JPH0173971U - - Google Patents
Info
- Publication number
- JPH0173971U JPH0173971U JP1988152828U JP15282888U JPH0173971U JP H0173971 U JPH0173971 U JP H0173971U JP 1988152828 U JP1988152828 U JP 1988152828U JP 15282888 U JP15282888 U JP 15282888U JP H0173971 U JPH0173971 U JP H0173971U
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- holes
- wiring layers
- approximately
- connect
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007747 plating Methods 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Description
第１図は従来の印刷基板に部品を取付け半田付
けすることを説明するための図、第２図は本考案
の第１実施例を示す印刷基板の断面図、第３図・
第４図は本考案の第２・第３実施例を示す図であ
る。
１……貫通孔、２……印刷配線層基板、３……
銅箔、４……銅メツキ、５……半田メツキ、６…
…電気部品、７……接続線、８……半田付け。
Fig. 1 is a diagram for explaining the conventional mounting and soldering of components on a printed circuit board, Fig. 2 is a cross-sectional view of the printed board showing the first embodiment of the present invention, and Fig. 3.
FIG. 4 is a diagram showing second and third embodiments of the present invention. 1...Through hole, 2...Printed wiring layer board, 3...
Copper foil, 4...Copper plating, 5...Solder plating, 6...
...Electrical parts, 7... Connection wires, 8... Soldering.
Claims (1)
いに接続している貫通孔において、印刷配線層の
中間部の少なくとも一部が使用部品接続線の太さ
より約１割小さい直径のものとしたことを特徴と
する印刷配線層の貫通孔。 In the through-holes that connect the printed wiring layers to each other by through-hole plating connections, at least a part of the middle part of the printed wiring layers has a diameter that is approximately 10% smaller than the thickness of the component connecting wire used. Through holes in the printed wiring layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152828U JPH0173971U (en) | 1988-11-24 | 1988-11-24 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988152828U JPH0173971U (en) | 1988-11-24 | 1988-11-24 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0173971U true JPH0173971U (en) | 1989-05-18 |
Family
ID=31428109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988152828U Pending JPH0173971U (en) | 1988-11-24 | 1988-11-24 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0173971U (en) |
-
1988
- 1988-11-24 JP JP1988152828U patent/JPH0173971U/ja active Pending
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH0173971U (en) | ||
| JPH0231800Y2 (en) | ||
| JPS62184727U (en) | ||
| JPH0397958U (en) | ||
| JPS59180470U (en) | Printed circuit board connection structure | |
| JPS596865U (en) | Electrical component | |
| JPS6298254U (en) | ||
| JPS61136576U (en) | ||
| JPS6255367U (en) | ||
| JPS62177075U (en) | ||
| JPS63100872U (en) | ||
| JPH03122581U (en) | ||
| JPH01145171U (en) | ||
| JPS6025168U (en) | Mounting structure for electronic components | |
| JPS6163868U (en) | ||
| JPS63195777U (en) | ||
| JPS5939960U (en) | printed wiring board | |
| JPS63110067U (en) | ||
| JPS6217176U (en) | ||
| JPH0325274U (en) | ||
| JPS63195778U (en) | ||
| JPH0412678U (en) | ||
| JPS59182976U (en) | printed wiring board | |
| JPS6185184U (en) | ||
| JPS62157184U (en) |