes a printed wiring board 10 on which a circuit pattern for connecting an input terminal and an output terminal is formed and a plurality of current reinforcing plates 50 connected and fixed to a circuit pattern through a conductive connecting member. The plurality of current reinforcing plates 50 are arranged side by side with a gap therebetween on the circuit pattern along the current path direction between input and output terminals.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a printed circuit board and a printed circuit device having a structure for reinforcing a current capacity of a circuit pattern formed on a printed wiring board.

  In recent years, a so-called strong electric circuit (for example, a power supply circuit) in which a large current flows and a so-called weak electric circuit (for example, an LSI) in which signal control is performed on the same substrate due to cost reduction related to the substrate and components. There is a need to implement. The printed circuit board dedicated to the high-power circuit is designed to increase the current capacity of the entire circuit board, but the cost of the printed circuit board itself and the manufacturing cost thereof are increased accordingly. On the other hand, the printed circuit board used in the weak electric circuit is less expensive than the printed circuit board dedicated to the high electric circuit, but the current capacity for mounting the high electric circuit may not be sufficient. In such a printed circuit board, when flowing a large current while suppressing heat generation, it is conceivable to widen the wiring width, but there is a problem that the board size increases.

  In order to solve the above problem, Patent Document 1 discloses a technique in which jumper wires are mounted on a wiring pattern of a printed wiring board, both ends of the jumper wires are passed through holes, and soldered on the back surface of the substrate. ing. As another technique, a method of forming all or part of a circuit pattern with a thick copper foil is known.

Japanese Patent Laid-Open No. 2006-82026

  However, when a jumper wire as shown in Patent Document 1 is used, the design of the printed circuit device is restricted because the jumper wire needs to be passed through the through hole and the circuit pattern of the same potential is required on both sides of the substrate. Or the substrate size may increase. Further, a jumper line corresponding to the shape of the circuit pattern must be created for each location where the current capacity is increased. Furthermore, if there is a design change in the circuit pattern on which the jumper line is mounted, it is necessary to recreate the corresponding jumper line, which is troublesome and increases costs.

  As described above, there is a method in which the entire circuit pattern is made of thick copper foil. However, since etching with a depth corresponding to the pattern is required, it is difficult to form a circuit pattern with a narrow line width. It may lead to an increase in area. In addition, when a part of the circuit pattern is formed of a thick copper foil, it is not desirable because an increase in the manufacturing process of the substrate may increase labor and cost.

  In view of the above problems, an object of the present invention is to solve the above-described problems and provide a printed circuit board having a sufficient current capacity.

  In the first aspect of the present invention, the printed circuit board includes a printed wiring board on which a circuit pattern for connecting two terminals is formed, and a gap along the current path direction between the two terminals on the circuit pattern. And a plurality of main current reinforcing members which are arranged to form a line in a row and are connected and fixed to the circuit pattern by a conductive connecting member.

  In the printed circuit board according to the above aspect, since the main current reinforcing members are arranged side by side along the current path direction, the cross-sectional area of the conductor region including the circuit pattern and the main current reinforcing member can be increased. The current capacity between the two can be ensured. Furthermore, the increase in the cross-sectional area of the conductor region can enhance the heat dissipation effect when a large current is passed.

  Further, in this aspect, the current reinforcing members are arranged along the current path with a gap therebetween, that is, the current capacity is reinforced by the current reinforcing member having a length divided into a plurality of the current path lengths. doing. Accordingly, for example, a common current reinforcing member can be used for circuit patterns having different lengths. Specifically, the number of current reinforcing members arranged along the current path direction may be varied. Further, even when the circuit pattern is bent (for example, when it is L-shaped), the row of current reinforcing members can be aligned in the current path direction. That is, a common current reinforcing member can be used for circuit patterns having different shapes and lengths. Thereby, compared with the case where the jumper line customized for every circuit pattern is used, cost and the effort of a work can be reduced, for example.

  Furthermore, even when the shape of the circuit pattern to be reinforced with current capacity changes due to a design change or the like, the number and arrangement of current reinforcing members to be arranged in accordance with the shape of the circuit pattern (for example, angle etc.) ) Can be adjusted to adjust the length and shape of the rows of current reinforcing members, so there is no need to remake the current reinforcing members.

  A side current reinforcing member disposed on one or both sides of the row of the plurality of main current reinforcing members, wherein the side current reinforcing member is a current in each gap provided between the adjacent main current reinforcing members. It may be connected and fixed to the circuit pattern so as to overlap the entire gap when viewed from the direction orthogonal to the flow path perpendicular to the path direction.

  According to this configuration, the side current reinforcing member can reinforce the current capacity of the gap portion provided between the adjacent main current reinforcing members by the side current reinforcing member. As a result, even if there is a place where the current capacity is relatively low compared to other parts in the gap between the main current reinforcing members adjacent in the current path direction, the lateral current reinforcing member The current capacity when viewed as the whole wiring can be supplemented.

  The side current reinforcing members may be provided on either side of the main current reinforcing member row, or may be provided on both sides of the main current reinforcing member row. However, the effect of reinforcing the current capacity can be further enhanced by providing the main current reinforcing members on both sides of the row.

  The current reinforcing member has a rectangular shape in which the length in the current path direction is longer than the flow path orthogonal direction and four corners are cut out, or an elliptical shape or an ellipse in which the current path direction length is longer than the flow path orthogonal direction. It is good also as a shape.

  Here, the current reinforcing member may include both a main current reinforcing member and a side current reinforcing member. Also in the following description, when only “current reinforcing member” is described, both the main current reinforcing member and the side current reinforcing member may be included. Further, the adjacent current reinforcing member may be either one of the current reinforcing members adjacent in the current path direction or the flow path orthogonal direction, or may include both of them.

  According to this configuration, for example, when the shape of the circuit pattern is bent, the current reinforcing members can be arranged close to each other so that unnecessary gaps are not generated between the current reinforcing members.

  The current reinforcing member is provided with solder connecting portions for connecting solder as connecting members at both ends in the longitudinal direction, and a through-hole penetrating in the plate thickness direction is provided at the center in the longitudinal direction of the solder connecting portion. It may be formed.

  According to this configuration, it is possible to make it difficult for heat at the time of soldering to the solder connection portion to be transmitted to the center in the longitudinal direction from the through hole. As a result, the temperature of the solder connection portion is likely to rise, and it is possible to make it difficult to cool down after the temperature rises. That is, the workability of soldering can be improved.

  The current reinforcing member may be provided with solder connecting portions for connecting solder as connecting members at both ends in the longitudinal direction, and the portions other than the solder connecting portions may be covered with an insulating layer.

  According to this configuration, since the portion other than the solder connection portion is covered with the insulating layer so that the solder is not attached, the amount of solder used is reduced, for example, when soldering by the flow soldering method. be able to.

  In a second aspect of the present invention, a printed circuit device is obtained by mounting a plurality of electronic components on the printed circuit board described in the first aspect, and two terminals of the printed circuit board are arranged on the circuit pattern. Are connected to component terminals of the electronic components different from each other.

  According to this configuration, the current capacity between the input / output terminals can be sufficiently secured as in the first aspect. Furthermore, a common current reinforcing member can be used for circuit patterns having different shapes and lengths.

  According to the present invention, the main current reinforcing members are arranged between the input / output terminals along the current path direction so that the current flows therethrough, so that the current between the input / output terminals (between the component terminals of the electronic component) A sufficient capacity can be secured. Furthermore, a common current reinforcing member can be used for circuit patterns having different shapes and lengths.

It is the schematic block diagram which looked at the printed circuit device concerning this embodiment from the back side of a substrate. It is a schematic sectional drawing in the II-II line of FIG. It is a schematic sectional drawing in the III-III line of FIG. It is a schematic sectional drawing in the IV-IV line of FIG. It is a perspective view which shows schematic structure of an electric current reinforcement member. It is a figure for demonstrating the manufacturing process of a printed circuit device. It is the schematic block diagram which looked at the printed circuit device which concerns on a modification from the surface side of the board | substrate. It is the schematic block diagram which looked at the printed circuit device which concerns on a modification from the surface side of the board | substrate. It is the schematic block diagram which looked at the printed circuit device which concerns on a modification from the back surface side of the board | substrate. It is the schematic block diagram which looked at the printed circuit device which concerns on a modification from the back surface side of the board | substrate.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The following description of the preferred embodiments is merely exemplary in nature and is in no way intended to limit the invention, its application, or its application.

  FIG. 1 is a schematic configuration diagram of a printed circuit device A according to an embodiment as viewed from the back side of a substrate. 2 is a schematic cross-sectional view taken along line II-II in FIG. 1, FIG. 3 is a schematic cross-sectional view taken along line III-III, and FIG. 4 is a schematic cross-sectional view taken along line IV-IV. In FIG. 1, it is assumed that a solder 42 for connecting between a current reinforcing plate 50 and a terminal 13 c described later and the circuit pattern 11 is not shown. The same applies to the schematic configuration diagram of another printed circuit device A viewed from the front and back surfaces of the substrate. In the cross-sectional views (FIGS. 2 to 4), the circuit pattern 11 is not specifically illustrated, and a region (wiring layer portion) where the circuit pattern 11 is formed is hatched.

  As shown in FIGS. 1 and 2, the printed circuit device A includes a printed circuit board 1 and an electronic component 30 such as an IC or a passive element mounted on the printed circuit board 1. The electronic component 30 may be mounted on one surface of the printed circuit board 1 or may be mounted on both surfaces. In the present disclosure, the printed circuit device A indicates a state in which the electronic component 30 or the like is mounted on the printed circuit board 1.

  The printed circuit board 1 includes a printed wiring board 10 having a circuit pattern 11 formed on at least one surface. In the following description, the printed wiring board 10 is described on the assumption that the circuit pattern 11 is formed on the front and back surfaces.

  The printed wiring board 10 has a stacked structure in which wiring layers 10a and insulating layers 10b are alternately stacked. FIG. 2 shows an example of a printed wiring board 10 having a four-layer structure. The wiring layer 10a is formed of, for example, copper foil, and the circuit pattern 11 is formed in each wiring layer 10a by etching or the like. In addition, the number of layers of the printed wiring board 10 and the material of the insulating layer and the wiring layer are not particularly limited.

  The printed wiring board 10 is formed with a plurality of through holes 12 for connecting circuit patterns 11 of different wiring layers 10a to each other. A plating film 10 c is formed continuously and integrally on the circuit pattern 11 on the front and back surfaces of the printed wiring board 10 and on the inner wall of the through hole 12. Circuit patterns 11 of different wiring layers 10a are connected to each other by the plating film 10c. 2 and 6 show an example in which the circuit pattern 11 on the front surface of the substrate and the circuit pattern 11 on the back surface of the substrate are connected by the plating film 10c by the plating film 10c. The thickness of copper foil and the plating film 10c is not specifically limited, What is necessary is just to have a thickness comparable as a prior art. Specifically, it is about 15-40 micrometers, for example. For convenience of explanation, in FIG. 1, the front surface in the direction orthogonal to the paper surface is the back surface, and the back surface in the direction orthogonal to the paper surface is not illustrated. Similarly, in FIGS. 2 and 6, the upper surface of the drawing is the front surface, and the lower surface of the drawing is the back surface. However, in the present disclosure, the manner of mounting on the front and back surfaces of the printed wiring board 10 and the printed circuit board 1 is not particularly limited, and therefore the front and back surfaces may be reversed, and the same effect is obtained.

  A conductive current reinforcing member 20 is attached to a desired through hole 12 selected from the plurality of through holes 12 from the viewpoint of reinforcing the current capacity. As shown in FIG. 5, the current reinforcing member 20 includes a hollow cylindrical main body 21 loosely fitted in the through hole 12 with a gap, and one end in the longitudinal direction (substrate thickness direction) of the main body 21. And a locking portion 22 that protrudes integrally from the portion toward the outer side in the circumferential direction. In this specification, “to be loosely fitted” means to be fitted with a play (interval) between the through hole 12 and the main body portion 21 of the current reinforcing member 20. Note that the size of the gap between the through hole 12 and the main body 21 is not particularly limited as long as the circuit pattern 11 and the main body 21 can be soldered.

  More specifically, the main body 21 of the current reinforcing member 20 has a hollow cylindrical shape, and the outer diameter in plan view is slightly smaller than the hole diameter of the through hole 12. Thereby, the current reinforcing member 20 is loosely fitted in the through hole 12 with a gap. Further, the current reinforcing member 20 can be attached later to the printed wiring board 10 created by a general-purpose device. That is, the current capacity of the desired through hole 12 can be reinforced afterwards. Reference numeral 21 a denotes a hollow portion of the main body 21.

  The main body 21 is formed with a slit 21b that extends over the entire length. By forming such a slit 21b, the solder 42 can be easily guided into the through hole 12, and the contact area between the current reinforcing member 20 and the plating film 10c formed on the inner wall of the through hole 12 can be increased. . Specifically, for example, when the current reinforcing member 20 is attached to the through hole and then soldered by the flow soldering method from the back side of the printed wiring board 10, the solder 42 is easily guided into the through hole. . Thereby, the effect of reinforcing the current capacity of the through hole 12 can be enhanced, and the connection stability can be enhanced.

  For example, when the current reinforcing member 20 is attached from the surface side of the printed wiring board 10, the locking portion 22 of the current reinforcing member 20 contacts the surface of the printed wiring board 10. This prevents the current reinforcing member 20 from falling off the printed wiring board 10 when the current reinforcing member 20 and the circuit pattern 11 are soldered. After making the above contact state, the locking portion 22 is soldered to the circuit pattern 11. That is, the locking portion 22 may be configured to be locked to the printed wiring board 10 and to be connected and fixed to the circuit pattern 11, and the specific shape is not particularly limited. However, the locking portion 22 is a flat plate from the viewpoint of securing the contact area with the circuit pattern 11 to increase the connection stability and enabling mounting with a general-purpose suction-type component mounting device. desirable. If the locking portion 22 is a flat plate, the current reinforcing member 20 can be attached to the through hole 12 by adsorbing the locking portion with a general-purpose component mounting apparatus.

  On the back surface of the printed wiring board 10, a circuit pattern 11 (hereinafter referred to as a large current pattern 13 for convenience of explanation) for flowing a large current out of the circuit pattern 11 is formed. The large current pattern 13 is a substantially L-shaped wiring extending in the vertical direction and the horizontal direction in FIG. Specifically, the large current pattern 13 is configured on the back surface of the printed wiring board 10 by two main wirings 13a extending in directions orthogonal to each other and a connection wiring 13b connecting the two main wirings 13a. Yes. The connection wiring 13b is a wiring in an oblique direction (inclined to the right in FIG. 1) that inclines inward from the tip end portions of both the main wirings 13a with respect to the extending direction of the main wiring 13a.

  In FIG. 1, through holes 12 with a plating film 10 c are formed at both ends of the large current pattern 13, and each constitutes a terminal 13 c. One component terminal 31 of the electronic component 30 (see FIG. 2) is connected to one terminal 13c (the terminal 13c on the lower left side in FIG. 1) of the large current pattern 13. The other component terminal 31 of the electronic component 30 is connected to a circuit pattern (for example, a circuit pattern in which a large current flows) 11 different from the large current pattern 13 through the through hole 12. Similarly, a component terminal 31 of an electronic component (not shown) different from the electronic component 30 is connected to the other terminal 13c of the large current pattern 13 (terminal 13c on the upper right side in FIG. 1). The function and type of the electronic component connected to the large current pattern 13 are not particularly limited. For example, electronic components include passive elements represented by resistance elements and capacitive elements, active elements such as flip-flops, ICs, terminal blocks, connectors, and the like.

  Between the two terminals 13c, the current reinforcing plates 50 are arranged along the current path direction so as to form three rows. Specifically, the current reinforcing plates 50 are arranged side by side with a predetermined gap in the current path direction in each row. Similarly, a predetermined gap is provided between the current reinforcing plates 50 adjacent to each other. The size of the predetermined gap between the current reinforcing plates 50 adjacent to each other in the direction of the current path and the direction orthogonal to the flow path is not particularly limited. For example, it is necessary between the current reinforcing plates 50 when mounting the current reinforcing plates 50 on the printed wiring board 10. It is desirable that the clearance is set based on the clearance required for soldering the current reinforcing plate 50 to the large current pattern 13. For example, when the connecting member is solder, when the thickness of the current reinforcing plate is about several hundreds μm to 2 mm, it is desirable to secure 1 mm or more as a clearance in order to perform soldering.

  In the present disclosure, a direction in which a current flows between two terminals 13c provided in the large current pattern 13 is referred to as a current path direction. For example, in FIG. 1, when a current flows between the two terminals 13c when the printed circuit device A is energized, the direction along the wiring of the large current pattern 13 is the current path direction. Note that the current path direction does not have to be strictly the direction in which current flows, and refers to the direction along the direction in which current flows in the large current pattern 13. Therefore, the fact that the current reinforcing plates 50 are arranged side by side along the current path direction means that, for example, a part of the arranged current reinforcing plates 50 is between the other current reinforcing plates 50 constituting the row, It is a concept that includes a part that is slightly shifted in the direction orthogonal to the flow path orthogonal to the current path direction, a part of the arranged current reinforcing plates that are slightly inclined from the direction in which the current flows, and the like. (Refer to FIGS. 7 to 9 described in the modification).

  Further, the size of the predetermined gap between the current reinforcing plates 50 adjacent in the current path direction and the flow path orthogonal direction is not particularly limited, but from the viewpoint of securing the current capacity, it is adjacent while securing the necessary clearance. It is preferable to arrange them close to each other so that the gap between the current reinforcing plates 50 is small. Further, the gap between the adjacent current reinforcing plates 50 may be sized so that the side walls of the adjacent current reinforcing plates 50 can be connected by the solder 42.

  For example, in FIGS. 3 and 4, an example in which the current reinforcing plates 50 adjacent to each other in the direction orthogonal to the flow path are connected by the solder 42 (an example in which the current reinforcing plates 50 are filled with solder) is indicated by a one-dot chain line. As a result, the current capacity of the solder 42 can be increased. When soldering by the flow soldering method, there is a case where such a solder state is brought about. In addition, when connecting between the said current reinforcement boards 50 adjacent as mentioned above with solder, it may be that the specific adjacent current reinforcement boards are connected with the electroconductive connection member, and the same effect Is obtained.

  The specific shape of the current reinforcing plate 50 is not particularly limited. However, when the current reinforcing plate 50 is disposed, the current reinforcing plate 50 has a shape in which a gap that greatly exceeds the clearance necessary for the clearance is not easily generated. It is desirable.

  For example, when the large current pattern 13 has a shape including a bent portion as shown in FIG. 1, the current reinforcing plate 50 has a polygonal shape in which the length in the current path direction is longer than that in the flow path orthogonal direction and the corner is removed. The length in the current path direction is preferably an oval or elliptical shape that is longer than the direction orthogonal to the flow path. By doing so, it is possible to efficiently increase the cross-sectional area when viewed as the entire wiring portion to which the current reinforcing plate 50, the connection member (for example, solder), and the large current pattern 13 are added. In FIG. 1, the current reinforcing plate 50 is an octagonal flat plate in which four corners of a rectangular plate are cut out in a triangular shape, and the ratio of the width direction to the longitudinal direction is approximately 1: 3. An example of the case is shown.

  The ratio between the width direction and the longitudinal direction of the current reinforcing plate 50 is not limited to the illustrated size ratio, and can be set arbitrarily. For example, by setting the ratio of the length in the longitudinal direction to the width direction of the current reinforcing plate 50 to about FIG. 1, there is an advantage that variations in the shape of the circuit pattern that can be handled when the current reinforcing plates 50 having the same shape are arranged are increased. is there. That is, there is an advantage that the versatility of the current reinforcing plate 50 is enhanced and the parts can be shared, so that the cost can be reduced. For example, FIG. 1 shows an example in which current reinforcing plates 50 having the same shape are arranged.

  On the other hand, details will be described in a later-described modification, but the number of necessary current reinforcing plates 50 can be reduced by making the ratio of the length in the longitudinal direction to the width direction of the current reinforcing plate 50 larger than that in FIG. There is a merit that can be.

  Further, the size and thickness of the current reinforcing plate 50 are not particularly limited, and may be appropriately set according to, for example, the width of the large current pattern 13 and the required current capacity. Further, for example, the width and length of the current reinforcing plate 50 may be set based on a size that can be mounted by a general-purpose mounting device, or may be set to a value according to the size of other electronic components. Good.

  Next, a method for manufacturing the printed circuit device A will be described in detail with reference to FIG.

  First, a printed wiring board 10 on which four wiring layers 10a as shown in FIG. 6B are formed is prepared. As shown in FIG. 6A, the printed wiring board 10 has through holes 12 formed by drilling, laser processing, or the like on the board on which the four wiring layers 10a are formed. It is obtained by forming a plating film 10 c on the circuit pattern 11 and on the inner wall of the through hole 12.

  Next, the current reinforcing member 20 is inserted into the through hole 12 formed in the large current pattern 13 from the front side or the back side, and the circuit pattern 11 formed on the front surface in the insertion direction and the locking portion 22 are connected. Solder. FIG. 6C shows an example in which the current reinforcing member 20 is inserted from the front side of the printed wiring board 10 and the locking portion 22 is soldered to the circuit pattern 11 on the surface of the printed wiring board 10. The soldering method is not particularly limited. For example, the solder can be connected and fixed to the circuit pattern 11 by a reflow soldering method using cream solder 41 as a conductive connecting member. The conductive connection member is not limited to solder, and other connection members may be used, and the same applies to other descriptions in the embodiment.

  Next, as shown in FIGS. 1 and 6D, the current reinforcing plate 50 is mounted on the large current pattern 13. Specifically, the current reinforcing plate 50 is attached in a predetermined position on the large current pattern 13 using a heat resistant adhesive or the like. Further, the component terminal 31 of the electronic component 30 is inserted from the front side of the printed wiring board 10 through the hollow portion 21 a of the main body 21 of the current reinforcing member 20 and soldered from the back side of the printed wiring board 10. The soldering method is not particularly limited. For example, the soldering method can be connected and fixed to the circuit pattern 11 by a flow soldering method using a heating tank 40 in which the solder 42 is melted and accommodated. In this way, the printed circuit device A can be obtained.

  As described above, in the printed circuit board 1 and the printed circuit device A according to the present embodiment, the large current pattern 13, the current reinforcing plate 50, and the solder 42 are arranged by arranging the current reinforcing plates 50 along the current path direction. Can be increased, and the current capacity between the two terminals 13c can be ensured. Further, since the current reinforcing plates 50 are arranged in three rows, the conductor area can be increased as compared with the case of one row. In this way, the number of rows of current reinforcing plates 50 can be increased or decreased according to the required current capacity.

  Further, in the relationship between the current reinforcing plate 50 in one row of the current reinforcing plates 50 arranged in three rows and the current reinforcing plate 50 adjacent to the side thereof, when viewed from the direction orthogonal to the flow path. The current reinforcing plates 50 belonging to the other row are arranged so as to overlap the entire gap between the current reinforcing plates 50 belonging to one row. As described above, the gap between the current reinforcing plates 50 in each row is supplemented by the current reinforcing plates 50 in the other rows, so that the variation in the conductor region can be reduced over the entire current path direction. That is, the current capacity can be increased more stably over the entire current path direction.

  Although the preferred embodiments of the present invention have been described above, various modifications as shown in the following modifications and other embodiments are possible. In each modification and other embodiments, differences from the above embodiments will be mainly described in detail.

-Modification 1-
FIG. 7 is a schematic configuration diagram of the printed circuit device B according to the first modification when viewed from the front surface side of the substrate. In the first modification, the large current pattern 13 is formed on the surface of the printed wiring board 10 and the electronic component 30 is mounted. Specifically, the large current pattern 13 has an L shape and is constituted by two main wirings 13a extending in directions orthogonal to each other.

  As in FIG. 1 (embodiment), terminals 13 c are provided at both ends of the large current pattern 13. One component terminal 31 of the surface-mount type electronic component 30 is connected to one terminal (the terminal 13c on the lower left side in FIG. 7). The other component terminal 31 of the electronic component 30 is connected to a circuit pattern 11 different from the large current pattern 13. Similarly, a terminal block (hereinafter referred to as a terminal block 30) as the electronic component 30 is connected to the other terminal 13c (the terminal 13c on the upper right side in FIG. 7) of the large current pattern 13. The terminal block 30 is provided with four component terminals 31. The four component terminals 31 are connected to the large current pattern 13, and a terminal 13c is constituted by the connection portion. As described above, the terminal 13c in the present disclosure indicates a current inlet / outlet in the large current pattern 13, and does not have to be one point. The same applies to other descriptions.

  Further, the current reinforcing plate 51 according to this modification has a shape in which four corners of a rectangular plate are cut out into a rectangular shape. In other words, the current reinforcing plate 51 has a shape in which a rectangular protrusion protrudes in a convex shape from a central portion in the width direction of the rectangular flat plate. The protruding portion may be a solder connection portion 51a for soldering. For example, when the front side is soldered by the reflow soldering method, only the solder connection portion 51a (projecting portion) may be soldered. Specifically, as shown in FIGS. 9 and 10 to be described later, it can be realized by covering other than the solder connection portion 51a with an insulating film. Thereby, it is possible to secure the connection length between the solder and the substrate while reducing the amount of solder used.

  FIG. 7 shows an example in which the current reinforcing plates 51 are arranged so as to form two rows along the current path direction (see the solid line in FIG. 7). Further, when viewed from the direction orthogonal to the flow path, the adjacent rows and the solder connection portions 51a are arranged so as to overlap each other. Thereby, the variation in the cross-sectional area of the conductor region can be reduced over the entire current path direction. Note that the current reinforcing plates 51 indicated by the solid lines in FIG. 7 may be regarded as one row. That is, the current reinforcing plates 51 indicated by the solid lines in FIG. 7 are also arranged in a line along the current path direction with a gap therebetween. In addition, in FIG. 7, in addition to the row | line | column of the current reinforcement board 51, the example increased 1 line (row | line of the current reinforcement board 52) with the virtual line is shown. In FIG. 7, 52a indicates a solder connection portion.

  The technology according to the present disclosure is characterized in that it can be applied to a surface-mounted circuit configuration as in the present modification. That is, since the current capacity can be reinforced only on the same surface as the large current pattern 13, the circuit design on the surface opposite to the surface on which the large current pattern 13 is formed (the back surface in FIG. 7) as compared with the technique according to Patent Document 1. The degree of freedom increases. Specifically, in the technique such as Patent Document 1, it is necessary to prepare a circuit pattern having the same potential as the large current pattern 13 on both sides, but this modification 1 and the following modification 2 do not need this.

-Modification 2-
FIG. 8 is a schematic configuration diagram of a printed circuit device C according to Modification 2 as viewed from the front surface side of the substrate. This modification shows an example in which current reinforcing plates 53 and 54 having different shapes are mounted. In the second modification, the large current pattern 13 and the electronic component 30 are mounted on the surface of the printed wiring board 10 as in FIG. 7 (the first modification). The shape of the large current pattern 13 is the same as that in FIG. 1 (embodiment).

  Specifically, in FIG. 8, a current reinforcing plate 53 (hereinafter also referred to as a main current reinforcing plate 53) having the same length as the sides of the two main wirings 13a and the connection wirings 13b is arranged in the current path direction. Are arranged side by side along the line. In addition, current reinforcement is provided inside each gap provided between adjacent main current reinforcement plates 53 so as to overlap the entire gap between the main current reinforcement plates 53 when viewed from the direction orthogonal to the flow path. A plate 54 (hereinafter also referred to as a side current reinforcing plate 54) is disposed. This modification shows an example in which the side current reinforcing plate 54 is shorter than the main current reinforcing plate 53. As described above, the lengths of the current reinforcing plates 53 and 54 constituting the printed circuit board 1 may be different from each other. The same applies to the current reinforcing plates 53 constituting the same row, and one row may be constituted by current reinforcing plates having different lengths. However, by increasing the number of places where the current-reinforcing plates of the common size are used, workability can be improved and manufacturing costs can be reduced, and component costs can be reduced.

  Further, the current reinforcing plates 53 and 54 according to the second modification are provided with solder connection portions 53a and 54a for soldering to both ends in the longitudinal direction, as in the first modification, and the solder connection portions 53a. , 54a is formed with heat diffusion preventing holes 53b, 54b penetrating in the thickness direction at the center in the longitudinal direction. Thereby, heat at the time of soldering to the solder connection portions 53a and 54a is blocked by the heat diffusion preventing holes 53b and 54b, so that the heat is less easily transmitted to the center in the longitudinal direction than the heat diffusion preventing holes 53b and 54b. As a result, the temperature of the solder connection portions 53a and 54a is likely to rise, but after the temperature rises, it becomes difficult to cool down, so that the soldering workability can be improved.

-Modification 3-
FIG. 9 is a schematic configuration diagram of a printed circuit device D according to Modification 3 as viewed from the back side of the substrate. In the third modification, as in FIG. 1 (embodiment), electronic components are mounted on the surface of the printed wiring board 10, and the large current pattern 13 is formed on the back surface of the printed wiring board 10. Similarly to FIG. 7 (Modification 1), the shape of the large current pattern 13 is L-shaped, and the current reinforcing plates 55 and 56 are mounted on the large current pattern 13.

  Specifically, in FIG. 9, a current reinforcing plate 55 (hereinafter also referred to as a main current reinforcing plate 55) extending along each main wiring 13 a is provided at a portion closer to the outside on each main wiring 13 a of the large current pattern 13. ) Has been implemented. Further, a current reinforcing plate 56 (hereinafter also referred to as a side current reinforcing plate 56) having a shorter length in the longitudinal direction than the main current reinforcing plate 55 is formed in a gap portion between the main current reinforcing plates 55 orthogonal to each other in the current path direction. ) Are arranged. The plurality of side current reinforcing plates 56 are arranged so as to overlap the entire gap when viewed from the direction orthogonal to the flow path with respect to the gap provided between the main current reinforcing plates 55 along the current path direction. Has been.

  Further, in the current reinforcing plates 55 and 56 according to the third modification, from the viewpoint of reducing the amount of solder, intermediate portions 55b other than the solder connection portions 55a and 56a for soldering provided at both ends in the longitudinal direction. , 56b (see hatched lines in FIG. 9) are covered with an insulating film.

  As shown in FIG. 9, the current reinforcing members 55 and 56 need not all overlap the large current pattern 13, and part of the current reinforcing members 55 and 56 protrudes to the outside of the large current pattern 13. It doesn't matter.

  Although not shown in the drawings, the main current reinforcing plate 55 and the side current reinforcing plate 56 may have different thicknesses, or may be a laminate in which a plurality of sheets are stacked. For example, a plurality of main current reinforcing plates 55 having the same thickness may be stacked to form a laminated body. When the main current reinforcing plate 55 is laminated, for example, the intermediate portions 55b and 56b of the main current reinforcing plate 55 forming each layer (between the insulating films) are attached with a heat-resistant adhesive or the like, and then all the layers are bonded. What is necessary is just to solder between the solder connection parts 55a of the main current reinforcement board 55 which comprises.

-Other embodiments-
It should be noted that the above-described embodiments and modifications can be combined. For example, instead of the current reinforcing plate 50 shown in FIG. 1, the current reinforcing plate having the shape and form shown in FIGS. 7, 8, and 9 may be applied, and the same effect can be obtained. Further, as shown in FIG. 10, a solder connecting portion 50a for soldering the trapezoidal tip of the current reinforcing plate 50 shown in FIG. 1 is used, and the other intermediate portion 50b in the longitudinal direction is an insulating film. You may make it cover with. Although not shown, a thermal diffusion prevention hole for preventing thermal diffusion may be formed in the vicinity of the solder connection portion 50a (the central side in the longitudinal direction).

  In the above description, the current reinforcing plate is shown as being disposed over substantially the entire current path. However, the current reinforcing plate is disposed only in a part of the current path along the current path direction. It may be configured to reinforce the current capacity of the portion. Although not shown in detail, for example, when the large current pattern 13 is a combination of a wide wiring and a wiring that becomes narrow in relation to other elements, the current reinforcing plate is applied only to the narrow wiring portion. May be arranged.

  In the above description, the example in which the terminals 13c of the large current pattern 13 are provided at both ends of the large current pattern 13 has been described. However, even if the terminal 13c is provided at an intermediate position of the large current pattern 13. The number of terminals 13c may be three or more. Even in this case, the same effect can be obtained by arranging the current reinforcing plate along the current path direction between the terminals 13c.

  The present invention is extremely useful because the current capacity of a desired circuit pattern can be increased afterwards in a printed circuit board.

A, B, C, D Printed circuit device 1 Printed circuit board 10 Printed wiring board 11 Circuit pattern 13 Large current pattern (circuit pattern)
13c terminal 30 electronic component 31 component terminal 53a, 54a, 55a, 56a solder connection part 53b, 54b heat diffusion prevention hole (through hole)
50, 51, 52, 53, 54, 55, 56 Current reinforcing plate (main current reinforcing member, side current reinforcing member)

Claims (6)

A printed wiring board on which a circuit pattern for connecting two terminals is formed;
A plurality of main currents arranged in a line along the current path direction between the two terminals on the circuit pattern so as to form a row and connected and fixed to the circuit pattern by a conductive connecting member A printed circuit board comprising a reinforcing member. The printed circuit board according to claim 1,
A lateral current reinforcing member disposed on one side or both sides of the row of the plurality of main current reinforcing members,
The side current reinforcing member is arranged on the circuit pattern so as to overlap the entire gap when viewed from the direction orthogonal to the flow path perpendicular to the current path direction of each gap provided between the adjacent main current reinforcing members. A printed circuit board characterized by being connected and fixed. The printed circuit board according to claim 1 or 2,
The current reinforcing member has a rectangular shape in which the length in the current path direction is longer than the flow path orthogonal direction and four corners are cut out, or an elliptical shape or an ellipse in which the current path direction length is longer than the flow path orthogonal direction A printed circuit board having a shape. The printed circuit board according to claim 1 or 2,
The current reinforcing member is provided with solder connecting portions for connecting solder as a connecting member at both ends in the longitudinal direction,
A printed circuit board, wherein a through-hole penetrating in the plate thickness direction is formed on the center side in the longitudinal direction of the solder connection portion. The printed circuit board according to claim 1 or 2,
The current reinforcing member is provided with solder connecting portions for connecting solder as a connecting member at both ends in the longitudinal direction,
The printed circuit board is covered with an insulating layer except for the solder connection portion. A printed circuit device in which a plurality of electronic components are mounted on the printed circuit board according to claim 1,
Two terminals of the printed circuit board are respectively connected to component terminals of the electronic components different from each other on the circuit pattern.

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