JP2015082538A - Printed circuit board, electronic apparatus including the same, and manufacturing method of the same - Google Patents

Printed circuit board, electronic apparatus including the same, and manufacturing method of the same Download PDF

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Publication number
JP2015082538A
JP2015082538A JP2013218826A JP2013218826A JP2015082538A JP 2015082538 A JP2015082538 A JP 2015082538A JP 2013218826 A JP2013218826 A JP 2013218826A JP 2013218826 A JP2013218826 A JP 2013218826A JP 2015082538 A JP2015082538 A JP 2015082538A
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Japan
Prior art keywords
sheet metal
metal member
fixing portion
circuit board
substrate
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Abandoned
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JP2013218826A
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Japanese (ja)
Inventor
将史 鎌田
Masashi Kamata
将史 鎌田
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Sumitomo Wiring Systems Ltd
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Sumitomo Wiring Systems Ltd
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Priority to JP2013218826A priority Critical patent/JP2015082538A/en
Priority to PCT/JP2014/076282 priority patent/WO2015060085A1/en
Publication of JP2015082538A publication Critical patent/JP2015082538A/en
Abandoned legal-status Critical Current

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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q23/00—Antennas with active circuits or circuit elements integrated within them or attached to them
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00—Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30—Arrangements for providing operation on different wavebands
    • H01Q5/307—Individual or coupled radiating elements, each element being fed in an unspecified way
    • H01Q5/342—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes
    • H01Q5/35—Individual or coupled radiating elements, each element being fed in an unspecified way for different propagation modes using two or more simultaneously fed points
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01Q—ANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00—Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04—Resonant antennas
    • H01Q9/0407—Substantially flat resonant element parallel to ground plane, e.g. patch antenna
    • H01Q9/0421—Substantially flat resonant element parallel to ground plane, e.g. patch antenna with a shorting wall or a shorting pin at one end of the element
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/0026—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units
    • H05K5/0039—Casings, cabinets or drawers for electric apparatus provided with connectors and printed circuit boards [PCB], e.g. automotive electronic control units having a tubular housing wherein the PCB is inserted longitudinally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10098—Components for radio transmission, e.g. radio frequency identification [RFID] tag, printed or non-printed antennas
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10659—Different types of terminals for the same component, e.g. solder balls combined with leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10856—Divided leads, e.g. by slot in length direction of lead, or by branching of the lead
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/1075—Shape details
    • H05K2201/10871—Leads having an integral insert stop
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1178—Means for venting or for letting gases escape
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Support Of Aerials (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a printed circuit board having a new structure that enables a mounting machine to mount a sheet metal member more securely and easily, and to provide an electronic apparatus including the printed circuit board and a new manufacturing method of the printed circuit board.SOLUTION: Lead fixing parts 22a, 22b, which are inserted into through holes 38a, 38b of a substrate 12 to be soldered, and a surface fixing part 32 having a plate-like part 34, which is overlapped with a surface 42 of the substrate 12 to be soldered thereto, are provided in a sheet metal member 14 erected on the substrate 12. Further, the lead fixing parts 22a, 22b are provided in positions close to a holding part 30 held by a mounting machine 46 and the surface fixing part 32 is provided at a position far from the holding part 30.

Description

本発明は、板金部材が立設されたプリント基板およびその製造方法に係り、特に、板金部材の半田付け部が基板の貫通孔に挿通されて半田付けされているプリント基板と、かかるプリント基板を備えた電子機器、並びにプリント基板の製造方法に関するものである。   The present invention relates to a printed circuit board on which a sheet metal member is erected and a method for manufacturing the same, and in particular, a printed circuit board in which a soldered portion of a sheet metal member is inserted into a through hole of the substrate and soldered, and the printed circuit board The present invention relates to an electronic device provided and a method for manufacturing a printed circuit board.

従来から、金属板からなる板金部材が立設されたプリント基板が知られている。例えば、特開２０１３−９０１９２号公報（特許文献１）や特開２０１０−６２２４９号公報（特許文献２）に記載のものがそれである。特許文献１に記載のプリント基板は、板金部材として、自動車のドアの施錠や開錠を無線で行なうワイヤレスキーシステムの電波を受信するためのアンテナが立設されたものである。特許文献２に記載のプリント基板は、板金部材として、導電路を構成するバスバーが立設されたものである。   Conventionally, a printed circuit board in which a sheet metal member made of a metal plate is erected is known. For example, those described in Japanese Patent Application Laid-Open No. 2013-90192 (Patent Document 1) and Japanese Patent Application Laid-Open No. 2010-62249 (Patent Document 2). The printed circuit board described in Patent Document 1 has an antenna for receiving a radio wave of a wireless key system that wirelessly locks and unlocks a door of an automobile as a sheet metal member. In the printed circuit board described in Patent Document 2, a bus bar that constitutes a conductive path is erected as a sheet metal member.

ところで、これらアンテナやバスバー等の板金部材は、基板に貫設された貫通孔に半田付け部が挿通されて半田付けされることで基板に立設されている。従来、板金部材の半田付け部の貫通孔への挿通は、人手で行われていたが、近年では、実装機を用いた機械化実装が広く普及しつつある。   By the way, the sheet metal members such as the antenna and the bus bar are erected on the substrate by inserting a soldering portion into a through hole penetrating the substrate and soldering. Conventionally, insertion of the soldering portion of the sheet metal member into the through hole has been manually performed, but in recent years, mechanized mounting using a mounting machine has been widely spread.

ところが、例えば板金部材が長尺で、半田付け部が、実装機で把持する把持部から離れている場合には、板金部材の寸法精度や、板金部材が撓んで把持部から離れた部位が振れること等により、把持部から離れた半田付け部が基板の貫通孔から位置ずれするおそれがあり、実装機では対応できないという新たな問題を生じていた。   However, for example, when the sheet metal member is long and the soldering part is separated from the gripping part to be gripped by the mounting machine, the dimensional accuracy of the sheet metal member or the part away from the gripping part due to the bending of the sheet metal member is shaken. For this reason, there is a possibility that the soldering part away from the gripping part may be displaced from the through hole of the substrate, which causes a new problem that the mounting machine cannot cope with it.

特開２０１３−９０１９２号公報JP 2013-90192 A 特開２０１０−６２２４９号公報JP 2010-62249 A

本発明は、上述の事情を背景に為されたものであって、その解決課題は、板金部材を実装機でより容易かつ確実に実装することのできる、新規な構造のプリント基板を提供すること、およびかかるプリント基板を備えた電子機器を提供すること、並びにそのようなプリント基板の新規な製造方法を提供することにある。   The present invention has been made in the background of the above-mentioned circumstances, and its solution is to provide a printed circuit board having a novel structure capable of mounting a sheet metal member more easily and reliably by a mounting machine. It is another object of the present invention to provide an electronic apparatus including such a printed circuit board and to provide a novel method for manufacturing such a printed circuit board.

プリント基板に関する本発明の第一の態様は、金属板からなる板金部材を備え、該板金部材のリード固定部が基板の貫通孔に挿通されて半田付けされることにより、前記板金部材が前記基板上に立設されているプリント基板において、前記板金部材には、少なくとも１つの前記リード固定部と、前記基板の表面に重ね合わされて半田付けされる平板状部を有する少なくとも１つの表面固定部とが設けられており、前記板金部材において実装機に把持される把持部の近位に前記リード固定部が設けられている一方、前記把持部の遠位に前記表面固定部が設けられていることを、特徴とする。   A first aspect of the present invention relating to a printed circuit board includes a sheet metal member made of a metal plate, and a lead fixing portion of the sheet metal member is inserted into a through-hole of the substrate and soldered, so that the sheet metal member is the substrate. In the printed circuit board erected above, the sheet metal member includes at least one lead fixing portion and at least one surface fixing portion having a flat plate portion that is superposed on the surface of the substrate and soldered. In the sheet metal member, the lead fixing part is provided in the vicinity of the grip part gripped by the mounting machine, and the surface fixing part is provided in the distal part of the grip part. Is a feature.

本発明に従う構造とされたプリント基板においては、基板上に立設された板金部材に、基板の貫通孔に挿通されて半田付けされるリード固定部と、基板表面に重ね合わされて半田付けされる表面固定部とが設けられている。表面固定部は、リード固定部のように基板の貫通孔に挿通する必要がないことから、高精度な位置決めが必要とされることがなく、多少の位置ずれが許容される。このような表面固定部が、板金部材において実装機で把持される把持部から離れた位置に設けられている。これにより、板金部材において、把持部に近く、位置精度が得られ易い部位はリード固定部によって、基板の貫通孔に挿通して半田付けしつつ、把持部から遠く、板金部材の寸法精度や撓み等によって位置精度が得られ難い部位は、表面固定部によって、多少の位置ずれを生じても、基板に半田付けすることができる。その結果、実装機でも、板金部材を容易且つ確実に実装することができる。   In the printed circuit board having the structure according to the present invention, a lead fixing portion inserted into a through hole of the substrate and soldered to a sheet metal member standing on the substrate and superposed on the surface of the substrate and soldered. A surface fixing portion is provided. Since the surface fixing portion does not need to be inserted into the through hole of the substrate unlike the lead fixing portion, high-precision positioning is not required, and a slight positional deviation is allowed. Such a surface fixing portion is provided at a position away from the grip portion gripped by the mounting machine on the sheet metal member. As a result, a portion of the sheet metal member that is close to the gripping portion and easily obtains positional accuracy is inserted into the through-hole of the substrate and soldered by the lead fixing portion, while being distant from the gripping portion, the dimensional accuracy and bending of the sheet metal member. For example, a portion where positional accuracy is difficult to obtain can be soldered to the substrate even if a slight positional deviation occurs due to the surface fixing portion. As a result, the sheet metal member can be easily and reliably mounted even with the mounting machine.

しかも、板金部材には、基板への半田付け部として、基板の貫通孔に挿通されて固定されるリード固定部と、基板の表面に重ね合わされて固定される表面固定部の２種類が設けられている。これにより、実装機による把持部から近く、位置精度が確保され得る場所は、リード固定部としてリード部を基板の貫通孔に挿通して半田付けすることで、基板への固定強度を確保することができる。   In addition, the sheet metal member is provided with two types of solder fixing portions to the substrate: a lead fixing portion that is inserted and fixed through the through hole of the substrate, and a surface fixing portion that is superimposed and fixed on the surface of the substrate. ing. As a result, the place where the position accuracy can be secured is close to the gripping part by the mounting machine, and the lead fixing part is inserted into the through hole of the board and soldered as the lead fixing part, thereby securing the fixing strength to the board. Can do.

なお、板金部材は、金属板から形成されて基板に立設されるものを広く含むものであり、例えば電波受信用のアンテナや、導電路として用いられるバスバー等を含む。また、板金部材の具体的な形状は、板金部材に要求される機能や基板上での配設スペース等に応じて、適宜に設定され得る。   The sheet metal member widely includes those formed from a metal plate and standing on the substrate, and includes, for example, an antenna for receiving a radio wave, a bus bar used as a conductive path, and the like. Further, the specific shape of the sheet metal member can be appropriately set according to the function required for the sheet metal member, the arrangement space on the substrate, and the like.

プリント基板に関する本発明の第二の態様は、前記第一の態様に記載のものにおいて、前記板金部材の前記リード固定部において、前記貫通孔に挿通されるリード部の両側には、該リード部の突出方向に開口する凹所が形成されているものである。   A second aspect of the present invention relating to a printed circuit board is the one described in the first aspect, wherein in the lead fixing part of the sheet metal member, the lead part is provided on both sides of the lead part inserted through the through hole. A recess opening in the protruding direction is formed.

本態様によれば、リード部を伝って基板の表面に上がってきたり、予め半田ペーストとして基板表面上に塗布された半田を、リード部両側の凹所に収容することができる。これにより、半田が飛散して、周囲の電気部品や回路に悪影響を与えることを防止することができる。   According to this aspect, it is possible to accommodate the solder that has been transferred to the surface of the substrate through the lead portion or previously applied as a solder paste on the surface of the substrate in the recesses on both sides of the lead portion. As a result, it is possible to prevent the solder from scattering and adversely affecting the surrounding electrical components and circuits.

プリント基板に関する本発明の第三の態様は、前記第一又は第二の態様に記載のものにおいて、前記板金部材には屈曲部が設けられており、前記板金部材において、前記把持部から前記屈曲部を経由した位置に前記表面固定部が設けられているものである。   According to a third aspect of the present invention relating to a printed circuit board, in the first or second aspect, the sheet metal member is provided with a bent portion, and the bent portion is provided from the grip portion in the sheet metal member. The surface fixing part is provided at a position via the part.

本態様においては、板金部材において、把持部と表面固定部の間に、屈曲部が存している。金属板から形成された板金部材において屈曲部が存すると、寸法精度が低下するおそれや、屈曲部から先が撓み易くなって、屈曲部の先の位置精度を確保することが困難となり易い。そこで、位置精度が確保し難い屈曲部の先を表面固定部とすることによって、位置ずれを生じた場合でも基板に固定することができる。   In this aspect, in the sheet metal member, a bent portion exists between the gripping portion and the surface fixing portion. If a bent portion is present in a sheet metal member formed of a metal plate, the dimensional accuracy may be lowered, and the tip of the bent portion is likely to be bent, and it is difficult to ensure the positional accuracy of the tip of the bent portion. Therefore, by setting the tip of the bent portion where the positional accuracy is difficult to be secured as the surface fixing portion, it is possible to fix to the substrate even when a positional deviation occurs.

プリント基板に関する本発明の第四の態様は、前記第三の態様に記載のものにおいて、前記板金部材が、前記屈曲部において直角に屈曲されたＬ字形状とされており、該Ｌ字形状の一方の辺部に前記把持部と前記リード固定部が設けられている一方、前記Ｌ字形状の他方の辺部における前記屈曲部と反対側の端部に、前記表面固定部が設けられているものである。   According to a fourth aspect of the present invention relating to a printed circuit board, in the one according to the third aspect, the sheet metal member is L-shaped bent at a right angle at the bent portion, and the L-shaped The grip portion and the lead fixing portion are provided on one side portion, and the surface fixing portion is provided on an end portion opposite to the bent portion in the other L-shaped side portion. Is.

本態様においては、板金部材がＬ字形状とされている。これにより、例えば板金部材が電波受信用のアンテナ等である場合には、基板上の限定されたスペース内で、板金部材に必要な全体長をスペース効率良く確保することができる。そして、把持部から遠く、把持部との間で屈曲部が介在することにより、位置ずれのおそれが高くなる他方の辺部の半田付け部を表面固定部とすることによって、基板に確実に固定することができる。なお、本態様において、より好ましくは、前記他方の辺部が、前記一方の辺部よりも長さ寸法が大きくされる。このようにすれば、長さ寸法の小さな一方の辺部を実装機で把持して、同じ辺部に設けられたリード固定部を基板の貫通孔に精度良く位置決めして、安定的に挿通することができると共に、長尺で撓み易い他方の辺部の半田付け部を表面固定部とすることによって、多少の位置ずれを許容して基板に確実に固定することができる。   In this aspect, the sheet metal member is L-shaped. Thereby, for example, when the sheet metal member is an antenna for radio wave reception or the like, the entire length necessary for the sheet metal member can be efficiently secured in a limited space on the substrate. And it is fixed to the board securely by using the soldering part on the other side where the risk of misalignment is high because the bending part is interposed between the grip part and the grip part. can do. In this aspect, more preferably, the length of the other side portion is larger than that of the one side portion. In this way, one side having a small length is gripped by the mounting machine, and the lead fixing portion provided on the same side is accurately positioned in the through hole of the substrate and stably inserted. In addition, by using the soldering portion on the other side that is long and easy to bend as the surface fixing portion, it is possible to allow a slight positional deviation and securely fix it to the substrate.

プリント基板に関する本発明の第五の態様は、前記第一〜第四の何れか１つの態様に記載のものにおいて、少なくとも１つの前記リード固定部が、前記基板に設けられたプリント配線と接続されている一方、前記表面固定部は、前記プリント配線に接続されていないものである。   A fifth aspect of the present invention relating to a printed circuit board is the one described in any one of the first to fourth aspects, wherein at least one of the lead fixing portions is connected to a printed wiring provided on the substrate. On the other hand, the surface fixing portion is not connected to the printed wiring.

本態様においては、板金部材の表面固定部は基板への固定のみに用いられており、プリント配線との接続は行われないようになっている。そして、貫通孔への挿通状態で半田付けされて、固定強度が確保されるリード固定部をプリント配線との接続に用いることによって、板金部材とプリント配線との電気的接続の信頼性を確保することができる。   In this aspect, the surface fixing portion of the sheet metal member is used only for fixing to the substrate, and connection with the printed wiring is not performed. And the reliability of the electrical connection between the sheet metal member and the printed wiring is ensured by using the lead fixing portion that is soldered in the inserted state to the through hole and secures the fixing strength for the connection with the printed wiring. be able to.

プリント基板に関する本発明の第六の態様は、前記第一〜第五の何れか１つの態様に記載のものにおいて、前記板金部材には、少なくとも２つの前記リード固定部と、少なくとも１つの前記表面固定部が設けられており、これら前記リード固定部と前記表面固定部で前記板金部材が前記基板上で自立可能とされているものである。   A sixth aspect of the present invention relating to a printed circuit board is the one described in any one of the first to fifth aspects, wherein the sheet metal member includes at least two lead fixing portions and at least one surface. A fixing portion is provided, and the sheet metal member can be self-supported on the substrate by the lead fixing portion and the surface fixing portion.

本態様によれば、半田付けを行なうに際して、治具等を用いることなく、板金部材を基板上に自立させることができる。これにより、製造コストの低減を図ることができる。   According to this aspect, when performing soldering, the sheet metal member can be self-supported on the substrate without using a jig or the like. Thereby, the manufacturing cost can be reduced.

プリント基板に関する本発明の第七の態様は、前記第一〜第六の何れか１つの態様に記載のものにおいて、前記板金部材が、電波受信用のアンテナであるものである。   A seventh aspect of the present invention relating to a printed circuit board is the one described in any one of the first to sixth aspects, wherein the sheet metal member is an antenna for receiving radio waves.

電波受信用のアンテナは、長尺に形成されるものが多い。それ故、寸法精度の確保が困難になると共に、撓み変形が生じ易くなって、半田付け部の位置ずれが生じ易い。そこで、本発明を適用することによって、板金部材がアンテナで長尺である場合でも、実装機で基板に確実に実装することができる。   Many antennas for receiving radio waves are long. Therefore, it is difficult to ensure the dimensional accuracy, and the bending deformation is likely to occur, and the position of the soldering portion is likely to be displaced. Therefore, by applying the present invention, even when the sheet metal member is an antenna and is long, it can be reliably mounted on the substrate with a mounting machine.

電子機器に関する本発明の第一の態様は、前記プリント基板に関する本発明の前記第一〜第七の何れか１つの態様に記載のプリント基板と、該プリント基板を収容するケースと、を有する電子機器、を特徴とする。   According to a first aspect of the present invention relating to an electronic device, there is provided an electronic device comprising: the printed circuit board according to any one of the first to seventh aspects of the present invention related to the printed circuit board; and a case that accommodates the printed circuit board. Equipment.

電子機器に関する本発明の第二の態様は、前記第一の態様に記載の電子機器において、車輌に搭載されて使用されるものである。   According to a second aspect of the present invention relating to an electronic device, the electronic device according to the first aspect is mounted on a vehicle and used.

プリント基板の製造方法に関する本発明は、金属板からなる板金部材を備え、該板金部材のリード固定部が基板の貫通孔に挿通されて半田付けされることにより、前記板金部材が前記基板上に立設されているプリント基板の製造方法であって、少なくとも１つの前記リード固定部と、前記基板の表面に重ね合わされて半田付けされる平板状部を有する少なくとも１つの表面固定部とが設けられた前記板金部材を用い、前記板金部材における前記表面固定部よりも前記リード固定部に近位の部位を実装機で把持して、前記リード固定部を前記貫通孔に挿通して半田付けすると共に、前記表面固定部を前記基板の表面に重ね合わせて半田付けすることを、特徴とする。   The present invention relating to a method for manufacturing a printed circuit board includes a sheet metal member made of a metal plate, and the lead fixing portion of the sheet metal member is inserted into a through hole of the substrate and soldered, whereby the sheet metal member is placed on the substrate. A method of manufacturing a printed circuit board, wherein at least one lead fixing portion and at least one surface fixing portion having a plate-like portion that is superposed on the surface of the substrate and soldered are provided. The sheet metal member is used, a portion closer to the lead fixing portion than the surface fixing portion of the sheet metal member is gripped by a mounting machine, and the lead fixing portion is inserted into the through hole and soldered. The surface fixing portion is superposed on the surface of the substrate and soldered.

本発明に従う製造方法によれば、基板に立設される板金部材に、基板への半田付け部として、基板の貫通孔に挿通されて半田付けされるリード固定部と、基板の貫通孔に挿通されずに半田付けされる表面固定部が設けられている。これにより、表面固定部においては、基板に対して多少の位置ずれを生じた場合でも、半田付けを行なうことができる。そして、基板の貫通孔への位置決めが必要とされるリード固定部の近位を実装機で把持することによって、リード固定部の位置決め精度を確保すると共に、把持部から遠位となる半田付け部は表面固定部とされていることから、多少の位置ずれを生じた場合でも基板に半田付けすることができる。その結果、板金部材を実装機で確実に実装することができる。   According to the manufacturing method according to the present invention, a sheet metal member erected on a substrate is inserted into a through hole of the substrate, and a lead fixing portion that is inserted into the through hole of the substrate and soldered as a soldering portion to the substrate. A surface fixing portion to be soldered without being provided is provided. As a result, the surface fixing portion can be soldered even when a slight positional deviation occurs with respect to the substrate. Then, by holding the lead fixing part proximal to the through hole of the board with the mounting machine, the lead fixing part is positioned accurately and the soldering part distal to the holding part is secured. Since it is a surface fixing portion, it can be soldered to the substrate even if a slight positional deviation occurs. As a result, the sheet metal member can be reliably mounted by the mounting machine.

プリント基板に関する本発明によれば、基板に立設される板金部材の半田付け部として、基板の貫通孔に挿通されて半田付けされるリード固定部と、基板表面に重ね合わされて半田付けされる表面固定部とを設け、実装機で把持される把持部の近位にリード固定部を設けると共に、把持部の遠位に表面固定部を設けた。これにより、把持部に近く、位置決め精度が確保出来る部位はリード固定部で貫通孔への挿通状態で強固に固定すると共に、把持部から遠位の部位は、表面固定部で多少の位置ずれを許容しつつ基板に固定することができる。これにより、基板への固定強度を確保しつつ、実装機で板金部材をより容易且つ確実に実装することができる。   According to the present invention relating to a printed circuit board, as a soldering portion of a sheet metal member standing on the substrate, a lead fixing portion that is inserted and soldered into a through hole of the substrate and superposed on the surface of the substrate is soldered. A surface fixing part is provided, a lead fixing part is provided in the vicinity of the gripping part gripped by the mounting machine, and a surface fixing part is provided distal to the gripping part. As a result, the part that is close to the gripping part and can secure the positioning accuracy is firmly fixed by the lead fixing part while being inserted into the through hole, and the part far from the gripping part is slightly displaced by the surface fixing part. It can be fixed to the substrate while allowing. Thereby, it is possible to more easily and reliably mount the sheet metal member with the mounting machine while securing the fixing strength to the substrate.

電子機器に関する本発明によれば、本発明に基づくプリント基板を内部に収容して構成されていることから、上述の本発明のプリント基板の効果を享受する電子機器を有利に提供することができる。   According to the present invention relating to an electronic device, since the printed circuit board according to the present invention is accommodated therein, it is possible to advantageously provide an electronic device that enjoys the effects of the above-described printed circuit board of the present invention. .

また、プリント基板の製造方法に関する本発明によれば、基板に立設される板金部材として、基板の貫通孔に挿通されて半田付けされるリード固定部と、基板表面に重ね合わされて半田付けされる表面固定部とを備えた板金部材を用い、リード固定部の近位を実装機で把持して基板に実装するようにした。これにより、リード固定部を基板の貫通孔に精度良く位置決めして挿通することができると共に、板金部材において実装機の把持部から離れた部位で位置ずれを生じた場合でも、表面固定部で位置ずれを許容しつつ基板に半田付けすることができる。これにより、板金部材を、固定強度を確保しつつ実装機で実装することができる。   Further, according to the present invention relating to a method of manufacturing a printed circuit board, as a sheet metal member standing on the board, a lead fixing portion that is inserted into a through hole of the board and soldered, and superimposed and soldered on the surface of the board. A sheet metal member having a surface fixing portion is used, and the lead fixing portion is mounted on the substrate by holding the proximal portion of the lead fixing portion with a mounting machine. As a result, the lead fixing portion can be accurately positioned and inserted into the through hole of the substrate, and even if the sheet metal member is displaced at a position away from the mounting portion of the mounting machine, the lead fixing portion is positioned at the surface fixing portion. It can be soldered to the substrate while allowing the deviation. Thereby, a sheet metal member can be mounted with a mounting machine, ensuring fixed strength.

本発明の第一の実施形態としてのプリント基板とかかるプリント基板を内部に備えた電子機器を示す斜視図。1 is a perspective view showing a printed circuit board according to a first embodiment of the present invention and an electronic apparatus including the printed circuit board inside. 図１に示したプリント基板に設けられる板金部材の斜視図。The perspective view of the sheet-metal member provided in the printed circuit board shown in FIG. 図２に示した板金部材の平面図。The top view of the sheet-metal member shown in FIG. 図２に示した板金部材の正面図。The front view of the sheet-metal member shown in FIG. 本発明のプリント基板の製造方法を説明するための斜視図。The perspective view for demonstrating the manufacturing method of the printed circuit board of this invention. 図１に示したプリント基板における、板金部材のリード部の拡大断面図。The expanded sectional view of the lead part of a sheet metal member in the printed circuit board shown in FIG. 本発明の第二の実施形態としてのプリント基板に設けられる板金部材を示す斜視図。The perspective view which shows the sheet-metal member provided in the printed circuit board as 2nd embodiment of this invention.

以下、本発明の実施形態について、図面を参照しつつ説明する。   Embodiments of the present invention will be described below with reference to the drawings.

先ず、図１に、プリント基板に関する本発明の第一の実施形態としてのプリント基板１０を示す。プリント基板１０は、基板１２に、板金部材としてのアンテナ１４が設けられた構造とされている。そして、このプリント基板１０は、合成樹脂製のケース６４の内部に収容された状態で、電気接続箱や自動車のワイヤレスキーシステム用通信機等の電子機器６６として使用に供される。なお、図１では、視認性向上の目的からケース６４の外形線を仮想線で示している。また、プリント基板１０を内部に収容した電子機器６６は、図示しない自動車等の車輌に搭載されて使用される。   First, FIG. 1 shows a printed circuit board 10 as a first embodiment of the present invention relating to a printed circuit board. The printed circuit board 10 has a structure in which an antenna 14 as a sheet metal member is provided on a circuit board 12. The printed circuit board 10 is used as an electronic device 66 such as an electric connection box or a communication device for a wireless key system of an automobile while being accommodated in a case 64 made of synthetic resin. In FIG. 1, the outline of the case 64 is indicated by a virtual line for the purpose of improving visibility. The electronic device 66 that houses the printed circuit board 10 is mounted and used in a vehicle such as an automobile (not shown).

図２〜図４に、アンテナ１４を示す。アンテナ１４は、例えば自動車のワイヤレスキーシステムの電波を受信するものであり、薄肉の金属板が打ち抜き加工および曲げ加工されて形成された、一体成形品とされている。本実施形態のアンテナ１４は、直角に屈曲された屈曲部１６を有するＬ字形状とされており、一方の辺部１８と、他方の辺部２０が、互いに直交する方向で直線状に延び出されている。なお、一方の辺部１８の長さ寸法：Ｌ1 に比して、他方の辺部２０の長さ寸法：Ｌ2 の方が大きくされている。 The antenna 14 is shown in FIGS. The antenna 14 receives radio waves from a wireless key system of an automobile, for example, and is an integrally molded product formed by stamping and bending a thin metal plate. The antenna 14 of the present embodiment has an L shape having a bent portion 16 bent at a right angle, and one side portion 18 and the other side portion 20 extend linearly in directions orthogonal to each other. Has been. The length dimension of the one side portion 18: in comparison with L 1, the length of the other side portion 20: direction of L 2 is large.

一方の辺部１８には、リード固定部２２ａ，２２ｂが一体形成されている。これらリード固定部２２ａ，２２ｂは互いに同様の形状とされていることから、図中に同一の符号を付し、リード固定部２２ａを例に説明する。   One side portion 18 is integrally formed with lead fixing portions 22a and 22b. Since these lead fixing portions 22a and 22b have the same shape, the same reference numerals are given in the figure, and the lead fixing portion 22a will be described as an example.

リード固定部２２ａは、辺部１８の長さ方向（図４中、左右方向）と直交する方向に突出して形成されている。図４に拡大して示すように、リード固定部２２ａの突出先端部には、後述する基板１２のスルーホール３８ａに挿通可能な大きさの略矩形断面をもって延びるリード部２４が形成されている。リード部２４は、リード固定部２２ａの突出先端部の幅方向の中央部分から突出されている。これにより、リード固定部２２ａにおけるリード部２４の両側の先端縁部には、基板１２に当接する当接縁部２５，２５が形成されている。更に、リード固定部２２ａにおいて、リード部２４を挟む両側には、一対の凹所２６，２６が形成されている。凹所２６，２６は、リード部２４の突出方向（図４中、下方）に開口して形成されている。   The lead fixing portion 22a is formed so as to protrude in a direction orthogonal to the length direction of the side portion 18 (the left-right direction in FIG. 4). As shown in an enlarged view in FIG. 4, a lead portion 24 extending with a substantially rectangular cross section of a size that can be inserted into a through hole 38 a of the substrate 12 described later is formed at the protruding tip portion of the lead fixing portion 22 a. The lead portion 24 protrudes from the central portion in the width direction of the protruding tip portion of the lead fixing portion 22a. Thus, contact edge portions 25 and 25 that contact the substrate 12 are formed at the tip edge portions on both sides of the lead portion 24 in the lead fixing portion 22a. Further, in the lead fixing portion 22a, a pair of recesses 26 and 26 are formed on both sides of the lead portion 24. The recesses 26 are formed to open in the protruding direction of the lead portion 24 (downward in FIG. 4).

このようなリード固定部２２ａ，２２ｂは、リード固定部２２ａが、辺部１８における屈曲部１６と反対側の端縁部２８ａに形成されていると共に、リード固定部２２ｂが、辺部１８における屈曲部１６に近位の端部に形成されている。このように、リード固定部２２ａとリード固定部２２ｂは、辺部１８の長さ方向で適当な間隔を隔てて形成されており、辺部１８において、リード固定部２２ａとリード固定部２２ｂの間が、後述する実装機４６で把持される把持部３０とされている。   In such lead fixing portions 22a and 22b, the lead fixing portion 22a is formed on the end edge portion 28a on the side 18 opposite to the bent portion 16 and the lead fixing portion 22b is bent on the side portion 18. Formed at the end proximal to section 16. In this way, the lead fixing portion 22a and the lead fixing portion 22b are formed at an appropriate interval in the length direction of the side portion 18, and in the side portion 18, between the lead fixing portion 22a and the lead fixing portion 22b. Is a gripping portion 30 that is gripped by a mounting machine 46 to be described later.

一方、アンテナ１４における他方の辺部２０には、表面固定部３２が一体形成されている。表面固定部３２は、辺部２０の長さ方向（図３中、左右方向）と直交して、リード固定部２２ａ，２２ｂと同方向に突出されている。表面固定部３２の先端縁部には、平板状部３４が形成されている。平板状部３４は、表面固定部３２の先端縁部が略直角に屈曲されることで形成されており、特に本実施形態においては、平面視（図３参照）においてアンテナ１４の内側となる辺部１８側に屈曲されることにより、アンテナ１４の配設スペース効率の向上が図られている。そして、平板状部３４における基板１２との重ね合わせ面３６が、アンテナ１４の高さ方向（図４中、上下方向）で、リード固定部２２ａ，２２ｂの当接縁部２５，２５と等しい高さ位置に設定されている。   On the other hand, a surface fixing portion 32 is formed integrally with the other side portion 20 of the antenna 14. The surface fixing portion 32 protrudes in the same direction as the lead fixing portions 22a and 22b perpendicular to the length direction of the side portion 20 (left and right direction in FIG. 3). A flat plate portion 34 is formed at the front end edge of the surface fixing portion 32. The flat plate portion 34 is formed by bending the front end edge portion of the surface fixing portion 32 at a substantially right angle. In particular, in the present embodiment, the side that is the inner side of the antenna 14 in plan view (see FIG. 3). The space efficiency of the antenna 14 is improved by being bent toward the portion 18 side. The overlapping surface 36 of the flat plate portion 34 with the substrate 12 is the same height as the contact edge portions 25 and 25 of the lead fixing portions 22a and 22b in the height direction of the antenna 14 (vertical direction in FIG. 4). The position is set.

なお、表面固定部３２は、辺部２０における屈曲部１６と反対側の端縁部２８ｂに形成されている。これにより、アンテナ１４において、把持部３０の近位にリード固定部２２ａ，２２ｂが設けられている一方、把持部３０の遠位に表面固定部３２が設けられている。また、表面固定部３２は、把持部３０から屈曲部１６を経由した位置に形成されている。即ち、リード固定部２２ａ，２２ｂは、把持部３０と同一直線上の辺部１８に形成されている一方、表面固定部３２は、把持部３０から屈曲部１６を介した辺部２０に形成されている。   The surface fixing portion 32 is formed on the end edge portion 28b on the side 20 opposite to the bent portion 16. Accordingly, in the antenna 14, the lead fixing portions 22 a and 22 b are provided in the vicinity of the grip portion 30, and the surface fixing portion 32 is provided in the distal portion of the grip portion 30. Further, the surface fixing portion 32 is formed at a position from the grip portion 30 via the bent portion 16. That is, the lead fixing portions 22 a and 22 b are formed on the side portion 18 that is collinear with the grip portion 30, while the surface fixing portion 32 is formed on the side portion 20 from the grip portion 30 via the bent portion 16. ing.

このようなアンテナ１４を備えたプリント基板１０は、例えば、以下に示す、プリント基板の製造方法に関する本発明の一実施形態に従って製造することができる。先ず、図５に示すように、上述の如きアンテナ１４を用意すると共に、基板１２を用意する。基板１２には、貫通孔としてのスルーホール３８ａ，３８ｂが形成されている。なお、スルーホール３８ａは、基板１２に形成されたプリント配線４０と接続されている。プリント配線４０は、基板１２の表面４２上に設けられた集積回路４４と接続されている。集積回路４４は、例えばアンテナ１４からの受信電波に基づいて、ドアの施錠や開錠を制御するものである。   The printed circuit board 10 provided with such an antenna 14 can be manufactured, for example, according to an embodiment of the present invention relating to a printed circuit board manufacturing method described below. First, as shown in FIG. 5, the antenna 14 as described above is prepared and the substrate 12 is prepared. The substrate 12 has through holes 38a and 38b as through holes. The through hole 38 a is connected to the printed wiring 40 formed on the substrate 12. The printed wiring 40 is connected to an integrated circuit 44 provided on the surface 42 of the substrate 12. The integrated circuit 44 controls the locking and unlocking of the door based on, for example, the received radio wave from the antenna 14.

そして、アンテナ１４の把持部３０を実装機４６の装着部４７で板厚方向の両側から摘まむように把持して、実装機４６によって、リード固定部２２ａ，２２ｂのリード部２４，２４を、基板１２のスルーホール３８ａ，３８ｂにそれぞれ挿通すると共に、表面固定部３２の平板状部３４を、基板１２の表面４２に予め塗布された半田ペースト４８に重ね合わせる。そして、リード固定部２２ａ，２２ｂのリード部２４，２４と、表面固定部３２の平板状部３４を半田付けする。なお、リード部２４，２４は、スルーホール３８ａ，３８ｂ内に予め半田ペーストを充填して、表面固定部３２と共にリフロー工程で半田付けしても良いし、表面固定部３２の半田付けと別工程のフロー工程で半田付けしても良い。これにより、アンテナ１４が基板１２に固定されて、基板１２上に立設される。このようにして、プリント基板１０を得ることができる。   Then, the grip portion 30 of the antenna 14 is gripped by the mounting portion 47 of the mounting machine 46 so as to be gripped from both sides in the plate thickness direction, and the lead portions 24 and 24 of the lead fixing portions 22a and 22b are held by the mounting machine 46 on the substrate 12. The flat plate-like portion 34 of the surface fixing portion 32 is overlaid on the solder paste 48 applied in advance to the surface 42 of the substrate 12. Then, the lead portions 24 and 24 of the lead fixing portions 22a and 22b and the flat plate portion 34 of the surface fixing portion 32 are soldered. The lead portions 24 and 24 may be filled with solder paste in the through holes 38a and 38b in advance and soldered together with the surface fixing portion 32 in a reflow process, or may be separate from the soldering of the surface fixing portion 32. Soldering may be performed in this flow step. Thereby, the antenna 14 is fixed to the substrate 12 and is erected on the substrate 12. In this way, the printed circuit board 10 can be obtained.

そして、スルーホール３８ａに半田付けされたアンテナ１４のリード固定部２２ａが、プリント配線４０と接続されて、プリント配線４０を介して、集積回路４４と接続される。一方、リード固定部２２ｂおよび表面固定部３２は、プリント配線４０と接続されることなく、アンテナ１４の基板１２への固定のみに用いられている。   Then, the lead fixing portion 22 a of the antenna 14 soldered to the through hole 38 a is connected to the printed wiring 40 and is connected to the integrated circuit 44 through the printed wiring 40. On the other hand, the lead fixing portion 22 b and the surface fixing portion 32 are used only for fixing the antenna 14 to the substrate 12 without being connected to the printed wiring 40.

本実施形態に従う構造とされたプリント基板１０によれば、アンテナ１４に、基板１２のスルーホール３８ａ，３８ｂに挿通されて半田付けされるリード固定部２２ａ，２２ｂと、基板１２の表面４２に重ね合わされて半田付けされる表面固定部３２とが形成されている。そして、アンテナ１４において、実装機４６で把持される把持部３０の近位がリード固定部２２ａ，２２ｂとされている一方、把持部３０の遠位が、表面固定部３２とされている。これにより、アンテナ１４を実装機４６で把持して基板１２に半田付けするに際して、把持部３０に近いリード固定部２２ａ，２２ｂは、基板１２のスルーホール３８ａ，３８ｂに精度良く位置決めして挿通することができる。一方、把持部３０から遠い表面固定部３２は、平板状部３４を基板１２の表面４２に重ね合わせることで半田付け可能であることから、アンテナ１４の寸法精度や、辺部２０の撓み等に起因して、表面固定部３２が多少の位置ずれを生じた場合でも、半田付けを行なうことができる。その結果、表面固定部３２で位置ずれを許容して実装機４６による組み付けを可能としつつ、スルーホール３８ａ，３８ｂへの挿通状態で半田付けされるリード固定部２２ａ，２２ｂを設けたことによって、基板１２への固定強度も確保することができる。そして、スルーホール３８ａへの挿通されて、基板１２に強固に固定されるリード固定部２２ａをプリント配線４０と接続することによって、アンテナ１４と基板１２との電気的な接続信頼性を確保することができる。   According to the printed circuit board 10 having the structure according to the present embodiment, the antenna 14 is superposed on the surface 42 of the substrate 12 and the lead fixing portions 22a and 22b that are inserted into the through holes 38a and 38b of the substrate 12 and soldered. Then, a surface fixing portion 32 to be soldered is formed. In the antenna 14, the proximal portion of the grip portion 30 gripped by the mounting machine 46 is the lead fixing portions 22 a and 22 b, while the distal end of the grip portion 30 is the surface fixing portion 32. Thus, when the antenna 14 is gripped by the mounting machine 46 and soldered to the substrate 12, the lead fixing portions 22a and 22b near the grip portion 30 are accurately positioned and inserted into the through holes 38a and 38b of the substrate 12. be able to. On the other hand, the surface fixing portion 32 far from the grip portion 30 can be soldered by superposing the flat plate portion 34 on the surface 42 of the substrate 12, so that the dimensional accuracy of the antenna 14, the bending of the side portion 20, etc. As a result, soldering can be performed even when the surface fixing portion 32 is slightly displaced. As a result, by providing the lead fixing portions 22a and 22b that are soldered while being inserted into the through holes 38a and 38b while allowing the surface fixing portion 32 to be displaced and allowing the mounting by the mounting machine 46, The fixing strength to the substrate 12 can also be ensured. Then, by connecting the lead fixing portion 22a that is inserted into the through hole 38a and is firmly fixed to the substrate 12 to the printed wiring 40, electrical connection reliability between the antenna 14 and the substrate 12 is ensured. Can do.

また、本実施形態のアンテナ１４は、屈曲部１６が設けられたＬ字形状とされている。これにより、要求される全体長：Ｌ1 ＋Ｌ2 （図３参照）を、限定された基板１２上で確保しつつ、スペース効率良く基板１２上に配設することができる。そして、屈曲部１６が設けられると、把持部３０から屈曲部１６を経由した辺部２０の先端において、屈曲部１６の曲げの精度や辺部２０の撓み等で位置ずれを生じるおそれが高くなるが、本発明によれば、辺部２０の先端を表面固定部３２としたことによって、位置ずれを生じた場合でも基板１２に半田付けすることができる。 Further, the antenna 14 of the present embodiment has an L shape with a bent portion 16 provided. Thus, the required overall length: L 1 + L 2 (see FIG. 3) can be arranged on the substrate 12 with high space efficiency while ensuring on the limited substrate 12. When the bent portion 16 is provided, there is a high possibility that a positional shift occurs due to the bending accuracy of the bent portion 16 and the bending of the side portion 20 at the tip of the side portion 20 via the bent portion 16 from the grip portion 30. However, according to the present invention, since the front end of the side portion 20 is the surface fixing portion 32, it is possible to solder to the substrate 12 even when a positional deviation occurs.

さらに、アンテナ１４のリード固定部２２ａ，２２ｂと表面固定部３２は、同一直線上に無い３点に位置されている。これにより、アンテナ１４は、リード固定部２２ａ，２２ｂの当接縁部２５，２５と表面固定部３２の重ね合わせ面３６を基板１２の表面４２に重ね合わせることによって、基板１２上に自立することが可能とされている。その結果、半田付けに際して、アンテナ１４を支持する治具等を不要とすることができて、製造コストの低減を図ることができる。   Furthermore, the lead fixing portions 22a and 22b and the surface fixing portion 32 of the antenna 14 are located at three points that are not on the same straight line. As a result, the antenna 14 can stand on the substrate 12 by superimposing the contact surfaces 25 and 25 of the lead fixing portions 22a and 22b and the overlapping surface 36 of the surface fixing portion 32 on the surface 42 of the substrate 12. Is possible. As a result, a jig or the like for supporting the antenna 14 can be eliminated during soldering, and the manufacturing cost can be reduced.

また、図６にリード固定部２２ａを例に示すように、リード固定部２２ａ，２２ｂのそれぞれにおいて、リード部２４の両側には、凹所２６，２６が形成されている。これにより、スルーホール３８ａからリード部２４を伝わる等して基板１２の表面４２上に存する半田４９を、凹所２６，２６内に収容することができる。これにより、半田４９の飛散を防止して、半田４９が周囲の電気部品や回路に悪影響を与えることを防止することができる。   Further, as shown in FIG. 6 as an example of the lead fixing portion 22a, recesses 26 and 26 are formed on both sides of the lead portion 24 in each of the lead fixing portions 22a and 22b. Accordingly, the solder 49 existing on the surface 42 of the substrate 12 by being transmitted through the lead portion 24 from the through hole 38a can be accommodated in the recesses 26 and 26. Thereby, scattering of the solder 49 can be prevented, and the solder 49 can be prevented from adversely affecting the surrounding electrical components and circuits.

次に、図７に、プリント基板に関する本発明の第二の実施形態としての、プリント基板に設けられる板金部材としてのアンテナ５０を示す。なお、以下の説明において、前記第一の実施形態と同様の構造とされた部位には、図中に前記第一の実施形態と同一の符号を付することにより、重複する説明を省略する。   Next, FIG. 7 shows an antenna 50 as a sheet metal member provided on the printed circuit board as a second embodiment of the present invention relating to the printed circuit board. In the following description, parts having the same structure as in the first embodiment are denoted by the same reference numerals as those in the first embodiment in the drawing, and redundant description is omitted.

アンテナ５０は、２つの屈曲部５２，５４が形成されたコの字形状とされている。具体的には、直線状に延びる１つの辺部５６の両端に、略直角に屈曲された屈曲部５２，５４が形成されており、屈曲部５２，５４から、辺部５８，６０がそれぞれ直線状に延び出されている。そして、辺部５６に２つのリード固定部２２ａ，２２ｂが形成されており、これらリード固定部２２ａ，２２ｂで挟まれた辺部５６の中央部分が把持部３０とされている一方、屈曲部５２，５４から延び出された辺部５８，６０の先端縁部に、表面固定部６２ａ，６２ｂがそれぞれ形成されている。   The antenna 50 has a U-shape in which two bent portions 52 and 54 are formed. Specifically, bent portions 52 and 54 that are bent at substantially right angles are formed at both ends of one side portion 56 that extends in a straight line, and the side portions 58 and 60 are straight from the bent portions 52 and 54, respectively. It extends into a shape. Two lead fixing portions 22a and 22b are formed on the side portion 56, and the central portion of the side portion 56 sandwiched between the lead fixing portions 22a and 22b is the grip portion 30, while the bent portion 52 is formed. , 54 are formed on the front edge portions of the side portions 58, 60 which are extended from the front surface fixing portions 62a, 62b, respectively.

本実施形態のアンテナ５０についても、前記第一の実施形態と同様に、実装機４６で把持部３０を把持して基板１２に実装することができる。そして、本実施形態においても、把持部３０の近位がリード固定部２２ａ，２２ｂとされると共に、把持部３０の遠位は表面固定部６２ａ，６２ｂとされていることによって、表面固定部６２ａ，６２ｂが基板１２に対して位置ずれした場合でも、半田付けすることができる。   Similarly to the first embodiment, the antenna 50 of the present embodiment can be mounted on the substrate 12 by gripping the grip portion 30 with the mounting machine 46. Also in the present embodiment, the proximal portion of the grip portion 30 is the lead fixing portions 22a and 22b, and the distal portion of the grip portion 30 is the surface fixing portions 62a and 62b, whereby the surface fixing portion 62a. 62b can be soldered even when they are displaced with respect to the substrate 12.

以上、本発明の実施形態について詳述したが、本発明はその具体的な記載によって限定されない。例えば、板金部材の具体的形状は、板金部材に要求される機能や基板上での配設スペース等に応じて適宜に設定され得るものであり、前述の如きＬ字形状やコの字形状に限定されることはない。また、屈曲部は直角に限定されるものではないし、必ずしも必要ではない。従って、板金部材は、例えば鋭角や鈍角の屈曲部や、湾曲状の屈曲部を有するものでも良いし、屈曲部を有さず、一直線状に延びる形状等でも良い。   As mentioned above, although embodiment of this invention was explained in full detail, this invention is not limited by the specific description. For example, the specific shape of the sheet metal member can be appropriately set according to the function required for the sheet metal member, the arrangement space on the substrate, etc., and can be an L shape or a U shape as described above. There is no limit. Further, the bent portion is not limited to a right angle and is not always necessary. Accordingly, the sheet metal member may have, for example, an acute or obtuse bent portion or a curved bent portion, or may have a shape that does not have a bent portion and extends straight.

また、板金部材におけるリード固定部および表面固定部の個数や形成位置は、基板への固定強度等を考慮して任意に設定することが可能である。また、板金部材に屈曲部が設けられる場合において、リード固定部と表面固定部は、必ずしも屈曲部を挟んだ把持部側とその反対側に限定して設けられるものではなく、リード固定部を屈曲部よりも把持部側に設けても良いし、表面固定部を屈曲部から把持部と反対側に設けても良い。例えば、前記第一の実施形態において、辺部２０の屈曲部１６側にリード固定部を設けたり、辺部１８におけるリード固定部２２ｂよりも屈曲部１６側に表面固定部を設ける等しても良い。   Further, the number and formation positions of the lead fixing portions and the surface fixing portions in the sheet metal member can be arbitrarily set in consideration of the fixing strength to the substrate. In addition, when the bent portion is provided on the sheet metal member, the lead fixing portion and the surface fixing portion are not necessarily provided only on the gripping portion side sandwiching the bending portion and the opposite side, and the lead fixing portion is bent. You may provide in the holding part side rather than a part, and you may provide a surface fixing | fixed part in the opposite side to a holding part from a bending part. For example, in the first embodiment, a lead fixing portion may be provided on the bent portion 16 side of the side portion 20, or a surface fixing portion may be provided on the bent portion 16 side of the side portion 18 relative to the lead fixing portion 22b. good.

加えて、例示の実施形態では、板金部材をアンテナ１４として使用する例を示したが、板金部材が導通用バスバーとして使用されるプリント基板や、かかるプリント基板が収容された電気接続箱等の電子機器に対しても、本発明が適用可能であることは勿論である。   In addition, in the exemplary embodiment, an example in which the sheet metal member is used as the antenna 14 has been described. However, an electronic device such as a printed circuit board in which the sheet metal member is used as a conductive bus bar or an electrical connection box in which the printed circuit board is accommodated. Of course, the present invention can also be applied to devices.

１０：プリント基板、１２：基板、１４：アンテナ（板金部材）、１６，５２，５４：屈曲部、１８，２０：辺部、２２ａ，ｂ：リード固定部、２４：リード部、２６：凹所、２８ａ，ｂ：端縁部、３０：把持部、３２，６２ａ，ｂ：表面固定部、３４：平板状部、３８ａ，ｂ：スルーホール（貫通孔）、４０：プリント配線、４２：表面、４４：集積回路、４６：実装機、４８：半田ペースト、４９：半田、５０：アンテナ、６４：ケース、６６：電子機器 10: printed circuit board, 12: circuit board, 14: antenna (sheet metal member), 16, 52, 54: bent part, 18, 20: side part, 22a, b: lead fixing part, 24: lead part, 26: recess 28a, b: edge portion, 30: gripping portion, 32, 62a, b: surface fixing portion, 34: flat plate portion, 38a, b: through hole (through hole), 40: printed wiring, 42: surface, 44: Integrated circuit, 46: Mounting machine, 48: Solder paste, 49: Solder, 50: Antenna, 64: Case, 66: Electronic equipment

Claims (10)

金属板からなる板金部材を備え、
該板金部材のリード固定部が基板の貫通孔に挿通されて半田付けされることにより、前記板金部材が前記基板上に立設されているプリント基板において、
前記板金部材には、少なくとも１つの前記リード固定部と、
前記基板の表面に重ね合わされて半田付けされる平板状部を有する少なくとも１つの表面固定部とが設けられており、
前記板金部材において実装機に把持される把持部の近位に前記リード固定部が設けられている一方、前記把持部の遠位に前記表面固定部が設けられている
ことを特徴とするプリント基板。 A sheet metal member made of a metal plate is provided,
In the printed board in which the sheet metal member is erected on the substrate, the lead fixing portion of the sheet metal member is inserted into the through hole of the substrate and soldered,
The sheet metal member includes at least one lead fixing portion;
And at least one surface fixing portion having a flat plate portion that is superposed on the surface of the substrate and soldered,
The printed board according to claim 1, wherein the lead fixing portion is provided proximal to a grip portion gripped by a mounting machine in the sheet metal member, and the surface fixing portion is provided distal to the grip portion. . 前記板金部材の前記リード固定部において、前記貫通孔に挿通されるリード部の両側には、該リード部の突出方向に開口する凹所が形成されている
請求項１に記載のプリント基板。 2. The printed circuit board according to claim 1, wherein in the lead fixing portion of the sheet metal member, recesses that open in a protruding direction of the lead portion are formed on both sides of the lead portion inserted through the through hole. 前記板金部材には屈曲部が設けられており、前記板金部材において、前記把持部から前記屈曲部を経由した位置に前記表面固定部が設けられている
請求項１又は２に記載のプリント基板。 The printed circuit board according to claim 1, wherein the sheet metal member is provided with a bent portion, and the surface fixing portion is provided at a position through the bent portion from the grip portion in the sheet metal member. 前記板金部材が、前記屈曲部において直角に屈曲されたＬ字形状とされており、該Ｌ字形状の一方の辺部に前記把持部と前記リード固定部が設けられている一方、前記Ｌ字形状の他方の辺部における前記屈曲部と反対側の端部に、前記表面固定部が設けられている
請求項３に記載のプリント基板。 The sheet metal member has an L shape bent at a right angle at the bent portion, and the grip portion and the lead fixing portion are provided on one side portion of the L shape. The printed circuit board according to claim 3, wherein the surface fixing portion is provided at an end of the other side of the shape opposite to the bent portion. 少なくとも１つの前記リード固定部が、前記基板に設けられたプリント配線と接続されている一方、前記表面固定部は、前記プリント配線に接続されていない
請求項１〜４の何れか１項に記載のプリント基板。 5. The device according to claim 1, wherein at least one of the lead fixing portions is connected to a printed wiring provided on the substrate, and the surface fixing portion is not connected to the printed wiring. 6. Printed circuit board. 前記板金部材には、少なくとも２つの前記リード固定部と、少なくとも１つの前記表面固定部が設けられており、前記板金部材が前記リード固定部と前記表面固定部で支持されて前記基板上で自立可能とされている
請求項１〜５の何れか１項に記載のプリント基板。 The sheet metal member is provided with at least two lead fixing portions and at least one surface fixing portion, and the sheet metal member is supported by the lead fixing portion and the surface fixing portion and is self-supporting on the substrate. The printed circuit board according to claim 1, wherein the printed circuit board is enabled. 前記板金部材が、電波受信用のアンテナである
請求項１〜６の何れか１項に記載のプリント基板。 The printed circuit board according to claim 1, wherein the sheet metal member is an antenna for receiving radio waves. 請求項１〜７の何れか１項に記載のプリント基板と、
該プリント基板を収容するケースと、
を有する電子機器。 The printed circuit board according to any one of claims 1 to 7,
A case for housing the printed circuit board;
Electronic equipment having 車輌に搭載されて使用されるものである請求項８に記載の電子機器。   The electronic device according to claim 8, wherein the electronic device is used by being mounted on a vehicle. 金属板からなる板金部材を備え、
該板金部材のリード固定部が基板の貫通孔に挿通されて半田付けされることにより、前記板金部材が前記基板上に立設されているプリント基板の製造方法であって、
少なくとも１つの前記リード固定部と、前記基板の表面に重ね合わされて半田付けされる平板状部を有する少なくとも１つの表面固定部とが設けられた前記板金部材を用い、
前記板金部材における前記表面固定部よりも前記リード固定部に近位の部位を実装機で把持して、前記リード固定部を前記貫通孔に挿通して半田付けすると共に、前記表面固定部を前記基板の表面に重ね合わせて半田付けする
ことを特徴とするプリント基板の製造方法。 A sheet metal member made of a metal plate is provided,
A method of manufacturing a printed circuit board in which the sheet metal member is erected on the substrate by the lead fixing portion of the sheet metal member being inserted into a through hole of the substrate and soldered,
Using the sheet metal member provided with at least one lead fixing portion and at least one surface fixing portion having a flat plate portion that is superposed on the surface of the substrate and soldered,
A portion of the sheet metal member closer to the lead fixing portion than the surface fixing portion is gripped by a mounting machine, the lead fixing portion is inserted into the through hole and soldered, and the surface fixing portion is A method of manufacturing a printed circuit board, comprising superimposing and soldering on the surface of the circuit board.
JP2013218826A 2013-10-22 2013-10-22 Printed circuit board, electronic apparatus including the same, and manufacturing method of the same Abandoned JP2015082538A (en)

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JP2013218826A JP2015082538A (en) 2013-10-22 2013-10-22 Printed circuit board, electronic apparatus including the same, and manufacturing method of the same
PCT/JP2014/076282 WO2015060085A1 (en) 2013-10-22 2014-10-01 Printed circuit board, electronic device provided with printed circuit board, and manufacturing method for printed circuit board

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JP2013218826A JP2015082538A (en) 2013-10-22 2013-10-22 Printed circuit board, electronic apparatus including the same, and manufacturing method of the same

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