DE4425803A1 - Printed circuit board - Google Patents
Printed circuit boardInfo
- Publication number
- DE4425803A1 DE4425803A1 DE4425803A DE4425803A DE4425803A1 DE 4425803 A1 DE4425803 A1 DE 4425803A1 DE 4425803 A DE4425803 A DE 4425803A DE 4425803 A DE4425803 A DE 4425803A DE 4425803 A1 DE4425803 A1 DE 4425803A1
- Authority
- DE
- Germany
- Prior art keywords
- circuit board
- printed circuit
- board according
- sections
- metal strip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/222—Completing of printed circuits by adding non-printed jumper connections
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/58—Fixed connections for rigid printed circuits or like structures characterised by the terminals terminals for insertion into holes
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/09672—Superposed layout, i.e. in different planes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
- H05K2201/0979—Redundant conductors or connections, i.e. more than one current path between two points
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1028—Thin metal strips as connectors or conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/1034—Edge terminals, i.e. separate pieces of metal attached to the edge of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10409—Screws
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10954—Other details of electrical connections
- H05K2201/10962—Component not directly connected to the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
Die Erfindung bezieht sich auf eine Leiterplatte mit auf zumindest einer ihrer Seiten aufge brachten Leiterbahnen, welche auf der Leiterplatte vorsehbare Bauelemente untereinander bzw. mit Leiterplattenanschlüssen verbinden.The invention relates to a circuit board with on at least one of its sides brought conductor tracks, which provided components on the circuit board with each other or connect to PCB connectors.
Üblicherweise ergeben sich auf dem Gebiet der Elektronik bei der Dimensionierung von Lei terbahnen auf Leiterplatten keine Probleme. Bei größeren Leistungen, insbesondere bei Netz teilen, aber auch in anderen Spezialfällen, bei welchen höhere Ströme in der Größenordnung einiger Ampere oder darüber auftreten, müssen beim Layout der Leiterplatten jene Leiterbah nen, die solch hohe Ströme führen, besonders berücksichtigt werden.Usually, in the field of electronics, lei are dimensioned tracks on PCBs no problems. For larger services, especially for the network share, but also in other special cases where higher currents of the order of magnitude of a few amperes or above, the PCB must have the same layout those that carry such high currents are particularly taken into account.
Die einfachste, oft angewandte Möglichkeit besteht in einer Verbreiterung solcher Leiterbah nen, wodurch jedoch die für die anderen Leiterbahnen zur Verfügung stehende Fläche auf einer Leiterplatte oft drastisch eingeschränkt wird.The simplest, often used option is to widen such a ladder nen, however, whereby the area available for the other conductor tracks on one PCB is often drastically restricted.
Man geht daher oft dazu über, für Hochstromverbindungen auf Leiterbahnen vorgerichtete, abisolierte Leitungen, eindrähtige Bügel mit gebogenen Enden oder gestanzte Brücken zu ver wenden, die händisch in dafür vorgesehene Lötaugen gesteckt und mit diesen verlötet werden. Hiedurch ist jedoch eine vollautomatische Bestückung der Leiterplatten ausgeschlossen, was bei der Herstellung zu beträchtlichen Mehrkosten führt.It is therefore often adopted to prepare for high-current connections on conductor tracks, stripped cables, solid brackets with curved ends or punched bridges turn, which are manually inserted into the soldering eyes provided and soldered to them. This, however, means that fully automatic assembly of the circuit boards is impossible leads to considerable additional costs in the production.
Aus der EP-A-375 428 geht die Verwendung von Drahtbügeln aus Runddraht zur Erhöhung der Strombelastbarkeit von Leiterbahnen hervor, wobei beispielsweise zwei Drahtbügel mit ihren geraden Abschnitten parallel zueinander auf der Leiterbahn über deren gesamten Länge aufliegen und eine Lötauflage zwischen, neben und auf den Drahtabschnitten aufgebracht wird. Der Querschnitt dieser Lötauflage beträgt hiebei ein Mehrfaches des Querschnittes der Draht abschnitte. Da bei dieser Art von Leiterbahnverstärkung der verwendeten Lötmenge eine er hebliche Bedeutung für die Strombelastbarkeit zukommt, sind der gesamte Lötvorgang und das verwendete Lot ein kritischer Punkt bei der Fertigstellung der Leiterplatte. Es liegt somit nicht nur der bereits vorhin erwähnte Umstand vor, daß ein automatisches Bestücken der Lei terplatte mit den Drahtbügeln auf üblichen Bestückungsautomaten nicht möglich ist, sondern darüber hinaus hängt die tatsächliche Belastbarkeit des Strompfades von dem Lötvorgang ab, so daß ein definierter Querschnitt des Strompfades in der Praxis nicht einhaltbar scheint.From EP-A-375 428 the use of wire brackets made of round wire goes to increase the current carrying capacity of conductor tracks, with two wire brackets for example their straight sections parallel to each other on the conductor track over its entire length rest and a soldering pad is applied between, next to and on the wire sections. The cross section of this soldering pad is a multiple of the cross section of the wire sections. Because with this type of conductor reinforcement the amount of solder used, he The entire soldering process and are of considerable importance for the current carrying capacity the solder used is a critical point in the completion of the circuit board. It is therefore not only the fact that an automatic loading of the Lei terplatte with the wire brackets on conventional pick and place machines is not possible, but in addition, the actual load capacity of the current path depends on the soldering process, so that a defined cross section of the current path does not appear to be observable in practice.
Eine Aufgabe der Erfindung liegt somit darin, eine Leiterplatte mit kostengünstigen Hoch stromverbindungen definierten Querschnitts zu finden.An object of the invention is therefore to provide a circuit board with an inexpensive high to find electrical connections of defined cross-section.
Diese Aufgabe wird, ausgehend von einer Leiterplatte der eingangs genannten Art, erfindungs gemäß dadurch gelöst, daß zur Schaffung hochbelastbarer Strompfade zumindest eine der Lei terbahnen mittels eines auf sie aufgelöteten Metallstreifens zumindest abschnittsweise verstärkt ist.This task is fiction, starting from a circuit board of the type mentioned solved according to that at least one of the Lei to create heavy-duty current paths reinforced at least in sections by means of a metal strip soldered to them is.
Die erfindungsgemäße Lösung ergibt hochbelastbare Strompfade, die nicht auf Kosten der ver fügbaren Fläche gehen und die einer vollautomatisierten Bestückung der Leiterplatten auf SMD-Bestückungsautomaten nicht im Wege stehen. Die Verbindung der Metallstreifen mit den Leiterbahnen kann durch Schwallöten - auf der Lötseite - oder durch Reflowlöten - auf der Bauteilseite - erfolgen. Die Erfindung ermöglicht auch eine extrem flache Bauweise, verglichen beispielsweise mit herkömmlichen Drahtbügeln. Weitere Merkmale der Erfindung sind in den abhängigen Ansprüchen gekennzeichnet.The solution according to the invention results in heavy-duty current paths that are not at the expense of ver available area and the fully automated assembly of the circuit boards SMD pick and place machines are not in the way. The connection of the metal strips with The conductor tracks can be soldered by wave soldering - on the solder side - or by reflow soldering - on the Component side - done. The invention also enables an extremely flat design, compared for example with conventional wire brackets. Further features of the invention are in the dependent claims marked.
Die Erfindung samt ihrer anderen Vorteile ist im folgenden an Hand beispielsweiser Ausfüh rungsformen näher erläutert, die in der Zeichnung veranschaulicht sind. In dieser zeigenThe invention, along with its other advantages, is explained below by way of example tion forms explained in more detail, which are illustrated in the drawing. In this show
Fig. 1a eine Unteransicht einer ersten Ausführungsform einer Hochstromverbindung auf einer Leiter platte, Fig. 1b einen Schnitt nach der Linie Ib-Ib der Fig. 1a, Fig. 2a und 2b in den Fig. 1a und 1b entsprechender Darstellung eine zweite Ausführungsform der Erfindung, Fig. 3 in einer Draufsicht (oder Unteransicht) eine dritte Ausführungsform der Erfindung, Fig. 4 in einer An sicht wie Fig. 3 eine vierte Ausfürungsform der Erfindung, Fig. 5 in einem Schnitt eine fünfte Ausführungsform der Erfindung bei einer beidseitig kaschierten Leiterplatte, Fig. 6 in einem Schnitt bei einer sechsten Ausführungsform der Erfindung die Ausbildung eines Anschlußab schnittes einer Hochstromverbindung und Fig. 7 bei einer siebenten Ausführungsform in einer Draufsicht (oder Unteransicht) gleichfalls die Ausbildung der Anschlußabschnitte von Hoch stromverbindungen. Fig. 1a is a bottom view of a first embodiment of a high current connection on a circuit board, Fig. 1b shows a section along the line Ib-Ib of Fig. 1a, Figs. 2a and 2b in Figs. 1a and 1b corresponding representation of a second embodiment of the invention . 3 in a plan view (or bottom view) a third embodiment of the invention, Fig. 4 in one of visibility Fig like Fig. 3, a fourth Ausfürungsform of the invention, Fig. 5 in a sectional view a fifth embodiment of the invention, in a laminated on both sides printed circuit board , Fig. 6 in a section in a sixth embodiment of the invention, the formation of a section of a high-current connection and Fig. 7 in a seventh embodiment in a plan view (or bottom view) also the formation of the connection sections of high-current connections.
In den Fig. 1a und 1b ist ein Ausschnitt aus einer Leiterplatte 1 dargestellt, auf der eine blanke, übliche Leiterbahn 2 zwischen zwei Lötaugen 3 aufgebracht ist. Erfindungsgemäß ist auf diese Leiterbahn 2, die typisch eine Dicke von 20 bis 70 µm, vorzugsweise etwa 35 µm, aufweist, ein ebener Metallstreifen 4 vollflächig aufgesetzt und z. B. durch Schwallöten mit der Leiter bahn 2 verbunden. Bei typischen Ausführungsbeispielen besitzt dieser Metallstreifen 4, der z. B. aus Kupferblech oder Kupferflachdraht besteht, eine Dicke von etwa 0,5 mm und eine Breite von 5 mm. Selbstverständlich hängt die Dimensionierung des Metallstreifens 4 von den tatsächlich auftretenden Strömen ebenso ab wie von der Art des verwendeten Leitermaterials. In FIGS. 1a and 1b, a detail is shown of a circuit board 1 on which a bare common conductor path is applied between two pads 3 2. According to the invention on this conductor track 2 , which typically has a thickness of 20 to 70 microns, preferably about 35 microns, a flat metal strip 4 is placed over the entire surface and z. B. connected by wave soldering to the conductor track 2 . In typical embodiments, this metal strip 4 , the z. B. consists of copper sheet or flat copper wire, a thickness of about 0.5 mm and a width of 5 mm. Of course, the dimensioning of the metal strip 4 depends on the currents actually occurring as well as on the type of conductor material used.
An den Übergangsstellen zwischen den Lötaugen 3 bzw. den Enden der Leiterbahn 2 ist deren Querschnitt durch die Lotkehlen 5 verstärkt, so daß sich auch dort ein dem hohen Strom ent sprechender Leiterquerschnitt ergibt. Mit 6 sind bedrahtete, eingelötete Bauelemente bezeich net.At the transition points between the pads 3 and the ends of the conductor track 2 , the cross section of which is reinforced by the solder fillets 5 , so that there is also a conductor cross section corresponding to the high current. With 6 wired, soldered components are referred to net.
Naturgemäß wird man den Metallstreifen 4 möglichst dünn dimensionieren, um die Bauhöhe zu beschränken und breit genug auszuführen, damit er von dem Vakuumaufnehmer eines Be stückungsautomaten sicher erfaßt werden kann. Die Länge bzw. das Gewicht des Metallstrei fens 4 ist durch die Haltekraft eines derartigen Vakuumaufnehmers begrenzt.Naturally, you will dimension the metal strip 4 as thin as possible to limit the overall height and run wide enough so that it can be detected by the vacuum pickup of a loading machine. The length or weight of the metal strip 4 is limited by the holding force of such a vacuum sensor.
Die Ausführung nach Fig 2a und 2b besitzt einen Metallstreifen 4, der endseitig je einen eben auf einem Leiterbahnabschnitt 2′ aufliegenden Kontaktierungsabschnitt 4′ aufweist. Zwischen diesen Abschnitten 4′ liegt ein abgekröpfter, von der Oberfläche der Leiterplatte 1 in Abstand liegender Abschnitt 4′′, der im vorliegenden Beispiel mehrere herkömmliche Leiterbahnen 7 überbrückt. Gegebenenfalls könnten solcherart auch Bauelemente überbrückt werden.The embodiment according to FIGS. 2 a and 2 b has a metal strip 4 , each of which has a contacting section 4 ′ lying flat on a conductor track section 2 ′ at the end. Between these sections 4 'is a cranked, from the surface of the circuit board 1 spaced section 4 '', which bridges several conventional conductor tracks 7 in the present example. If necessary, components could also be bridged in this way.
Die Ausbildung nach Fig. 2a, b ist besonders dann vorteilhaft, wenn der Metallstreifen 4 aus einem Widerstandswerkstoff z. B. aus Konstantanblech, besteht und als Meßwiderstand, z. B. für den Ausgangsstrom eines Netzteiles, dienen soll.The embodiment according to Fig. 2a, b is particularly advantageous when the metal strip 4 z of a resistor material. B. from constantan sheet, and as a measuring resistor, for. B. for the output current of a power supply.
Das Ausführungsbeispiel nach Fig. 3 zeigt je eine längere Leiterbahn 2 mit zweimal abgewin keltem Verlauf. Längs dieser Leiterbahn 2 sind mehrere Metallstreifen 4a hintereinander an geordnet, wobei sie mit ihren schmalen Seiten jeweils nahe aneinander liegen. Beim Löten ent stehen zwischen den Metallstreifen 4a ausreichend dicke und definierte Lotkehlen, die an den Stellen zwischen den Streifen 4a für einen ausreichenden Querschnitt des Strompfades sorgen.The embodiment of FIG. 3 shows a longer conductor track 2 with a twisted curve. Along this conductor track 2 , a plurality of metal strips 4 a are arranged one behind the other, with their narrow sides each being close to one another. When soldering ent between the metal strips 4 a sufficiently thick and defined solder fillets, which ensure a sufficient cross section of the current path at the locations between the strips 4 a.
Eine weitere, auf Fig. 3 aufbauende Variante ist der Fig. 5 zu entnehmen, wonach Metallstreifen 4b auf einer Leiterbann 2 nicht nur hintereinander, sondern auch nebeneinander, mit ihren Längsseiten benachbart angeordnet sein können. Falls die Leiterbahn 2 nur kurz ist, können auch lediglich zwei, nebeneinander liegende Metallstreifen vorgesehen sein (nicht gezeigt). Ebenso ist es denkbar, auf breiteren Leiterbahnen mehr als zwei nebeneinander liegende Reihen von Metallstreifen vorzusehen.A further builds on Figs. 3 variant is shown in FIG. 5, after which the metal strip 4 b on a circuit spell 2 not only behind each other, but can also be arranged side by side, adjacent with their longitudinal sides. If the conductor track 2 is only short, only two metal strips lying next to one another can also be provided (not shown). It is also conceivable to provide more than two adjacent rows of metal strips on wider conductor tracks.
Der Vorteil der Ausführungen nach den Fig. 3 und 4 liegt darin, daß auch längere Leiterbahnen 2 beliebiger Konfiguration mit Hilfe von Metallstreifen einer einzigen Größe verstärkt werden können und daß die Bestückung automatisch erfolgen kann. The advantage of the embodiments according to FIGS. 3 and 4 is that longer conductor tracks 2 of any configuration can be reinforced with the help of metal strips of a single size and that the assembly can take place automatically.
Fig. 5 zeigt die Erfindung am Beispiel einer doppelt kaschierten Leiterplatte 1, auf deren bei den Seiten einander gegenüberliegende Leiterbahnen 2c ausgebildet und je mit Hilfe von Me tallstreifen 4c verstärkt sind. Die einander gegenüberliegenden Leiterbahnen sind an ihren En den in Bohrungen 8 durchkontaktiert. Diese Bohrungen 8 dienen auch zur Aufnahme der An schlußdrähte von Bauelementen 6. Fig. 5 shows the invention using the example of a double-laminated circuit board 1 , on the opposite side of the conductors 2 c formed and each with the help of Me tallstreifen 4 c are reinforced. The opposite conductor tracks are plated through at their ends in the holes 8 . These holes 8 also serve to accommodate the connection wires to components 6th
Die Ausführungen nach den Fig. 6 und 7 zeigen, daß die zur Verstärkung einer Leiterbahn 2 herangezogenen Metallstreifen 4d über einen Rand der Leiterplatte 1 vorstehende Anschlußab schnitte 4d′ aufweisen können. 4 d may be in the embodiments according to FIGS. 6 and 7 show that the relied on for reinforcing a conductor track 2 metal strip sections 4 d over an edge of the circuit board 1 above Anschlußab '.
Bei der Ausführung nach Fig. 6 ist ein solcher Anschlußabschnitt 4d′ mit einer Bohrung 9 für eine Schraubverbindung 10 versehen, mit deren Hilfe ein Leiter 11, z. B. ein Schutzleiter zur Verbindung mit einem nicht gezeigten Metallgehäuse, angeschlossen werden kann.In the embodiment of FIG. 6, such a terminal section 4 is provided d 'with a hole 9 for a screw connection 10, with the aid of a conductor 11, for. B. a protective conductor for connection to a metal housing, not shown, can be connected.
Bei der Ausführung nach Fig. 7 sind vorstehende Anschlußabschnitte 4d′ als übliche Flach steckzungen ausgebildet, denen entsprechende Gegenstücke in einem Stecker 12 zugeordnet sind. Bei den Ausführungen nach Fig. 6 und 7 können die Anschlußabschnitte 4d′ im Bedarfs fall auch abgewinkelt, z. B. um 90°, sein.In the embodiment according to FIG. 7, the projecting connection sections 4 d 'are designed as conventional flat tabs, to which corresponding counterparts in a plug 12 are assigned. In the embodiments according to FIGS. 6 and 7, the terminal portions 4 can drop also angled d 'in demand such. B. 90 °.
Claims (14)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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AT160693 | 1993-08-11 |
Publications (1)
Publication Number | Publication Date |
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DE4425803A1 true DE4425803A1 (en) | 1995-02-16 |
Family
ID=3517069
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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DE4425803A Withdrawn DE4425803A1 (en) | 1993-08-11 | 1994-07-21 | Printed circuit board |
Country Status (1)
Country | Link |
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DE (1) | DE4425803A1 (en) |
Cited By (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19529592A1 (en) * | 1995-08-11 | 1997-02-13 | Ingbuero Gunter Langer | Arrangement for reduction of electromagnetic radiation from integrated circuit cards etc - has surface conductor paths of the cards subjected to localised thickening to reduce noise generation |
WO1998036625A1 (en) * | 1997-02-17 | 1998-08-20 | Magnetek S.P.A. | Process for producing printed circuits and printed circuits thus obtained |
WO2000016446A1 (en) * | 1998-09-10 | 2000-03-23 | Siemens Aktiengesellschaft | Printed circuit board arrangement with a multipole plug-in connector |
FR2803716A1 (en) * | 2000-01-11 | 2001-07-13 | Sagem | ELECTRONIC MODULE WITH POWER COMPONENTS AND MANUFACTURING METHOD |
EP1379113A2 (en) * | 2002-06-27 | 2004-01-07 | Epcos Ag | Circuit board with a conductive reinforcement element |
FR2908587A1 (en) * | 2006-11-14 | 2008-05-16 | Power Supply Systems Holdings | CIRCUIT BOARD PLATE FOR PASSING VERY CURRENT STRONG AND CORRESPONDING PRODUCTION METHOD. |
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-
1994
- 1994-07-21 DE DE4425803A patent/DE4425803A1/en not_active Withdrawn
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