DE10001180B4 - A double-sided pattern connection component, printed circuit board, and method of connecting connection patterns formed on both sides of a printed circuit board - Google Patents

Abstract

Double-sided pattern connection component (10b) for producing a conductive connection between connection patterns which are formed on both sides of a plate substrate (1) of a printed circuit (PB), the plate substrate (1) having at least one through hole (8), characterized in that the double-sided pattern connection component (10b) comprises: a line section (13) to be inserted into the through hole (8), and an upper section (F) with a flat plane (12) and a connection part (14) arranged perpendicularly to the line section (13), wherein the flat plane (12) has a suction surface (12s) on its upper side which is capable of being held by suction by a surface mounting member attaching device, the connecting portion (14) being formed by bending one end of the flat plane (12). is formed on the underside and the line section (13) by bending only one of the connecting part (14) ge opposite end of the flat plane (12) is formed perpendicular to this, wherein the line section (13) and the upper section (F) are integrally formed and a ...

Description

The present invention relates to a method of manufacturing a printed circuit board in which a conductive connection is made between interconnection patterns formed on both sides of a printed circuit board used in electronic equipment and the like on a printed circuit board as well as therein used connecting part for a double-sided pattern.

The 8th to 11 FIG. 12 are sectional views showing printed circuit boards PB processed by conventional methods to provide a conductive connection between the interconnection patterns formed on both sides of the disk substrate 1 are made to produce. The disk substrate 1 has a footbridge formed on its one side, the side A. 4 and a bridge formed on the other side, the side B 5 , The substrate material 1a of the disk substrate 1 has a through hole 8th on for the production of a conductive connection between the bars 4 and 5 , solder resist 3 is on the parts except the webs 4 and 5 applied.

At the in 8th The method shown becomes the copper-plated through-hole region 6 by plating the inside of the through hole 8th formed with copper, and he is with the webs 4 and 5 connected on both sides to make a line. The through hole 8th can with solder 2 be filled because it is plated with copper.

At the in 9 As shown in the conventional method, silver paste becomes the through hole 8th introduced and cured to a silver paste through hole area 7 in the through hole 8th by which a line is established between the connection patterns on both sides.

At the in 10 shown conventional method is an eyelet 9 in the through hole 8th inserted and filled with solder, and soldering is performed on both sides A and B to obtain a conductive connection.

At the in 11 shown conventional method is a support bridge 19 in two through holes 8th introduced, and the support bridge 19m is soldered on both sides A and B, to get a conductive connection between the two sides.

At the in 8th However, as shown by the through hole copper plating method, the plating of the inside of the through hole is complicated 8th with copper, the printed circuit board manufacturing process PB. Furthermore, a glass Iboxydmaterial having a low linear expansion coefficient as a substrate material 1a can be used to avoid interruption due to temperature variations on the pattern and the plated part, which causes the problem of increased costs.

In the case of in 9 As shown, while the cost can be reduced as compared with the copper via method, the manufacturing process is also complicated. Furthermore, the silver via method does not require the use of a via 8th allowed with large diameter, through the through hole 8th flowing current so limited that this method can not be generally applied to all types of circuits.

This in 10 Connection method using the eyelet 9 allows production at a relatively low cost since it allows the use of existing tooling. However, as the temperature changes repeatedly, it will concentrate between the substrate material 1a and the solder 2 due to different linear expansion coefficients occurring stresses on the soldered parts in the webs 4 and 5 because the eyelet 9 of solder 2 is covered, and then cracks occur in the soldered parts, so that the problem of lack of reliability occurs.

This in 11 shown connection method with the support bridge 19 allows the use of existing tooling and therefore allows production at a relatively low cost. Furthermore, since the stresses exerted on the soldered parts in the event of temperature fluctuations affect the non-soldered part of the support bridge 19 This method is the connection method using the eyelet 9 think.

However, when the support bridge 19 used method after the solder paste 11 in the solder paste application step in the soldering process line to the substrate plate 1 has been printed, they are once taken out of the Auflötverfahrenslinie and moved to the line component insertion step using a Tragbrückenereinsetzvorrichtung or the like. Then she has to, after the bridge 19 in the line component insertion step, are returned to the brazing process line for the brazing component mounting step and the reflow step to solder components and melt soldering the brazing paste 11 apply.

Thus, the connection method using the support bridge 19 the problem that productivity is reduced due to the complicated manufacturing process.

Furthermore, in the connection method using the support bridge 19 the solder paste 11 be scattered when the bridge 19 is used because it is on the not yet melted solder paste 11 is used, and then an operation to remove it is additionally required. This further complicates the manufacturing process and reduces productivity.

US 5,073,118 A describes electrical connection components for through-contacting circuit boards. The connection components are gold plated and have a stem and a perpendicular thereto arranged rectangular shaped head, which merges in the middle or at its outer end in the stem. Further, to the publications DE 196 02 832 A1 and DE 196 25 934 C1 which describe electrical conductors for the conductive connection of printed conductors on the top and bottom of a printed circuit board.

It is an object of the present invention to provide a double-sided pattern connection component, a printed circuit board, and a method of electrically connecting patterns of a circuit board, which method is relatively simple and the component and the circuit board provide high reliability. The above-mentioned problems are solved by the double-side pattern connector according to claim 1, the double-sided printed circuit board according to claim 3 and the manufacturing method according to claim 5. Preferred developments are given in the respective subclaims.

According to one aspect of the invention, a double-sided pattern connection component for forming a conductive connection between connection patterns formed on both sides of a printed circuit board substrate, wherein the disk substrate has at least one through-hole, has a wiring section to be inserted into the through-hole. Further, a double-sided pattern connecting component according to the present invention has an upper portion having a flat plane and a connecting part disposed perpendicular to the conduit section, the flat plane having on its upper side a suction surface capable of being suction-held by a surface-mounting element mounting device become. In this case, the connecting part is formed by bending one end of the flat plane on its underside and the line section by bending only one of the connecting part opposite end of the flat plane perpendicular thereto. The line section and the upper section are integrally formed and form an approximately L-shaped cross-section.

Preferably, in another aspect, the double-sided pattern connection component is formed by bending a sheet.

According to another aspect of the invention, a printed circuit board comprises: a disk substrate having interconnection patterns formed on both sides; and a double-side pattern connection component according to claim 1, which is inserted into a through hole formed in the disk substrate to make electrical conduction between the connection patterns formed on both sides, and the double-side pattern connection component comprises: an upper portion having a flat plane which on its upper side has a suction surface capable of being held by sucking an outer fixing component attaching device and a connecting part defined on the lower side of the flat plane and connected by solder with the connection pattern on one side of the plate substrate is; and a lead portion that projects downwardly from the upper portion and is inserted into the through hole with its end connected to the connection pattern formed on the other side of the disc substrate by solder.

Preferably, according to another aspect of the printed circuit board, the line section includes a plurality of conductors arranged in parallel, with solder between the plurality of conductors.

In order to achieve the above object, another aspect of the present invention relates to a method of manufacturing a printed circuit board in which interconnection patterns formed on both sides are conductively connected to each other. According to the invention, the method comprises the steps of: forming a disk substrate having a first land formed on one side thereof, a second land formed on the other side and a through hole leading from one side to the other side; A double-sided pattern connecting component according to claim 1, having a flat-top upper portion having on its upper side a suction surface capable of being held by suction from an outer-fixing-component attaching device, and a connecting portion mounted on said outer surface Defined lower side of the flat plane and is able to be connected to the connection pattern, and with a A conduit portion projecting downwardly from the upper portion; Holding the suction surface by suction by the outer-fixing-component attaching device, and inserting the lead portion of the double-side-pattern connecting component into the through-hole formed in the plate substrate; and soldering both sides of the disk substrate in which the double-side pattern connecting component is arranged to connect the first land and the connecting portion of the double-side pattern connecting component, and the second land and the pipe portion.

Preferably, in another aspect, in the printed circuit board manufacturing method, the double-side pattern connecting component is formed by bending a sheet-like material.

According to the double-side pattern joining component according to any one of the described aspects, it has an upper portion with a flat plane having on its upper side a suction surface capable of being held by suction from an outer fixing component attaching device, and a connecting part, which is defined on the lower side of the flat plane and is capable of being connected to a connection pattern, and a line section projecting downwardly from the upper section. This double-sided pattern connection component does not degrade productivity when making a conductive connection between two sides.

According to the double-side pattern connection component according to another aspect, it is formed by bending a sheet-like material. The double-sided pattern connection component can be manufactured at a low cost and provides high reliability.

According to the printed circuit board according to another aspect, a double-side pattern connection component inserted into a through hole formed in the disk substrate to make conductive connection between the connection patterns on both sides comprises a top portion having a flat plane at its upper side a suction surface capable of being held by suction by means of an external fixing component attaching device, and having a connecting part defined on the lower side of the flat plane and connected by solder to the connection pattern on one side of the plate substrate, and one A lead portion projecting downwardly from the upper portion and into which the through-hole is inserted, with its end connected with solder to the connection pattern formed on one of the disc substrate. This printed circuit board can be manufactured at low cost and has high reliability.

As stated above, according to the printed circuit board manufacturing method according to another aspect, a double-side pattern connecting component has an upper portion with a flat plane having on its upper side a suction surface capable of being suction-molded by means of an external fastening component. An attachment device to be held, as well as a connection part, which is defined on the lower side of the flat plane and is able to be connected to a connection pattern, and a line portion which projects from the upper portion down on. The double-side pattern connection component is held by suction from an outer-attachment-component attachment device, and the lead portion of the double-side-pattern connection component is inserted into a through hole formed in the plate substrate. Then, the two sides of the disk substrate thus connected to the double-side pattern connecting component are soldered. As a result, a conductive connection between the two sides of the printed circuit board is made without the process steps are complicated and without therefore the productivity is reduced.

According to the printed circuit board manufacturing method according to another aspect, a component formed by bending a sheet is used as a double-sided pattern connecting component. Thus, a low-cost component can be used to make a conductive connection between sides of the printed circuit board at a low cost.

The present invention has been made in order to solve the above-described problems, and it is the object of the present invention to provide a printed circuit board manufacturing method in which a conductive connection between connecting patterns formed on both sides of the printed circuit board is obtained Packing density at low cost and with great reliability without reducing productivity to realize.

The invention will be explained in more detail below with reference to examples shown in the figures. Show it:

1 a perspective view of the double-sided pattern connection component according to a first example, which is necessary and helpful for the understanding of the invention,

2 a perspective view of the connection component, wherein this is held by negative pressure to be mounted on the substrate of a printed circuit board,

3 FIG. 4 is a sectional view of the disk substrate and the solder-attached connection component according to the first example; FIG.

4 a diagram illustrating the process steps in the production of the printed circuit board with connection patterns on both sides, which are conductively connected to each other by using the connection component,

5 a perspective view of a double-sided pattern connection component according to the second example of the invention,

6 the vacuum-retained connection component according to the second example when mounted on the substrate of the printed circuit board,

7 a sectional view of the disc substrate and attached thereto with solder connection component according to the second example, and

8th to 11 Sectional views of printed circuit boards whose two sides are conductively connected together by conventional methods.

Only example 2 describes a double-sided pattern connection component according to the invention, while example 1 provides background information which is necessary and helpful for the understanding of the invention.

First example

A first example will now be described with reference to FIGS 1 to 4 described. In the drawings, the same or corresponding parts are indicated by the same reference numerals.

1 FIG. 12 is a perspective view illustrating a double-sided pattern connection component. FIG 10a after the first example shows;

2 is a perspective view showing the connection component 10a to 1 in the state in which it is held by negative pressure to enter the disc substrate 1 the printed circuit to be used; and 3 FIG. 10 is a sectional view showing the obtained printed circuit board PB after the connection component. FIG 10a by soldering on the plate substrate 1 was attached.

As in 1 is shown contains the connection component 10a an upper portion F of superimposed plates formed by bending a sheet, and a pipe portion 13 which has been formed by bending the narrower parts integrally arranged at both ends of the sheet and extending downward from the upper portion F so that the entire structure is approximately T-shaped in cross section.

In this structure, the upper portion F has a flat plane 12 with a suction surface 12s on its upper side, which is capable of being held by suction from an external fixing component attaching device, and connecting parts 14 at the bottom of the flat plane 12 are defined and capable of using the web 5 ( 3 ) located on one side (side B) of the disk substrate 1 is formed to be connected. The pipe section 13 becomes a through hole 8th from any number of in the disk substrate 1 formed through holes from one side (the side A) and protrudes on the other side (the side B) of the disk substrate 1 out.

For these purposes, the suction surface 12s the flat plane substantially flat without any irregularities and through holes, and the line section 13 has a length greater than the thickness of the disk substrate 1 and sufficient to form a good solder fillet.

Accordingly, as in 2 is shown, the connection component 10a by suction on its flat plane 12 through a vacuum holding nozzle 31 of the external fastening component attaching device, and therefore, the connecting component 10a on the disk substrate 1 in the outer-fixing-component attaching step in the outer-fixing line.

The pipe section 13 after the first example will consist of two printed circuit boards 13a and 13b formed, which are arranged at a small distance from each other and two connecting parts 14 are symmetrical on the back of the flat plane 12 intended.

As in 3 which shows the disk substrate 1 and the connection component 10a shows are the connecting parts 14 with the jetty 4 on the side A of the disk substrate 1 by means of the solder paste 11 connected, and the ends of the line section 13 are with the jetty 5 that's around the through hole 8th around on the side B is formed by means of the solder 2 connected, so that the patterns are thereby electrically connected on both sides.

The connection component 10a can be obtained at a relatively low cost by processing a metal sheet realized as a bent structure in which bends between the flat plane and the connecting parts 14 and between the connecting parts 14 and the line section 13 are performed. Accordingly, even if the material 1a of the disk substrate 1 as temperature changes, it shrinks or expands, absorbs the stresses in the bends, and therefore, there are no cracks in the soldered parts between the lands 4 and the connecting parts 14 as well as between the bridge 5 and the line section 13 , This prevents interruption due to temperature changes, and therefore the reliability is increased.

As stated above, the line section becomes 13 the connection component 10a from two printed circuit boards 13a and 13b formed, which are arranged close to each other. This causes a capillary phenomenon when the line section 13 is soldered, and therefore the solder occurs 2 between the two circuit boards 13a and 13b and climbs up between them. then the solder increases 2 the volume in the through hole 8th that with the line section 13 is integrated, allowing a higher current value. Accordingly, the small distance between the two circuit boards 13a and 13b be adjusted so that an adequate capillary action for the solder 2 occurs.

Next, the process for attaching the connection component 10a on the disk substrate 1 described to establish a conductive connection between the pattern on the two sides. 4 1) is a diagram showing the process steps of manufacturing the printed circuit board PB in which the connection patterns formed on both sides thereof by using the connection component 10a be connected together in a conductive state.

First, before the process, the disk substrate 1 as in 3 shown, which is the web formed on one side (side A) 4 (first bridge), the bridge formed on the other side (side B) 5 (second land) and the through hole extending from one surface to the other 8th having. Also prepared are the connection component 10a for making a conductive connection between the double-sided patterns, other fastening components, etc.

Then, in the solder paste printing step S1, the solder paste becomes 11 on the side A of the disc substrate 1 formed footbridge 4 imprinted with a given solder paste printing device.

Next, in the exterior fixing component attaching step S2, the vacuum holding nozzle stops 31 the outer-fixing-component attaching device the suction surface 12S the connection component 10a by suction and leads the line section 13 in the through hole 8th one. Then she pushes the connecting parts 14 down on the solder paste 11 on the jetty 4 printed on page A to the connection component 10a on the disk substrate 1 to fix. because the connection component 10a is fixed by the external fixing component attaching device, the not yet molten solder paste 11 not scattered. Other external fastening components are also attached in this step.

Then, in the soldering step S3, the disc substrate becomes 1 the printed circuit with the connection component attached thereto 10a moved to a soldering to the solder paste 11 to melt, so that the connecting parts 14 the connection component 10a and the jetty 4 be soldered together on the side A.

Next, insert fixing components are inserted into other through holes in the insert fixing component inserting step S4, and then the manufacturing process moves to the wave soldering step S5 in which the projecting line portion 13 the connection component 10a and the jetty 5 on the side B at the same time as the insert fixing components are soldered together with a wave soldering device. At this time, the solder increases due to the above-described capillary phenomenon 2 plates between the above two conductors 13a and 13b the connection component 10a up to the side A back.

In this way, the two sides of the disk substrate 1 in a conductive state, and a printed circuit board PB was fabricated. Unlike the conventional method, this method does not require the step of moving to the ladder component insertion step using a support bridge inserter or the like prior to the soldering step S3, thereby improving the productivity. That is, the use of the connection component described in this example 10a enables the realization of the double-sided conductive connection in the series of external fastening line steps, whereby the productivity is improved without complicating the process.

While the line section 13 the connection component 10a may have three or more printed circuit boards to cause the Kapillarerscheinung for the solder, the Two-plate structure prefers taking into account the parts costs according to structural and processing aspects. Even if the line section 13 is not limited to the plate-like structure, the structure of the facing plates is preferable to effectively cause the capillary phenomenon of the solder.

As described above, the connection component becomes 10a formed from the flat plane 12 in its upper portion F with the suction surface 12S , which is capable of being held by suction by means of an external fixing component attaching device, and the conductor portion 13 , which is in a in the disk substrate 1 trained through hole 8th of which one side (side A) is inserted and protrudes on the other side (the side S), and the connecting parts 14 , which with the on one side (side A) of the disk substrate 1 the printed circuit formed web are connected. This structure enables a cost reduction and a high reliability, and allows the component to be fixed in the series of outer attachment line steps, and therefore, those on both sides of the disk substrate 1 formed connection patterns are connected in a conductive state without lowering the productivity.

The pipe section 13 the connection component 10a has several printed circuit boards 13a and 13b which are arranged close to each other. This structure causes a capillary phenomenon to allow soldering with a larger amount of solder, and the allowable current can be increased. This relaxes the restriction on the through-hole 8th flowing current, whereby a general application to all circuits is possible.

In the series of outer fastening line steps, the connection component becomes 10a in the exterior fixing component attaching step 2 by an external mounting component mounting device on the disk substrate 1 the printed circuit disposed and the two sides of the disk substrate 1 on which the connection component 10a are soldered in the Auflötschritt S3 and the wave soldering step S5 soldered. Thus, the connecting parts 14 of the connecting part 10a with the on one side (side A) of the disk substrate 1 formed footbridge 4 connected, and the line section is with the bridge 5 connected to the through hole 8th around on the other side (side B) of the disk substrate 1 is formed, and the printed circuit board PB, whose connection patterns are conductively connected to each other on both sides, can be produced by these simple process steps. This method allows cost reduction and improves reliability without reducing productivity.

Furthermore, this connection component 10a can be mass-produced at a low cost since it can be obtained by performing only a sheet-metal working operation of folding or bending a sheet formed by punching. That is, while the T-shaped connection component having a flat upper surface can be formed as a structure obtained by assembling plate pieces corresponding to the flat plane 12 , the connecting parts 14 and the circuit boards 13a and 13b is obtained, the connection component can be fabricated as described in the first example to reduce the manufacturing cost of a large number of components used for the production of the printed circuit board.

Furthermore, the formation of the entire structure in symmetrical form with respect to the pipe section eliminates 13 as in the first example, the need to pay attention to the lateral orientation of the components when mounting them.

Second example

Next, a second example as an example according to the invention will be described with reference to FIGS 5 to 7 described. In the figures, the same or corresponding parts shown in the first example are indicated by the same reference numerals.

5 Fig. 13 is a perspective view of a double-sided pattern connection component 10b according to the second embodiment of the present invention; 6 is a perspective view in which the connection component 10b is held by negative pressure while on the disc substrate 1 the printed circuit is applied; and 7 is a sectional view of the disc substrate 1 on the the connection component 10b fixed by soldering.

The connection component 10b includes a layered upper portion F formed by bending one end of a sheet and a pipe portion 13 formed by bending the integrally formed narrower part at the other end of the sheet and projecting downwardly from the upper portion F. The entire structure is approximately L-shaped in cross-section (inversely L-shaped from the direction of 5 to 7 considered).

Similar to the first example, the upper portion F has a flat plane 12 , which on its upper side a suction surface 12s which is capable of being held by suction by means of an external fixing component attaching device and a connecting part 14 standing on the lower side of the flat plane 12 is defined and capable of being on one side (side A) of the disk substrate 1 formed footbridge 5 to be connected. However, the connecting part is 14 formed only on one side of the upper portion F, and the conductor portion 13 is from the other side of the upper section F from.

With regard to the other features, this structure is the same as that shown in the first example. That is, the suction surface 12s on the flat level 12 is essentially flat without any irregularities and through holes, and the line section 13 becomes a through hole 8th from any number of in the disk substrate 1 formed through holes from one side (side A) and protrudes on the other side (side B) of the disk substrate 1 out.

Accordingly, as in 6 is shown, the connection component 10b also by suction on their flat plane 12 by means of a vacuum holding nozzle 31 an external fixing component attaching device, and therefore, the connection component 10b in the outer-attachment-component attaching step in the outer-attachment line to the disc substrate 1 be applied.

As in 7 are shown by means of the disk substrate 1 and the connection component 10b as in the first example, the double-sided patterns are electrically connected to each other, the connecting part 14 through the solder paste 11 with the jetty 4 on the side A of the disk substrate 1 and the end of the line section 13 through the solder 2 with the jetty 5 on the side B are connected.

As explained above, the connection component is different 10b according to the second embodiment of the connection component 10a by the following two features: the line section 13 is from a single circuit board 13c formed, and the connecting part 14 is on the back of the flat plane 12 only on one side with respect to the position of the pipe section 13 educated.

Accordingly, the connection component 10b not the capillary phenomenon for the solder as well as the connection component 10a effect, and therefore gives a reduced effect in increasing the volume of the line section 13 through solder. However, the connection component has 10b only two bends while the connection component 10a has four bends, and this simple shape can reduce the manufacturing cost of the connection component 10b even with regard to the manufacture of parts.

Although the connection component 10b only has two bends, the stresses that can be generated when the material 1a of the disk substrate 1 shrinks or expands as the temperature changes, being absorbed in the two bends so that there are no cracks in the brazed parts between the web 4 and the connecting part 14 and between the jetty 5 and the line section 13 occur. Therefore, also the connection component 10b prevent an interruption due to temperature fluctuations, so that the reliability is increased.

The connection component 10b can through the same process steps as those in 4 shown and described in connection with the first example on the disk substrate 1 be attached to establish the electrical conduction between the connection patterns on the two sides. The connection component 10b can thus also the two sides of the disk substrate 1 connect in a conductive state. Unlike the conventional method, this method can improve productivity because it does not require the step of moving to the lead component insertion step using a support bridge inserter or the like prior to the soldering step S3.

As described above, the connection component has 10b like the connection component 10a the flat plane 12 , which can be held by suction by means of an external fastening component attachment device, the line section 13 , which is in a in the disk substrate 1 trained through hole 8th from the one side (side A) to the other side (side B) of the disk substrate 1 stand out, and the connecting part 14 , which is connected to the on one side (side A). This structure enables a cost reduction and improves reliability, and the component can be mounted in the series of exterior fastening line steps. It can thus provide a conductive connection between the on the two sides of the disk substrate 1 formed compound patterns without reducing the productivity.

Furthermore, the line section 13 the connection component 10b formed from a single conductor, and this simple shape further reduces the manufacturing cost.

Also, in this second example in the series of in 4 shown Außenbefestlinienlinienschritte the connection component 10b in the exterior fixing component applying step S2 to the disc substrate by an exterior fixing component applying device 1 applied, and both sides of the disk substrate 1 to which the connection component 10b is applied, soldered in the Auflötschritt S3 and the surge soldering step S5. Thus, the connecting part becomes 14 the connection component 10b with the one side (side A) of the disk substrate 1 formed footbridge 4 connected, and the line section 13 will be with the jetty 5 connected to the through hole 8th on the other side (side B) of the disk substrate 1 is formed around; and the printed circuit board whose double-sided connection patterns are conductively connected to each other can be manufactured by these simple process steps. This method therefore enables a cost reduction and improves reliability without reducing productivity.

Furthermore, this connection component 10b like that in the first example, it is advantageous in that it can be mass-produced at a low cost because it can be obtained by performing only a sheet processing operation of folding or bending on a punched sheet.

Claims (6)

Double-sided pattern connection component ( 10b ) for establishing a conductive connection between interconnection patterns which are provided on both sides of a board substrate ( 1 ) of a printed circuit (PB) are formed, wherein the disk substrate ( 1 ) at least one through hole ( 8th ), characterized in that the double-sided pattern connection component ( 10b ): one in the through hole ( 8th ) line section ( 13 ), and one perpendicular to the line section ( 13 ) arranged upper portion (F) with a flat plane ( 12 ) and a connecting part ( 14 ), where the flat plane ( 12 ) on its upper side a suction surface ( 12s ) which is capable of being held by suction by a surface-mount element attachment device, the connection part 14 ) by bending one end of the flat plane ( 12 ) is formed on the underside thereof and the line section ( 13 ) by bending only one of the connecting part ( 14 ) opposite end of the flat plane ( 12 ) is formed perpendicular to this, wherein the line section ( 13 ) and the upper portion (F) are integrally formed and form an approximately L-shaped cross-section. Double-sided pattern connecting component according to claim 1, characterized in that this is formed by bending a sheet. Printed circuit board (PB) with a disk substrate ( 1 ), which on its two sides connecting pattern and at least one through hole ( 8th ), wherein the connection patterns formed on both sides with a double-sided pattern connection component ( 10b ) are electrically connected, characterized in that the double-sided pattern connection component ( 10b ): one in the through hole ( 8th ) ( 13 ), and one perpendicular to the line section ( 13 ) arranged upper portion (F) with a flat plane ( 12 ) and a connecting part ( 14 ), where the flat plane ( 12 ) on its upper side a suction surface ( 12s ) which is capable of being held by suction by the surface-mounting-member attachment device, the connection part (14) 14 ) by bending one end of the flat plane ( 12 ) is formed on the underside thereof and the line section ( 13 ) by bending only the connecting part ( 14 ) opposite end of the flat plane ( 12 ) is formed perpendicular to this, wherein the line section ( 13 ) and the upper portion (F) are integrally formed and form an approximately L-shaped cross section, wherein the connecting part ( 14 ) by means of solder ( 11 ) with a bridge ( 4 ) of the connection pattern on one side of the disk substrate ( 1 ) and the line section ( 13 ) at its end by solder ( 2 ) with a bridge ( 5 ) on the other side of the disc substrate ( 1 ) formed connecting pattern, wherein only the web ( 5 ) around the through hole ( 8th ) is formed around. A printed circuit board according to claim 3, characterized in that the double-sided pattern connection component ( 10b ) is formed by bending a sheet. Method for electrically connecting on both sides of a disk substrate ( 1 ) of a printed circuit board (PB) via at least one through hole ( 8th ), wherein the disk substrate ( 1 ) on its one side a first bridge ( 4 ) and on its other side a second bridge ( 5 ), wherein only the second bridge ( 5 ) around the through hole ( 8th ) with a double-sided pattern connection component ( 10b ) according to claim 1 or 2, wherein the double-sided pattern connecting component ( 10b ) on the suction surface ( 12s ) is received by means of a surface mount element mounting device and connected to the Line section ( 13 ) in the at least one through hole ( 8th ) in the disk substrate ( 1 ), and wherein the connecting part ( 14 ) by solder ( 11 ) with the first bridge ( 4 ) and the end of the line section ( 13 ) by solder ( 2 ) with the second bridge ( 5 ) get connected. Method according to claim 5, characterized in that the double-sided pattern connection component ( 10b ) is formed by bending a sheet.

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