JP2004335682A - Bonding structure of printed circuit board - Google Patents
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- JP2004335682A JP2004335682A JP2003128746A JP2003128746A JP2004335682A JP 2004335682 A JP2004335682 A JP 2004335682A JP 2003128746 A JP2003128746 A JP 2003128746A JP 2003128746 A JP2003128746 A JP 2003128746A JP 2004335682 A JP2004335682 A JP 2004335682A
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【０００１】
【発明の属する技術分野】
本発明は２枚以上のプリント配線基板を相互に接合するプリント配線基板の接合構造に関する。
【０００２】
【従来の技術】
電子機器を構成する複数のプリント配線基板を相互に電気的に接合する場合、コネクタを用いる方法が一般的である。プリント配線基板接合用のコネクタとしては、接合するプリント配線基板の双方に実装して用いるボードｔｏボードコネクタと呼ばれるものや、片方のプリント配線基板の一端側の回路パターンを端子状に処理したカードエッジコネクタなどがある。図１４は従来の接続構造のうちボードｔｏボードコネクタを使用した構造を示す斜視図である。図中１０１は第１の基板、１０２は第２の基板、１０３は第１の基板１０１に実装されるスタッキングコネクタＡ、１０４は第２の基板に実装されるスタッキングコネクタＢである。この場合スタッキングコネクタＡ１０３とスタッキングコネクタ１０４が電気接合されることでプリント基板同士の電気的接合が達成される。
【０００３】
また、図１５は従来の接続構造のうちカードエッジコネクタを使用した構造を示す斜視図である。図中２０１は第１の基板、２０２は第１の基板上に設けられた電気端子、２０３は第２の基板、２０４は第２の基板上の実装されたカードエッジコネクタである。この場合電気端子２０２とカードエッジコネクタが電気接合されることでプリント基板同士の電気的接合が達成される。
【０００４】
一方、コネクタを用いない接合構造も提案されている。図１６は従来のコネクタを用いない接合構造を示した斜視図、図１７は図１６の矢印方向からみた断面図である。図中３０１は第１の基板、３０２は第１の基板３０１上に設置された基板端子Ａ、３０３は第２の基板、３０４は第２の基板３０３上に設置された基板端子Ｂ、４０１ははんだである。図１６で示したとおり従来のコネクタを用いない接合構造では第１の基板３０１を第２の基板３０３へ垂直に密着させ、図１７に示したとおり基板端子Ａ３０２と基板端子Ｂ３０４をはんだ４０１を介して電気接続することで基板同士の電気的接続を達成している。
【０００５】
この他、２枚のプリント配線基板を接合する構成として例えば、特許文献１や特許文献２等が提案されている。
【０００６】
【特許文献１】
特開平１１−２６９０６号公報
【特許文献２】
特開２００１−３５８４２１号公報
【０００７】
【発明が解決しようとする課題】
前述のようにプリント配線基板を電気接合しようとした場合、通常コネクタなどが使用される。
【０００８】
しかしながらコネクタは端子同士を圧着して電気接合するので、どうしても信頼性が劣る。更にコネクタ自体のコストがかかるため、多信号の接続を行う場合など、コネクタ費用が無視できなくなる。また、コネクタを使用しない方式においても図１６の方式などは薄いはんだ同士の接続となるため、接続強度が劣っており信頼性が低い。また、特許文献１や特許文献２等で提案されている方式はいずれも特殊な加工を必要とするため、結局特殊加工のための費用がかかってしまうためコスト的に問題がある。また、ボードｔｏボードでの接合では両基板間に熱がこもってしまい、信頼性が低下してしまう。
【０００９】
本発明は上記従来の問題点を解決するもので、コネクタを用いずにかつ、十分な信頼性とコスト競争力をもつプリント配線基板の接合構造を提供することを目的とする。
【００１０】
【課題を解決するための手段】
上記課題を解決するために、本発明におけるプリント配線基板の接合構造は、基板挿入用のスリットと前記スリットの端部近傍に配置された第１の接点をもつ第１のプリント配線基板と、前記第１の接点に少なくとも一カ所以上対応する位置に第２の接点をもつ第２のプリント配線基板を用意し、前記第２のプリント配線基板が前記スリットへ斜めに挿入固定され、前記第１の接点と前記第２の接点を導電性部材を介在して接合する。さらに、前記第１のプリント配線基板と前記第２のプリント配線基板の少なくとも一方を多層プリント配線基板とし、また、前記第１の接点と前記第２の接点の少なくとも一方が電気回路を構成する電気接点とする。また、前記第１の接点が前記第１のプリント配線基板の裏表両面に配置され、前記第２の接点とプリント基板の裏表両面で接合される。この構造によりコネクタを使用することなく信頼性の高い接合が実現できる。
【００１１】
また、前記スリットの端部を面取りし、前記スリットの端部の面取りをスリットの第１のエッジ辺ではプリント配線基板の表面から行い、前記第１のエッジ辺と対向する第２のエッジ辺ではプリント配線基板の裏面から行う。さらに前記面取りによって形成される断面に前記第１のプリント配線基板の内層パターンを露出させ、前記断面が平行面を形成するように面取りする。さらに前記内層パターンの露出部に少なくとも一カ所以上対応する第２のプリント配線基板上に第３の接点を持ち、第２のプリント配線基板を面取り加工された前記スリットへ挿入し前記内層パターンの露出部と前記第３の接点を導電性部材を介在して接合する。これにより内層パターンまで含めた高信頼性接合をコネクタ無しで実現できる。
【００１２】
また、前記スリットに沿って少なくとも一個以上の切り欠きを設けることで空気通路の確保も可能となり放熱性も向上する。
【００１３】
さらに、端部に第４の接点をもつ第３のプリント配線基板と、前記第４の接点に少なくとも一カ所以上対応する位置に第５の接点をもつ第４のプリント配線基板を用意し、前記第４の接点と前記第５の接点とを少なくとも２種類の導電性部材を介在して接合する。また、内層パターンがプリント基板端面に露出した前記第３のプリント配線基板と、前記露出した内層パターンに少なくとも一カ所以上対応した位置に第６の接点が、導電性部材を介在して接合することで、導電性部材による基板保持力が増加し接合強度が向上すると共に内層パターンを含めた高信頼性接合を実現できる。
【００１４】
【発明の実施の形態】
以下、本発明の実施の形態におけるプリント配線基板の接合構造を図面と共に説明する。
【００１５】
（実施の形態１）
図１は本発明の実施の形態１におけるプリント配線基板の接合構造の第１の基板を示す斜視図、図２は本発明の実施の形態１におけるプリント配線基板の接合構造の第１の基板を示す断面図、図３は本発明の実施の形態１におけるプリント配線基板の接合構造の第２の基板を示す斜視図、図４は本発明の実施の形態１におけるプリント配線基板の接合構造の第２の基板を示す断面図、図５は本発明の実施の形態１におけるプリント配線基板の接合構造の接合後を示す斜視図、図６は本発明の実施の形態１におけるプリント配線基板の接合構造の接合後を示す断面図である。図中、５０１は接合対象の基板の一方である第１の基板、５０２は第１の基板５０１上に設けられ、接合対象の基板が挿入されるスリット、５０３は第１の基板５０１の部品面上でスリット５０２の端部近傍に設けられた部品面基板端子Ａ、６０１は第１の基板５０１の部品面、６０２は第１の基板５０１のはんだ面、６０３は第１の基板５０１のはんだ面上でスリット５０２の端部近傍に設けられたはんだ面基板端子Ａ、７０１は接続対象のもう一方の基板で第１の基板５０１のスリット５０２へ挿入される第２の基板、７０２は第２の基板７０１の部品面の端部近傍に設けられた部品面基板端子Ｂ、８０１は第２の基板７０１のはんだ面に設けられたはんだ面基板端子Ｂ、１００１は第２の基板７０１に実装されるＬＳＩ、１００２は基板同士の接合部で電気接続をおこなうはんだである。図１、図２で示す第１の基板では、基板同士を接合する際に電気接続を行う基板端子である部品面基板端子Ａ５０３とはんだ面基板端子Ａ６０３はスリット５０２の向かい合う辺の部品面６０１とはんだ面６０２にそれぞれ配置される。
【００１６】
また、図３，図４で示す第２の基板では、基板同士を接合する際に電気接続を行う基板端子である部品面基板端子Ｂ７０２は図４で示すとおり第２の基板７０１の部品面に、はんだ面基板端子Ｂ８０１は第２の基板７０１のはんだ面に配置される。このように構成された第１の基板５０１と第２の基板７０１の接合は次のように行われる。
【００１７】
まず第２の基板７０１の必要領域にクリームはんだを塗布し、次にＬＳＩ１００１等の部品をマウント、その後リフロー等の処理により部品実装を行う。次に第１の基板５０１の必要領域にクリームはんだを塗布し、次に部品（図示せず）をマウントする。この状態で図５、図６に示すように第２の基板７０１を第１の基板５０１のスリット５０２に挿入し、はんだ面基板端子Ａ６０３と部品面基板端子Ｂ７０２、部品面基板端子Ａ５０３とはんだ面基板端子Ｂ８０１の位置を合わせて斜めに固定した後、両基板をリフロー等の処理により接合する。
【００１８】
以上のようにすることでコネクタ等の付加部材を使用することなく基板同士の接合を実現することができる。
【００１９】
なお、本実施の形態では、第１の基板５０１と第２の基板７０１のリフロー工程を別々に行ったが、第２の基板７０２をスリット５０２へ挿入固定後に、一度に行っても構わない。
【００２０】
また、第１の基板５０１と第２の基板７０１のリフロー順序はどちらがさきでもよいことも明らかである。
【００２１】
また、第２の基板７０１にＬＳＩ１００１が実装された例を示したが、第１の基板５０１、第２の基板７０１に搭載される部品は任意である。
【００２２】
また、部品面基板端子Ａ５０３、はんだ面基板端子Ａ６０３、部品面基板端子Ｂ７０２、はんだ面基板端子Ｂ８０１は、図面上では同じピッチで端子を配置しているが不規則でもよい。
【００２３】
また、基板同士の接合は、部品面、はんだ面両方で接続しているが、どちらか一方でも構わない。
【００２４】
また、スリット５０２は基板中央に長孔として示しているが、基板上の位置および形状は任意である。さらに、一方が開口した状態でもよいし、スリットの幅は挿入する基板以上であれば任意でなる。
【００２５】
また、部品実装に使用する導電性部材をクリームはんだとしたが、導電性接着剤などの導電性部材であれば種類は問わない。
【００２６】
また、接続の工程をリフローとしたが、いかなる接続工程であっても本発明の効果は変わりないことは明らかである。
【００２７】
（実施の形態２）
図７は本発明の実施の形態２におけるプリント配線基板の接合構造の第１の基板を示す断面図、図８は本発明の実施の形態２におけるプリント配線基板の接合構造の第２の基板を示す断面図、図９は本発明の実施の形態２におけるプリント配線基板の接合構造の接合後を示す断面図である。図中、１１０１は接合対象の基板の一方である第１の基板、１１０２は第１の基板１１０１上に設けられ、接合対象の基板が挿入されるスリット、１１０３は第１の基板１１０１の部品面上でスリット１１０２の端部近傍に設けられた部品面基板端子Ａ、１１０４は第１の基板１１０１のはんだ面上でスリット１１０２の端部近傍に設けられたはんだ面基板端子Ａ、１１０５は第１の基板の内層パターン、１１０６はスリット１１０２の端部を面取り加工して作成された面取り部、１１０７は面取り加工によって露出した内層パターンエッジ、１２０１は接続対象のもう一方の基板で第１の基板１１０１のスリット１１０２へ挿入される第２の基板、１２０２は第２の基板の内層パターン、１２０３は第２の基板１２０１の部品面の端部近傍に設けられた部品面基板端子Ｂ、１２０４は第２の基板１２０１のはんだ面に設けられたはんだ面基板端子Ｂ、１２０５は第２の基板１２０１の部品面に設けられた部品面ランド、１２０６は第２の基板１２０１のはんだ面に設けられたはんだ面ランド、１２０７は部品面ランド１２０５と内層パターン１２０２を接続する部品面ビア、１２０８ははんだ面ランド１２０６と内層パターン１２０２を接続するはんだ面ビア、１３０１は基板同士の接合部で電気接続をおこなうはんだである。図７で示した第１の基板１１０１では、実施の形態１で示した第１の基板５０１のスリット５０２の端部を図で示すように面取り加工し、面取り部１１０６を形成する。この加工により内層パターンを面取り部から露出させ内層パターンエッジ１１０７を作成する。この面取り加工は接合対象の基板が斜めに固定された際に、その基板面と並行となるような角度で加工する。
【００２８】
また、図８で示した第２の基板１２０１では、実施の形態１で示した第２の基板７０２に加えて内層パターン１２０２と部品面ビア１２０７を介して接続される部品面ランド１２０５と、はんだ面ビア１２０８を介して接続されるはんだ面ランド１２０６が追加される。このように構成された第１の基板１１０１と第２の基板１２０１の接合は実施の形態１と同様の手順で行われ図９に示すような接合状態となる。この際、部品面ランド１２０５とはんだ面ランド１２０６にもクリームはんだが塗布されるため、部品面ランド１２０５と内層パターンエッジ１２０７、はんだ面ランド１２０６と内層パターンエッジ１２０７とが接続される。
【００２９】
以上のようにすることで、実施の形態１同様にコネクタ等の付加部材を使用することなく基板同士の接合を実現することができるとともに、面取り部により基板同士の接触面積が増えることによる信頼性の更なる向上が実現できる。また、内層パターンの接続も可能となり接続強度が向上するだけでなく回路設計の自由度が大幅に向上する。
【００３０】
なお、本実施の形態では、接合対象の基板それぞれ内層パターンを示しているが、内層パターンの有無および接続は必須ではない。
【００３１】
また、内層パターンエッジ１１０７にクリームはんだ等の導電性部材を塗布しても構わない。その場合部品面ランド１２０５、はんだ面ランド１２０６への導電性部材塗布は必須ではない。
【００３２】
また、実施の形態１と同様に、基板同士の接合は、部品面、はんだ面両方で接続しているが、どちらか一方でも構わない。
【００３３】
また、スリット１１０２の基板上の位置および形状は任意である。
【００３４】
さらに、一方が開口した状態でもよいし、スリットの幅は挿入する基板以上であれば任意でなる。
【００３５】
また、部品実装に使用する導電性部材をクリームはんだとしたが、導電性接着剤などの導電性部材であれば種類は問わない。
【００３６】
（実施の形態３）
図１０は本発明の実施の形態３におけるプリント配線基板の接合構造の第１の基板を示す斜視図、図１１は本発明の実施の形態３におけるプリント配線基板の接合構造の接合後を示す断面図である。図１０，図１１において、１４０１は接合対象の基板の一方である第１の基板、１４０２は第１の基板１４０１上に設けられ、接合対象の基板が挿入されるスリット、１４０３は第１の基板１４０１の部品面上でスリット１４０２の端部近傍に設けられた部品面基板端子、１４０４はスリット１４０２に端部に設けられた空気孔、１５０１は接合対象のもう一方の基板である第２の基板、１５０２は第２の基板に実装されるＬＳＩである。図１０で示すように第１の基板１４０１にはスリット１４０２の端部に一個以上の空気孔を設けている。このように構成された第１の基板１４０１と第２の基板１５０１は実施の形態１，実施の形態２で説明したのと同様に、基板接合される。ここで図１１に示すとおり、第１の基板１４０１と第２の基板１５０１の間には空気孔１４０２による隙間が生じるため、暖められた空気がこの隙間を通って上昇することでＬＳＩ１５０２からの発熱を防ぐ効果がある。
【００３７】
なお、空気孔１４０２は空気の通り道に用途を限定するものではない。
【００３８】
また、第２の基板１４０１にＬＳＩ１５０２が実装された例を示したが、第１の基板１４０１、第２の基板１５０１に搭載される部品は任意であるため発熱源もＬＳＩ１５０２限定しない。
【００３９】
また、部品面基板端子Ａ１４０３は図面上では同じピッチで端子を配置しているが不規則でもよい。
【００４０】
また、スリット１４０２は基板中央に長孔として示しているが、基板上の位置および形状は任意である。
【００４１】
さらに、一方が開口した状態でもよいし、スリットの幅は挿入する基板以上であれば任意でなる。
【００４２】
また、空気孔１４０４の形状は図１０では角形となっているがいかなる形状でもよい。
【００４３】
また、空気孔１４０４の位置はスリット１４０２と一体化している必要はなく、単独の孔であっても構わない。
【００４４】
（実施の形態４）
図１２は本発明の実施の形態４におけるプリント配線基板の接合構造の接合後を示す断面図、図１３は本発明の実施の形態４におけるプリント配線基板の接合構造の接合後を示す断面図である。図１２、図１３において、１６０１は接合対象の基板の一方である第１の基板、１６０２は第１の基板１６０１上に設けられた基板端子Ａ、１６０３は接続対象のもう一方の基板である第２の基板、１６０４は第２の基板１６０３上に設けられた基板端子Ｂ、１６０５は導電性部材である金属ボール、１７０１は第１の基板１６０１基板端まで存在するの内層パターンＢ、１７０２は第２の基板１６０３の内層パターンＡ、１７０３は第２の基板１６０３上に設けられたランド、１７０４はランド１７０３と内層パターンＡ１７０２を接続するビアである。ここで図１２に示すように第１の基板と第２の基板は、第１の基板の端面と第２の基板の表面とで固定され、さらに基板端子Ａ１６０２と基板端子Ｂ１６０４と接するようにボール１６０５を配置している。基板端子Ａ１６０２と基板端子Ｂ１６０４には予めクリームはんだ等の導電性部材が塗布されており、この状態でリフロー等の処理を行うことで第１の基板１６０１と第２の基板１６０３の接合を行う。このように従来にはないボール１６０５を用いることで接続強度が向上するため、信頼性の高い基板接合が可能となる。
【００４５】
また、図１３に示すように、ランド１７０３へクリームはんだを塗布することで、ランド１７０３と内層パターンＢを接合することも可能となるため、回路の自由度も向上させることができる。
【００４６】
なお、本実施の形態ではボール１６０５として金属素材のものを使用したが、導電性を持った部材であれば種類を問わない。
【００４７】
なお、実施の形態１、２、３においてプリント配線基板として２層および４層基板を例にとって説明したが、片面、６層以上等任意の、多層プリント配線基板にも適用できることはいうまでもない。
【００４８】
【発明の効果】
本発明によれば、２枚のプリント配線基板をコネクタ等の付加部材を使用することなく低コスト、高信頼性の接合が可能となる。
【図面の簡単な説明】
【図１】本発明の実施の形態１におけるプリント配線基板の接合構造の第１の基板を示す斜視図
【図２】本発明の実施の形態１におけるプリント配線基板の接合構造の第１の基板を示す断面図
【図３】本発明の実施の形態１におけるプリント配線基板の接合構造の第２の基板を示す斜視図
【図４】本発明の実施の形態１におけるプリント配線基板の接合構造の第２の基板を示す断面図
【図５】本発明の実施の形態１におけるプリント配線基板の接合構造の接合後を示す斜視図
【図６】本発明の実施の形態１におけるプリント配線基板の接合構造の接合後を示す断面図
【図７】本発明の実施の形態２におけるプリント配線基板の接合構造の第１の基板を示す断面図
【図８】本発明の実施の形態２におけるプリント配線基板の接合構造の第２の基板を示す断面図
【図９】本発明の実施の形態２におけるプリント配線基板の接合構造の接合後を示す断面図
【図１０】本発明の実施の形態３におけるプリント配線基板の接合構造の第１の基板を示す斜視図
【図１１】本発明の実施の形態３におけるプリント配線基板の接合構造の接合後を示す断面図
【図１２】本発明の実施の形態４におけるプリント配線基板の接合構造の接合後を示す断面図
【図１３】本発明の実施の形態４におけるプリント配線基板の接合構造の接合後を示す断面図
【図１４】従来のプリント配線基板の接合構造の接合後を示す斜視図
【図１５】従来のプリント配線基板の接合構造の接合後を示す斜視図
【図１６】従来のプリント配線基板の接合構造の接合後を示す斜視図
【図１７】従来のプリント配線基板の接合構造の接合後を示す断面図
【符号の説明】
５０１ 第１の基板
５０２ スリット
５０３ 部品面基板端子Ａ
６０１ 部品面
６０２ はんだ面
６０３ はんだ面基板端子Ａ
７０１ 第２の基板
７０２ 部品面基板端子Ｂ
８０１ はんだ面基板端子Ｂ
１００１ ＬＳＩ
１００２ はんだ
１１０１ 第１の基板
１１０２ スリット
１１０３ 部品面基板端子Ａ
１１０４ はんだ面基板端子Ａ
１１０５ 内層パターン
１１０６ 面取り部
１１０７ 内層パターンエッジ
１２０１ 第２の基板
１２０２ 内層パターン
１２０３ 部品面基板端子Ｂ
１２０４ はんだ面基板端子Ｂ
１２０５ 部品面ランド
１２０６ はんだ面ランド
１２０７ 部品面ビア
１２０８ はんだ面ビア
１３０１ はんだ
１４０１ 第１の基板
１４０２ スリット
１４０３ 部品面基板端子
１４０４ 空気孔
１５０１ 第２の基板
１５０２ ＬＳＩ
１６０１ 第１の基板
１６０２ 基板端子Ａ
１６０３ 第２の基板
１６０４ 基板端子Ｂ
１６０５ ボール
１７０１ 内層パターンＢ
１７０２ 内層パターンＡ
１７０３ ランド
１７０４ ビア[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a printed wiring board joining structure for joining two or more printed wiring boards to each other.
[0002]
[Prior art]
When a plurality of printed wiring boards constituting an electronic device are electrically connected to each other, a method using a connector is generally used. A connector for connecting a printed wiring board may be a board-to-board connector mounted on both of the printed wiring boards to be joined, or a card edge obtained by processing a circuit pattern on one end of one printed wiring board into a terminal. There are connectors. FIG. 14 is a perspective view showing a structure using a board-to-board connector among conventional connection structures. In the figure, 101 is a first board, 102 is a second board, 103 is a stacking connector A mounted on the first board 101, and 104 is a stacking connector B mounted on the second board. In this case, the electrical connection between the printed circuit boards is achieved by electrically connecting the stacking connector A103 and the stacking connector 104.
[0003]
FIG. 15 is a perspective view showing a structure using a card edge connector in a conventional connection structure. In the figure, 201 is a first substrate, 202 is an electric terminal provided on the first substrate, 203 is a second substrate, and 204 is a card edge connector mounted on the second substrate. In this case, the electrical connection between the printed circuit boards is achieved by electrically connecting the electric terminal 202 and the card edge connector.
[0004]
On the other hand, a joint structure that does not use a connector has also been proposed. FIG. 16 is a perspective view showing a joining structure without using a conventional connector, and FIG. 17 is a sectional view seen from the direction of the arrow in FIG. In the figure, reference numeral 301 denotes a first substrate, 302 denotes a substrate terminal A provided on the first substrate 301, 303 denotes a second substrate, 304 denotes a substrate terminal B provided on the second substrate 303, and 401 denotes a substrate terminal. Solder. As shown in FIG. 16, in the conventional bonding structure without using a connector, the first substrate 301 is vertically adhered to the second substrate 303, and the substrate terminals A302 and B304 are connected via the solder 401 as shown in FIG. Electrical connection between the substrates is achieved by electrical connection.
[0005]
In addition, for example, Patent Literature 1 and Patent Literature 2 have been proposed as configurations for joining two printed wiring boards.
[0006]
[Patent Document 1]
JP-A-11-26906 [Patent Document 2]
JP 2001-358421 A
[Problems to be solved by the invention]
As described above, when an attempt is made to electrically connect a printed wiring board, a connector or the like is usually used.
[0008]
However, since the connector is electrically connected by crimping the terminals, the reliability is inferior. Furthermore, since the cost of the connector itself is high, the cost of the connector cannot be ignored, for example, when connecting multiple signals. Further, even in the method using no connector, the method shown in FIG. 16 and the like require thin solders to be connected to each other, so that the connection strength is poor and the reliability is low. Further, all of the methods proposed in Patent Literature 1 and Patent Literature 2 require special processing, so that the cost for the special processing is eventually required, which is problematic in terms of cost. Further, in the case of board-to-board bonding, heat is trapped between the two substrates, and reliability is reduced.
[0009]
SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a printed wiring board joining structure which has sufficient reliability and cost competitiveness without using connectors.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problems, a bonding structure of a printed wiring board according to the present invention includes a first printed wiring board having a slit for inserting a board and a first contact arranged near an end of the slit, A second printed wiring board having a second contact at at least one position corresponding to the first contact is prepared, and the second printed wiring board is obliquely inserted into and fixed to the slit, and the first printed wiring board is obliquely fixed to the slit. The contact and the second contact are joined via a conductive member. Further, at least one of the first printed wiring board and the second printed wiring board is a multilayer printed wiring board, and at least one of the first contact and the second contact forms an electric circuit. Contact points. Further, the first contact is disposed on both sides of the first printed circuit board, and the second contact is joined to both sides of the printed circuit board. With this structure, highly reliable bonding can be realized without using a connector.
[0011]
In addition, the end of the slit is chamfered, and the end of the slit is chamfered from the surface of the printed wiring board at the first edge side of the slit, and at the second edge side facing the first edge side. This is performed from the back of the printed wiring board. Further, the inner layer pattern of the first printed wiring board is exposed on the cross section formed by the chamfering, and the chamfering is performed so that the cross section forms a parallel plane. Furthermore, a third contact point is provided on a second printed wiring board corresponding to at least one or more locations of the exposed portion of the inner layer pattern, and the second printed wiring board is inserted into the chamfered slit to expose the inner layer pattern. The part and the third contact are joined via a conductive member. Thereby, highly reliable bonding including the inner layer pattern can be realized without a connector.
[0012]
Further, by providing at least one notch along the slit, it is possible to secure an air passage and improve heat dissipation.
[0013]
Further, a third printed wiring board having a fourth contact at an end portion, and a fourth printed wiring board having a fifth contact at a position corresponding to at least one or more locations of the fourth contact are prepared. The fourth contact and the fifth contact are joined via at least two types of conductive members. In addition, the third printed wiring board having the inner layer pattern exposed at the end face of the printed board and the sixth contact at a position corresponding to at least one or more locations of the exposed inner layer pattern are joined via a conductive member. As a result, the holding strength of the substrate by the conductive member is increased, the bonding strength is improved, and highly reliable bonding including the inner layer pattern can be realized.
[0014]
BEST MODE FOR CARRYING OUT THE INVENTION
Hereinafter, a joint structure of a printed wiring board according to an embodiment of the present invention will be described with reference to the drawings.
[0015]
(Embodiment 1)
FIG. 1 is a perspective view showing a first substrate of a printed wiring board bonding structure according to the first embodiment of the present invention, and FIG. 2 is a perspective view showing a first substrate of the printed wiring board bonding structure according to the first embodiment of the present invention. FIG. 3 is a perspective view showing a second substrate of the printed wiring board bonding structure according to Embodiment 1 of the present invention. FIG. 4 is a perspective view showing a printed wiring board bonding structure according to Embodiment 1 of the present invention. 5 is a cross-sectional view showing the substrate of FIG. 2, FIG. 5 is a perspective view showing the printed circuit board according to Embodiment 1 of the present invention after bonding, and FIG. 6 is the printed wiring board bonding structure of Embodiment 1 of the present invention. FIG. 4 is a cross-sectional view showing a state after bonding. In the figure, reference numeral 501 denotes a first substrate which is one of the substrates to be bonded, 502 denotes a slit provided on the first substrate 501, and a slit into which the substrate to be bonded is inserted, and 503 denotes a component surface of the first substrate 501. The component surface substrate terminals A, 601 provided near the end of the slit 502 above are the component surface of the first substrate 501, 602 is the solder surface of the first substrate 501, and 603 is the solder surface of the first substrate 501. The solder surface substrate terminals A and 701 provided above near the end of the slit 502 are the other substrate to be connected, the second substrate inserted into the slit 502 of the first substrate 501, and 702 the second substrate. The component surface substrate terminals B, 801 provided near the end of the component surface of the substrate 701 are mounted on the solder surface of the second substrate 701, and the terminal 1001 is mounted on the second substrate 701. LSI, 1002 based A solder for electrical connection at the junction between. In the first board shown in FIGS. 1 and 2, the component side board terminal A 503 and the solder side board terminal A 603, which are board terminals for making electrical connection when joining the boards, are connected to the component side 601 on the side facing the slit 502. It is arranged on each of the solder surfaces 602.
[0016]
Also, in the second substrate shown in FIGS. 3 and 4, the component-side substrate terminal B702, which is a substrate terminal for making an electrical connection when joining the substrates, is attached to the component surface of the second substrate 701 as shown in FIG. The solder-side board terminal B 801 is arranged on the solder side of the second board 701. The joining of the first substrate 501 and the second substrate 701 thus configured is performed as follows.
[0017]
First, cream solder is applied to a required area of the second substrate 701, and then components such as the
[0018]
By doing as described above, the joining between the substrates can be realized without using an additional member such as a connector.
[0019]
In this embodiment mode, the first substrate 501 and the second substrate 701 are reflowed separately, but may be performed at once after the second substrate 702 is inserted and fixed in the slit 502.
[0020]
It is also clear that the order of reflow of the first substrate 501 and the second substrate 701 may be either.
[0021]
Although the example in which the
[0022]
In addition, the component-side substrate terminals A503, the solder-side substrate terminals A603, the component-side substrate terminals B702, and the solder-side substrate terminals B801 are arranged at the same pitch in the drawing, but may be irregular.
[0023]
In addition, the substrates are joined together on both the component side and the solder side, but either one may be used.
[0024]
Although the slit 502 is shown as a long hole in the center of the substrate, the position and shape on the substrate are arbitrary. Further, one side may be open, and the width of the slit is arbitrary as long as it is larger than the substrate to be inserted.
[0025]
Although the conductive member used for component mounting is cream solder, any type of conductive member such as a conductive adhesive can be used.
[0026]
In addition, although the connection step is reflow, it is clear that the effect of the present invention does not change regardless of the connection step.
[0027]
(Embodiment 2)
FIG. 7 is a cross-sectional view illustrating a first substrate of a printed wiring board bonding structure according to the second embodiment of the present invention. FIG. 8 is a cross-sectional view illustrating a second substrate of the printed wiring board bonding structure according to the second embodiment of the present invention. FIG. 9 is a cross-sectional view showing a state after the bonding of the printed wiring board bonding structure according to the second embodiment of the present invention. In the figure, reference numeral 1101 denotes a first substrate which is one of the substrates to be bonded, 1102 is a slit provided on the first substrate 1101, and a slit into which the substrate to be bonded is inserted; 1103 is a component surface of the first substrate 1101. The component surface substrate terminals A and 1104 provided near the end of the slit 1102 above are the solder surface substrate terminals A and 1105 provided near the end of the slit 1102 on the solder surface of the first substrate 1101. 1106 is a chamfered portion formed by chamfering the end of the slit 1102, 1107 is an inner layer pattern edge exposed by chamfering, 1201 is the other substrate to be connected and the first substrate 1101 The second substrate 1202 inserted into the slit 1102 is an inner layer pattern of the second substrate 1203 is near the end of the component surface of the second substrate 1201 The provided component surface substrate terminals B 1204 are solder surface substrate terminals B 1205 provided on the solder surface of the second substrate 1201, the component surface lands provided on the component surface of the second substrate 1201, and 1206 are the A solder surface land provided on the solder surface of the second substrate 1201, 1207 is a component surface via connecting the component surface land 1205 and the inner layer pattern 1202, 1208 is a solder surface via connecting the solder surface land 1206 and the inner layer pattern 1202, 1301 Is a solder for making an electrical connection at a joint between the substrates. In the first substrate 1101 shown in FIG. 7, the end of the slit 502 of the first substrate 501 shown in Embodiment 1 is chamfered as shown in the drawing to form a chamfered portion 1106. By this processing, the inner layer pattern is exposed from the chamfered portion to form an inner layer pattern edge 1107. This chamfering is performed at an angle parallel to the substrate surface when the substrate to be joined is fixed obliquely.
[0028]
Further, in the second substrate 1201 shown in FIG. 8, in addition to the second substrate 702 shown in the first embodiment, a component surface land 1205 connected to the inner layer pattern 1202 via the component surface via 1207 and a solder A solder surface land 1206 connected via a surface via 1208 is added. The first substrate 1101 and the second substrate 1201 configured as described above are joined in the same procedure as in the first embodiment, resulting in a joined state as shown in FIG. At this time, since the cream solder is also applied to the component surface land 1205 and the solder surface land 1206, the component surface land 1205 and the inner layer pattern edge 1207 are connected, and the solder surface land 1206 and the inner layer pattern edge 1207 are connected.
[0029]
As described above, the bonding between the substrates can be realized without using an additional member such as a connector as in the first embodiment, and the reliability due to an increase in the contact area between the substrates due to the chamfered portion can be realized. Can be further improved. In addition, the connection of the inner layer pattern becomes possible, so that not only the connection strength is improved but also the degree of freedom in circuit design is greatly improved.
[0030]
In the present embodiment, although the inner layer pattern is shown for each of the substrates to be joined, the presence or absence of the inner layer pattern and the connection are not essential.
[0031]
Also, a conductive member such as cream solder may be applied to the inner layer pattern edge 1107. In this case, application of the conductive member to the component surface land 1205 and the solder surface land 1206 is not essential.
[0032]
Further, as in the first embodiment, the substrates are joined together on both the component side and the solder side, but either one may be used.
[0033]
The position and shape of the slit 1102 on the substrate are arbitrary.
[0034]
Further, one side may be open, and the width of the slit is arbitrary as long as it is larger than the substrate to be inserted.
[0035]
Although the conductive member used for component mounting is cream solder, any type of conductive member such as a conductive adhesive can be used.
[0036]
(Embodiment 3)
FIG. 10 is a perspective view showing a first substrate of a printed wiring board bonding structure according to Embodiment 3 of the present invention, and FIG. 11 is a cross-sectional view showing a state after bonding of the printed wiring board bonding structure according to Embodiment 3 of the present invention. FIG. 10 and 11, reference numeral 1401 denotes a first substrate which is one of substrates to be bonded; 1402, a slit provided on the first substrate 1401 to insert the substrate to be bonded; 1403, a first substrate; A component surface substrate terminal provided near the end of the slit 1402 on the component surface of 1401, 1404 is an air hole provided at the end of the slit 1402, and 1501 is a second substrate which is another substrate to be joined , 1502 are LSIs mounted on the second substrate. As shown in FIG. 10, the first substrate 1401 has one or more air holes at the end of the slit 1402. The first substrate 1401 and the second substrate 1501 configured as described above are bonded to each other as described in the first and second embodiments. Here, as shown in FIG. 11, since a gap is formed between the first substrate 1401 and the second substrate 1501 by the air hole 1402, the heated air rises through the gap to generate heat from the
[0037]
The air holes 1402 are not limited to the use of the air passage.
[0038]
Although the example in which the
[0039]
In the drawing, the terminals of the component side substrate terminals A1403 are arranged at the same pitch but may be irregular.
[0040]
Although the slit 1402 is shown as a long hole in the center of the substrate, the position and shape on the substrate are arbitrary.
[0041]
Further, one side may be open, and the width of the slit is arbitrary as long as it is larger than the substrate to be inserted.
[0042]
The shape of the air hole 1404 is square in FIG. 10, but may be any shape.
[0043]
Further, the position of the air hole 1404 does not need to be integrated with the slit 1402, and may be a single hole.
[0044]
(Embodiment 4)
FIG. 12 is a cross-sectional view showing a printed wiring board according to a fourth embodiment of the present invention after bonding, and FIG. 13 is a cross-sectional view showing a printed wiring board after the bonding structure according to the fourth embodiment of the present invention. is there. 12 and 13, reference numeral 1601 denotes a first substrate which is one of substrates to be joined, 1602 denotes a substrate terminal A provided on the first substrate 1601, and 1603 denotes another substrate to be connected. 2, 1604 is a substrate terminal B provided on the second substrate 1603, 1605 is a metal ball as a conductive member, 1701 is an inner layer pattern B of the first substrate 1601 extending to the substrate end, 1702 is a The inner layer patterns A and 1703 of the second substrate 1603 are lands provided on the second substrate 1603, and 1704 is a via connecting the land 1703 and the inner layer pattern A 1702. Here, as shown in FIG. 12, the first substrate and the second substrate are fixed by the end surface of the first substrate and the surface of the second substrate, and furthermore, the balls are brought into contact with the substrate terminals A1602 and B1604. 1605 is arranged. A conductive member such as cream solder is applied to the substrate terminals A1602 and B1604 in advance, and the first substrate 1601 and the second substrate 1603 are joined by performing a process such as reflow in this state. As described above, since the connection strength is improved by using the ball 1605 which has not been conventionally used, highly reliable substrate bonding can be performed.
[0045]
In addition, as shown in FIG. 13, by applying cream solder to the land 1703, the land 1703 and the inner layer pattern B can be joined, so that the degree of freedom of the circuit can be improved.
[0046]
In this embodiment, the ball 1605 is made of a metal material, but any kind of conductive member may be used.
[0047]
In the first, second, and third embodiments, a two-layer and four-layer board is described as an example of a printed wiring board. However, it is needless to say that the present invention can be applied to an arbitrary multilayer printed wiring board such as a single-sided or six-layer board. .
[0048]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, low-cost and highly reliable joining of two printed wiring boards is possible, without using additional members, such as a connector.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a first substrate of a printed wiring board bonding structure according to a first embodiment of the present invention; FIG. 2 is a first substrate of a printed wiring board bonding structure according to a first embodiment of the present invention; FIG. 3 is a perspective view showing a second substrate of the printed wiring board joining structure according to the first embodiment of the present invention; FIG. 4 is a sectional view showing the printed wiring board joining structure according to the first embodiment of the present invention; FIG. 5 is a cross-sectional view showing a second substrate. FIG. 5 is a perspective view showing a state after the bonding of the printed wiring board bonding structure according to the first embodiment of the present invention. FIG. 6 is a bonding view of the printed wiring board according to the first embodiment of the present invention. FIG. 7 is a cross-sectional view showing a structure after bonding. FIG. 7 is a cross-sectional view showing a first substrate of a printed wiring board bonding structure in Embodiment 2 of the present invention. FIG. 8 is a printed wiring board in Embodiment 2 of the present invention. The second group of the joining structure of FIG. 9 is a cross-sectional view showing a state after bonding of the printed wiring board bonding structure according to the second embodiment of the present invention. FIG. 10 is a first view showing a printed wiring board bonding structure according to the third embodiment of the present invention. FIG. 11 is a cross-sectional view showing a state after bonding of a printed wiring board bonding structure according to Embodiment 3 of the present invention. FIG. 12 is a cross-sectional view showing a printed wiring board bonding structure according to Embodiment 4 of the present invention. FIG. 13 is a cross-sectional view showing a state after bonding; FIG. 13 is a cross-sectional view showing a state after bonding of a printed wiring board bonding structure according to a fourth embodiment of the present invention; FIG. FIG. 15 is a perspective view showing a conventional printed wiring board bonding structure after bonding; FIG. 16 is a perspective view showing a conventional printed wiring board bonding structure after bonding; FIG. 17 is a conventional printed wiring board bonding structure; of Sectional view showing a post-engagement EXPLANATION OF REFERENCE NUMERALS
501 First substrate 502 Slit 503 Component side substrate terminal A
601 Component side 602 Solder side 603 Solder side board terminal A
701 second substrate 702 component side substrate terminal B
801 Solder side board terminal B
1001 LSI
1002 Solder 1101 First substrate 1102 Slit 1103 Component side substrate terminal A
1104 Solder side board terminal A
1105 Inner layer pattern 1106 Chamfer 1107 Inner layer pattern edge 1201 Second substrate 1202 Inner layer pattern 1203 Component side board terminal B
1204 Solder side board terminal B
1205 Component side land 1206 Solder side land 1207 Component side via 1208 Solder side via 1301 Solder 1401 First board 1402 Slit 1403 Component side board terminal 1404 Air hole 1501
1601 first substrate 1602 substrate terminal A
1603 Second substrate 1604 Substrate terminal B
1605 Ball 1701 Inner layer pattern B
1702 Inner layer pattern A
1703 Land 1704 Via
Claims (12)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003128746A JP2004335682A (en) | 2003-05-07 | 2003-05-07 | Bonding structure of printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003128746A JP2004335682A (en) | 2003-05-07 | 2003-05-07 | Bonding structure of printed circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2004335682A true JP2004335682A (en) | 2004-11-25 |
Family
ID=33504776
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003128746A Pending JP2004335682A (en) | 2003-05-07 | 2003-05-07 | Bonding structure of printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2004335682A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104180797A (en) * | 2013-05-24 | 2014-12-03 | 精工爱普生株式会社 | sensor unit, method of manufacturing the same, electronic apparatus, and moving object |
| JP2016078037A (en) * | 2014-10-10 | 2016-05-16 | ミネベア株式会社 | Flexible printed circuit board and junction structure of strain gauge |
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| JPH01248590A (en) * | 1988-03-29 | 1989-10-04 | Nec Corp | Connection structure of printed board |
| JPH05111756A (en) * | 1991-10-15 | 1993-05-07 | Omron Corp | Method and apparatus for soldering |
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| JPH09237951A (en) * | 1996-02-29 | 1997-09-09 | Matsushita Electric Ind Co Ltd | Connecting structure of printed board |
| JPH1126906A (en) * | 1997-07-04 | 1999-01-29 | Fujitsu Ltd | Structure for connecting printed wiring board |
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| JP2002314257A (en) * | 2001-02-23 | 2002-10-25 | Fujitsu Ltd | Multilayer circuit board, method of manufacturing the same, and electric assembly |
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|---|---|---|---|---|
| JPS523163A (en) * | 1975-06-26 | 1977-01-11 | Sharp Kk | Method of connecting printed substrate |
| JPH01248590A (en) * | 1988-03-29 | 1989-10-04 | Nec Corp | Connection structure of printed board |
| JPH05111756A (en) * | 1991-10-15 | 1993-05-07 | Omron Corp | Method and apparatus for soldering |
| JPH0623277U (en) * | 1992-08-28 | 1994-03-25 | 富士通テン株式会社 | Electronic component fixing structure |
| JPH0736470U (en) * | 1993-12-09 | 1995-07-04 | 松下電工株式会社 | Circuit board mounting structure |
| JPH09237951A (en) * | 1996-02-29 | 1997-09-09 | Matsushita Electric Ind Co Ltd | Connecting structure of printed board |
| JPH1126906A (en) * | 1997-07-04 | 1999-01-29 | Fujitsu Ltd | Structure for connecting printed wiring board |
| JPH11121896A (en) * | 1997-10-16 | 1999-04-30 | Toshiba Corp | Circuit wiring board and its production |
| JP2000091010A (en) * | 1998-09-17 | 2000-03-31 | Nec Corp | Electronic component module and mounting structure thereof |
| JP2002314257A (en) * | 2001-02-23 | 2002-10-25 | Fujitsu Ltd | Multilayer circuit board, method of manufacturing the same, and electric assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104180797A (en) * | 2013-05-24 | 2014-12-03 | 精工爱普生株式会社 | sensor unit, method of manufacturing the same, electronic apparatus, and moving object |
| JP2014228489A (en) * | 2013-05-24 | 2014-12-08 | セイコーエプソン株式会社 | Sensor unit and manufacturing method thereof, and electronic apparatus and moving body |
| JP2016078037A (en) * | 2014-10-10 | 2016-05-16 | ミネベア株式会社 | Flexible printed circuit board and junction structure of strain gauge |
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