JP4626680B2 - Holding member, electronic component, and electronic device - Google Patents

Description

  The present invention relates to a holding member that holds an electronic component such as a connector on a substrate, an electronic component that includes the holding member, and an electronic device that includes the substrate and the electronic component.

Conventionally, a part of a holding member provided in an electronic component is inserted into a through-hole formed in the substrate while being elastically deformed, and the electronic component is held on the substrate by a reaction force (restoring force) due to the deformation of the holding member. A holding structure is known. For example, in Patent Document 1, a holding member is formed by punching a metal plate, printing pressure, and bending, and the fitting is inserted from a pair of first legs that extend in the same direction from the plate-like base and face each other. The portion is inserted into the through-hole while elastically deforming in the plate thickness direction (a direction substantially perpendicular to the thickness direction of the substrate and inward of the through-hole) with the connection end with the parallel portion in the transition portion as a fulcrum. . Then, due to the reaction force (restoring force) against the deformation, the fitting portion contacts (interferences) with the wall surface (inner surface) of the through hole, and thereby the electronic component from the board in the direction to pull out the fitting portion from the through hole. The disconnection is suppressed and the electronic component is held on the substrate. With such a holding structure, the area occupied by the electronic component relative to the board (physical size of the electronic component) can be reduced as compared with screw fastening or the like. Also, the assembly man-hour can be reduced.
JP 2007-128772 A

  However, the holding member shown in Patent Document 1 has a structure in which the insertion portion contacts (locks) with the wall surface of the through hole by a reaction force against its own elastic deformation, and the electronic component is held on the substrate. There is a problem that the proof strength against the external force (the proof strength against pulling) that attempts to pull out the insertion portion from the through hole is low. That is, there is a problem that the holding strength of the electronic component with respect to the substrate is low and the electronic component is easily detached from the substrate.

  In addition, a plated layer is generally formed on the wall surface of the through hole. However, if an attempt is made to improve the resistance to tension, the reaction force (spring property) against the elastic deformation of the fitting portion becomes stronger, so the plated layer is peeled off. It becomes easy. That is, the wall surface of the through hole is easily damaged.

  In view of the above problems, an object of the present invention is to provide a holding member, an electronic component, and an electronic device that can improve the holding strength of the electronic component with respect to the substrate and can reduce damage to the wall surface of the through hole.

  In order to achieve the above object, an invention according to claim 1 includes a base fixed to an electronic component and at least one first leg extending from the base, and the first leg is a substrate. A holding member for holding an electronic component on the surface of the substrate, wherein the first leg is formed integrally with the base by processing the same metal plate, A locking part is provided on the tip side of the one leg part, and the electronic part is fixed to the board, and at least a part thereof is located on the periphery of the opening of the through hole on the back surface of the board, and one end part is engaged. One end is connected to the end of the connecting portion that is connected to the stop portion, and a part of the connecting portion is disposed in the through hole in a fixed state, and the other end is connected to the base portion, and the other end is connected to the base portion. It is placed on the surface of the board in a fixed state, and when inserting the locking part and the connecting part into the through hole, And a spring part that is displaced so that the locking part is inserted into the through hole with respect to the fixed state, and the spring part extends in substantially the same direction as the connecting part, and the extended longitudinal direction and The width in the short direction substantially perpendicular to the plate thickness direction is wider than the plate thickness of the metal plate, and the portion between the connecting end with the connecting portion and the connecting end with the base portion is a flat plate shape before displacement. The plate thickness direction of the flat plate portion is substantially parallel to the direction extending from the connecting portion of the locking portion in the state before displacement.

  As described above, according to the present invention, the holding member has the locking portion that passes through the through hole and is positioned on the periphery of the opening on the back surface of the substrate in the fixed state, and the locking portion is penetrated by the displacement of the spring portion. It passes through the hole and is located on the back side of the substrate. The locking portion is locked to the back surface of the substrate when an external force is applied to pull out the first leg portion from the through hole. Therefore, the strength against pulling is improved as compared with the conventional case, and the holding strength of the electronic component against the substrate can be improved. In other words, at least before soldering, it is possible to make it easier for the electronic component to come off the substrate than before.

  Moreover, the spring part is connected with the edge part on the opposite side to the connection end of the latching | locking part in a connection part. That is, the locking portion and the spring portion are configured at different positions in the first leg portion, and the spring portion is not inserted into the through hole. That is, the spring portion itself does not lock onto the substrate by a reaction force due to deformation. Therefore, the damage to the through-hole wall surface (plated layer formed on the wall surface) can be reduced compared to the conventional configuration in which the spring portion itself is locked to the wall surface of the through-hole by the reaction force of the spring portion. it can. In addition, the degree of freedom in designing the spring portion can be improved.

  Moreover, the width | variety in the transversal direction is made wider than the plate | board thickness of a metal plate, and, thereby, a spring part is displaced to the plate | board thickness direction. The spring portion extends in substantially the same direction as the connecting portion, and the portion between the connecting end with the connecting portion and the connecting end with the base portion is formed into a flat plate shape before displacement, and the plate thickness direction of this flat plate portion Is substantially parallel to the direction in which the locking portion extends from the connecting portion in a state before displacement. In other words, the spring portion extends from the base side toward the surface side of the substrate, and the plate thickness direction of the flat plate portion is substantially parallel to the surface of the substrate before being displaced. As a result, the spring portion is displaced substantially parallel to the direction extending from the connecting portion of the locking portion, in other words, with respect to the substrate on which the electronic component is attached by this holding member, rather than the thickness direction of the substrate. It is displaced in a direction substantially perpendicular to the vertical direction (direction along the substrate surface). As described above, in the present invention, the displacement direction of the spring portion is mainly a direction substantially perpendicular to the thickness direction. Therefore, in the thickness direction of the substrate, rather than the structure in which the spring portion is displaced mainly in the thickness direction of the substrate, The positional accuracy of the electronic component with respect to the substrate can be improved. That is, an electronic component that requires positional accuracy in the thickness direction of the substrate, such as an electronic component in which the terminal mounting portion extending from the main body portion is surface-mounted on a corresponding land on the substrate surface (for example, It is suitable for a connector provided with a terminal having a surface mounting structure.

Specifically, as defined in claim 2, the connecting portion has a width in the short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction that is wider than the plate thickness of the metal plate, and the spring portion. The portion excluding the connecting end is made into a flat plate shape integral with the locking portion, the plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction at the base portion, and the spring portion is , while being bent in one direction side in the thickness direction of the flat plate-like portion of the base portion and connecting portion, with respect to flat plate-like portion of the connecting portion, it is bent in the same direction side as the base, the spring portion tabular The thickness direction of the part is substantially perpendicular to the thickness direction in the base portion before displacement, and is substantially perpendicular to the thickness direction in the flat portion of the connecting portion in the state before displacement. Is preferred.

  According to this, the bending part in a holding member is only the connection part of a base part and a spring part, and the connection part of a spring part and a connection part, and it is not bent in the thickness direction of a board | substrate in each bending part. . Therefore, it is possible to improve the positional accuracy of the electronic component with respect to the substrate in the thickness direction of the substrate while reducing the number of bent portions and simplifying the structure of the holding member. Moreover, it is also possible to bend | fold simultaneously the connection site | part of a base part and a spring part, and the connection site | part of a spring part and a connection part.

  In addition, since the locking part is formed in a flat plate shape integral with the connecting part, and the locking part is formed only by punching, the locking part is formed by bending (the bent part is associated with the connecting part. Compared to the configuration (including the connection portion with the stop portion), the strength of the locking portion can be improved against deformation and breakage. Thereby, the holding | maintenance strength of the electronic component with respect to a board | substrate can further be improved.

  According to a third aspect of the present invention, the first leg portion may have a pair of first leg portions extending in the same direction from the base portion. According to this, the holding strength of the electronic component with respect to the substrate can be improved as compared with the configuration having only one first leg portion.

  Specifically, as described in claim 4, each connecting portion of the pair of first legs has a width in the short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction of the metal plate. It is wider than the plate thickness, and the portion excluding the connecting end with the spring portion is a flat plate integrated with the locking portion, and the plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction at the base, Each spring part is bent at substantially the same angle on the same surface side of the base part with respect to the base part and the connecting part, and the thickness direction of each flat plate portion is substantially perpendicular to the thickness direction of the base part before displacement. It is preferable to adopt the configuration described above. Since the effect of this invention is the same as the effect similar to the invention of Claim 2, the description is abbreviate | omitted.

  As described in claim 5, each locking portion may be configured to be at the same position as the base portion at least before displacement in the thickness direction of the base portion. Each locking portion may have a position shifted from each other by at least the plate thickness difference in the thickness direction of the base portion at least before the displacement.

  In the former case, since at least the portions excluding the locking portions in the pair of first leg portions have a symmetrical structure, the configuration of the first leg portion can be simplified and formed with high accuracy. In the latter case, contact between the engaging portions and the connecting portions can be prevented when the through hole is inserted.

  According to a seventh aspect of the present invention, the first portion extending in the same direction as the first leg portion from the base portion is disposed between the pair of first leg portions and is inserted into a through hole different from the first leg portion in the substrate. Two leg portions are further provided, and the second leg portion is formed integrally with the base portion and the first leg portion by processing the same metal plate, and is substantially in the extending longitudinal direction and the plate thickness direction. The width in the vertical short side direction is wider than the plate thickness of the metal plate, and has a flat plate-like portion that extends from the base and is inserted into the through hole at the tip side. It is good also as a structure made substantially parallel to the plate | board thickness direction.

  According to this, the plate | board thickness direction of the flat part in a 2nd leg part is substantially parallel to the plate | board thickness direction in a base. Therefore, even if an external stress is applied in the plate thickness direction of the spring portion, rattling of the holding member can be suppressed by the second leg portion inserted into the through hole.

  As described in claim 8, it is preferable that the distal end position of the flat plate-like portion in the second leg portion is a position farther from the base portion than the distal end position of the locking portion. According to this, since the second leg portion can be inserted into the through hole of the substrate before the first leg portion, each of the pair of first leg portions can be easily inserted into the corresponding through hole by this positioning effect. It becomes possible to insert.

  According to a ninth aspect of the present invention, the flat part may have an insertion part inserted into the through-hole, a connection part that connects the insertion part and the base part, and a holding part that is wider than the insertion part.

  According to this, the insertion portion is inserted into the through hole, and the end surface on the insertion portion side of the holding portion is brought into contact with the surface of the substrate in a state where the engaging portion is positioned on the peripheral portion of the through hole on the back surface of the substrate. Can do. Therefore, shakiness of the electronic component with respect to the substrate can be reduced. Moreover, the holding strength of the electronic component with respect to the board | substrate can further be improved by soldering the end surface of a holding part to the corresponding dummy land provided in the board | substrate surface.

  According to a tenth aspect of the present invention, it is preferable that the width of the spring portion in the short direction is wider on the connecting end side with the base than on the connecting end side with the connecting portion. In the spring part, the stress is more likely to concentrate at positions farther from the connecting end with the connecting part. However, according to the above configuration, the stress is dispersed throughout the entire spring part to suppress the stress concentration on the connecting end side with the base part. That is, plastic deformation of the spring portion can be suppressed.

Flat plate-like portion of the planar shape of the spring portion, as described in claim 11, may be configured that is a substantially U-shape, as described in claim 12, folded portion which end faces are adjacent It is good also as a structure made into the shape which has.

  In the former case, the configuration of the spring portion (first leg portion) can be simplified while suppressing contact between the spring portion and the connecting portion. In the latter case, the spring force can be made weaker than the former by increasing the spring length. In this case, if the applied force is the same, the amount of displacement (stroke) of the spring portion increases, so that the length of the locking portion can be increased. That is, it is difficult to release the locked state by the locking portion, and it is possible to suppress the first leg portion from coming off from the through hole (the electronic component coming from the board).

Next, the invention according to claim 13 is made of a conductive material, and is electrically connected to a land of the substrate, a main body provided with the terminal, and the main body provided with a through hole. An electronic component including a holding member for holding on the surface of the formed substrate, wherein the holding member includes a base fixed to the main body, and at least one extending from the base and inserted into the through hole. The first leg is formed integrally with the base by processing the same metal plate, is provided on the distal end side of the first leg, and is fixed to the substrate. In a fixed state, at least a part of the locking part is located on the periphery of the opening of the through hole on the back surface of the substrate, and one end is connected to the locking part, and a part is disposed in the through hole in the fixed state. One end is connected to the end of the connecting portion opposite to the engaging portion in the connecting portion, and the other end is connected to the base. It is arranged on the surface of the substrate in a fixed state, and at the time of inserting the engaging portion and the connecting portion into the through hole, the connecting portion is inclined with respect to the fixed state and the engaging portion is inserted into the through hole. The spring portion extends in substantially the same direction as the connecting portion, and the width of the metal plate is a width in the short direction substantially perpendicular to the extended longitudinal direction and the plate thickness direction. The portion between the connecting end with the connecting portion and the connecting end with the base portion is wider than the thickness and is flat before the displacement, and the thickness direction of the flat portion is related to the state before the displacement. It is characterized by being substantially parallel to the direction extending from the connecting portion of the stop portion.

  As described above, the electronic component of the present invention includes the above-described holding member. Since the function and effect are the same as those of claim 1, the description thereof is omitted.

In addition, since the effect of the invention described in claim 14 is the same as that of the invention described in claim 2, the description is omitted.

According to a fifteenth aspect of the present invention, the holding member is disposed on at least one of the longitudinal ends of the main body so that the thickness direction of the base is substantially parallel to the longitudinal direction, and the spring portion is folded with respect to the base. It is good to set it as the structure by which the bending direction was made into the opposite side to the center side of the main-body part in a longitudinal direction .

According to this, according to this, in the thickness direction of the board, the spring portion that is closer to the mounting portion than the base portion is based on the mounting portion of the terminal with the land in the longitudinal direction of the connector from the base portion. Is also on the outer side in the longitudinal direction (the side opposite to the center side of the main body) . Therefore, considering the draft angle from the mold of the main body formed by, for example, resin injection molding, the size of the electronic component in the longitudinal direction of the main body can be reduced.

The surface mounting type in which a surface mounting portion that is surface-mounted on the land of the substrate is provided as a plurality of terminals at the distal ends of the extending portions extending from the main body portion to the outside as the plurality of terminals. It is suitable for a configuration including a terminal.

  In the case of a surface mount type terminal, since the surface mount portion is disposed on a corresponding land on the substrate surface and connected to the land via solder, positional accuracy in the thickness direction of the substrate is required. However, according to the above-described invention, an electronic component including such a surface mount type terminal can be accurately positioned with respect to the substrate. The surface mount type terminal may be any of a terminal having only a surface mount portion and a branched terminal having both an insertion mount portion and a surface mount portion inserted into a through hole of the substrate.

As described in claim 17 , the planar shape of the main body portion along the surface of the substrate is a shape that is long in one direction, and the surface mounting portions in the plurality of surface mount terminals are substantially perpendicular to the length of the main body portion. The surface mounting portion may be arranged in multiple stages between the engaging portions of the pair of first leg portions in a direction that is arranged in multiple stages in a direction substantially perpendicular to the length of the main body.

  According to this, even when an external stress is applied to the main body portion in such a manner that the electronic component is inclined in a direction substantially perpendicular to the length of the main body portion with the electronic component mounted on the substrate, The stress acts on the first leg portion outside the surface mounting portion of the terminal. Therefore, the connection reliability at the connection portion between the terminal and the corresponding land can be improved.

  In addition, when rattling occurs in the pair of first leg portions in the thickness direction of the substrate, the inclination of the electronic component with respect to the substrate becomes smaller as the interval between the locking portions (joining portions) becomes wider. In the above-described invention, the surface mounting portions are arranged in multiple stages between the locking portions of the pair of first leg portions, and the interval between the locking portions is secured. The inclination of the electronic component can be reduced as compared with the configuration in which the surface mounting portion is located outside the portion.

In addition, as described in claim 18 , the connecting portion has a flat plate-like shape so that the end face of the predetermined range from the connecting end with the spring portion is located on the peripheral portion of the through hole on the substrate surface. The position of the end surface where the bottom surface of the surface mounting portion of the surface mounting type terminal contacts the substrate surface in the connecting portion in the thickness direction of the substrate in a state before the portion is substantially L-shaped and fixed to the substrate It is good also as a structure located in the latching | locking part side rather than.

  In the thickness direction of the substrate, the positions of the surface mounting portions of the plurality of surface mounting terminals vary somewhat. That is, the position of the surface mounting portion varies within a tolerance range. In addition, in the state where the electronic component is assembled to the substrate, there is some variation in the gap between the locking portion of the first leg portion and the back surface of the substrate. That is, the position of the locking portion varies with respect to the back surface of the substrate within a tolerance range. As described above, since there is a variation in position between the surface mounting portion and the locking portion, rattling of the electronic component occurs with respect to the substrate.

  On the other hand, in the present invention, in the thickness direction of the substrate, the bottom surface of the surface mounting portion is positioned closer to the locking portion than the position of the end surface in contact with the substrate surface in the connecting portion. In this configuration, when the electronic component is assembled to the substrate by the holding member, at least a part of the surface mounting portion comes into contact with the substrate surface before the locking portion penetrates the through hole. However, since the extended portion of the terminal extending from the main body portion to the outside is elastically deformed, the locking portion can be disposed on the back side of the substrate in a state where the surface mounting portion is in contact with the surface of the substrate. That is, in the state where the electronic component is assembled to the substrate by the holding member, the variation in the position of the surface mounting portion in the thickness direction of the substrate can be reduced from the above tolerance. Thereby, the shakiness of the electronic component in the thickness direction of a board | substrate can be suppressed.

Next, the invention as set forth in claim 19 is a substrate in which lands and through holes are formed, a plurality of terminals made of a conductive material and electrically connected to the lands, and a main body provided with the terminals. And an electronic component having a holding member that holds the main body portion on the surface of the substrate, and the electronic component is mounted on the substrate, the holding member including a base portion fixed to the main body portion, And at least one first leg portion that extends from the base portion and is inserted into the through hole. The first leg portion is formed integrally with the base portion by processing the same metal plate. A locking part is provided on the tip side of the one leg part, and the electronic part is fixed to the board, and at least a part thereof is located on the periphery of the opening of the through hole on the back surface of the board, and one end part is engaged. A connecting part that is connected to the stop part and is partly disposed in the through hole in a fixed state, and a connecting part. One end is connected to the end opposite to the locking portion and is arranged on the surface of the substrate in a fixed state, and the connecting portion is fixed when the locking portion and the connecting portion are inserted into the through hole. And a spring part that is displaced so that the locking part is inserted into the through hole. The spring part extends in substantially the same direction as the joint part, and the longitudinal direction and the plate thickness direction in which the spring part extends. The width in the lateral direction substantially perpendicular to the width of the metal plate is wider than the thickness of the metal plate, and the portion between the connecting end with the connecting portion and the connecting end with the base portion is formed into a flat plate shape before displacement, The thickness direction of the flat plate portion is substantially parallel to the direction extending from the connecting portion of the locking portion in the state before displacement.

  Thus, the electronic device of the present invention includes the above-described holding member (electronic component). Since the function and effect are the same as those of claim 1, the description thereof is omitted.

In the inventions described in claims 20 and 21 , the functions and effects thereof are the same as those of the inventions described in claims 2 and 3, respectively, and therefore description thereof is omitted.

According to a twenty- second aspect, the pair of first leg portions may be inserted into through holes at different positions on the substrate. According to a twenty- third aspect of the present invention, the through hole is a long hole whose opening is long in one direction along the surface of the substrate, and the engaging portions of the pair of first leg portions are in the longitudinal direction of the through hole. It is good also as a structure which is extended from a connection part along an extension direction and is made into the opposite direction mutually, and is located on the opening periphery of the longitudinal side of the through-hole in a substrate back surface.

  In the former case, the play of the first leg portion (joining portion) with respect to the through hole is small compared to the configuration in which the pair of first leg portions are inserted together in one through hole. Can be suppressed. Further, it is possible to make it difficult to release the locked state of the locking portion. In the latter case, the pair of first legs are inserted into one through-hole, but the electronic parts are not rattled with respect to the board as compared with a structure in which the locking portions extend in the same direction. Can be suppressed. Further, it is possible to make it difficult to release the locked state of the locking portion.

As described in claim 24 , a dummy land that is made of a metal material and does not provide an electrical connection function is provided at least on the surface around the corresponding through-hole of the substrate on which the electronic component is mounted, The connecting part has a substantially L-shaped flat part, and the end face of the part within a predetermined range from the connecting end with the spring part is arranged on the dummy land and connected to the dummy land via solder. Also good.

  According to this, a part of the connecting portion is connected to the dummy land on the substrate surface via the solder, that is, the holding member is surface-mounted on the substrate, so that the holding strength of the electronic component to the substrate is improved. Can do. Further, when a terminal that is reflow-mounted on a corresponding land such as a surface-mounted terminal is provided, the mounting of the terminal and the connecting portion can be performed in the same process.

According to a twenty-fifth aspect , the holding member extends in the same direction as the first leg portion from the base portion and is disposed between the pair of first leg portions, and is formed in a through hole different from the first leg portion in the substrate. The second leg portion is inserted, and the second leg portion is formed integrally with the base portion and the first leg portion by processing the same metal plate, and extends in the longitudinal direction and the plate thickness direction. The width in the perpendicular direction is wider than the thickness of the metal plate, and has a flat part extending from the base and inserted into the through hole at the tip side. This flat part is inserted into the through hole. The insertion portion to be connected, and the insertion portion and the base are connected, the holding portion is wider than the insertion portion, and the thickness direction of the insertion portion is substantially parallel to the thickness direction of the base portion, The surface around the corresponding through-hole of the board and on which at least the electronic component is mounted is made of a metal material and is electrically connected. Function dummy land that does not provide, there are provided as holding portions, the end surface of the insertion portion side is disposed on the dummy land, may be connected to each dummy land through the solder.

  Also in this case, since a part of the holding part in the second leg part is connected to the dummy land on the board surface via the solder, that is, the holding member is surface-mounted on the board, the holding strength of the electronic component to the board Can be improved. Further, when a terminal that is reflow-mounted on a corresponding land such as a surface-mounted terminal is provided, the mounting of the terminal and the mounting of the holding portion can be performed in the same process.

Hereinafter, embodiments of the present invention will be described with reference to the drawings.
(First embodiment)
FIG. 1 is an exploded view for explaining a schematic configuration of the electronic control device according to the first embodiment. FIG. 2 is a plan view of the periphery of the mounting portion in a state where the connector is mounted on the substrate. In FIG. 2, a part of the main body portion of the connector is indicated by a broken line, and terminals and holding members at the lower portion of the main body portion are illustrated. FIG. 3 is a partial cross-sectional view taken along line III-III in FIG. FIG. 4 is a plan view of FIG. 3 viewed from the back side of the substrate. FIG. 5 is a perspective view showing a schematic configuration of the holding member. FIG. 6 is an enlarged partial cross-sectional view of the periphery of the through hole of the substrate into which the first leg portion is inserted. 6 and 8, only one of the pair of first legs is shown for convenience. FIG. 7 is a development view of the holding member for explaining the manufacturing method. FIG. 8 is an enlarged view of the vicinity of the connecting portion in FIG. FIG. 9 is a plan view showing a position where solder is applied to the substrate. FIG. 10 is a partial cross-sectional view showing when the first leg portion is inserted into the through hole. In FIG. 10, the land of the substrate is omitted for convenience. 3, 6, and 10, the holding member is in a plan view.

  In the present embodiment, as shown in FIG. 1, the thickness direction of the substrate is shown as the vertical direction, and as shown in FIG. 2, the terminal arrangement direction in the housing (in other words, the longitudinal direction of the housing) is changed to the left and right. The direction orthogonal to the direction, the vertical direction, and the horizontal direction (in other words, the short direction of the housing) is indicated as the front-rear direction.

  In the embodiment described below, the holding member is mainly characterized, but the holding member will be described together with the connector and the electronic device having the holding member. The electronic device shown in the present embodiment is a non-waterproof electronic control device, and is used, for example, as an engine ECU (Electric Control Unit) of a vehicle.

  The electronic control device 1 shown in FIG. 1 includes a circuit board 30 in which an electronic component 32 is mounted on a board 31, and a connector 50 having a terminal 51, a housing 52, and a holding member 60. In addition to the above elements, the present embodiment includes a housing 10 that houses the circuit board 30 and the connector 50.

  The housing 10 is made of a metal material such as aluminum or iron, or a resin material, and accommodates the circuit board 30 and a part of the connector 50 therein. The number of constituent members of the housing 10 is not particularly limited, and may be configured from one member or a plurality of members. In the present embodiment, as shown in FIG. 1, it is constituted by two members, a box-shaped case 11 with one side opened and a shallow cover 12 with a substantially rectangular plate shape that closes the open surface of the case 11. Has been. The case 11 and the cover 12 are assembled to form the housing 10 having an internal space for accommodating the circuit board 30 and the connector 50. The housing 10 (case 11) is provided with a connector notch (not shown) corresponding to the connector 50, and the case 11 and the cover 12 are assembled so as to accommodate the circuit board 30 (for example, In a state where the screw is fastened), a part of the circuit board 30 and the connector 50 (including the connection side of the terminal 51 to the circuit board 30) is accommodated in the housing 10, and the remaining part of the connector 50 (external to the terminal 51) (Including the connection side with the connector) is exposed outside the housing 10.

  As shown in FIG. 1, a circuit board 30 has electronic components 32 such as a microcomputer, a power transistor, a resistor, a capacitor, etc. formed on a board 31 formed with wiring including lands as electrodes and via holes connecting the wirings. It is implemented. In the present embodiment, a connector 50 that electrically connects the circuit board 30 and the outside is mounted on the board 31 as one of the electronic components 32. The connector 50 corresponds to the electronic component described in the claims. As shown in FIG. 2, a plurality of lands 33 are provided on the surface 31 a of the substrate 31 not only in the left-right direction but also in the front-rear direction. The lands 33 are arranged on the lands 33. The mounting portion of the terminal 51 to be connected is connected via solder (not shown).

  Further, the substrate 31 is provided with through holes 34 at a total of four locations, two locations between both ends of the connector 50 so as to sandwich the lands 33 in the left-right direction. The first leg 62 of the holding member 60 is inserted into the through hole 34 as shown in FIG. The cross-sectional shape of the through hole 34 is not particularly limited. In the present embodiment, as shown in FIG. 4, the through-hole 34 is a long hole having a substantially elliptical cross section in which the length in the front-rear direction is long with respect to the left-right direction and the diameter in the front-rear direction is D. As shown in FIGS. 3 and 4, a pair of first leg portions 72 and 82 are inserted into one through hole 34. As shown in FIGS. 3, 4, and 7, dummy lands 35 that do not provide an electrical connection function are formed around the through hole 34 by patterning or plating the conductive foil. As shown in FIG. 6, the first leg portion 62 (72, 82) is connected to the dummy land 35 via the solder 36. In FIG. 6, only the first leg portion 72 is shown, but the same applies to the first leg portion 82. In the present embodiment, the dummy land 35 includes a surface portion 35 a provided around the opening of the through hole 34 on the surface 31 a of the substrate 31, a wall surface portion 35 b provided on the wall surface of the through hole 34, and a through hole on the back surface 31 b of the substrate 31. It has a back surface portion 35 c provided around the opening of the hole 34 and an inner layer portion 35 d provided in the inner layer of the substrate 31. And as shown in FIG. 6, the solder 36 is arrange | positioned on the surface part 35a and the wall surface part 35b in the dummy land 35, and the connection part 74 is connected. In FIG. 6, only the first leg portion 72 is shown, but the same applies to the first leg portion 82. The dummy lands 35 having the above-described configuration are provided for all the through holes 34. Thus, if all the dummy lands 35 have a common structure, the variation in the thickness of the substrate 31 at the formation site of the dummy lands 35 can be reduced, so that rattling of the connector 50 with respect to the substrate 31 is suppressed. be able to.

  The connector 50 is formed by arranging a plurality of terminals 51 made of a conductive material along a surface 31a of the substrate 31 with respect to a housing 52 made of an electrically insulating material (resin in this embodiment). The housing 52 corresponds to a main body described in the claims. As for the terminal 51, the front-end | tip of one edge part extended from the front surface 52a of the housing 52 is arrange | positioned on the land 33 corresponding as a mounting part, and is electrically connected through the solder which is not shown in figure. The other end portion extended from the rear surface of the housing 52 is exposed to the outside of the housing 10 and is electrically connected to an external connector. That is, in the present embodiment, as the terminal 51, a surface mounting structure terminal 51 having only a surface mounting portion as a mounting portion with the land 33 is employed. As shown in FIG. 2, the terminal 51 having such a surface mounting structure includes a signal terminal 51a for signal transmission and a power terminal 51b for power transmission that is thicker than the signal terminal 51a. These terminals 51 are partially held so that the planar shape along the surface 31a of the substrate 31 does not interfere with the substantially rectangular housing 52 that is long in the left-right direction as one direction. Are arranged along the left-right direction.

  Further, as shown in FIG. 3, there are four groove portions 52c for the holding member 60 from the front surface 52a to the rear surface side, as shown in FIG. Is formed. A holding member 60 is inserted into each groove portion 52c from the front surface 52a toward the rear surface side, whereby the holding member 60 is fixed to the housing 52 and eventually to the connector 50, which is an electronic component. The housing 52 according to the present embodiment has a two-stage structure in the front-rear direction, and reference numeral 52 d shown in FIGS. 1 to 3 denotes a rear stage part including a fitting part with an external connector in the housing 52, Reference numeral 52e denotes a front stage portion including the front surface 52a. The groove 52c opens over the front surface 52a and the lower surface of the front step portion 52e, and extends from the front step portion 52e and the rear step portion 52d.

  The holding member 60 is inserted into the through hole 34 of the substrate 31 to make it difficult for the connector 50, which is an electronic component, to be detached from the substrate 31. That is, the connector 50 is held on the surface 31 a of the substrate 31. As shown in FIG. 5, the holding member 60 has a base portion 61 and a first leg portion 62 that are integrally formed by processing a metal plate having a plate thickness T.

  The base 61 is a fixed portion of the holding member 60 to the housing 52. In the present embodiment, the base portion 61 has a flat plate shape that is inserted into and fixed to a groove portion 52 c that opens to the front surface 52 a side of the housing 52. As shown in FIG. 5, the base 61 includes an L-shaped portion 61a extending in the front-rear direction and the up-down direction, and a rear surface of the housing 52 further from a front end on the rear surface side of the portion extending in the front-rear direction of the L-shaped portion 61a. And a T-shaped portion 61c extending in the front-rear direction from the tip of the lower surface facing the substrate 31 in the portion extending in the vertical direction of the L-shaped portion 61a. The base 61 is inserted and fixed in the groove 52c of the housing 52 with the bifurcated portion 61b as the head and the T-shaped portion 61c as the lower side. In this fixed state, the position of the end surface on the front surface 52a side in the L-shaped portion 61a of the base 61 is substantially flush with the front surface 52a of the housing 52 or on the rear surface side of the housing 52 relative to the front surface 52a. A first leg 62 extends downward (toward the substrate 31) with respect to the base 61.

  The first leg 62 is a part that functions to hold the connector 50 on the surface 31 a of the substrate 31, and a part thereof is inserted into the through hole 34 of the substrate 31. In the present embodiment, as the first leg portion 62, a pair of first leg portions 72 and 82 are extended in the same direction (downward) from the respective front and rear end portions of the T-shaped portion 61 c of the base portion 61. ing.

  Of the first legs 72 and 82, one first leg 72 is provided on the distal end side (lower distal end side) of the first leg 72 and the connector 50 is held by the substrate 31. 31 has a locking portion 73 at least partially located on the periphery of the opening of the through-hole 34 on the back surface 31b of 31. The locking portion 73 is connected to one end of a connecting portion 74 that is partly disposed in the through hole 34 in the holding state. Further, the other end of the connecting portion 74 is disposed on the surface 31a of the substrate 31 in a holding state, and the connecting portion 74 is fixed when the engaging portion 73 and the connecting portion 74 are inserted into the through hole 34. A spring portion 75 that is tilted with respect to the displacement portion so that the locking portion 73 is inserted into the through hole 34 is connected. The spring portion 75 has a width W in the short side direction wider than a plate thickness T of the metal plate, and thereby elastically deforms in the plate thickness direction. Moreover, the spring part 75 is extended in the substantially same direction as the connection part 74, and the site | part between the connection end with the connection part 74 and the connection end with the base part 61 is made into a flat form in the state before a displacement, and this flat plate. The plate thickness direction of the shaped portion is substantially parallel to the direction in which the locking portion 73 extends from the connecting portion 74 in a state before displacement. The end of the spring portion 75 opposite to the connecting end with the connecting portion 74 is connected to the base 61. The short direction is a direction substantially perpendicular to the longitudinal direction (the direction in which the spring portion 75 extends) that connects the base portion 61 and the connecting portion 74 in a plane that is substantially perpendicular to the plate thickness direction in the flat plate portion. .

  In the present embodiment, the spring portion 75 has a width W in the short-side direction that is substantially constant in the longitudinal direction, and a flat plate portion connects the parallel portions 75a and 75b facing each other and the parallel portions 75a and 75b. It has a substantially U-shape in a plane having a straight line portion 75c that is longer than the parallel portions 75a and 75b. And the front-end | tip of the parallel part 75a is connected with the front end part in the T-shaped part 61c of the base 61, the front-end | tip of the parallel part 75b is connected with the connection part 74, and is the same with respect to the flat base 61 and the connection part 74 It is bent approximately 90 ° to the side. If the spring portion 75 does not contact the base portion 61 or the connecting portion 74 even when displaced, a configuration without the parallel portions 75a and 75b may be employed.

  The connecting portion 74 is formed in a flat plate shape with the locking portion 73 being integrated, except for the connecting end with the spring portion 75, and the plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base portion 61. It has become. As a result, the plate thickness direction of the spring portion 75 is substantially parallel to the direction in which the locking portion 73 extends from the connecting portion 74 in the state before displacement, and the plate thickness direction in the base portion 61 and the plate in the connecting portion 74. It is substantially perpendicular to the thickness direction. More specifically, the lengths extending from the straight portions 75c of the parallel portions 75a and 75b are made substantially equal, whereby the connecting portion 74 and the locking portion 73 that are formed as an integral flat plate and the flat base 61 are formed. In the thickness direction of the base 61, the base 61 is at the same position at least before being displaced.

  Further, as shown in FIG. 5, the connecting portion 74 has a width X in the short direction wider than the plate thickness T of the metal plate, and the plate thickness direction is substantially the same as the plate thickness direction of the spring portion 75 as described above. It is vertical. Thereby, it is rigid so that it hardly deforms at the time of insertion of the locking portion 73 and the connecting portion 74 into the through hole 34. In addition, the flat portion of the connecting portion 74 has a substantially L-shaped plane, and the length of the longitudinal portion 74 a of the substantially L-shaped connecting portion 74 extending in the vertical direction is such that at least the locking portion 73 is the back surface of the substrate 31. The short portion 74b and the spring portion 75 of the substantially L-shaped connecting portion 74 have a length that does not contact the surface 31a of the substrate 31 until it is positioned on 31b. The short direction of the connecting portion 74 is a longitudinal direction (direction in which the connecting portion 74 extends) connecting the spring portion 75 and the locking portion 73 in a plane substantially perpendicular to the plate thickness direction in the flat plate portion. It is a substantially vertical direction.

  The locking portion 73 extends from the lower end of the longitudinal portion 74a in the front (rear) direction with respect to the substantially L-shaped connecting portion 74. In other words, the locking portion 73 extends substantially parallel to the direction in which the short portion 74b of the substantially L-shaped connecting portion 74 extends. The direction extending from the connecting portion 74 of the locking portion 73 is substantially parallel to the back surface 31b (front surface 31a) of the substrate 31, as shown in FIG. The locking portion 73 has a so-called wedge shape whose width in the vertical direction becomes narrower as it approaches the tip of the corner portion away from the connecting portion 74 in the front-rear direction from the connecting end side with the connecting portion 74, at least. A part is located on the back surface 31b of the board | substrate 31 in the holding | maintenance state (facing).

  In this embodiment, as shown in FIG. 6, the portion 73 a facing the back surface 31 b of the substrate 31 in the wedge-shaped locking portion 73 moves up and down in the holding state as it moves away from the corresponding connecting portion 74 in the front-rear direction. In the direction, it is tapered away from the surface 31 a of the substrate 31. With such a configuration, even when manufacturing variation or assembly variation occurs in the holding member 60, the substrate 31, the housing 52, or the like within a tolerance range in the vertical direction, the engaging portion 73 of the substrate 31 is held in the holding state. It can be locked to the back surface 31b. In particular, in the embodiment shown in the present embodiment, the substrate side end surface of the short portion 74b of the connecting portion 74 (and the substrate side end surface of the parallel portion 75b in the substantially U-shaped spring portion 75) is in contact with the surface 31a of the substrate 31. Therefore, the substrate 31 is sandwiched between the short portion 74 b and the locking portion 73. Therefore, rattling between the substrate 31 and the connector 50 can be suppressed compared to a configuration in which the facing portion 73a is substantially parallel to the back surface 31b of the substrate 31. In addition, the holding member 60 having the same configuration can be a common member for substrates 31 having different thicknesses (a plurality of types of substrates 31 having different thicknesses).

  Further, the corners of the locking portions 73 and 83 may have a square shape (an angle of 90 ° or less), but in this case, when the first leg 62 (72, 82) is inserted into the through hole 34, When the locking portions 73 and 83 penetrate the through hole 34, at least a part of the locking portions 73 and 83 penetrates and moves outward from the through hole 34 by the reaction force (restoring force) of the spring portions 75 and 85. Accordingly, the corners may damage the wall surface of the through hole 34. In particular, as shown in the present embodiment, in the configuration in which the dummy land 35 (wall surface portion 35b) made of plating is provided on the wall surface of the through hole, The part 35b may be scraped off. Therefore, in the present embodiment, as shown in FIG. 6, in the front-rear direction, the corner 73 b that is the farthest position from the through hole 34 in the holding state in the holding portion 73 has a rounded shape. Yes. With such a configuration, the pressure applied to the wall surface of the through hole 34 is reduced, and damage to the wall surface of the through hole due to the corner portion 73b can be suppressed. In addition to the rounded shape, the same effect can be expected by adopting polygonal locking portions 73 and 83 formed by connecting a plurality of angles larger than 90 °. In FIG. 6, only the locking portion 73 is illustrated, but the locking portion 83 has the same configuration. Furthermore, damage to the wall surface of the through-hole can also be suppressed by making the outer peripheral shape along the substrate surface 31a at the corners of the locking portions 73 and 83 arc. Moreover, when the connection parts 74 and 84 contact | connect a through-hole wall surface, it is good also considering the end surface facing the through-hole wall surface in the connection parts 74 and 84 as an arc shape.

  On the other hand, the first leg portion 82 extends from the base portion 61 in the same direction as the first leg portion 72, and has a locking portion 83, a connecting portion 84, and a spring portion 85, like the first leg portion 72. The first leg portion 72 (72, 82) extends from the base portion 61 in a line symmetric shape with the first leg portion 72 in the extending direction. Therefore, the detailed description of the first leg portion 82 is omitted.

  In the present embodiment, the engaging portions 73 and 83 of the pair of first leg portions 72 and 82 have directions opposite to each other extending from the corresponding connecting portions 74 and 84. Specifically, as shown in FIG. 4, with respect to the through-hole 34 having a substantially elliptical cross section that is long in the front-rear direction, the locking portion 73 is provided on the back surface 31 b of the substrate 31 on one end side in the longitudinal direction (front-rear direction) of the through-hole 34. , And the locking portion 83 is positioned on the back surface 31b of the substrate 31 on the other end side. Further, in the pair of first leg portions 72 and 82, the width X in the short direction of the connecting portions 74 and 84 is the width (inner diameter) D of the through hole 34 in the front-rear direction in which the locking portions 73 and 83 are locked. The length is shorter than half of the length, and the length is such that the first legs 72 and 82 do not come into contact with each other when inserted into the through hole 34. As shown in FIG. 3, the width P between the outer portions of the connecting portions 74 and 84 in a state where the spring portions 75 and 85 are not displaced is shorter than the width D of the through hole 34. That is, in a state where a part of the locking portions 73 and 83 are located on the back surface 31 b of the substrate 31, the connecting portions 74 and 84 are not in contact with the wall surface of the through hole 34, and face the outer portion of the connecting portions 74 and 84. There is a gap between the wall and the wall.

  In this embodiment, as shown in FIG. 2, a total of four holding members 60 are fixed to the housing 52 of the connector 50, two on the left side and two on the right side with respect to the center of the housing 52 in the left-right direction. There are two symmetrical arrangements. Each holding member 60 is arranged so that the plate thickness direction of the base portion 61 is substantially parallel to the longitudinal direction of the housing 52 at the end portion 52 b in the longitudinal direction of the housing 52, and the spring portions 75 and 85 with respect to the base portion 61. The bending direction is the outer side of the end 52b on the near side in the housing 52.

  Such a holding member 60 can be formed by punching a flat metal plate having a thickness T and bending it partially. Specifically, a flat metal plate is first punched into the shape shown in FIG. At this stage, the spring portions 75 and 85, the connecting portions 74 and 84, and the locking portions 73 and 83 are configured in the same plane as the base portion 61. The flat broken line shown in FIG. 7 is bent with respect to the flat holding member 60 so that the lengths of the parallel portions 75a and 75b from the straight portion 75c are substantially equal at the flat portion of the spring portion 75. As a position, the spring portion 75 is bent approximately 90 ° on the same side with respect to the base portion 61, the connecting portion 74, and the locking portion 73. Moreover, in the flat part of the spring part 85, the spring part 85 is used as a base part with the straight broken line shown in FIG. 7 as a bending position so that the lengths of the parallel parts 85a and 85b from the straight part 85c are substantially equal. 61, the connecting portion 84, and the locking portion 83 are bent by approximately 90 ° toward the side closer to the spring portion 75 (for example, both sides closer to the paper surface). In the present embodiment, the lengths of the two spring portions 75 and 85 are substantially equal. Thus, the holding member 60 shown in FIG. 5 can be formed by punching one metal plate into a predetermined shape and bending each of the spring portions 75 and 85. Thus, in this embodiment, the latching | locking parts 73 and 83 are formed only by the punching process, without bending.

  In addition, if a metal member is bent, a convex part will be formed in a bending site | part. Therefore, in the present embodiment, as illustrated in FIG. 8, when the metal plate is punched, the recess 76 is formed in the portion on the substrate 31 side in the connecting portion 74 b of the connecting portion 74 and the parallel portion 75 b of the spring portion 75. Is previously formed. Thereby, when the spring part 75 is bent, it can suppress that a convex part arises in the said connection part. And the board | substrate side end surface in the short part 74b of the connection part 74 can be arrange | positioned on the surface 31a of the board | substrate 31 substantially parallel. 8 illustrates only the first leg portion 72 side, the first leg portion 82 has the same configuration.

  Next, a method for holding the connector 50 on the substrate 31 by the holding member 60 will be described. In the present embodiment, a terminal having a surface mounting structure connected to the land 33 formed on the surface 31 a of the substrate 31 is used as the terminal 51, and the holding member 60 is also reflow soldered together with the terminal 51. Thus, when the holding member 60 is reflow-mounted together with the terminals 51, the holding member 60 can be firmly fixed to the substrate 31, and the manufacturing process is simplified by sharing the mounting process with other electronic components. be able to.

  First, the base portion 61 of the holding member 60 described above is inserted and fixed in a groove portion 52 c provided in the housing 52 of the connector 50. Then, before mounting the connector 50 to which the holding member 60 is fixed on the substrate 31, solder paste is applied to the lands 33 and the dummy lands 35 by screen printing or the like. Here, when the solder paste is disposed in advance in the through hole 34 (on the wall surface portion 35b of the dummy land 35), the solder paste in the through hole 34 is inserted when the first leg 62 (72, 82) is inserted. There is a risk that the solder paste will fall by being pushed to the back surface 31b side. Further, when the engaging portions 73 and 83 are positioned around the through hole 34 in the back surface 31b of the substrate 31 due to the reaction force of the spring portions 75 and 85, the solder paste may be blown off. And there exists a possibility that a reflow furnace may be contaminated by these. Therefore, the solder paste may be disposed only on the surface portion 35a in the dummy land 35, and more preferably only on the portion away from the through hole 34 in the surface portion 35a. In the present embodiment, as shown in FIG. 9, the solder paste 36 a is disposed only on the surface portion 35 a of the dummy land 35 and away from the through hole 34.

  Then, as shown in FIG. 10, the holding member 60 is inserted into the through-hole 34 from the locking portions 73 and 83 side in the direction from the front surface 31 a side to the back surface 31 b side (in the direction of the white arrow in the figure) of the substrate 31. . Here, in the state before insertion, the locking portions 73 and 84 have a length that is longer than the width D of the through hole 34 in the distance between the tips of the corner portions. However, the locking portions 73 and 83 are wedge-shaped, and the spring portions 75 and 85 are elastically deformable in the plate thickness direction. Therefore, when the holding member 60 (connector 50) is pushed in the direction of the white arrow shown in FIG. 10 and the locking portions 73 and 83 come into contact with the substrate 31, the wedge-shaped locking portions 73 and 83 penetrate along the inclination. The spring portions 75 and 85 are displaced (elastically deformed) with the connection portion side with the base portion 61 as a fulcrum so as to move inward of the hole 34. Specifically, as shown in FIG. 10, in the flat spring portions 75 and 85, at least the connecting portion side with the connecting portions 74 and 84, which are lower portions of the spring portions 75 and 85, is the plate thickness of the spring portions 75 and 85. Direction, and the spring portions 75 and 85 are displaced toward each other, in other words, inward in the longitudinal direction of the through hole 34 along the surface 31 a of the substrate 31. Due to the displacement of the spring portions 75 and 85, the wedge-shaped locking portions 73 and 83 are inserted into the through hole 34. Further, since the plate thickness direction of the connecting portions 74 and 84 itself is substantially perpendicular to the plate thickness direction of the spring portions 75 and 85, little elastic deformation occurs and the fixed state (or the state before insertion). It will be in a state inclined with respect to. That is, the spring portions 75 and 85 are displaced so that the connecting portions 74 and 84 are inclined and the locking portions 73 and 83 are inserted into the through holes 34. In addition, the dashed-dotted line shown in FIG. 10 has shown the spring parts 75 and 85 of the state which is not displaced as a comparison.

  Then, the holding member 60 (with the corners of the locking portions 73 and 83 in contact with the wall surface of the through hole 34 (the wall surface portion 35 b of the dummy land 35) by the reaction force (restoring force) due to the elastic deformation of the spring portions 75 and 85. When the connector 50) is further pushed in, the locking portions 73 and 83 pass through the through hole 34. 3 and 4, due to the reaction force of the spring portions 75 and 85, at least a part of the locking portions 73 and 83 is on the back surface 31b of the substrate 31 and on the periphery of the opening of the through-hole 34. Will be located. Further, the short-side portions 74b and 84b of the connecting portions 74 and 84 and the parallel-side portions 75b and 85b of the flat substantially U-shaped spring portions 75 and 85 have the substrate-side end surfaces of the surface 31a of the substrate 31 via the solder paste. In a state of being stacked on the surface portion 35a of the dummy land 35. In addition, the mounting portions of the terminals 51 are also stacked on the lands 33 on the surface 31a of the substrate 31 via the solder paste.

  In this state, reflow is performed. As a result, the melted solder moves the surfaces of the connecting portions 74 and 84 and the dummy land 35 made of a metal material to the long portions 74 a and 84 a of the connecting portions 74 and 84 and the wall surface of the through hole 34 (the wall surface portion of the dummy land 35. 35b), or between the short portions 74b and 84b or the parallel portions 75b and 85b and the surface portion 35a of the dummy land 35, and so on, and spreads by wetting. Thus, in this embodiment, as shown in FIG. 6, the holding member 60 is also connected to the dummy land 35 formed on the wall surface of the through hole 34 and the periphery of the opening via the solder 36.

  Next, effects of the characteristic portions of the holding member 60, the connector 50 having the holding member 60, and the electronic control device 1 having the connector 50 shown in the present embodiment will be described. First, the holding member 60 has a base 61 and a first leg 62 (72, 82) formed by processing the same metal plate, and the first leg 62 passes through the through hole 34 and is fixed in the substrate. There are engaging portions 73 and 83 located on the periphery of the opening in the back surface 31b of the 31. Further, due to the displacement of the spring portions 75 and 85 connected to the locking portions 73 and 83 via the connecting portions 74 and 84, the locking portions 73 and 83 pass through the through hole 34 and are positioned on the back surface 31 b of the substrate 31. The The engaging portions 73 and 83 are engaged with the back surface 31b of the substrate 31 when an external force (external force for removing the connector 50 from the substrate 31) is applied to pull out the first leg portion 62 from the through hole 34. . Therefore, the strength against pulling is improved as compared with the conventional case, whereby the holding strength of the connector 50 with respect to the substrate 31 can be improved. That is, it is possible to make the connector 50 less likely to come off the substrate 31 than in the prior art, at least before the terminals 51 are soldered.

  Further, in the present embodiment, in the first leg portion 62 (72, 82), the locking portions 73, 83 and the spring portions 75, 85 that are locked to the substrate 31 are configured at different positions. 75 and 85 are not inserted into the through hole 34. That is, the spring portions 75 and 85 are not themselves locked to the substrate 31 by the reaction force due to the deformation thereof, but the locking portions 73 and 83 (and the connecting portions 74 and 84) are inserted into the through holes 34. When the engaging portions 73 and 83 pass through the through hole 34, the engaging portions 73 and 83 have a spring property that allows the engaging portions 73 and 83 to be positioned on the back surface of the substrate 31. In other words, when inserting the locking portions 73 and 83 (and the connecting portions 74 and 84) into the through hole 34, the springs such that the corners of the locking portions 73 and 83 strongly hit the wall surface of the through hole 34. Therefore, the insertion force of the locking portions 73 and 83 (and the connecting portions 74 and 84) with respect to the through hole 34 can be reduced. Therefore, damage to the wall surface of the through hole 34 (the wall surface portion 35b in the dummy land 35) can be reduced as compared with the conventional configuration in which the spring portion itself is locked to the wall surface of the through hole. Moreover, the design freedom of the spring parts 75 and 85 can also be improved.

  In the present embodiment, the width W in the short direction of the spring portions 75 and 85 is made wider than the plate thickness T of the metal plate, whereby the spring portions 75 and 85 are displaced in the plate thickness direction. ing. The spring portions 75 and 85 extend in substantially the same direction as the connecting portions 74 and 84, and the portions between the connecting ends of the connecting portions 74 and 84 and the connecting end of the base portion 61 are substantially flat in a state before being displaced. The plate thickness direction of the flat plate portion is substantially parallel to the extending direction of the locking portions 73 and 83 from the connecting portions 74 and 84 in a state before displacement. In other words, the spring portions 75 and 85 extend from the base 61 side toward the surface 31a side of the substrate 31, and the plate thickness direction of the flat plate portion is substantially parallel to the surface 31a of the substrate 31 before being displaced. ing. As a result, the spring portions 75 and 85 are displaced substantially parallel to the direction extending from the connecting portions 74 and 84 of the locking portions 73 and 83, in other words, with respect to the substrate 31 to which the connector 50 is attached by the holding member 60. Instead of the vertical direction, it is displaced mainly in a direction substantially perpendicular to the vertical direction (direction along the substrate surface 31a). Thereby, the position accuracy of the connector 50 with respect to the board | substrate 31 can be improved rather than the structure where a spring part is displaced mainly to an up-down direction. Therefore, the holding member 60 having the configuration shown in the present embodiment is suitable for an electronic component that requires positional accuracy in the thickness direction of the substrate 31, particularly the connector 50 having the terminals 51 of the surface mounting structure. In addition, as the terminal 51 of the surface mounting structure, not only a terminal having only the surface mounting portion described above but also a branched terminal having both an insertion mounting portion and a surface mounting portion to be inserted into the through hole of the substrate may be adopted. it can.

  Moreover, in this embodiment, the bending part in the holding member 60 is only the connection part of the base part 61 and the spring parts 75 and 85, and the connection part of the spring parts 75 and 85 and the connection parts 74 and 84, Each bent portion is not bent in the thickness direction of the substrate 31. Therefore, it is possible to improve the positional accuracy of the connector 50 with respect to the substrate 31 in the thickness direction of the substrate 31 while reducing the number of bent portions and simplifying the structure of the holding member 60. Further, since the substrate 31 is not bent in the thickness direction, it is possible to improve the proof strength against stress in the vertical direction (for example, a force for pulling out the holding member 60 from the through hole 34).

  Moreover, in this embodiment, the latching | locking parts 73 and 83 are made into the flat plate shape integrated with the connection parts 74 and 84, and the latching | locking parts 73 and 83 are formed only by stamping. Therefore, compared to a configuration in which the locking portions 73 and 83 are formed by bending (including the connection portion between the connecting portions 74 and 84 and the locking portions 73 and 83 as bending portions), the deformation and damage are prevented. The yield strength of the locking portions 73 and 83 can be improved. Thereby, the holding strength of the connector 50 with respect to the board | substrate 31 can further be improved.

  In the present embodiment, the holding member 60 has a pair of first leg portions 62 (72, 82) facing each other and extending from the base portion 61 in the same direction. As for the latching | locking parts 73 and 83, the extension direction from the corresponding connection parts 74 and 84 is a mutually opposite direction. Thus, when it is set as the structure by which the several 1st leg part 62 was extended from one base 61, compared with the structure where only one 1st leg part 62 was extended from the base 61, it is with respect to the board | substrate 31. FIG. The holding strength of the connector 50 can be improved. Further, since the pair of locking portions 73 and 83 extend in different directions, the backlash against the substrate 31 is reduced as compared with the configuration in which the pair of locking portions 73 and 83 extend in the same direction. can do. Thereby, the latching | locking parts 73 and 83 can be made hard to remove | deviate from the back surface 31b of the board | substrate 31. FIG. In particular, in the present embodiment, the locking portions 73 and 83 forming a pair extend in opposite directions, so that the rattling can be effectively reduced. Furthermore, since the locking portions 73 and 83 extend along the front-rear direction, the degree of freedom in the left-right direction, that is, the longitudinal direction of the housing 52 in the connector 50 is greater than the front-rear direction. Therefore, even if a stress based on a difference in linear expansion coefficient occurs between the housing 52 and the substrate 31 due to a temperature change during the reflow mounting of the terminal 51, the clearance in the left-right direction is larger than that in the front-rear direction. The stress acting on the joint portion with the corresponding land 33 and the stress acting on the holding member 60 can be suppressed.

  Moreover, in this embodiment, in the plate | board thickness direction of the base 61, the position of each latching | locking part 73 and 83 is the same position as the base 61 at least in the state before a displacement. In other words, the flat portion of the spring portion 75 is substantially U-shaped in the plane, and the lengths of the parallel portions 75a and 75b are substantially equal. Similarly, the flat portion of the spring portion 85 is substantially U-shaped in the plane, and the lengths of the parallel portions 85a and 85b are substantially equal. That is, in the pair of first leg portions 72 and 82, at least the portions excluding the locking portions 73 and 83 have a symmetrical structure. Therefore, the configuration of the first leg portions 72 and 82 can be simplified and formed with high accuracy. Moreover, the connection part of the base part 61 and the spring part 75, and the spring part 75, the connection part 74, and the connection part can be bent simultaneously, the connection part of the base part 61 and the spring part 85, and the spring part 85. Since the connecting portion 84 and the connecting portion can be bent at the same time, the number of bending steps can be reduced.

  In the present embodiment, the through hole 34 into which the first leg portions 72 and 82 of the holding member 60 are inserted is a long hole in one direction, and the locking portions in the first leg portions 72 and 82 are provided. 73 and 83 extend from the connecting portions 74 and 84 along the longitudinal direction of the through hole 34, and the extending directions from the connecting portions 74 and 84 are opposite to each other. The locking portions 73 and 83 are positioned on the periphery of the opening on the longitudinal side of the through hole 34 in the back surface 31 b of the substrate 31. Thus, when the through hole 34 is a long hole, the inclination of the connecting portions 74 and 84 at the time of insertion can be made larger than that of a circular through hole having the same cross-sectional area. That is, the reaction force of the spring portions 75 and 85 can be reduced, and the insertion force of the locking portions 73 and 83 (and the connecting portions 74 and 84) with respect to the through hole 34 can be reduced. Therefore, when the engaging portions 73 and 83 and the connecting portions 74 and 84 are inserted into the through hole 34, damage to the wall surface of the through hole 34 can be reduced. In the present embodiment, the longitudinal direction of the through hole 34 is substantially parallel to the short direction (front-rear direction) of the housing 52 of the connector 50. Therefore, it is possible to improve the degree of freedom of wiring arrangement on the substrate 31.

  In the present embodiment, the holding member 60 is disposed at the end 52 b in the longitudinal direction of the housing 52 such that the plate thickness direction of the base 61 is substantially parallel to the longitudinal direction of the housing 52, and the spring portion with respect to the base 61 The bending directions of 75 and 85 are on the outer side of the end portion 52 b on the near side in the housing 52. In other words, it is outside in the longitudinal direction with respect to the housing 52. According to this, in the vertical direction, the spring portions 75 and 85 that are closer to the mounting portion than the base portion 61 are on the outer side in the longitudinal direction from the base portion 61 in the left-right direction with reference to the mounting portion of the terminal 51 with the land 33. It becomes. Therefore, considering the draft of the housing 52 formed by resin injection molding from the mold, the size of the connector 50 in the longitudinal direction of the housing 52, that is, in the left-right direction can be reduced.

  In the present embodiment, the dummy land 35 is provided around the through hole 34 in the substrate 31, and the first leg 62 (72, 82) is connected to the dummy land 35 via the solder 36. . However, a configuration in which the first leg portion 62 (72, 82) is not connected to the dummy land 35 (configuration that is not soldered) may be employed. For example, in the embodiment described above, the facing portion 73a of the locking portion 73 (83) is tapered, the substrate side end surface of the short portion 74b of the connecting portion 74 is smooth, and is substantially parallel to the surface 31a of the substrate 31. It has become. Accordingly, the board 31 is sandwiched between the locking parts 73 and 83 and the connecting parts 74 and 84, thereby suppressing rattling of the connector 50 with respect to the board 31 and holding strength of the connector 50 with respect to the board 31. Can be improved.

  Moreover, in this embodiment, the bending in the connection part of the base part 61 and the spring part 75 and the bending in the connection part of the spring part 75 and the connection part 74 are both about 90 degrees on the same side. Indicated. Similarly, an example is shown in which the bending at the connecting portion between the base portion 61 and the spring portion 85 and the bending at the connecting portion between the spring portion 85 and the connecting portion 84 are both approximately 90 ° on the same side. However, the bending angle at each connecting portion is not limited to the above example. For example, they may be bent in opposite directions, and the bending angle may be an angle different from 90 °. However, if the bending at the connecting portion between the base 61 and the spring portion 75 and the connecting portion between the spring portion 75 and the connecting portion 74 are at substantially the same angle on the same side, the bending at both connecting portions should be performed simultaneously. Can do.

  Further, in this embodiment, a groove 52c that opens to the front surface 52a side is provided in the housing 52 of the connector 50, and the base portion 61 of the holding member 60 is inserted into the groove portion 52c from the front surface 52a side of the housing 52. An example in which 50 holding members 60 are fixed is shown. However, the fixing structure of the holding member 60 is not limited to the above example. For example, as shown in FIGS. 11A and 11B, a fixing portion 52f having a longitudinal slit-like groove is formed at the end 52b of the housing 52 in the left-right direction. With respect to the groove of the fixing portion 52f, The base 61 of the holding member 60 may be inserted and fixed from above. 11A and 11B are diagrams showing a modification of the fixing structure of the holding member with respect to the connector, wherein FIG. 11A is a plan view seen from the outside in the left-right direction, and FIG. 11B is a plan view seen from the front side of the housing in the front-rear direction. .

  Moreover, in this embodiment, as shown to Fig.12 (a), in the plate | board thickness direction of the base 61, the example which the spring parts 75 and 85 protruded only in the one surface side with respect to the base 61 was shown. However, as shown in FIG. 12B, the spring portions 75 and 85 may be protruded on both surface sides of the base portion 61 in the thickness direction of the base portion 61. According to this, when the length of the spring parts 75 and 85 is the same, the physique of the holding member 60 in the plate | board thickness direction (this embodiment left-right direction) can be reduced in size. 12A and 12B are plan views of the holding member as viewed from the locking portion side, in which FIG. 12A is a holding member of the present embodiment shown as a comparison target, and FIG. 12B is a modified example.

  Further, in the present embodiment, as shown in FIG. 7, the locking portions 73 and 83 and the connecting portions 74 and 84 are formed into an integral flat plate shape, and this flat plate portion is in the thickness direction of the base portion 61. The example which has become the same position as the base 61 was shown. In other words, the bending position of the spring part 75 with respect to the base part 61 and the bending position of the spring part 75 with respect to the connecting part 74 are in a straight line as indicated by the broken line 63 in FIG. An example in which the bending position of the spring portion 85 with respect to the connecting portion 84 is a straight line indicated by a broken line 64 in FIG. However, as shown in FIGS. 13A and 13B, the locking portions 73 and 83 are shifted from each other in the plate thickness direction of the base portion 61 by at least the plate thickness difference at least before being displaced. It is good also as composition which has. 13A, the bending position 65a (broken line) of the spring portion 75 with respect to the base portion 61 and the bending position 65b (broken line) of the spring portion 75 with respect to the connecting portion 74 are in a straight line. The bending position 66a (broken line) of the spring part 85 with respect to the base part 61 and the bending position 66b (broken line) of the spring part 85 with respect to the connecting part 84 are also shifted without becoming straight. That's fine. According to this, as shown in FIG. 13 (b), in the thickness direction of the base 61, the positions are shifted from each other by at least the thickness difference before the displacement. , Contact between the engaging portions 73 and 83 and between the connecting portions 74 and 84 can be prevented. In the example shown in FIG. 13, the lengths of the two spring portions 75 and 85 are substantially the same. FIG. 13 is a view showing a modified example of the spring portion, where (a) is a development view and (b) is a plan view seen from the locking portion side.

(Second Embodiment)
Next, a second embodiment of the present invention will be described based on FIG. FIG. 14 is a developed view showing a schematic configuration of the holding member according to the second embodiment.

  Since the holding member according to the second embodiment, the connector having the holding member, and the electronic control device having the connector are often in common with those shown in the above-described embodiment, the detailed description of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

  In 1st Embodiment, the width W of the transversal direction in the flat part of the spring parts 75 and 85 is substantially constant along a longitudinal direction, and the planar shape of a flat part is a substantially U-shape. showed that. However, the form of the spring portions 75 and 85 is not limited to the above example. For example, in the example shown in FIG. 14, the width W in the short direction of the flat plate portion is not substantially constant along the longitudinal direction of the plate portion that is thicker than the plate thickness T. The connection part side is wider and the connection part side with the connecting portions 74 and 84 is narrower. For example, in the example illustrated in FIG. 14, in the spring portion 75, the width W <b> 1 near the base portion 61 is wider than the width W <b> 2 near the connecting portion 74.

  Here, when the locking portions 73 and 83 are inserted into the through holes 34 of the substrate 31, the stress acting on the spring portions 75 and 85 is away from the locking portions 73 and 83, that is, with the base 61. The closer to the connection site, the larger it becomes. On the other hand, according to the configuration shown in the present embodiment, the rigidity closer to the base portion 61 is higher, so that the stress is dispersed throughout the spring portions 75 and 85 to connect the spring portion 75 and 85 to the base portion 61 side. It is possible to suppress stress concentration on the surface.

  In addition, the spring parts 75 and 85 of the form shown in FIGS. 15 to 17 are development views showing modifications of the spring portion. In the example shown in FIG. 15, the outer shape (in the drawing) extends from the connection portion of the spring portions 75 and 85 to the base portion 61 to the connection end of the parallel portions 75a and 85a and the parallel portions 75a and 85a of the straight portions 5c and 85c. The part surrounded by a broken line is rounded. According to this, compared with the square shape (angle of 90 ° or less), it is possible to suppress stress concentration at the connecting portion with the base portion 61 where stress is easily concentrated. The same effect can be expected even when the outer shape is a polygonal shape formed by connecting a plurality of angles larger than 90 °.

  In the example shown in FIG. 16, the planar shape of the flat portions of the spring portions 75 and 85 is not substantially U-shaped, but parallel portions 75 a and 75 b and parallel portions 85 a and 85 b corresponding to the straight portions 75 c and 85 c. The connecting portions 75d and 85d that connect the two are detoured by being inclined with respect to the vertical direction and connect the parallel portions 75a and 75b and the parallel portions 85a and 85b. Moreover, in the example shown in FIG. 17, it has the shape which has the folding | returning parts 75e and 85e which end surfaces adjoin. In the configuration shown in FIGS. 16 and 17, even if the heights of the spring portions 75 and 85 are the same in the vertical direction, the spring length can be increased and the spring force can be weakened as compared with the substantially U-shape. In this case, if the applied force is the same, the amount of displacement (stroke) of the spring portions 75 and 85 is increased, so that the length of the locking portions 73 and 83 can be increased. That is, it is difficult to release the locked state by the locking portions 73 and 83, and the disconnection of the first leg portion 62 (72, 82) from the through hole 34 (the disconnection of the connector 50 from the board 31) is suppressed. it can.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to FIG. FIG. 18 is a schematic perspective view showing the positional relationship between the locking portion and the land in the electronic control device according to the third embodiment. In FIG. 18, for the sake of convenience, only characteristic portions are extracted and shown.

  Since the holding member according to the third embodiment, the connector having the holding member, and the electronic control unit having the connector are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

  In the above-described embodiment, the positional relationship between the locking portions 73 and 83 in the pair of first leg portions 72 and 82 and the mounting portion of the terminal 51, in other words, the position of the locking portions 73 and 83 and the land 33. No particular mention was made of the relationship. On the other hand, in the present embodiment, as shown in FIG. 18, the lands 33 are arranged in multiple stages (three stages in FIG. 18) not only in the left-right direction but also in the front-rear direction. All the multi-stage lands 33 are arranged between the locking portions 73 and 83. Specifically, as shown by a broken line in FIG. 18, in the front-rear direction, the distance between the corner vertices between the locking portions 73 and 83 is the rear end of the first-stage land 33 on the side closer to the first leg portion 82. And a distance between the front end of the third-stage land 33 on the side close to the first leg portion 72. In other words, as shown in FIG. 18, the mounting portion of the terminal 51 is arranged in multiple stages (three stages in FIG. 18) not only in the left-right direction but also in the front-rear direction corresponding to the land 33. In the front-rear direction, all the multi-stage mounting parts are arranged between the locking parts 73 and 83. Specifically, as shown by a one-dot chain line in FIG. 18, in the front-rear direction, the first-stage terminal 51 is mounted on the side where the distance between the corner vertices between the locking portions 73 and 83 is closer to the first leg portion 82. This is longer than the distance between the rear end of the portion and the front end of the mounting portion of the third-stage terminal 51 on the side closer to the first leg portion 72.

  With such a configuration, an external stress that causes the connector 50 to tilt in the front-rear direction acts on the connector 50 (housing 52) when the connector 50 is attached to the substrate 31 (holding state) by the holding member 60. Even in such a case, first, stress acts on the first leg portions 72 and 82 outside the mounting portion of the terminal 51 in the front-rear direction. Therefore, the connection reliability at the connection portion between the terminal 51 and the corresponding land 33 can be improved.

  In addition, due to at least one of the size of the pair of first leg portions 72 and 82 and the thickness of the substrate 31, rattling occurs in the pair of first leg portions 72 and 82 with respect to the substrate 31 in the vertical direction. In this case, the longer the distance between the locking portions 73 and 83, the smaller the inclination of the connector 50 with respect to the board 31. In the above-described configuration, all the multi-stage lands 33, in other words, all the multi-stage mounting parts, are arranged between the locking parts 73 and 83 in the front-rear direction. Is secured. Therefore, the inclination of the connector 50 can be reduced as compared with the configuration in which the mounting portion of the land 33 and the terminal 51 is positioned outside the locking portions 73 and 83 in the front-rear direction.

  In the present embodiment, the pair of first leg portions 72 and 82 are inserted into the through holes 34 a and 34 b at different positions on the substrate 31, respectively. With such a configuration, the first leg portions 72 and 82 (the connecting portions 74 and 84) with respect to the through hole 34 are compared with the configuration in which the pair of first leg portions 72 and 82 are inserted into one through hole 34. Since the play of the connector 50 is small, rattling of the connector 50 with respect to the substrate 31 can be suppressed. Further, it is possible to make it difficult to release the locked state of the locking portions 73 and 83. The configuration in which the pair of first leg portions 72 and 82 are respectively inserted into the through holes 34a and 34b at different positions on the substrate 31 can also be applied to the above embodiments. In the present embodiment, the pair of first leg portions 72 and 82 may be inserted into one through hole 34 in the substrate 31. However, in this case, since the length of the through hole 34 in the front-rear direction is increased, the locking portions 73 and 83 are easily released from the back surface 31 b of the substrate 31.

(Fourth embodiment)
Next, 4th Embodiment of this invention is described based on FIG.19 and FIG.20. FIG. 19 is a plan view showing a state in which the holding member according to the fourth embodiment is attached to the substrate. In FIG. 19, the connector 50 is omitted for convenience. FIGS. 20A and 20B are schematic plan views showing the positional relationship between the leg portions and the solder applied on the dummy lands. In FIG. 20, for convenience, the base portion and the parallel portion on the base side of the spring portion of the first leg portion are omitted from the holding member.

  Since the holding member according to the fourth embodiment, the connector having the holding member, and the electronic control device having the connector are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

  In the above-described embodiment, the example in which the holding member 60 has only the pair of first leg portions 62 (72, 82) as the leg portions extending from the base portion 61 is shown. On the other hand, in this embodiment, as shown in FIG. 19, the holding member 60 extends from the base portion 61 in the same direction as the first leg portions 72 and 82 and is between the pair of first leg portions 72 and 82. It further includes a second leg portion 92 that is disposed and is inserted into a through hole 37 different from the first leg portions 72 and 82 in the substrate 31. And the 2nd leg part 92 is integrally formed with the base 61 and the 1st leg parts 72 and 82 by processing the same metal plate, The width | variety in the transversal direction is plate | board thickness T of a metal plate. Wider than the base 61 and has a flat plate-like portion whose tip end is inserted into the through hole 37, and the plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base 61. . Therefore, even if an external stress is applied in the plate thickness direction of the spring portions 75 and 85 (the front-rear direction in this embodiment), the plate portions of the spring portions 75 and 85, that is, the displacement directions of the spring portions 75 and 85 are applied. On the other hand, since the second leg portion 92 is difficult to be deformed, rattling of the holding member 60 is suppressed by the second leg portion 92 inserted into the through hole 37 different from the through holes 34a and 34b. Can do. Note that the short direction of the second leg portion 92 is a direction substantially perpendicular to the direction (longitudinal direction) extending from the base portion 61 in a plane substantially perpendicular to the plate thickness direction in the flat plate portion.

  In the example shown in FIG. 19, the tip position of the flat plate-like portion in the second leg portion 92 is a position farther from the base portion 61 than the tip positions of the locking portions 73 and 83. Therefore, the second leg 92 can be inserted into the corresponding through hole 37 before the first leg 72, 82 is inserted into the corresponding through hole 34a, 34b. The one leg portions 72 and 82 can be easily inserted into the corresponding through holes 34a and 34b, respectively.

  In addition, in the example shown in FIG. 19, as the flat plate-like portion of the second leg portion 92, an insertion portion 93 that is a portion within a predetermined range from the tip and is inserted into the through hole 37, and the insertion portion 93 A holding portion 94 that is connected to the base portion 61 and wider than the insertion portion 93 is provided. In the vertical direction, the position of the end surface on the insertion portion 93 side of the holding portion 94 is substantially coincident with the surface of the short portions 74b and 84b of the connecting portions 74 and 84 facing the substrate surface 31a. With this configuration, the insertion portion 93 is inserted into the through hole 37, and the insertion portions of the holding portion 94 are inserted in the state where the locking portions 73 and 83 are positioned on the peripheral portions of the through holes 34a and 34b on the substrate back surface 31b. The end surface on the 93 side can be brought into contact with the surface 31 a of the substrate 31. Therefore, rattling of the connector 50 with respect to the board 31 can be reduced.

  In addition, the holding strength of the connector 50 with respect to the substrate 31 can be further improved by soldering a part of the second leg 92 described above to a dummy land provided around the through hole 37. For example, in the example shown in FIG. 20A, the holding strength of the connector 50 with respect to the board 31 is further improved by soldering the end face of the holding portion 94 to the corresponding dummy land 38 provided on the board surface 31a. Yes. Specifically, the dummy land 38 has the same configuration as the dummy land 35 described above, and the solder paste 36a is disposed only on the substrate surface 31a of the dummy land 38. The solder paste 36 a is disposed only on the surface portion of the dummy land 38 and away from the through hole 37. Therefore, like the above-described dummy land 35, contamination of the reflow furnace by the solder paste 36a can be suppressed. In addition, since the reflow mounting can be performed on the dummy land 38 corresponding to the second leg 92, the first leg 72, 82, the terminal 51, and other electronic components can be soldered together.

  Moreover, in the above-described example, an example in which the holding portion 94 has a flat plate shape is shown. However, a part of the holding portion 94 shown in FIG. 19 is bent, and as shown in FIG. 20B, in the front-rear direction, a flat plate-like portion 94a integrated with the insertion portion 93 and the portion 94a. It is also possible to adopt a configuration in which the plane is substantially bowl-shaped having a bent portion 94b that is bent and a configuration in which the plane is substantially U-shaped. When these configurations are employed, the contact area between the solder paste 36a and the holding portion 94 can be increased.

  In the example shown in FIG. 20, the areas of the dummy lands 35 (surface portions 35a) and 38 are secured while ensuring the contact area between the first leg portions 72 and 82 and the solder paste 36a, and the second leg portion 92 and the solder paste 36a. In order to suppress, the through holes 34 and 37 are the end portions of the corresponding dummy lands 35 (surface portions 35a) and 38, respectively. However, the positions of the through holes 34 and 37 with respect to the dummy lands 35 and 38 are not limited to the above example. For example, a configuration in which the through holes 34 and 37 are provided at the centers of the dummy lands 35 and 38 may be adopted. 20A and 20B, the through-hole 37 is arranged on a straight line connecting the through-holes 34a and 34b. However, the position of the through-hole 37 is shifted so that the through-holes 34a and 34b are connected to one. It may be a long hole.

(Fifth embodiment)
Next, 5th Embodiment of this invention is described based on FIG.21 and FIG.22. FIG. 21 is a partial cross-sectional view showing a schematic configuration of the connector according to the fifth embodiment. FIG. 21 is a cross-sectional view taken along the line III-III in FIG. 2 and shows the holding member in a plan view. FIG. 22 is a schematic partial cross-sectional view showing the effect of the connector shown in FIG. 21, where (a) is a comparative example, and (b) is a view of the connector shown in FIG. Also in FIG. 22, the holding member is in a plan view.

  Since the holding member, the connector having the holding member, and the electronic control device having the connector according to the fifth embodiment are often in common with those shown in the above-described embodiment, detailed descriptions of the common parts will be given below. Omitted and focused on the differences. In addition, the same code | symbol shall be provided to the element same as the element shown to each above-mentioned embodiment.

  As the terminal 51, a terminal having a surface mounting structure is adopted as shown in the above embodiment, and a part of the connecting portions 74, 84 (short portions 74b, 84b) is disposed on the surface 31a of the substrate 31. In the case of the configuration, in the vertical direction, the position of the part facing the substrate surface 31a in a part of the connecting portions 74, 84 (short portions 74b, 84b) and the bottom surface of the surface mounting portion of the terminal 51 substantially coincide. It is preferable. However, due to manufacturing variations and assembly variations, the positions of the surface mounting portions in the terminals 51 of the plurality of surface mounting structures vary somewhat in the vertical direction. That is, the position of the surface mounting portion varies within a tolerance range. Further, the gap between the locking portions 73 and 83 of the first leg portions 72 and 82 and the back surface 31b of the substrate 31 varies somewhat when the connector 50 is assembled to the substrate 31 by the holding member 60. That is, the positions of the locking portions 73 and 83 vary with respect to the substrate back surface 31b within a tolerance range. As described above, since the surface mounting portion of the terminal 51 and the locking portions 73 and 83 have a variation in position, the connector 50 is rattled with respect to the substrate 31. For example, when the contact surface of the contact portion (74b, 84b) with the surface 31a of the substrate 31, in other words, the contact surface (74b, 84b) with the substrate surface 31a in the connecting portions 74, 84 is used as the position reference, the locking portions 73, 83 and the substrate As shown in FIG. 22A, the gap between the rear surface 31b of 31 varies within the range of the intersection α. Further, as shown in FIG. 22A, the position of the bottom surface 51c in the surface mounting portion of the terminal 51 varies upward within the range of the tolerance β from the reference position. In this case, the rattling width of the connector 50 with respect to the board 31 is α + β. Accordingly, it is conceivable that the surface mounting portion of the terminal 51 is not connected to the corresponding land 33 via the solder 36.

  On the other hand, in this embodiment, the rattling width of the connector 50 with respect to the substrate 31 is reduced by utilizing the spring property of the terminal 51. Specifically, as shown in FIG. 21, in the vertical direction, the bottom surface 51c of the surface mounting portion of the terminal 51 of the surface mounting structure is a part of the connecting portions 74 and 84 (on the surface 31a of the substrate 31 ( It is located closer to the locking portions 73 and 83 than the position of the end face of the short portions 74b and 84b). Note that the distance between the end surfaces of the short portions 74b and 84b of the connecting portions 74 and 84 in the vertical direction and the bottom surface 51c of the terminal 51 is such that when the terminal 51 is mounted on the substrate 31, the terminal 51 has its own spring property (elastic deformation). It is set within the range that can be absorbed.

  Therefore, when the connector 50 shown in FIG. 21 is attached to the substrate 31, the surface mounting portion comes into contact with the substrate surface 31a depending on the terminal 51. It can be brought closer to the substrate 31 side. As a result, as shown in FIG. 22B, the variation γ of the bottom surface 51c of the terminal 51 with respect to the substrate surface 31a is smaller than the tolerance β. Therefore, since the rattling width of the connector 50 with respect to the board 31 is α + γ, rattling of the connector 50 with respect to the board 31 is suppressed in the vertical direction, thereby improving the connection reliability between the terminal 51 and the land 33. You can also

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the spirit of the present invention.

  In the present embodiment, the holding member 60 having the pair of first leg portions 72 and 82 and the holding member 60 having the second leg portion 92 together with the pair of first leg portions 72 and 82 are shown. However, the number of the first leg portions 62 extended from the base portion 61 is not limited to the above example. For example, the holding member 60 fixed to the both end portions 52b of the housing 52 in the left-right direction may have only one first leg portion 62 (72). In this case, when the extending direction of the locking portion 73 is configured to be opposite to each other (the left direction outer side and the right direction outer side) with different holding members 60, rattling in the extending direction of the locking portion 73 is caused. Can be reduced. Thereby, the latching | locking part 73 can be made hard to remove | deviate from the back surface 31b of the board | substrate 31. FIG.

  Further, the connector 50 may be configured to have different types of holding members 60. For example, a configuration in which a holding member 60 having only a pair of first leg portions 72 and 82 and a holding member 60 having a pair of first leg portions 72 and 82 and a second leg portion 92 are disposed in one connector 50. It is also good.

  The extending direction of the locking portion 73 (83) is not limited to the front-rear direction. For example, it is good also as a structure by which the extending direction was made into the left-right direction. In addition, in the pair of first leg portions 72 and 82, an example in which the extending directions of the locking portions 73 and 83 are opposite to each other (outward in the front-rear direction) is shown. However, although it is not the opposite, it is good also as a structure made into the mutually different direction, or the structure made into the mutually same direction. Furthermore, it is good also as a structure extended in the front-back direction inner side in the mutually opposite direction. However, when the directions are at least different from each other, more preferably in the opposite directions, the rattling of the connector 50 with respect to the board 31 can be reduced as compared with the configuration extending in the same direction. Further, it is possible to make it difficult to release the locked state.

  In this embodiment, the example in which the latching | locking parts 73 and 83 were formed only by stamping a metal plate was shown. However, the engaging portions 73 and 83 may be bent with respect to the connecting portions 74 and 84 by bending. However, when bending is performed, the resistance to deformation and breakage is reduced. Therefore, it is preferably formed only by punching as shown in this embodiment, in other words, a flat plate shape integral with the connecting portions 74 and 84. It is good to have the structure made.

  In this embodiment, the example of the electronic control apparatus 1 of the non-waterproof structure was shown as an electronic apparatus. However, the present invention can also be applied to a waterproof electronic control device. Moreover, it is not limited to an electronic control device.

  In the present embodiment, an example of the connector 50 is shown as an electronic component, but the electronic component held on the surface 31 a of the substrate 31 by the holding member 60 is not limited to the connector 50. Any electronic component may be used as long as it is made of a conductive material and includes a terminal electrically connected to the land of the substrate and a main body provided with the terminal.

  In the present embodiment, an example in which a terminal having a surface mounting structure having only a surface mounting portion is employed as the terminal 51 and reflow soldering is performed on the corresponding land 33 on the substrate surface 31a is shown. However, the surface mounting structure terminal is not limited to the terminal having only the surface mounting portion, and as described above, the insertion mounting is inserted and mounted in the through hole having the land on the surface mounting portion and the wall surface. It is also possible to adopt a branched terminal that has both a part and a part. Further, the terminals to be reflow mounted are not limited to the terminals of the surface mounting structure, and the terminals of the insertion mounting structure can be reflow soldered.

  Furthermore, the mounting of the connector 50 on the board 31 is not limited to reflow soldering. For example, a terminal having an insertion mounting portion is adopted as the terminal 51, and the terminal 51, the first leg portion 62 (72, 82), and further the second leg portion 92 are collectively collected by flow soldering (local flow soldering). You may make it solder. Also in this case, the manufacturing process can be simplified.

  In the present embodiment, the connecting portions 74 and 84 and the parallel portions 75b and 85b of the spring portions 75 and 85 of the first leg portions 72 and 82 are connected via the dummy land 35 and the solder 36. . However, only the connecting portions 74 and 84 may be connected to the dummy land 35 via the solder 36 (a configuration in which the spring portions 75 and 85 are not soldered). The engaging portions 73 and 83 may also be connected to the back surface portion 35 c of the dummy land 35 via the solder 36.

  Even in the configuration in which the first leg portion 62 (72, 82) is connected to the dummy land 35, the configuration of the dummy land 35 is not limited to the above example. The dummy land 35 may have a configuration having only the front surface portion 35a, a configuration having only the back surface portion 35c, or a configuration having only the front surface portion 35a and the wall surface portion 35b. Moreover, it is good also as a structure which does not have the dummy land 35, and it is good also as a structure where the 1st leg parts 72 and 82 are not soldered, although it has the dummy land 35.

  In this embodiment, during reflow soldering, the solder paste 36a is disposed only on the surface portion 35a of the dummy land 35 (on the dummy land 38) and away from the through hole 34 (through hole 37). showed that. However, the solder paste 36a may be disposed in the through holes 34 and 37 at the time of application. In this case, the contact area between the solder 36, the first leg 62 (72, 82), and the second leg 92 can be increased, and the connector 50 can be firmly fixed to the board 31.

  In the present embodiment, an example is shown in which the holding members 60 are arranged in a total of four places, near the both ends 52b of the housing 52 and two places between the both ends 52d in the left-right direction. However, the arrangement of the holding member 60 with respect to the housing 52 is not limited to the above example. For example, a configuration in which the holding member 60 is disposed only in the vicinity of both end portions 52b of the housing 52 in the left-right direction, or a configuration in which a plurality of portions are disposed in a central region between both end portions 52d may be employed. If it arrange | positions not a little in the center area | region between both ends 52d, the curvature of the board | substrate 31 with respect to the connector 50 can be suppressed, and the connection reliability of the terminal 51 and the land 33 can be improved.

  In the present embodiment, an example in which the holding member 60 has one second leg 92 has been described. However, a configuration having a plurality of second legs 92 is also possible. Further, the second leg 92 may be formed in any form as long as it is a corresponding through hole formed in the substrate 31 and hardly deforms with respect to the displacement direction of the springs 75 and 85.

  In the present embodiment, the surface 73 of the substrate 31 in the vertical direction in the holding state is such that the portion 73a facing the back surface 31b of the substrate 31 in the wedge-shaped locking portion 73 (83) is further away from the corresponding connecting portion 74 in the front-back direction. The example made into the taper shape far from 31a was shown. However, the form of the locking portions 73 and 83 is not limited to the above example. For example, the facing portion 73a may be configured to be substantially parallel to the surface 31a of the substrate 31 in the up-down direction in the holding state.

  In the present embodiment, an example is shown in which the distal end position of the insertion portion 93 of the second leg portion 92 is positioned farther from the base portion 61 than the distal end positions of the locking portions 73 and 83. However, in the case where the terminal 51 is a terminal having a surface mounting structure having only the surface mounting portion, the tip 51 is located below the surface mounting portion, and at least a part of the terminal 51 is inserted into the through hole 37. be able to. In addition, in the case of a terminal having an insertion mounting portion, any form can be adopted as long as at least a part is inserted into the through hole 37. For example, the tip position of the insertion mounting portion may be lower than the tip position of the insertion portion 93.

It is an exploded view for demonstrating schematic structure of the electronic controller which concerns on 1st Embodiment. It is a top view of the mounting part periphery of the state which mounted the connector in the board | substrate. It is a fragmentary sectional view which follows the III-III line of FIG. It is the top view which looked at FIG. 3 from the back surface side of the board | substrate. It is a perspective view which shows schematic structure of a holding member. It is the fragmentary sectional view which expanded the through-hole periphery of the board | substrate with which the 1st leg part was inserted. It is an expanded view of the holding member for demonstrating a manufacturing method. It is the figure which expanded the connection part vicinity in FIG. It is a top view which shows the application | coating position of the solder to a board | substrate. It is a fragmentary sectional view showing the time of insertion of the 1st leg part to a penetration hole. It is a figure which shows the modification of the fixing structure of the holding member with respect to a connector, (a) is the top view seen from the left-right direction outer side, (b) is the top view seen from the housing front side in the front-back direction. It is the top view which looked at the holding member from the latching | locking part side, (a) is the holding member of this embodiment shown as a comparison object, (b) is a modification. It is a figure which shows the modification of a spring part, (a) is an expanded view, (b) is the top view seen from the latching | locking part side. It is an expanded view which shows schematic structure of the holding member which concerns on 2nd Embodiment. It is an expanded view which shows the modification of a spring part. It is an expanded view which shows the modification of a spring part. It is an expanded view which shows the modification of a spring part. It is a typical perspective view which shows the positional relationship of a latching | locking part and a land in the electronic control apparatus which concerns on 3rd Embodiment. It is a top view which shows the state which attached the holding member which concerns on 4th Embodiment to the board | substrate. (A), (b) is a schematic top view which shows the positional relationship of a leg part and the solder apply | coated on the dummy land. It is a fragmentary sectional view showing a schematic structure of a connector concerning a 5th embodiment. It is a typical fragmentary sectional view which shows the effect of the connector shown in FIG. 21, (a) is a comparative example, (b) is a figure by the connector shown in FIG.

Explanation of symbols

1 ... Electronic control device (electronic device)
31 ... Board 31a ... Front surface 31b ... Back 34 ... Through hole 50 ... Connector (electronic component)
52 ... Housing (main body)
60 ... holding member 61 ... base 62, 72, 82 ... first leg 73, 83 ... locking part 74, 84 ... connecting part 75, 85 ... spring part

Claims (25)

A base fixed to the electronic component; and at least one first leg extending from the base; and the first leg is inserted into a through-hole of the substrate, and the surface is formed on the surface of the substrate. A holding member for holding an electronic component,
The first leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the first leg portion, and in which the electronic component is fixed to the substrate, and at least a part of the locking portion is located on the periphery of the opening of the through hole on the back surface of the substrate;
One end portion is connected to the locking portion, and a connection portion that is partially disposed in the through hole in the fixed state;
One end is connected to the end of the connecting portion opposite to the locking portion, the other end is connected to the base, and is arranged on the surface of the substrate in the fixed state, and is connected to the through hole. A spring part that is displaced so that the connecting part is inclined with respect to the fixed state and the engaging part is inserted into the through-hole when the engaging part and the connecting part are inserted;
The spring portion extends in substantially the same direction as the connecting portion, and a width in a short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction is wider than the plate thickness of the metal plate, and the connecting portion and The portion between the connecting end of the connecting portion and the connecting end with the base portion is formed into a flat plate shape before the displacement, and the plate thickness direction of the flat plate portion is the connecting portion of the locking portion in the state before the displacement. A holding member, characterized in that the holding member is substantially parallel to a direction extending from the head. The connecting portion has a width in the transverse direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction that is wider than the plate thickness of the metal plate, and the portion excluding the connection end with the spring portion is the locking portion. The plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base portion,
The spring portion is bent with respect to the base portion in one direction side in the plate thickness direction of the flat portion of the base portion and the connecting portion, and the base portion and the flat portion of the connecting portion. The plate is bent in the same direction, and the plate thickness direction of the flat portion of the spring portion is substantially perpendicular to the plate thickness direction of the base portion before displacement, and the connecting portion The holding member according to claim 1, wherein the holding member is substantially perpendicular to a plate thickness direction in the flat plate portion .   The holding member according to claim 1, wherein the holding member has a pair of first legs extending in the same direction as the first leg. Each connecting portion of the pair of first legs has a width in a short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction that is wider than the plate thickness of the metal plate, and is connected to the spring portion. The portion excluding the end is a flat plate integrated with the locking portion, and the plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base,
Each spring portion is bent at substantially the same angle on the same surface side of the base portion with respect to the base portion and the connecting portion, and the plate thickness direction of each flat plate portion is in the state before the displacement in the base portion. The holding member according to claim 3, wherein the holding member is substantially perpendicular to the plate thickness direction.   5. The holding member according to claim 4, wherein each locking portion is located at the same position as the base portion at least before displacement in the thickness direction of the base portion.   5. The holding member according to claim 4, wherein the locking portions are at positions shifted from each other by at least a plate thickness difference in a plate thickness direction of the base portion at least before being displaced. A second leg extending from the base in the same direction as the first leg and disposed between the pair of first legs and inserted into a through-hole different from the first leg in the substrate; In addition,
The second leg portion is formed integrally with the base portion and the first leg portion by processing the same metal plate, and is a short side substantially perpendicular to the extending longitudinal direction and the plate thickness direction. The width in the direction is wider than the plate thickness of the metal plate, and has a flat plate-like portion that extends from the base and is inserted into the through-hole on the tip side.
The holding member according to any one of claims 4 to 6, wherein a plate thickness direction in the flat plate portion is substantially parallel to a plate thickness direction in the base portion.   The holding member according to claim 7, wherein a distal end position of the flat plate-like portion in the second leg portion is a position farther from the base portion than a distal end position of the locking portion.   8. The flat plate-shaped portion includes an insertion portion that is inserted into the through-hole, and a holding portion that connects the insertion portion and the base portion and is wider than the insertion portion. Item 9. The holding member according to Item 8.   The width in the short side direction of the said spring part is wider on the connection end side with the said base than the connection end side with the said connection part, The any one of Claims 1-9 characterized by the above-mentioned. Holding member. The holding member according to any one of claims 1 to 10 , wherein the spring portion has a substantially U-shape in a planar shape at the flat plate portion. The holding member according to any one of claims 1 to 10 , wherein the spring portion has a shape in which a planar shape at the flat plate portion has a folded portion where end faces are adjacent to each other. A plurality of terminals made of a conductive material and electrically connected to the lands of the board, a main body provided with the terminals, and a holding for holding the main body on the surface of the board where the through holes are formed An electronic component comprising a member,
The holding member includes a base fixed to the main body, and at least one first leg extending from the base and inserted into the through hole,
The first leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the first leg portion and is fixed to the substrate, and at least a part of the locking portion is located on the periphery of the opening of the through hole on the back surface of the substrate;
One end portion is connected to the locking portion, and a connection portion that is partially disposed in the through hole in the fixed state;
One end is connected to the end of the connecting portion opposite to the locking portion, the other end is connected to the base, and is arranged on the surface of the substrate in the fixed state, and is connected to the through hole. A spring part that is displaced so that the connecting part is inclined with respect to the fixed state and the engaging part is inserted into the through-hole when the engaging part and the connecting part are inserted;
The spring portion extends in substantially the same direction as the connecting portion, and a width in a short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction is wider than the plate thickness of the metal plate, and the connecting portion and The portion between the connecting end of the connecting portion and the connecting end with the base portion is formed into a flat plate shape before the displacement, and the plate thickness direction of the flat plate portion is the connecting portion of the locking portion in the state before the displacement. An electronic component characterized in that the electronic component is substantially parallel to a direction extending from the surface. The connecting portion has a width in the transverse direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction that is wider than the plate thickness of the metal plate, and the portion excluding the connection end with the spring portion is the locking portion. The plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base portion,
The spring portion is bent with respect to the base portion in one direction side in the plate thickness direction of the flat portion of the base portion and the connecting portion, and the base portion and the flat portion of the connecting portion. The plate is bent in the same direction, and the plate thickness direction of the flat portion of the spring portion is substantially perpendicular to the plate thickness direction of the base portion before displacement, and the connecting portion The electronic component according to claim 13 , wherein the electronic component is substantially perpendicular to a plate thickness direction in the flat plate portion . The holding member is disposed on at least one of the end portions in the longitudinal direction of the main body so that the thickness direction of the base portion is substantially parallel to the longitudinal direction, and the bending direction of the spring portion with respect to the base portion is The electronic component according to claim 14 , wherein the electronic component is opposite to a center side of the main body portion in the longitudinal direction . The plurality of terminals include a surface mount type terminal in which a surface mount portion that is surface mounted to the land of the substrate is formed at the tip of an extended portion that extends from the main body portion to the outside. The electronic component according to any one of claims 13 to 15 . The main body has a shape in which a planar shape along the surface of the substrate is long in one direction,
Surface mount portions of the plurality of surface mount terminals as the plurality of terminals are arranged in multiple stages in a direction substantially perpendicular to the length of the main body portion,
17. The electronic component according to claim 16 , wherein the surface mounting portions are arranged in multiple stages between the locking portions of the pair of first leg portions in a direction substantially perpendicular to the length of the main body portion. . The connecting portion has a substantially L-shaped flat plate portion so that an end surface of a predetermined range from a connecting end with the spring portion is located on a peripheral portion of the through hole on the surface of the substrate.
In a state before being fixed to the substrate, in the thickness direction of the substrate, the bottom surface of the surface mounting portion of the surface mounting type terminal is more than the position of the end surface in contact with the substrate surface of the connecting portion. The electronic component according to claim 17, wherein the electronic component is located on a locking portion side. A substrate on which lands and through holes are formed;
An electronic component comprising a plurality of terminals made of a conductive material and electrically connected to the land, a main body provided with the terminals, and a holding member for holding the main body on the surface of the substrate. An electronic device in which the electronic component is mounted on the substrate,
The holding member includes a base fixed to the main body, and at least one first leg extending from the base and inserted into the through hole,
The first leg is formed integrally with the base by processing the same metal plate,
A locking portion that is provided on the distal end side of the first leg portion, and in which the electronic component is fixed to the substrate, and at least a part of the locking portion is located on the periphery of the opening of the through hole on the back surface of the substrate;
One end portion is connected to the locking portion, and a connecting portion in which a part is disposed in the through hole in the fixed state;
One end of the connecting portion is connected to the end of the connecting portion opposite to the locking portion, and is arranged on the surface of the substrate in the fixed state, and the locking portion and the connecting portion to the through hole are arranged. A spring portion that is displaced so that the connecting portion is inclined with respect to the fixed state and the locking portion is inserted into the through-hole at the time of insertion;
The spring portion extends in substantially the same direction as the connecting portion, and a width in a short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction is wider than the plate thickness of the metal plate, and the connecting portion and The portion between the connecting end of the connecting portion and the connecting end with the base portion is formed into a flat plate shape before the displacement, and the plate thickness direction of the flat plate portion is the connecting portion of the locking portion in the state before the displacement. An electronic device, characterized in that the electronic device is substantially parallel to a direction extending from the device. The connecting portion has a width in the transverse direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction that is wider than the plate thickness of the metal plate, and the portion excluding the connection end with the spring portion is the locking portion. The plate thickness direction of the flat plate portion is substantially parallel to the plate thickness direction of the base portion,
The spring portion is bent with respect to the base portion in one direction side in the plate thickness direction of the flat portion of the base portion and the connecting portion, and the base portion and the flat portion of the connecting portion. The plate is bent in the same direction, and the plate thickness direction of the flat portion of the spring portion is substantially perpendicular to the plate thickness direction of the base portion before displacement, and the connecting portion The electronic device according to claim 19 , wherein the electronic device is substantially perpendicular to a plate thickness direction in the flat plate portion . 21. The electronic device according to claim 20 , wherein the first leg portion includes a pair of first leg portions extending in the same direction from the base portion. The electronic device according to claim 21 , wherein the pair of leg portions are respectively inserted into through holes at different positions on the substrate. The through hole is a long hole whose opening is long in one direction along the surface of the substrate,
The engaging portions of the pair of first leg portions extend from the connecting portion along the longitudinal direction of the through hole, and the extending directions are opposite to each other, and the longitudinal side of the through hole on the back surface of the substrate The electronic device according to claim 21 , wherein the electronic device is located on the periphery of the opening. Around the corresponding through hole of the substrate and at least on the surface on which the electronic component is mounted, a dummy land made of a metal material and not providing an electrical connection function is provided,
The connecting part has a substantially L-shaped flat part, and an end surface of a part within a predetermined range from a connecting end with the spring part is disposed on the dummy land, and is connected to the dummy land via solder. The electronic device according to claim 19 , wherein the electronic device is provided. The holding member extends from the base in the same direction as the first leg, is disposed between the pair of first legs, and is inserted into a through hole different from the first leg in the substrate. Having a second leg,
The second leg portion is formed integrally with the base portion and the first leg portion by processing the same metal plate, and in a short direction substantially perpendicular to the extending longitudinal direction and the plate thickness direction. The width is wider than the plate thickness of the metal plate, and has a flat plate-like portion that extends from the base and is inserted into the through-hole on the tip side.
The flat plate portion has an insertion portion to be inserted into the through hole, and a holding portion that connects the insertion portion and the base portion and has a width wider than the insertion portion. It is substantially parallel to the plate thickness direction at the base,
Around the corresponding through hole of the substrate and at least on the surface on which the electronic component is mounted, a dummy land made of a metal material and not providing an electrical connection function is provided,
25. The electron according to any one of claims 19 to 24 , wherein the holding portion has an end surface on the insertion portion side disposed on the dummy land and connected to the dummy land via solder. apparatus.

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