JPH03122581U - - Google Patents
Info
- Publication number
- JPH03122581U JPH03122581U JP3155190U JP3155190U JPH03122581U JP H03122581 U JPH03122581 U JP H03122581U JP 3155190 U JP3155190 U JP 3155190U JP 3155190 U JP3155190 U JP 3155190U JP H03122581 U JPH03122581 U JP H03122581U
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- hole
- diameter
- board
- multilayer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
Description
第１図は本考案の多層回路基板の実施例に係る
構成を示す断面図、第２図は従来の技術に係る多
層回路基板の配線接続構造を示す断面図である。
１２……フレキシブル回路基板、１２ａ……ス
ルーホール、１２ｂ……銅膜部、１２ｃ……ラン
ド部、１４……リジツト回路基板、１４ａ……ス
ルーホール、１４ｂ……銅膜部、１４ｃ……ラン
ド部、ｍ……半田。
FIG. 1 is a sectional view showing the structure of a multilayer circuit board according to an embodiment of the present invention, and FIG. 2 is a sectional view showing a wiring connection structure of a multilayer circuit board according to the prior art. 12...Flexible circuit board, 12a...Through hole, 12b...Copper film part, 12c...Land part, 14...Rigid circuit board, 14a...Through hole, 14b...Copper film part, 14c...Land Department, m... solder.
Claims (1)
を接合して半田付けの接続を行う多層回路基板の
配線接続構造において、一方の回路基板のスルー
ホールの直径が、前記一方の回路基板より薄い他
方の回路基板のスルーホールの直径より大なる値
に形成され、且つ、一方の回路基板のスルーホー
ルから下方の他方の回路基板のスルーホールに半
田を流入せしめて半田付けすることを特徴とする
多層回路基板。 In the wiring connection structure of a multilayer circuit board in which the through holes of the laminated circuit boards are joined and the connections are made by soldering, the diameter of the through hole of one circuit board is thinner than that of the other circuit board. A multilayer circuit board that is formed to have a diameter larger than the diameter of a through hole in the board, and is soldered by flowing solder from the through hole in one circuit board to the through hole in the other circuit board below. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155190U JPH03122581U (en) | 1990-03-27 | 1990-03-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3155190U JPH03122581U (en) | 1990-03-27 | 1990-03-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03122581U true JPH03122581U (en) | 1991-12-13 |
Family
ID=31534336
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3155190U Pending JPH03122581U (en) | 1990-03-27 | 1990-03-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03122581U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054493A (en) * | 1983-09-05 | 1985-03-28 | 東芝テック株式会社 | Multilayer pattern type printed board |
| JPH02137295A (en) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | Multilayer printed wiring board |
-
1990
- 1990-03-27 JP JP3155190U patent/JPH03122581U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6054493A (en) * | 1983-09-05 | 1985-03-28 | 東芝テック株式会社 | Multilayer pattern type printed board |
| JPH02137295A (en) * | 1988-11-17 | 1990-05-25 | Ibiden Co Ltd | Multilayer printed wiring board |
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