JPH088417B2 - Multilayer printed wiring board - Google Patents
Multilayer printed wiring boardInfo
- Publication number
- JPH088417B2 JPH088417B2 JP63292125A JP29212588A JPH088417B2 JP H088417 B2 JPH088417 B2 JP H088417B2 JP 63292125 A JP63292125 A JP 63292125A JP 29212588 A JP29212588 A JP 29212588A JP H088417 B2 JPH088417 B2 JP H088417B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- wiring board
- printed wiring
- multilayer printed
- diameter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/429—Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
【発明の詳細な説明】 （産業上の利用分野） 本発明は、導通穴を有する多層プリント配線板に関
し、特に高密度に配線がなされる多層プリント配線板に
関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a multilayer printed wiring board having a conductive hole, and more particularly to a multilayer printed wiring board in which wiring is made at high density.
（従来の技術） 従来の多層プリント配線板は、第５図に示した如く、
円柱状の貫通穴（13）を形成した後、その内壁部に金属
メッキ（14）を施して導通穴（12）を形成しており、こ
れによって表面層（15）や内面層（16）の導体パターン
間の電気的な接続を実現していた。(Prior Art) As shown in FIG. 5, a conventional multilayer printed wiring board is
After forming a cylindrical through hole (13), metal plating (14) is applied to the inner wall portion of the through hole (12) to form a conduction hole (12), whereby the surface layer (15) and the inner surface layer (16) are formed. The electrical connection between the conductor patterns was realized.
（発明が解決しようとする課題） 近年の電気機器の小型化、高機能化に伴ない、プリン
ト配線板に対する高密度配線の要求が益々高まってきて
いる。その要求を満足するために、プリント配線板に形
成する導体パターンを極力細くすることで配線密度を向
上させようとする、所謂ファインパターン化への努力が
なされてきた。これにより、同一層内の高密度配線は実
現するが、一方各々の層間を電気的に接続するための導
通穴を小径化することで、更に高密度な多層プリント配
線板を形成しようとする努力もなされており、0.5mm程
度の径を有する小径バイアホールと呼ばれる導通穴がそ
の例として挙げられる。ところが、この程度の小径化で
は十分な高密度配線が得られず、更に小径化された導通
穴を形成することが必要となっている。(Problems to be Solved by the Invention) With the recent miniaturization and higher functionality of electric devices, the demand for high-density wiring for printed wiring boards is increasing. In order to satisfy the demand, efforts have been made to make a so-called fine pattern in which the conductor pattern formed on the printed wiring board is made as thin as possible to improve the wiring density. This will realize high-density wiring in the same layer, but on the other hand, efforts will be made to form a higher-density multilayer printed wiring board by reducing the diameter of the conductive hole for electrically connecting each layer. A conducting hole called a small diameter via hole having a diameter of about 0.5 mm is given as an example. However, with such a small diameter, a sufficient high density wiring cannot be obtained, and it is necessary to form a conduction hole with a further smaller diameter.
一般に、円柱状の貫通穴の形状を論じる場合、アスペ
クト比と呼ばれる係数が問題となるが、第７図に示した
如く、穴の直径をｄとし穴の深さをｌとすると、アスペ
クト比ａ＝l/dで与えられる。プリント配線板の基材の
材質や、穴あけ作業に用いるドリルの性能によって異な
るが、プリント配線板の導通穴のアスペクト比は５〜10
程度となっている。換言すれば、プリント配線板の板厚
を薄くすれば、導通穴を小径化することができるのであ
る。ところが、プリント配線板には、搭載される電子部
品を保持するだけの板厚が最低限必要であり、実用上導
通穴の小径化を困難にしているのである。従って、上記
問題を解決することのできる小径の導通穴を形成するこ
とが、高密度プリント配線板を形成する際の大きな課題
となっているのである。Generally, when discussing the shape of a cylindrical through hole, a factor called an aspect ratio becomes a problem. However, as shown in FIG. = Given by l / d. Depending on the material of the base material of the printed wiring board and the performance of the drill used for drilling work, the aspect ratio of the conductive holes on the printed wiring board is 5-10.
It has become a degree. In other words, if the thickness of the printed wiring board is reduced, the diameter of the conduction hole can be reduced. However, the printed wiring board requires a minimum thickness for holding the electronic components to be mounted, which makes it practically difficult to reduce the diameter of the conduction hole. Therefore, forming a small-diameter conduction hole that can solve the above problems is a major problem in forming a high-density printed wiring board.
（課題を解決するための手段） 以上のような課題を解決するために本発明が採った手
段は、第１図〜第４図に示したように、 『導通穴（２）を有する多層プリント配線板（１）にお
いて、 互いに積層された厚さの異なる少なくとも二つの基材
（7a）（7b）を備え、厚い側の基材（7a）に設けられた
大径の貫通穴（3a）と、薄い側の基材（7b）に設けられ
て前記大径の貫通穴（3a）に連通する小径の貫通穴（3
b）とから前記導通穴（２）を構成したことを特徴とす
る多層プリント配線板（１）』 である。(Means for Solving the Problems) As shown in FIGS. 1 to 4, the means adopted by the present invention for solving the above problems is, as shown in FIG. 1 to FIG. The wiring board (1) is provided with at least two base materials (7a) (7b) that are laminated on each other and have a large diameter through hole (3a) provided in the thick base material (7a). , A small diameter through hole (3) provided on the thin side base material (7b) and communicating with the large diameter through hole (3a).
The multilayer printed wiring board (1) ″ is characterized in that the conduction hole (2) is constituted by b) and b).
すなわち、電子部品を保持するのに必要な板厚をもっ
た基材（7a）に形成可能な大径の貫通穴（3a）を形成
し、高密度配線が必要とされる基材（7b）の板厚を薄く
することで所望の小径の貫通穴（3b）を形成し、大径の
貫通穴（3a）と小径の貫通穴（3b）とから多層プリント
配線板（１）の導通穴（２）を構成したのである。That is, a large-diameter through hole (3a) that can be formed in a base material (7a) having a plate thickness necessary to hold an electronic component is formed, and a base material (7b) that requires high-density wiring. The desired small diameter through hole (3b) is formed by reducing the plate thickness of the multilayer printed wiring board (1) through the large diameter through hole (3a) and the small diameter through hole (3b). 2) was constructed.
（発明の作用） 本発明が上述のような手段を採ることによる作用を第
４図、第６図を用いて説明する。第４図は本発明に係る
多層プリント配線板（１）の配線パターンであり、第６
図は従来の多層プリント配線板（11）の配線パターンで
ある。本発明に係る多層プリント配線板（１）の導通穴
（２）の間隔は、内面層においては従来の多層プリント
配線板（11）と同等であるが、表面層（５）においては
従来の多層プリント配線板（11）に比し広くなってお
り、その分配線パターンが高密度に形成されている。(Operation of the Invention) The operation of the present invention by adopting the above-mentioned means will be described with reference to FIGS. 4 and 6. FIG. 4 is a wiring pattern of the multilayer printed wiring board (1) according to the present invention,
The figure shows the wiring pattern of a conventional multilayer printed wiring board (11). The distance between the conductive holes (2) of the multilayer printed wiring board (1) according to the present invention is the same as that of the conventional multilayer printed wiring board (11) in the inner surface layer, but the conventional multilayer in the surface layer (5). It is wider than the printed wiring board (11), and the wiring pattern is formed in high density.
（実施例） 以下、図面に示す実施例に従って、本発明を具体的に
説明する。(Examples) Hereinafter, the present invention will be specifically described with reference to the examples shown in the drawings.
第１図は、本発明に係る多層プリント配線板（１）の
第１実施例を示す断面図である。電子部品を保持できる
だけの板厚をもった内面層（６）用の基材（7a）に対し
て、例えば0.5mm程度の穴径を有する貫通穴（3a）を形
成し、表面層（５）用の基材（7b）の板厚を薄くするこ
とで、例えば0.1mm程度の穴径を有する貫通穴（3b）を
形成する。その後、基材（7a）（7b）を張り合わせ、貫
通穴（3a）（3b）の内壁に金属メッキ（４）を施すこと
によって導通穴（２）を形成するようにしたものであ
る。この構造では表面層（５）において高密度配線が実
現できる。FIG. 1 is a sectional view showing a first embodiment of a multilayer printed wiring board (1) according to the present invention. A through hole (3a) having a hole diameter of, for example, about 0.5 mm is formed in a base material (7a) for an inner surface layer (6) having a thickness sufficient to hold an electronic component, and a surface layer (5) The through hole (3b) having a hole diameter of, for example, about 0.1 mm is formed by reducing the plate thickness of the base material (7b) for use. After that, the base materials (7a) and (7b) are bonded to each other, and the inner walls of the through holes (3a) and (3b) are plated with metal (4) to form the conduction holes (2). With this structure, high-density wiring can be realized in the surface layer (5).
第２図は、本発明に係る多層プリント配線板（１）の
第２実施例を示す断面図である。電子部品を保持できる
だけの板厚をもった表面層（5a）用の基材（7a）に対し
て、例えば0.5mm程度の穴径を有する貫通穴（3a）を形
成し、もう一方の表面層（5b）用の基材（7b）の板厚を
薄くすることで、例えば0.1mm程度の穴径を有する貫通
穴（3b）を形成する。その後、基材（7a）（7b）を張り
合わせ、貫通穴（3a）（3b）の内壁に金属メッキ（４）
を施すことによって、導通穴（２）を形成するようにし
たものである。この構造では表面層（5b）において高密
度配線が実現できる。FIG. 2 is a sectional view showing a second embodiment of the multilayer printed wiring board (1) according to the present invention. A through hole (3a) having a hole diameter of, for example, about 0.5 mm is formed in a base material (7a) for a surface layer (5a) having a plate thickness sufficient to hold an electronic component, and the other surface layer By reducing the plate thickness of the base material (7b) for (5b), a through hole (3b) having a hole diameter of, for example, about 0.1 mm is formed. After that, the base materials (7a) and (7b) are bonded together, and the inner walls of the through holes (3a) and (3b) are plated with metal (4).
The conductive hole (2) is formed by applying. With this structure, high-density wiring can be realized in the surface layer (5b).
第３図は、本発明に係る多層プリント配線板（１）の
第３実施例を示す断面図である。電子部品を保持できる
だけの板厚をもった内面層（６）用の基材（7a）に対し
て、例えば0.5mm程度の穴径を有する貫通穴（3a）を形
成し、表面層（5b）（5c）用の基材（7b）（7c）の板厚
を薄くすることで、例えば0.1mmの穴径を有する貫通穴
（3b）（3c）を基板（7b）（7c）のどちらか一方にのみ
形成する。その後、基材（7a）（7b）（7c）を張り合わ
せ、貫通穴（3a）（3b）（3c）の内壁に金属メッキ
（４）を施すことによって、導通穴（2a）（2b）を形成
するようにしたものである。この構造では表面層（5b）
（5c）において高密度配線が実現でき、導通穴（2a）は
表面層（5b）と内面層（６）を、導通穴（2b）は表面層
（5c）と内面層（６）を電気的に接続するものである。FIG. 3 is a sectional view showing a third embodiment of the multilayer printed wiring board (1) according to the present invention. A through hole (3a) having a hole diameter of, for example, about 0.5 mm is formed in a base material (7a) for an inner surface layer (6) having a thickness sufficient to hold an electronic component, and a surface layer (5b) By reducing the plate thickness of the base material (7b) (7c) for (5c), for example, the through holes (3b) (3c) having a hole diameter of 0.1 mm can be formed on either the substrate (7b) or (7c). To form only. After that, the base materials (7a), (7b) and (7c) are bonded together, and the inner walls of the through holes (3a), (3b) and (3c) are plated with metal (4) to form the conduction holes (2a) and (2b). It is something that is done. Surface layer (5b) in this structure
High density wiring can be realized in (5c), and the conduction hole (2a) electrically connects the surface layer (5b) and the inner surface layer (6), and the conduction hole (2b) electrically connects the surface layer (5c) and the inner surface layer (6). To connect to.
（発明の効果） 以上詳述した通り、本発明に係る多層プリント配線板
は、『導通穴を有する多層プリント配線板において、互
いに積層された厚さの異なる少なくとも二つの基材を備
え、厚い側に基材に設けられた大径の貫通穴と、薄い側
の基材に設けられて前記大径の貫通穴に連通する小径の
貫通穴とから前記導通穴を構成したこと』に特徴があ
り、これにより、従来技術では困難であった小径の導通
穴を形成することができ、高密度な配線パターンを実現
することができる。(Effects of the Invention) As described in detail above, the multilayer printed wiring board according to the present invention is a "multilayer printed wiring board having a conduction hole, which is provided with at least two base materials having different thicknesses, and which has a thick side. The large diameter through hole provided on the base material and the small diameter through hole provided on the thin base material and communicating with the large diameter through hole constitute the conduction hole. As a result, it is possible to form a conductive hole having a small diameter, which was difficult with the conventional technique, and it is possible to realize a high-density wiring pattern.
第１図は本発明に係る多層プリント配線板の第１実施例
を示す断面図、第２図は本発明に係る多層プリント配線
板の第２実施例を示す断面図、第３図は本発明に係る多
層プリント配線板の第３実施例を示す断面図、第４図は
本発明に係る多層プリント配線板の配線パターンを示す
平面図、第５図は従来の多層プリント配線板を示す断面
図、第６図は従来の多層プリント配線板の配線パターン
を示す平面図、第７図はアスペクト比を説明する貫通穴
の断面図である。 符号の説明 １……多層プリント配線板、２……導通穴、３……貫通
穴、４……金属メッキ、５……表面層、６……内面層、
７……基板。FIG. 1 is a sectional view showing a first embodiment of a multilayer printed wiring board according to the present invention, FIG. 2 is a sectional view showing a second embodiment of a multilayer printed wiring board according to the present invention, and FIG. 3 is a sectional view showing a third embodiment of a multilayer printed wiring board according to the present invention, FIG. 4 is a plan view showing a wiring pattern of the multilayer printed wiring board according to the present invention, and FIG. 5 is a sectional view showing a conventional multilayer printed wiring board. FIG. 6 is a plan view showing a wiring pattern of a conventional multilayer printed wiring board, and FIG. 7 is a sectional view of a through hole for explaining the aspect ratio. DESCRIPTION OF SYMBOLS 1 ... Multilayer printed wiring board, 2 ... Conductive hole, 3 ... Through hole, 4 ... Metal plating, 5 ... Surface layer, 6 ... Inner surface layer,
7 ... substrate.
Claims (1)
て、 互いに積層された厚さの異なる少なくとも二つの基材を
備え、厚い側の基材に設けられた大径の貫通穴と、薄い
側の基材に設けられて前記大径の貫通穴に連通する小径
の貫通穴とから前記導通穴を構成したことを特徴とする
多層プリント配線板。1. A multilayer printed wiring board having a through hole, comprising at least two base materials having different thicknesses, which are laminated on each other, and has a large-diameter through hole provided on the base material on the thick side and a base material on the thin side. A multilayer printed wiring board, characterized in that the conduction hole is constituted by a small-diameter through hole provided on a base material and communicating with the large-diameter through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63292125A JPH088417B2 (en) | 1988-11-17 | 1988-11-17 | Multilayer printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63292125A JPH088417B2 (en) | 1988-11-17 | 1988-11-17 | Multilayer printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02137295A JPH02137295A (en) | 1990-05-25 |
| JPH088417B2 true JPH088417B2 (en) | 1996-01-29 |
Family
ID=17777867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63292125A Expired - Lifetime JPH088417B2 (en) | 1988-11-17 | 1988-11-17 | Multilayer printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH088417B2 (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03122581U (en) * | 1990-03-27 | 1991-12-13 | ||
| JP2522180B2 (en) * | 1993-09-09 | 1996-08-07 | 日本電気株式会社 | Ceramic multilayer wiring board |
| EP1250033B1 (en) * | 1996-12-26 | 2004-09-08 | Matsushita Electric Industrial Co., Ltd. | Printed circuit board and electronic component |
| JP3238380B2 (en) * | 1999-07-02 | 2001-12-10 | 日本メクトロン株式会社 | Method of forming fine through-hole conductive portion of circuit board |
| JP2001332859A (en) | 2000-05-22 | 2001-11-30 | Murata Mfg Co Ltd | Laminate type ceramic electronic component and its manufacturing method, as well as electronic device |
| JP2007134389A (en) * | 2005-11-08 | 2007-05-31 | Nec Toppan Circuit Solutions Inc | Printed wiring board, and process of producing same |
| KR101044152B1 (en) * | 2009-10-26 | 2011-06-24 | 삼성전기주식회사 | A printed circuit board and a fabricating method the same |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6120080U (en) * | 1984-07-10 | 1986-02-05 | 株式会社東芝 | multilayer printed wiring board |
| JPS61140573U (en) * | 1985-02-20 | 1986-08-30 | ||
| JPS631383U (en) * | 1986-06-19 | 1988-01-07 | ||
| JPS63155669U (en) * | 1987-03-30 | 1988-10-12 |
-
1988
- 1988-11-17 JP JP63292125A patent/JPH088417B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH02137295A (en) | 1990-05-25 |
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