JP2008098398A - Circuit device, and its manufacturing method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method of a circuit device wherein a second circuit board can be easily installed nearly vertical to a first one. <P>SOLUTION: Penetrated portions 14, 24 are filled with a solder 30 while the penetrated portion 24 protrudes from portion 14 on the front face and rear face sides of the main circuit board 10, and therefore metal patterns 12a, 13a, and 26 join the solder 30. As a result, the sub-circuit board 20 and the main circuit board 10 are joined together by the solder 30. In this manner, the solder 30 takes less time to be distributed to the metal patterns 12a, 13a, and 26, leading to suppression of the inclination of the sub-circuit board 20 with respect to the main circuit board 10 due to biased distribution of the solder 30. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a circuit device in which a first circuit board is bonded to a second circuit board with a bonding material, and a manufacturing method thereof. In particular, the present invention relates to a circuit device that facilitates joining a second circuit board substantially vertically to a first circuit board, and a method for manufacturing the same.

  Most of the circuit of the apparatus is constituted by a circuit board on which functional parts are mounted. When the mounting area is insufficient with a single circuit board, it is necessary to divide and mount functional components on the plurality of circuit boards and to electrically connect the plurality of circuit boards.

  In addition, some of the circuits may have the same configuration among a plurality of devices. In such a case, the same circuit may be mounted on a circuit board different from other parts and shared among a plurality of devices. In such a case, it is necessary to electrically connect a circuit board used in common between a plurality of devices to a circuit board on which the remaining circuits are mounted.

  There is also a method using a connector as a method for connecting between circuit boards, but in this case, it is necessary to secure a space in the circuit board for providing the connector and wiring to be connected to the connector. It will decrease. Therefore, a structure has been adopted in which printed boards are directly joined with a joining material (for example, solder) without using a connector or a connecting wire group (see, for example, Patent Documents 1 and 2).

Japanese Utility Model Publication No. 7-36470 (FIG. 1) JP 2002-290002 A (FIG. 1)

  When the second circuit board is bonded to the first circuit board with a bonding material, it is preferable to bond the second circuit board perpendicularly to the first circuit board. However, bonding materials such as solder and resin often shrink when solidified, and the second circuit board may be inclined with respect to the first circuit board due to the shrinkage force. In order to prevent this, it is necessary to distribute the bonding material evenly over the entire bonded portion before the bonding material solidifies. Conventionally, the bonding material can be distributed evenly over the entire bonded portion. It was difficult.

  The present invention has been made in consideration of the above-described circumstances. The purpose of the present invention is to distribute the bonding material evenly over the entire bonded portion before the bonding material is solidified, thereby providing the first circuit board. On the other hand, it is an object of the present invention to provide a circuit device and a method for manufacturing the circuit device that facilitates joining a second circuit board substantially vertically.

In order to solve the above problems, a circuit device according to the present invention is a circuit device comprising a first circuit board and a second circuit board bonded to the first circuit board,
The first circuit board includes a first penetrating portion that penetrates the first circuit board from the front and back sides and into which the second circuit board is inserted,
The second circuit board has an insertion part inserted into the first penetration part, and the insertion part is inserted through the insertion part in the front-back direction of the second circuit board. A second penetrating portion having a width in the direction larger than the thickness of the first circuit board;
The first and second penetrating portions are filled with a bonding material in a state where the second penetrating portion protrudes from the first penetrating portion on each of the front surface side and the back surface side of the first circuit board. Thus, the second circuit board is bonded to the first circuit board.

  The bonding material is solder or resin. When the bonding material is solder, the first metal pattern is provided on the first surface of the first circuit board and located at the peripheral edge of the first through portion, and the first circuit board has a first metal pattern. 2 provided on the first surface of the insertion portion of the second circuit board, and a second metal pattern located on a peripheral edge of the first penetrating portion. A third metal pattern located on the peripheral edge of the penetrating portion; and a fourth metal pattern provided on the second surface of the insertion portion and located on the peripheral edge of the second penetrating portion. Also good. In this case, the first and second metal patterns are electrically connected to the third and fourth metal patterns by the solder.

A circuit device manufacturing method according to the present invention is a circuit device manufacturing method for manufacturing a circuit device by bonding a first circuit board to a second circuit board,
The first circuit board includes a first through hole penetrating the first circuit board on the front and back sides,
The second circuit board has an insertion part to be inserted into the first through hole, and a width in a direction in which the insertion part is inserted through the insertion part on the front and back sides of the first circuit board. A second through hole larger than the thickness of
The insertion part is inserted into the first through hole, and the second through hole protrudes from the first through hole on each of the front surface side and the back surface side of the first circuit board,
The second circuit board is bonded to the first circuit board by filling the first and second through holes with a bonding material.

  According to the present invention, since the second through hole is held in a state of protruding from the first through hole on each of the front surface side and the back surface side of the first circuit board, the bonding material is bonded. The time until it reaches the entire portion is shortened, and the bonding material can be distributed to the entire bonding portion before the bonding material is solidified. Therefore, it can suppress that the said 2nd circuit board is diagonally joined with respect to the said 1st circuit board.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings. FIG. 1A is a partial perspective view for explaining the configuration of the main circuit board 10 according to the first embodiment, and FIG. 1B is the configuration of the sub circuit board 20 according to the first embodiment. It is a perspective view for demonstrating.

  A plurality of wirings 12 are provided on the surface of the main circuit board 10, and bonding metal patterns 12 a are formed at the ends of the plurality of wirings 12. The plurality of bonding metal patterns 12 a form a row and are arranged substantially in parallel with one end surface of the main circuit board 10.

  On the back surface of the main circuit board 10, a plurality of bonding metal patterns 13a (not shown in the figure) are formed. When viewed from a direction perpendicular to the main circuit board 10, each of the plurality of bonding metal patterns 13a formed on the back surface substantially overlaps with different bonding metal patterns 12a.

  Further, the main circuit board 10 is provided with a through portion 14 for fixing the sub circuit board 20. The through portion 14 is a hole penetrating the main circuit board 10 on the front and back sides. The through portion 14 penetrates through substantially the center of each of the plurality of bonding metal patterns 12a and the plurality of bonding metal patterns 13a. For this reason, the metal patterns 12a and 13a for joining are located in the edge on the surface side of the penetration part 14, and the edge on the back surface side, respectively.

  The planar shape of the sub circuit board 20 is substantially rectangular. An insertion portion 22 is formed on the sub circuit board 20 by projecting the central portion of the end surface 21. The insertion part 22 is a part inserted into the through part 14 of the main circuit board 10. The planar shape of the insertion portion 22 is substantially rectangular, and the short side is perpendicular to the end face 21. The short side of the insertion part 22 is longer than the thickness of the main circuit board 10.

  The insertion portion 22 is formed with a plurality of through portions 24 that penetrate the sub circuit board 20 from the front to the back. The through portion 24 is elongated in a direction perpendicular to the end surface 21. When the insertion part 22 is inserted in the penetration part 14, the some penetration part 24 is arrange | positioned so that each may mutually differ from the metal patterns 12a and 13a for joining.

  The penetration part 24 has a part 24a protruding into the main body of the sub-circuit board 20 and the length of the part 24b located in the insertion part 22 (that is, the part other than the part) in the insertion direction. Is longer than the thickness of the main circuit board 10. In addition, a bonding metal pattern 26 is formed on the front side edge, the back side edge, and the inner side surface of the penetrating portion 24.

Next, a method for bonding the sub circuit board 20 to the main circuit board 10 will be described.
First, as shown in the plan view and the side view of FIGS. 2A and 2B, the insertion part 22 of the sub circuit board 20 is inserted into the through part 14 of the main circuit board 10. The insertion part 22 is inserted into the penetration part 14 until the end face 21 of the sub circuit board 20 contacts the surface of the main circuit board 10.

  FIG. 2C is an enlarged cross-sectional view for explaining the positional relationship between the through portions 14 and 24 in the state of FIGS. As described above, a part 24 a protrudes into the main body of the sub circuit board 20, and the length in the insertion direction of the part 24 b located in the insertion part 22 is the thickness of the main circuit board 10. Longer than that. For this reason, as shown in FIG. 2C, in the state where the insertion portion 22 is inserted into the penetration portion 14, the penetration portion 24 has two end portions in the major axis direction on the surface of the main circuit board 10, respectively. It protrudes to the side and back side.

  Next, as shown in the enlarged cross-sectional view of FIG. 3, the solder 30 is poured into the through portions 14 and 24. As described above, since the two end portions of the long axis direction protrude from the through portion 14 as described above, the solder 30 spreads over the entire through portions 14 and 24 before solidifying, and the metal pattern for joining 12a, 13a, and 26 are spread throughout. The sub circuit board 20 is mechanically and electrically bonded to the main circuit board 10 by the solder 30 being bonded to the bonding metal patterns 12a, 13a and 26 and solidifying.

  When the solder 30 is solidified, the solder 30 is distributed substantially evenly over the entire joint portion of the main circuit board 10 and the sub circuit board 20. For this reason, the contraction force generated when the solder 30 is solidified acts substantially uniformly on the entire joining portion of the main circuit board 10 and the sub circuit board 20, and the sub circuit board 20 is moved to the main circuit board by the same principle as the Manhattan phenomenon. Approximately perpendicular to 10.

Therefore, according to the first embodiment of the present invention, the time required for the solder 30 to reach the entire bonding metal patterns 12a, 13a, and 26 is shortened. As a result, the distribution of the solder 30 is unevenly distributed. It is possible to suppress the sub circuit board 20 from being inclined with respect to the main circuit board 10.
Further, since the bonding metal pattern 26 is also formed on the inner surface of the through portion 24, the bonding strength between the main circuit board 10 and the sub circuit board 20 is improved.

  FIG. 4 is a cross-sectional view for explaining the configuration of the main circuit board 10 and the sub circuit board 20 according to the second embodiment. In the present embodiment, the main circuit board 10 has a through-hole 14 having a slit shape, and the end is connected to one end face of the main circuit board 10 and is open at this end face. And different. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  Further, the sub circuit board 20 has an end portion on the end face 21 side as it is, and the recess portion 28a is formed in a part of the end face 28 perpendicular to the end face 21. The configuration is the same as that of the first embodiment. The width of the recess 28 a is slightly wider than the thickness of the main circuit board 10. Further, when viewed from a direction perpendicular to the end face 28, the two end portions of the penetrating portion 24 protrude from the recess 28a. Hereinafter, the same components as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

  In the present embodiment, when the sub circuit board 20 is bonded to the main circuit board 10, the sub circuit board 20 is inserted into the through portion 14 from the end face 28 side, and the concave portion 28 a is fitted into the end portion of the through portion 14. In this state, the penetrating portion 24 of the sub circuit board 20 has two end portions in the major axis direction protruding to the front surface side and the back surface side of the main circuit board 10, respectively. Next, the solder 30 is poured into the through portions 14 and 24 and solidified.

  According to this embodiment, the same effect as that of the first embodiment can be obtained. Note that a flexible substrate may be used as the sub circuit board 20. In this case, the terminal of the flexible substrate is inserted into the through portion 14.

FIG. 5 is a perspective view for explaining the configuration of the sub circuit board 20 according to the third embodiment. In the present embodiment, the sub circuit board 20 has a first shape except that the end portion of the penetrating portion 24 is connected to the lower end surface of the insertion portion 22 and is open at the end surface, and has a slit shape. 1 has the same configuration as that of the first embodiment.
In this embodiment, the same effect as that of the first embodiment can be obtained.

  6A is a partial perspective view for explaining the configuration of the main circuit board 10 according to the fourth embodiment, and FIG. 6B is the configuration of the sub circuit board 20 according to the fourth embodiment. It is a perspective view for demonstrating. In the present embodiment, the through portion 14 is formed for each of the plurality of bonding metal patterns 12a, and the insertion portion 22 is formed for each of the plurality of through portions 24 and the bonding metal pattern 26. The configuration is the same as that of the first embodiment except for.

  According to the present embodiment, the same operation and effect as the first embodiment can be obtained. Moreover, the penetration part 14 and the insertion part 22 are formed for each of the bonding metal patterns 12a and 26 that form a pair, and are separated from each other. For this reason, the solder which joins the main circuit board 10 and the sub circuit board 20 can be divided | segmented for every metal pattern 12a, 26 for a pair used as a pair. Therefore, the sub circuit board 20 can be joined to the main circuit board 10 by soldering while the joining metal patterns 12a are insulated from each other.

  Note that the present invention is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

  For example, the main circuit board 10 and the sub circuit board 20 may be bonded using a resin such as an epoxy resin instead of the solder 30. Since the resin such as epoxy resin shrinks when solidified, the effects described in the above embodiments can be obtained. In this case, the bonding metal patterns 12a, 13a, and 26 need not be provided.

  The present invention is applicable to a circuit device in which a second circuit board is soldered to a first circuit board.

(A) is a partial perspective view for demonstrating the structure of the main circuit board 10 which concerns on 1st Embodiment, (B) is a perspective view for demonstrating the structure of the sub circuit board 20 which concerns on 1st Embodiment. . (A) And (B) is a top view and a side view for demonstrating the method of joining the sub circuit board 20 to the main circuit board 10 with solder, (C) is a cross-sectional enlarged view of the penetration parts 14 and 24. FIG. (C) is a cross-sectional enlarged view of the through portions 14 and 24 in a state where the solder 30 is introduced. Sectional drawing for demonstrating the structure of the main circuit board 10 and the sub circuit board 20 which concern on 2nd Embodiment. The perspective view for demonstrating the structure of the sub circuit board 20 which concerns on 3rd Embodiment. (A) is a partial perspective view for demonstrating the structure of the main circuit board 10 which concerns on 4th Embodiment, (B) is a perspective view for demonstrating the structure of the sub circuit board 20 which concerns on 4th Embodiment. .

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 ... Main circuit board, 12 ... Wiring, 12a, 13a, 26 ... Metal pattern for joining, 14, 24 ... Penetration part, 20 ... Sub circuit board, 21 ... One side, 22 ... Insertion part, 30 ... Solder

Claims (9)

A circuit device comprising: a first circuit board; and a second circuit board bonded to the first circuit board,
The first circuit board includes a first penetrating portion that penetrates the first circuit board from the front and back sides and into which the second circuit board is inserted,
The second circuit board has an insertion part inserted into the first penetration part, and the insertion part is inserted through the insertion part in the front-back direction of the second circuit board. A second penetrating portion having a width in the direction larger than the thickness of the first circuit board;
The first and second penetrating portions are filled with a bonding material in a state where the second penetrating portion protrudes from the first penetrating portion on each of the front surface side and the back surface side of the first circuit board. Thus, the circuit device in which the second circuit board is bonded to the first circuit board.   The circuit device according to claim 1, wherein the bonding material is solder. A first metal pattern provided on a first surface of the first circuit board and located at a peripheral edge of the first through portion;
A second metal pattern provided on a second surface of the first circuit board and located at a peripheral edge of the first through portion;
A third metal pattern provided on a first surface of the insertion portion of the second circuit board and positioned at a peripheral portion of the second penetration portion;
A fourth metal pattern provided on the second surface of the insertion portion and located at a peripheral edge of the second penetration portion;
The circuit device according to claim 2, wherein the first and second metal patterns are electrically connected to the third and fourth metal patterns by the solder.   4. The circuit device according to claim 3, further comprising a fifth metal pattern formed on an inner surface of the second penetrating portion and interconnecting the third and fourth metal patterns.   The circuit device according to claim 1, wherein the bonding material is a resin. The insertion portion has a shape in which a part of one end face of the second circuit board protrudes outward,
The second penetrating portion protrudes from the one end surface to the inside of the second circuit board, and the length in the insertion direction of the portion located on the insertion portion side from the one end surface is The circuit device according to claim 1, wherein the circuit device is longer than a thickness of the first circuit board.   The circuit device according to claim 1, wherein the first penetrating portion has a slit shape, is connected to one end surface of the first circuit board, and is opened at the one end surface. A circuit device manufacturing method for manufacturing a circuit device by bonding a first circuit substrate to a second circuit substrate,
The first circuit board includes a first through hole penetrating the first circuit board on the front and back sides,
The second circuit board has an insertion part to be inserted into the first through hole, and a width in a direction in which the insertion part is inserted through the insertion part on the front and back sides of the first circuit board. A second through hole larger than the thickness of
The insertion part is inserted into the first through hole, and the second through hole protrudes from the first through hole on each of the front surface side and the back surface side of the first circuit board,
A method of manufacturing a circuit device, wherein the second circuit board is bonded to the first circuit board by filling the first and second through holes with a bonding material. The insertion portion has a shape in which a part of one end face of the second circuit board protrudes outward,
The second penetrating portion protrudes from the one end surface to the inside of the second circuit board, and the length in the insertion direction of the portion located on the insertion portion side from the one end surface is Longer than the thickness of the first circuit board,
When the first through hole is inserted into the insertion portion, the one end surface is brought into contact with one surface of the first circuit board, whereby the front surface side and the back surface side of the first circuit board respectively The method for manufacturing a circuit device according to claim 8, wherein the second through hole is in a state of protruding from the first through hole.

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