JPH0637417A - Part for electric conduction and double-sided substrate - Google Patents

Abstract

PURPOSE:To provide a part for electric conduction capable of being mounted on a double-sided substrate with high accuracy and high density and capable of relaxing stress to a soldering section due to thermal expansion and contraction in the thickness direction of the double-sided substrate. CONSTITUTION:A part 10 for electric conduction has a sucking surface 12 for a suction by a mounting machine. The part 10 for electric conduction has spring structure 19 for moving a lead terminal electrode 14 inserted into a via hole 42 in the thickness direction of a double-sided substrate 40.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a conducting component for conducting a conductor provided on the upper and lower surfaces of a double-sided board through holes provided in the board.

[0002]

2. Description of the Related Art Conventionally, in order to conduct the conductor patterns provided on the upper and lower surfaces of a double-sided board, a method of using a plated through-hole board and a method of mounting (soldering) a conductive part are used. There is.

[0003]

The method using the plated through-hole substrate described above requires a plating step and a drilling step with an NC drill, resulting in high cost.

The method of mounting the above-mentioned conductive parts is shown in FIG.
0, solder coated FS jumper wire 1
No. 00 is inserted into the component insertion holes 101 and 102 to be dip (DIP) soldered, and at the same time, the board upper surface side land 104 and the board lower surface side land 106 are connected. Since a self-inserting machine head and a large dead space D for preventing soldering defects are required, high-density mounting cannot be performed. Further, there are many restrictions on the soldering of such an FS jumper. Further, the conduction due to the pin insertion is likely to cause a solder crack due to thermal expansion in the thickness direction of the substrate.

A first object of the present invention is to provide a conductive component which can be mounted on a double-sided board with high precision and high density.

A second object of the present invention is to allow the conductors provided on the upper surface and the lower surface of the double-sided board to conduct at low cost, and for the lead terminal electrodes to be provided between the upper surface and the lower surface of the double-sided board. It is an object of the present invention to provide a conductive component capable of relieving stress on a soldered portion due to thermal expansion and contraction in the thickness direction of a double-sided board when inserted into a penetrating hole and soldered.

A third object of the present invention is that it can be mounted on a double-sided board with high precision and high density, and conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost. When the lead terminal electrode is inserted into a hole penetrating between the upper surface and the lower surface of the double-sided board and soldered, the stress on the soldered part due to thermal expansion and contraction in the thickness direction of the double-sided board can be relieved. It is an object of the present invention to provide a conductive component that can be used.

A fourth object of the present invention is to provide a double-sided board on which conductive parts can be mounted with high accuracy and high density.

A fifth object of the present invention is that the conducting parts can be mounted with high precision and high density, and the conductors provided on the upper and lower surfaces can be conducted at low cost, and at the same time, the conducting parts can be conducted. However, when the lead terminal electrode is inserted into a hole penetrating between the upper surface and the lower surface of the double-sided board and soldered, the stress on the soldered part due to thermal expansion and contraction in the thickness direction of the double-sided board is relieved. It is an object of the present invention to provide a double-sided substrate that can be manufactured.

[0010]

According to a first aspect of the present invention, there is provided a conductive component, wherein a conductor (for example, a double-sided board (for example, a double-sided bare-hole board 40 in FIG. 1)) is provided on an upper surface and a lower surface thereof.
The upper surface side lands 46 and 48 of FIG. 1 and the lower surface side land 5
2) is a conducting component for conducting electricity through a hole (for example, the bail 42 in FIG. 1) provided in this substrate, and is a suction surface (for example, the suction in FIG. 1) for suction by a mounting machine. It is characterized by having a face 12).

A conductive component according to a second aspect of the present invention is a conductor (for example, upper surface lands 46 and 48 in FIG. 1) disposed on the upper and lower surfaces of a double-sided substrate (for example, double-sided barehole substrate 40 in FIG. 1). And a lower surface side land 52) for electrical connection through a hole (for example, the bail 42 in FIG. 1) provided in the board, and a lead terminal electrode inserted into the hole is provided on the board. It is characterized by having a spring structure (for example, the spring structure 19 of FIG. 1) for making it movable in the thickness direction.

A conductive component according to a third aspect of the present invention is a conductor (for example, upper surface lands 46 and 48 in FIG. 1) disposed on the upper and lower surfaces of a double-sided substrate (for example, double-sided bare-hole substrate 40 in FIG. 1). And a lower surface side land 52) is a conduction component for conducting electricity through a hole (for example, the bail 42 in FIG. 1) provided in this substrate, and is a suction surface (for example, a suction surface) for suction by a mounting machine. , The suction surface 12 of FIG. 1)
And a spring structure for moving the lead terminal electrode inserted in the hole in the thickness direction of the substrate (for example, the spring structure 1 of FIG. 1).
9) and are included.

A double-sided substrate according to a fourth aspect of the present invention is a conductor disposed on the upper surface (for example, upper lands 46 and 48 in FIG. 1) and a conductor disposed on the lower surface (for example, in FIG. 1). A lower surface side land 52), a hole (for example, the bail 42 in FIG. 1) penetrating between the upper surface and the lower surface, and a suction surface (for example, the suction surface 12 in FIG. 1) for suction by a mounting machine. , A conduction component for conducting the conductors disposed on the upper surface and the lower surface through the holes (for example, the conduction component 1 in FIG. 1).
0) and are included.

A double-sided board according to a fifth aspect of the present invention is a conductor disposed on the upper surface (for example, upper surface lands 46 and 48 in FIG. 1) and a conductor disposed on the lower surface (for example, in FIG. 1). Lower surface side land 52), a hole (for example, bear 42 of FIG. 1) penetrating between the upper surface and the lower surface, and a lead terminal electrode (for example, lead terminal electrode 1 of FIG. 1) inserted into the hole.
4), and a spring structure for moving the lead terminal electrode in a direction perpendicular to the upper surface and the lower surface (see, for example, FIG. 1).
And a conductive component (for example, the conductive component 10 shown in FIG. 1) that conducts the conductors provided on the upper surface and the lower surface through the holes.

[0015]

In the conduction component having the structure of the first aspect, since the suction surface can be sucked by the mounting machine, it can be mounted on the double-sided board with high precision and high density.

In the conductive component of the second aspect, the lead terminal electrode inserted into the hole can move in the thickness direction of the substrate by the spring structure. Therefore, when the lead terminal electrode is inserted into a hole penetrating between the upper surface and the lower surface of the double-sided board and soldered, the stress on the soldered part due to thermal expansion and contraction in the thickness direction of the double-sided board is reduced. You can Further, since the plating process and the drilling process using the NC drill can be omitted, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

Since the suction surface of the conductive component of the third aspect can be sucked by the mounting machine, it can be mounted on the double-sided board with high precision and high density. Further, the spring structure allows the lead terminal electrode inserted in the hole to move in the thickness direction of the substrate. Therefore, when the lead terminal electrode is inserted into a hole penetrating between the upper surface and the lower surface of the double-sided board and soldered, the stress on the soldered part due to thermal expansion and contraction in the thickness direction of the double-sided board is reduced. You can Further, since the plating process and the drilling process using the NC drill can be eliminated, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

In the double-sided board having the structure according to the fourth aspect, since the suction surface of the conductive component can be sucked by the mounting machine,
The conductive component can be mounted on the double-sided board with high precision and high density.

In the double-sided board having the structure of the fifth aspect, since the suction surface of the conducting component can be sucked by the mounting machine, the conducting component can be mounted on the double-sided substrate with high precision and high density. Further, in the conductive component, the spring structure allows the lead terminal electrode inserted in the hole to move in the thickness direction of the substrate. Therefore, when the lead terminal electrode is inserted into a hole penetrating between the upper surface and the lower surface of the double-sided board and soldered, the stress on the soldered part due to the thermal expansion and contraction in the thickness direction of the double-sided board is reduced. You can Further, since the plating process and the drilling process using the NC drill can be eliminated, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS FIG. 1 shows the construction of a first embodiment of a conducting component and a double-sided board according to the present invention. The conduction component 10 is made of a conductive metal, and is a suction surface 1 for suction by a component suction nozzle 30 of an automatic mounting machine such as a chip racer.
Have two. Further, the conduction component 10 has electrodes 16 and 18 to be connected to the upper surface lands 46 and 48 of the double-sided through hole substrate 40. Electrodes 16 and 1
8 is connected to the suction surface 12 by connecting portions 16C and 18C, respectively. The lead terminal electrode 14 is provided at the end of the electrode 18. Lead terminal electrode 14
Are inserted into bare holes (holes without through hole plating) 42 of the double-sided through hole substrate 40.

As described above, in order to enable the automatic mounting of the component 10 for conduction, the component shape on the upper surface side of the substrate 40 is the shape of a normal surface mount type chip component, and the substrate hole portion is formed. -The shape of the parts on the bottom side is the shape of discrete parts.

In order to prevent solder cracks in the soldered portion due to thermal expansion and contraction in the thickness direction of the substrate 40,
The lead terminal electrode 14 of the conduction component 40 has a spring structure 19 whose upper portion is bent. This allows the lead terminal electrode 14 to move in the thickness direction of the substrate 40,
It is possible to relieve stress on the soldered portion due to thermal expansion and contraction of the substrate 40 in the thickness direction.

As described above, the lands 46 and 48 are formed near the hole 42 on the upper surface of the double-sided substrate 40. A copper foil layer (pattern) 62 is connected to the land 46, and another copper foil layer (pattern) is connected to the land 48. The lands 46 and 48 have a shape capable of automatic reflow soldering (of course, individual soldering (laser beam irradiation, etc.) and hand soldering with a soldering iron). Copper foil layer 6
A surface mount type chip component 60 is connected to the device 2.

As described above, the land 52 is formed near the hole 42 on the lower surface side of the double-sided substrate 40. A copper foil layer (pattern) 58C is connected to the land 52. The land 52 has a shape that enables automatic dip (DIP) batch soldering (of course, individual soldering (laser beam irradiation, etc.) and hand soldering with a soldering iron are also possible). The copper foil layer 58C extends to the bare hole 58. Also, another copper foil layer 56C
Extend to the bare hole 56. Bare hole 5
Lead terminal electrodes 56L and 58L of the discrete component 54 are inserted into 6 and 58.

FIG. 2 shows a double-sided board on which the conductive parts of FIG. 1 are mounted. The lands 46 and 48 on the upper surface of the substrate and the electrodes 16 and 18 of the conduction component 10 are soldered 36W.
And the lead terminal electrode 1 electrically connected by 38 W and penetrating the land 52 on the lower surface of the substrate and the bare hole 42.
4 is also electrically connected with the solder 32W so that the copper foil layers 62 and 58C on both surfaces can be electrically connected.

As described above, the conduction component 10 and the adsorption surface 20 that can be adsorbed by the component adsorption nozzle 30 are provided, and the shape of the conduction component 10 on the upper surface side of the substrate is miniaturized like the surface mounting component shape. it can. As a result, automatic mounting can be performed with high mounting accuracy, and high-density mounting can be achieved by downsizing the conductive component 10.

FIG. 3 shows a dead space D when the conducting component 10 of FIG. 1 is mounted on the double-sided board 40. Figure 1
It can be seen that the dead space D is smaller than the dead space D when the conventional FS jumper wire shown in 0 is used. This enables high-density mounting.

FIG. 4 shows an embodiment of the present invention when two bare holes are formed on the double-sided board. The two bare holes have lead terminal electrodes 14A and 14B, respectively.
Is inserted, and the lands 52A and 52 on the lower surface side of the substrate 40 are inserted.
B and solder 32WA and 32WB electrically connect. The lead terminal electrodes 14A and 14B have spring structures 19A and 19A whose upper portions are bent, respectively.
Have B.

FIG. 5 shows an embodiment of the present invention in the case where two bare holes are formed in the double-sided substrate and the number of lands on the upper surface side is one. In this example, the attraction surface 12 of the conductive component is recessed downward and also functions as an electrode electrically connected to the upper surface land 47.

FIGS. 6 and 7 show another embodiment of the present invention in which one bare hole is formed in the double-sided substrate 40, two upper surface lands and one lower surface land are formed as in FIGS. 1 and 2. Here is an example: Note that FIG. 7 is a sectional view taken along the line AA of FIG. The conducting parts of this embodiment are parallel 2
The two plates 76 and 78 to the top lands 46 and 4
8, the tongue portion 72 between the plate portions 76 and 78 serves as an adsorption surface, and the lead terminal electrode 74 is formed so as to extend vertically downward from the tongue portion 72. Tongue 7
The bent portion between 2 and the lead terminal electrode 74 is a portion of the spring structure 79.

The embodiment of FIGS. 8 and 9 is a longer version of the tongue 72 of the embodiment of FIGS. 6 and 7 (note that FIG. 9 is a cross-sectional view taken along line BB of FIG. 8). Is). As a result, the attracting surface becomes large, so that the mounting becomes easier and the spring force also becomes larger, so that the stress on the soldered portion can be further alleviated.

[0032]

According to the conductive component of the first aspect, since the suction surface can be sucked by the mounting machine, it is possible to mount the double-sided board with high precision and high density.

According to the conductive component of the second aspect, the lead terminal electrode inserted into the hole can be moved in the thickness direction of the substrate by the spring structure, so that the lead terminal electrode is formed between the upper surface and the lower surface of the double-sided substrate. When inserted into a hole penetrating the space and soldered, the stress on the soldered part due to thermal expansion and contraction in the thickness direction of the double-sided board can be relieved. Further, since the plating process and the drilling process using the NC drill can be omitted, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

According to the conductive component of the third aspect, since the suction surface can be suctioned by the mounting machine, it is possible to mount the double-sided board with high accuracy and high density. Also, the spring structure allows the lead terminal electrodes inserted in the holes to move in the thickness direction of the board, so the lead terminal electrodes are inserted into the holes penetrating between the upper surface and the lower surface of the double-sided board and soldered. In this case, stress on the soldered portion due to thermal expansion and contraction in the thickness direction of the double-sided board can be relieved. Further, since the plating process and the drilling process using the NC drill can be eliminated, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

According to the double-sided board of the fourth aspect, since the suction surface of the conducting component can be sucked by the mounting machine, the conducting component can be mounted on the double-sided substrate with high precision and high density.

According to the double-sided board of the fifth aspect, since the suction surface of the conductive component can be sucked by the mounting machine, the conductive component can be mounted on the double-sided substrate with high accuracy and high density. In addition, since the lead terminal electrode inserted in the hole can move in the thickness direction of the board due to the spring structure, the lead terminal electrode is inserted in the hole penetrating between the upper surface and the lower surface of the double-sided board. When soldered, the stress on the soldered portion due to thermal expansion and contraction in the thickness direction of the double-sided board can be relieved. Further, since the plating process and the drilling process using the NC drill can be eliminated, the conductors provided on the upper and lower surfaces of the double-sided board can be conducted at low cost.

[Brief description of drawings]

FIG. 1 is a perspective view showing a configuration of a first embodiment of a conduction component and a double-sided board according to the present invention.

FIG. 2 is a cross-sectional view showing a double-sided board on which the conductive component of FIG. 1 is mounted.

FIG. 3 is a plan view showing a dead space when the conductive component of FIG. 1 is mounted on a double-sided board.

FIG. 4 is a cross-sectional view showing a configuration of a second embodiment of a conducting component and a double-sided board according to the present invention.

FIG. 5 is a cross-sectional view showing the configuration of a third embodiment of the conducting component and the double-sided board of the present invention.

FIG. 6 is a plan view showing the configuration of a fourth embodiment of the conducting component and the double-sided board of the present invention.

7 is a cross-sectional view taken along the line AA of FIG.

FIG. 8 is a plan view showing a configuration of a fifth embodiment of a conduction component and a double-sided board according to the present invention.

9 is a cross-sectional view taken along the line BB in FIG.

FIG. 10 is a plan view showing a dead space in the case where a top surface and a bottom surface of a double-sided board are electrically connected by using a conventional FS jumper wire.

[Explanation of symbols]

 10 Conductive Components 12 Adsorption Surfaces 14, 14A, 14B Lead Terminal Electrodes 16, 18 Electrodes 19, 19A, 19B Spring Structure 30 Adsorption Nozzle 40 Double-sided Barehole Substrate 42 Barehole 46, 48 Top Side Land 52, 52A, 52B Bottom Side Land 72 Adsorption surface 74 Lead terminal electrode 79 Spring structure

Claims (5)

[Claims] 1. A conducting component for conducting a conductor disposed on the upper surface and the lower surface of a double-sided board through a hole provided in the board, which is a suction surface for suction by a mounting machine. A conductive component having: 2. A conduction component for electrically connecting conductors arranged on the upper surface and the lower surface of a double-sided board through a hole provided in the board, and a lead terminal electrode inserted into the hole. A conductive component having a spring structure for moving the substrate in the thickness direction of the substrate. 3. A conducting component for conducting a conductor disposed on the upper surface and the lower surface of a double-sided board through a hole provided in the board, which is a suction surface for suctioning by a mounting machine. And a spring structure for making the lead terminal electrode inserted into the hole movable in the thickness direction of the substrate. 4. A conductor provided on an upper surface, a conductor provided on a lower surface, a hole penetrating between the upper surface and the lower surface, and an adsorption surface for adsorption by a mounting machine. A double-sided board, further comprising: a conductive component for electrically connecting the conductors disposed on the upper surface and the lower surface through the holes. 5. A conductor provided on an upper surface, a conductor provided on a lower surface, a hole penetrating between the upper surface and the lower surface, a lead terminal electrode inserted into the hole, and A conduction component having a spring structure for moving the lead terminal electrode in a direction perpendicular to the upper surface and the lower surface, and electrically connecting the conductors arranged on the upper surface and the lower surface through the holes. A double-sided substrate comprising: