JP2000208935A - Manufacture of printed wiring board, printed wiring board and part for conducting double face patterns used for the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To inexpensively and highly reliably conduct double-face wiring patterns on a printed wiring board, without deteriorating productivity for realizing high density mounting. SOLUTION: This flat part 12 of a conduction part 10a is absorbed and held by a surface mounting part installation machine, and the part is installed on a printed wiring board main body 1 by using the conduction part 10a provided with a flat part 12, that can be absorbed/held by the surface mounted part installation machine, a lead part 13 which can be inserted into a through- hole 8 formed in the printed wiring board main body 1 and a joint part 14 jointed to a land formed on a side A of the printed wiring board main body 1. The double faces of the printed wiring board main body 1, to which the conduction part 10a is installed, are soldered, and therefore the land 4 formed on the side A of the printed wiring board main body 1 is jointed to the joint part 14 of the conduction part 10a. Then, the lead part 13 is jointed with a land 5 formed at the periphery of the through-hole 8 on the side B of the printed wiring board main body 1.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a printed wiring board for conducting wiring patterns formed on both sides of a printed wiring board used in electronic equipment and the like, a printed wiring board, and a double-sided pattern conduction method used for them. Related to parts.

[0002]

2. Description of the Related Art FIGS. 8 to 11 are sectional views showing a printed wiring board PB to which a conventional method for conducting wiring patterns formed on both surfaces of a printed wiring board main body 1 has been applied. A land 4 is formed on the surface A, which is one surface of the printed wiring board main body 1, and a land 5 is formed on the surface B, which is the other surface. These lands 4 and 5
A through hole 8 is formed in the base 1a of the printed wiring board main body 1 in order to establish electrical continuity between the substrate 1 and the base. The solder resist 3 is applied to portions other than the lands 4 and 5.

In the conventional method shown in FIG.
The inside is plated with copper to form a copper through-hole plated portion 6 and is connected to the lands 4 and 5 on each surface, whereby conduction between both surfaces is achieved. Further, it is also possible to fill and solder the solder 2 into the through hole by plating the through hole with copper.

In the conventional method shown in FIG. 9, a silver paste is filled and hardened in the through hole 8, and the through hole 8 is hardened.
A silver through-hole paste portion 7 is formed in the inside to achieve conduction of the double-sided wiring pattern.

In the conventional method shown in FIG. 10, a stud 9 is inserted into a through hole 8, and solder is filled in the stud 9, and soldering is performed on both the A side and the B side. Thus, conduction is achieved.

Further, in the conventional method shown in FIG. 11, a wire-like jumper wire 19 is inserted into two through holes 8, and the jumper wires 19 are soldered on both the A side and the B side. Thereby, conduction between both surfaces is achieved.

[0007]

However, the copper through-hole plating method shown in FIG. 8 has a problem that the manufacturing process of the printed wiring board PB is complicated because the inside of the through-hole 8 is plated with copper. In addition, since it is necessary to use a glass epoxy base material 1a having a small linear expansion coefficient in order to prevent disconnection due to a change in temperature of the pattern and the plated portion, there is a problem that the cost is high.

The silver through-hole method shown in FIG. 9 is less expensive than the copper through-hole method, but has a similar problem in that the manufacturing process is complicated. In addition, since the diameter of the through hole 8 cannot be increased due to the nature of the silver through hole method, the current flowing through the through hole 8 is greatly restricted, and there is a problem that it cannot be used in general circuits.

Further, in the conduction method using the ferrule 9 shown in FIG. 10, the existing equipment can be used and can be manufactured relatively inexpensively.
When the temperature change occurs repeatedly, the stress generated between the base material 1a and the solder 2 having different linear expansion coefficients concentrates on the soldered portions of the lands 4 and 5, and the There is a reliability problem that cracks occur.

In the conduction method using the jumper wire 19 shown in FIG. 11, the existing equipment can be used and the device can be manufactured relatively inexpensively, and the stress applied to the soldering portion due to the temperature change is not soldered to the jumper wire 19. Because of the partial dispersion, it is superior to the conduction method using the eyelet 9.

However, in the conduction method using the jumper wire 19, the cream solder 11 is formed on the printed wiring board main body 1 in a cream solder applying step for forming a surface mounting line.
After printing, it is necessary to temporarily take out from the surface mounting line and move to a lead component insertion step using a jumper wire insertion machine or the like. Then, after the jumper wire 19 is inserted in the lead component insertion process, the process returns to the surface mounting line again for the mounting of the surface mount component and the melting and soldering of the cream solder 11, and the process is shifted to the surface mount component mounting process and the reflow process. It is necessary. Thus jumper wire 1
9, the manufacturing process becomes complicated,
This is a problem because it lowers productivity.

In the conduction method using the jumper wire 19, the jumper wire 19 is placed on the cream solder 11 before melting.
Is inserted, the cream solder 11 may be scattered at the time of insertion, and it is necessary to add a process for removing the solder. Therefore, the production process is further complicated, and a decrease in productivity is a serious problem.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-described problems. In order to realize high-density mounting, it is inexpensive, highly reliable, and capable of producing printed wiring boards without lowering productivity. It is an object of the present invention to obtain a printed wiring board manufacturing method for conducting wiring patterns formed on both sides, a printed wiring board, and a double-sided pattern conducting component used for the same.

[0014]

In order to achieve the above object, the invention according to claim 1 is a method for manufacturing a printed wiring board for manufacturing a printed wiring board in which a wiring pattern formed on both sides is conducted between both sides. A step of preparing a printed wiring board main body in which a first land is formed on one surface and a second land is formed on the other surface, and a through hole is formed from the one surface to the other. An upper body having a flat portion having an upper surface having a suction surface that can be suction-held by a surface mounter and a bonding portion defined on a lower surface side of the flat portion and capable of bonding to the wiring pattern; A step of preparing a double-sided pattern conducting component having a lead portion protruding into the double-sided pattern conducting component, while adsorbing and holding the suction surface by the surface mount component mounting machine. The first land and the first land are formed by soldering both sides of the printed wiring board body on which the double-sided pattern conducting parts are mounted, and a suction insertion step of inserting the lead portion into a through hole of the printed wiring board body. A joining step of joining the joining portion of the component for conducting double-sided pattern and joining the second land and the lead portion.

According to a second aspect of the present invention, in the method for manufacturing a printed wiring board according to the first aspect, a component formed by bending a single plate-like base material is used as the double-sided pattern conducting component. It is characterized by:

According to a third aspect of the present invention, in the method for manufacturing a printed wiring board according to the second aspect, the lead portion of the double-sided pattern conducting component includes a plurality of leads arranged in close proximity to each other. The joining step includes a step of injecting solder between the plurality of leads.

According to a fourth aspect of the present invention, in the method of manufacturing a printed wiring board according to the second aspect, the lead portion of the double-sided pattern conducting component is constituted by a single lead.

According to a fifth aspect of the present invention, there is provided a printed wiring board main body having a wiring pattern formed on both sides thereof, and a wiring pattern inserted into a through hole formed in the printed wiring board main body to electrically connect the wiring patterns on both sides. A two-sided pattern conducting part for conducting, wherein the two-sided pattern conducting part has a flat part having an upper surface having a suction surface which can be suction-held by a surface mounter, and a lower surface of the flat part, the print being defined. An upper body having a bonding portion soldered to a wiring pattern on one surface of the wiring board body, and projecting downward from the upper body, being inserted into the through hole, and having an end portion of the printed wiring board A lead portion joined by solder to a wiring pattern on one surface of the main body is provided.

According to a sixth aspect of the present invention, in the printed wiring board according to the fifth aspect, the lead portion includes a plurality of leads arranged in a state of being close to each other, and between the plurality of leads. It is characterized by the penetration of solder.

According to a seventh aspect of the present invention, there is provided a double-sided pattern conducting component for conducting a wiring pattern formed on both sides of a printed wiring board main body between the two sides, the suction being capable of being held by a surface mounter. An upper body having a flat portion having an upper surface and a bonding portion defined on the lower surface side of the flat portion and capable of bonding to the wiring pattern, and a lead portion protruding downward from the upper body is provided.

According to an eighth aspect of the present invention, in the component for conducting a double-sided pattern according to the seventh aspect, the component is formed by bending a single plate-shaped base material.

According to a ninth aspect of the present invention, in the component for conducting a double-sided pattern according to the eighth aspect, the lead portion includes a plurality of leads arranged close to each other.

According to a tenth aspect of the present invention, in the component for conducting a double-sided pattern according to the eighth aspect, the lead portion is constituted by a single lead.

[0024]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1 Embodiment 1 of the present invention will be described with reference to FIGS. In addition,
In the drawings, the same or corresponding members as those described above are denoted by the same reference numerals.

FIG. 1 is a perspective view showing a double-sided pattern conducting component 10a (hereinafter, simply referred to as “conducting component 10a”) according to Embodiment 1 of the present invention, and FIG. 2 is an embodiment of the present invention. FIG. 3 is a conceptual perspective view showing an example of suction holding when the conductive component 10a according to the first embodiment is mounted on the printed wiring board main body 1, and FIG. 3 shows the printed wiring board main body 1 and a conductive mounting soldered thereto. FIG. 5 is a cross-sectional view showing a printed wiring board PB obtained by using a component 10a.

As shown in FIG. 1, the conducting part 10a is
A laminated flat plate-shaped upper body F formed by bending a single metal plate-shaped base material, and a narrower part integrally formed at both ends of the plate-shaped base material are bent to form an upper body F. And a lead portion 13 projecting downward from
It is shaped like a letter.

The upper body F has a flat surface portion 12 having an upper surface 12s that can be sucked and held by the surface mounting component mounting machine, and a lower surface of the flat surface portion 12 to define the printed wiring board body 1. It has a bonding portion 14 that can be bonded to the land 5 (see FIG. 3) formed on one surface (surface A). In addition, the lead portion 13 is the printed wiring board body 1.
Is inserted from one surface (A surface) of the printed wiring board main body 1 into one through hole 8 of an arbitrary number of through holes formed therein, and protrudes to the other surface (B surface). .

For these purposes, the suction surface 12 of the flat portion 12
s is a flat surface having no substantial irregularities or through holes, and the length of the lead portion 13 is
And a length that can form a good solder fillet.

Accordingly, as shown in FIG. 2, the conducting component 10a can be suction-held by the suction holding nozzle 31 of the surface mount component mounting machine so that the flat portion 12 can be held by suction. The conductive component 1
The mounting of Oa can be performed in the surface mounting component mounting process in the surface mounting line.

Further, the lead portions 13 in the first embodiment are arranged close to each other with a minute space therebetween.
It is constituted by a single lead plate 13a, 13b,
Two joints 14 are provided symmetrically on the back side of the plane part 12.

Then, as shown in FIG. 3, the printed wiring board main body 1 and the conductive component 10a are joined by the cream solder 11 to the lands 4 on the A side of the printed wiring board main body 1 and the joining portion 14. At the same time, the land 5 formed around the through hole 8 on the B side and the tip of the lead portion 13 are joined by the solder 2, so that electrical conduction of the double-sided pattern can be realized.

The conducting part 10a is a relatively inexpensive part obtained by subjecting one metal plate to sheet metal processing, and is provided between the flat part 12 and the joint part 14 and between the joint part 14 and the lead part 13. And a bent structure in which a bent portion is formed between the two. Therefore, even when the base material 1a of the printed wiring board body 1 contracts and expands due to a temperature change, the stress generated at that time is absorbed by the bent portion, so that the land 4 and the joining portion 14 Cracks can be avoided at the soldering portion of the lead 5 and the soldering portion between the land 5 and the lead portion 13. Therefore, disconnection due to a temperature change or the like can be prevented, and reliability can be improved.

The lead portion 13 of the conducting component 10a
Is formed by the two lead plates 13a and 13b arranged close to each other as described above, so that when performing soldering to the lead portion 13, a capillary phenomenon occurs and the two lead plates 13a and 13b The solder 2 penetrates between the plates 13a and 13b and rises. As a result, the volume electrically integrated with the lead portion 13 inside the through hole 8 is increased by the solder 2, so that the allowable value of the current can be increased. For this reason, the minute interval provided between the two lead plates 13a and 13b may be an interval that can appropriately cause a capillary phenomenon in the solder 2.

Next, a process for mounting the conducting component 10a on the printed wiring board main body 1 to achieve conduction of the double-sided pattern will be described. FIG. 4 is a process chart for manufacturing a printed wiring board PB in which wiring patterns formed on both sides are made conductive by using the conductive component 10a.

First, prior to each step, a land 4 (first land) and a land 5 (second land) are provided on one surface (A surface) and the other surface (B surface) as shown in FIG. A printed wiring board main body 1 is prepared, each of which is formed and in which a through hole 8 from one surface to the other is formed. Further, the above-described conducting component 1 for realizing conduction of a double-sided pattern.
0a and other mounting components are also prepared.

Then, in a cream solder printing step S1, the cream solder 11 is printed on the land 4 on the A side provided on the printed wiring board body 1 by a predetermined cream solder printing machine.

Next, in the surface mounting component mounting step S2, the suction holding nozzle 31 of the surface mounting component mounting machine suctions and holds the suction surface 12s of the conduction component 10a, and
Is inserted into the through hole 8 and the joint 14 is
It is mounted on the printed wiring board body 1 by pressing from above the cream solder 11 printed on the land 4 on the surface side. Here, since the conductive component 10a is mounted by the surface mounting component mounting machine, there is no possibility that the unmelted cream solder 11 is scattered. Note that other surface mount components are also mounted in this step.

Then, in the reflow step S3, the printed wiring board main body 1 on which the conductive parts 10a are mounted is flowed through a reflow device, and the cream solder 11 is melted, so that the joints 14 of the conductive parts 10a and the lands on the A-plane side are melted. 4 and solder.

Next, in the insertion mounting component insertion step S4, the insertion mounting component is inserted into each of the other through-holes, and then the process proceeds to the flow soldering step S5.
The soldering of the protruding lead portion 13 of the conduction component 10a and the land 5 on the side B is performed by a flow soldering device. At this time, the two lead plates 1 protruding from the conduction component 10a due to the capillary phenomenon of the solder 2 described above.
The solder 2 rises to the A side between 3a and 13b.

As described above, conduction on both sides of the printed wiring board main body 1 is obtained, and the mounted printed wiring board PB is obtained. Here, since there is no need to shift to a lead component insertion process using a jumper wire insertion machine or the like before the reflow process S3 as in the related art, productivity can be improved. That is, by using the conducting component 10a described in this embodiment, double-sided conduction can be realized in a series of surface mounting line processes, so that the process is not complicated and productivity can be improved. You can.

The number of lead plates for causing the capillary action of the solder at the lead portion 13 of the conductive component 10a is not limited to two, and may be two or more. However, from the viewpoint of structure and processing. In view of the cost of parts, it is preferable to configure with two sheets. Further, the lead portions 13 are not particularly limited to the plate shape, but are preferably plate shapes facing each other from the viewpoint that the capillary action of the solder is effectively generated.

As described above, the conduction component 10a
The upper surface F has a flat surface portion 12 having a suction surface 12 s which can be suction-held by a surface mount component mounting machine, and one surface side (one side) with respect to one through hole 8 formed in the printed wiring board main body 1. A lead 13 inserted from the A side) and protruding from the other side (the B side);
And a bonding portion 14 for bonding to a land formed on one surface side (A surface side) of the device, so that it is inexpensive and highly reliable, and can be mounted in a series of surface mounting line processes. Therefore, it is possible to conduct the wiring patterns formed on both surfaces of the printed wiring board main body 1 without lowering the productivity.

Further, the lead portion 13 of the conduction component 10a has a plurality of lead plates 13a, 1
3b, the amount of solder can be increased by the capillary phenomenon, and the allowable value of the current can be increased. Therefore, the restriction on the current flowing through the through hole 8 is reduced,
It can be applied to all circuits.

In a surface mounting component mounting step S2, which is a series of surface mounting line processes, the conductive component 10a is mounted on the printed wiring board main body 1 by a surface mounting component mounting machine, and a reflow step S3 and a flow soldering step S2 are performed.
5, by soldering both sides of the printed wiring board main body 1 on which the conductive parts 10a are mounted, the lands 4 formed on one surface side (A side) of the printed wiring board main body 1 and the conductive parts 10a, the lead portion 13 and the land 5 formed around the through hole 8 on the other surface side (surface B side) of the printed wiring board main body 1 are joined together, so that both sides are joined. Since the printed wiring board PB in which the formed wiring patterns are conducted can be manufactured, it is inexpensive, has high reliability, and does not lower the productivity.

Further, since the conductive component 10a can be obtained by simply performing sheet metal working such as folding or bending a single sheet-shaped base material formed by punching, it can be mass-produced at low cost. That is, the T-shaped conductive part having the upper surface as a flat portion can be obtained as an assembly structure of respective plate pieces constituting the flat portion 12, the joint portion 14, and the lead plates 13a and 13b. By forming as in the first embodiment, it is possible to reduce the manufacturing cost of a printed wiring board that is used in a large number.

Further, by forming the lead portion 13 symmetrically with respect to the left and right as in the first embodiment, it is not necessary to distinguish the left and right directions during mounting.

Embodiment 2 Next, a second embodiment will be described with reference to FIGS. In each figure,
Members that are the same as or correspond to the members described in the first embodiment are given the same reference numerals.

FIG. 5 is a perspective view showing a double-sided pattern conducting part 10b (hereinafter, simply referred to as “conducting part 10b”) according to Embodiment 2 of the present invention, and FIG. 6 is an embodiment of the present invention. FIG. 7 is a conceptual perspective view showing an example of suction holding when the conductive component 10b according to the second embodiment is mounted on the printed wiring board main body 1, and FIG. 7 shows the printed wiring board main body 1 and the conductive mounting soldered thereto. It is sectional drawing which shows the component 10b.

The conductive component 10b is formed integrally with a laminated flat upper body F formed by bending one end of a single metal plate-shaped base material and the other end of the plate-shaped base material. And a lead portion 13 protruding downward from the upper body F by bending the narrow portion thus formed.
5 (FIG. 5 to FIG. 7).

The upper body F has a flat surface portion 12 having a suction surface 12s on the upper side which can be suction-held by a surface mounting component mounting machine.
And a bonding portion 14 that can be bonded to a land 5 defined on the lower surface side of the flat portion 12 and formed on one surface (A surface) of the printed wiring board main body 1. Form 1
However, the joint portion 14 is provided only on one side of the upper body F, and the lead portion 13 protrudes from the other side of the upper body F.

The other structure, that is, the fact that the suction surface 12s of the flat portion 12 is a flat surface having no substantial irregularities or through holes, and that the lead portion 13 is formed on the printed wiring board body 1 The points inserted into one of the through holes 8 of the arbitrary number of through holes from one surface (A surface) of the printed wiring board main body 1 and projecting to the other surface (B surface) are as follows. This is the same as in the first embodiment.

Therefore, as shown in FIG. 6, this conducting component 10b is also used for the suction holding nozzle 3 of the surface mount component mounting machine.
1, the flat portion 12 can be held by suction, and the mounting of the conductive component 10b to the printed wiring board main body 1 can be performed in a surface mounting component mounting process in a surface mounting line.

As shown in FIG. 7, the printed wiring board main body 1 and the conducting parts 10b are connected to each other in the same manner as in the first embodiment.
Land 4 on surface A of printed wiring board main body 1 and joint 14
Are bonded by the cream solder 11 and
The land 5 on the B side and the tip of the lead 13 are solder 2
Thus, conduction of the double-sided pattern can be realized.

As described above, the conductive component 10b according to the second embodiment is different from the conductive component 10a in that
The point that the lead portion 13 is constituted by a single lead plate 13c and the joint portion 14 is provided only at one position on the back side of the flat portion 12 and at the position opposite to the position where the lead portion 13 is formed Two points.

Accordingly, since the conductive component 10b cannot cause the capillary phenomenon of the solder as shown in the conductive component 10a, the effect of increasing the volume of the lead portion 13 by the solder is small. However, while the conductive part 10a has four bent parts, the conductive part 10b can be realized only by forming two bent parts. The simplicity has the feature that the manufacturing cost of the conducting component 10b itself can be reduced.

Although the conductive part 10b has two bent portions, the stress generated when the substrate 1a of the printed wiring board body 1 contracts and expands due to a change in temperature is due to these two parts.
Since it is absorbed by the bent portion formed at the place, the land 4
Cracks can be avoided at the soldered portion between the lead portion 13 and the solder portion between the lead 5 and the land 5. For this reason, even in the case of the conductive component 10b, disconnection due to a temperature change or the like can be prevented, and reliability can be improved.

The process for mounting the conducting component 10b on the printed wiring board main body 1 to achieve conduction of the double-sided pattern can be performed in the same process as that described in the first embodiment with reference to FIG. Therefore, this conduction component 10
Even if b is used, the two-sided conduction of the printed wiring board main body 1 can be obtained, and it is not necessary to shift to a lead component insertion step by a jumper wire insertion machine or the like before the reflow step S3 as in the conventional case, so that productivity can be increased. it can.

As described above, the conduction component 10b
As in the case of the conductive component 10a described above, the printed wiring board main body 1 is attached to the flat portion 12 that can be sucked and held by the surface mount component mounting machine and the one through hole 8 formed in the printed wiring board main body 1. Lead portion 13 inserted from one surface side (surface A side) and projected to the other surface side (surface B side)
And a bonding portion 14 for bonding to a land formed on one surface side (A surface side) of the printed wiring board, so that it is inexpensive and highly reliable, and a series of surface mounting lines is provided. Since it can be mounted in the process, it is possible to conduct the wiring patterns formed on both surfaces of the printed wiring board main body 1 without lowering the productivity.

Further, since the lead portion 13 of the conducting component 10b is constituted by a single lead, the lead portion 13 has a feature that its shape is simple and that it can be realized at lower cost.

Also in this embodiment, as shown in FIG. 4, in the surface mounting component mounting step S2, which is a series of surface mounting line processes, the conductive component 10b is connected to the printed wiring board main body 1 by the surface mounting component mounting machine. In the reflow step S3 and the flow soldering step S5.
By soldering both sides of the printed wiring board main body 1 on which the conductive parts 10b are mounted, the lands 4 formed on one surface side (A side) of the printed wiring board main body 1 and the conductive parts 10a are joined. While joining the part 14,
The lead portion 13 and the other surface side of the printed wiring board main body 1 (B
By simply joining the lands 5 formed around the through holes 8 on the (surface side), it is possible to produce a printed wiring board in which conduction is established between the wiring patterns formed on both surfaces. Moreover, the reliability is high and the productivity is not reduced.

Further, the conducting part 1 of the second embodiment
0b can be mass-produced inexpensively by being obtained by simply performing sheet metal processing such as folding or bending on a single sheet-shaped base material formed by punching, and has the same advantages as in the first embodiment. .

[0062]

As described above, the method for manufacturing a printed wiring board according to the first aspect of the present invention defines a flat portion having a suction surface on the upper side which can be suction-held by a surface mounter and a lower surface side of the flat portion. A surface mounting component mounting machine suction-holds a double-sided pattern conducting component having an upper body having a joined portion that can be joined to a wiring pattern, and a lead portion protruding downward from the upper body. Inserting the lead of the component into the through hole of the printed wiring board body and soldering the two sides of the printed wiring board body on which the resulting double-sided pattern conducting component is mounted, so that the process is not complicated. The two-sided conduction of the printed wiring board can be achieved without lowering the productivity.

In the method for manufacturing a printed wiring board according to the second aspect of the present invention, a component formed by bending a single plate-like base material is used as a double-sided pattern conducting component, so that the cost of the component to be used is low. Thus, both-side conduction of the printed wiring board can be realized at low cost.

According to a third aspect of the present invention, in the method for manufacturing a printed wiring board, the lead portions of the double-sided pattern conducting component include a plurality of leads arranged in close proximity to each other, and solder enters between the plurality of leads. Since soldering is performed so that the allowable value of the current flowing through the through hole can be increased, it is possible to manufacture a printed wiring board having high reliability and a wide application range.

In the method of manufacturing a printed wiring board according to the fourth aspect of the present invention, the lead portion of the component for conducting the double-sided pattern is constituted by a single lead, so that the cost of the components used is further reduced and the printed wiring board is manufactured. Double-sided conduction can be realized at low cost.

The printed wiring board according to the fifth aspect of the present invention has a double-sided pattern conducting component which is inserted into a through hole formed in the printed wiring board main body and electrically conducts the wiring patterns on both sides. An upper body having a flat portion having a suction surface on the upper side that can be suction-held by the machine, and a bonding portion defined on the lower surface side of the flat portion and soldered to a wiring pattern on one surface of the printed wiring board body; , Which protrudes downward from the upper body and is inserted into the through-hole, and its end is provided with a lead portion soldered to the wiring pattern on one surface of the printed wiring board body, so that it is inexpensive and reliable. It will be expensive.

The printed wiring board according to the sixth aspect of the present invention has a plurality of leads whose lead portions are arranged in close proximity to each other, and since the solder penetrates between the plurality of leads, reliability is improved. It is a high-priced and widely applicable printed wiring board.

According to a seventh aspect of the present invention, there is provided a component for conducting a double-sided pattern, wherein a flat portion having a suction surface on the upper side which can be suction-held by a surface mounter and a lower surface of the flat portion are defined and can be joined to a wiring pattern. An upper body having a joint,
Since there is provided a lead portion projecting downward from the upper body, the productivity when conducting both-side conduction does not decrease.

Since the double-sided pattern conducting component according to the eighth aspect of the present invention is formed by bending a single plate-shaped base material, it is a low-cost and highly reliable double-sided pattern conducting component. .

In the component for conducting a double-sided pattern according to the ninth aspect of the present invention, since the lead portion has a plurality of leads arranged close to each other, it is possible for the solder to enter between the plurality of leads by capillary action. Thus, it is possible to conduct the double-sided pattern with high reliability and a wide range of application.

The component for conducting a double-sided pattern according to the tenth aspect of the present invention can be realized at a lower cost because the lead portion is constituted by a single lead.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a double-sided pattern conducting component according to Embodiment 1 of the present invention.

FIG. 2 is a conceptual perspective view showing an example of suction holding when a conductive component according to Embodiment 1 of the present invention is mounted on a printed wiring board main body.

FIG. 3 is a cross-sectional view showing a printed wiring board main body and a conductive component soldered and mounted thereon according to the first embodiment;

FIG. 4 is a process chart for manufacturing a printed wiring board in which wiring patterns formed on both sides are made conductive by using a conductive part.

FIG. 5 is a perspective view showing a component for conducting double-sided patterns according to Embodiment 2 of the present invention.

FIG. 6 is a conceptual perspective view showing an example of suction holding when a conductive part according to Embodiment 2 of the present invention is mounted on a printed wiring board main body.

FIG. 7 is a cross-sectional view showing a printed wiring board main body and a conductive part soldered and mounted thereon according to the second embodiment.

FIG. 8 is a cross-sectional view showing a printed wiring board on which double-sided conduction is performed by a conventional method.

FIG. 9 is a cross-sectional view showing a printed wiring board on which double-sided conduction is performed by a conventional method.

FIG. 10 is a cross-sectional view showing a printed wiring board on which double-sided conduction is performed by a conventional method.

FIG. 11 is a cross-sectional view showing a printed wiring board on which double-sided conduction is performed by a conventional method.

[Explanation of symbols]

1 printed wiring board, 1a base material, 2 solder, 3 solder resist, 4,5 land, 8 through hole,
10a, 10b Double-sided pattern conducting parts (conducting parts), 11 cream solder, 12 plane part, 13 lead part, 13a to 13c lead plate, 14 joint part, F
Upper body, PB Printed wiring board.

Claims (10)

[Claims] 1. A printed wiring board manufacturing method for manufacturing a printed wiring board in which a wiring pattern formed on both surfaces is conducted between both surfaces, wherein a first land is provided on one surface and a second land is provided on the other surface. Are respectively formed, and a step of preparing a printed wiring board main body in which a through hole communicating from the one surface to the other is formed, and a flat portion having a suction surface on the upper side which can be suction-held by a surface mount mounting machine. An upper body having a bonding portion defined on the lower surface side of the flat portion and capable of being bonded to the wiring pattern, and a step of preparing a double-sided pattern conduction component including a lead portion projecting downward from the upper body, While holding the suction surface by the surface mount component mounting machine, the suction portion for inserting the lead portion of the double-sided pattern conducting component into the through hole of the printed wiring board body. Attaching and inserting step, and by soldering both sides of the printed wiring board body on which the double-sided pattern conducting component is mounted, joining the first land and the joining portion of the double-sided pattern conducting component, A method for manufacturing a printed wiring board, comprising: a bonding step of bonding the second land and the lead portion. 2. The method for manufacturing a printed wiring board according to claim 1, wherein a component formed by bending a single plate-like base material is used as the double-sided pattern conducting component. Printed wiring board manufacturing method. 3. The method for manufacturing a printed wiring board according to claim 2, wherein the lead portion of the component for conducting double-sided pattern includes a plurality of leads arranged in close proximity to each other. And a step of injecting solder between the plurality of leads. 4. The method for manufacturing a printed wiring board according to claim 2, wherein the lead portion of the double-sided pattern conducting component is formed of a single lead. 5. A printed circuit board main body having a wiring pattern formed on both sides thereof, and a double-sided pattern conducting device which is inserted into a through hole formed in the printed wiring board body to electrically conduct the wiring patterns on both sides. A double-sided pattern conducting component, one of the printed wiring board main body defined on a lower surface side of the flat surface portion having an upper surface having a suction surface that can be suction-held by a surface mounter. An upper body having a joint joined to the wiring pattern of the surface by soldering, and projecting downward from the upper body, being inserted into the through hole, and having an end portion on one surface of the printed wiring board main body. A lead portion joined to the wiring pattern by soldering. 6. The printed wiring board according to claim 5, wherein the lead portion includes a plurality of leads arranged in a state of being close to each other, and solder has penetrated between the plurality of leads. A printed wiring board, characterized in that: 7. A part for conducting a double-sided pattern for conducting a wiring pattern formed on both sides of a printed wiring board body between both sides, and a flat surface having a suction surface which can be suction-held by a surface mounter on an upper side. A double-sided pattern, comprising: an upper body having a portion, a joining portion defined on the lower surface side of the plane portion and capable of joining to the wiring pattern, and a lead portion projecting downward from the upper body. Conductive parts. 8. The two-sided pattern conducting part according to claim 7, wherein the one-sided base material is formed by bending a single plate-like base material. 9. The component for conducting a double-sided pattern according to claim 8, wherein the lead portion includes a plurality of leads arranged in close proximity to each other. 10. The two-sided pattern conducting part according to claim 8, wherein the lead portion is constituted by a single lead.