DE102013222919B4 - Interconnects - Google Patents

Abstract

A connector (20) attached to a printed circuit board (16) with a holding element (26), the holding element (26) being inserted into a through hole (30) of the printed circuit board (16) and having solder applied by a reflow soldering process of the circuit board (16) such that the retaining member (26) retains the connector (20) on the circuit board (16), the retaining member (26) having:- a body portion (40) extending above a faceplate surface (16a ) of the circuit board (16) and attached to the connector (20); and- a leg portion (42) composed of a metal plate and formed integrally with the body portion (40), wherein- a leg portion (42) is inserted into a through hole (30), - the leg portion (42) extends from the body portion ( 40) extends in a direction toward the through hole (30),- the leg portion (42) includes a first leg (44) having a front end (46c) protruding from a back panel surface (16b) of the circuit board (16) and over which the solder applied by the reflow soldering process is connected to the printed circuit board (16), - the first leg (44) has a first leg section (48) and a second leg section (46), the second leg section (46) being inserted into the through hole (30th ) is inserted and the first leg portion (48) connects the second leg portion (46) to the body portion (40), and- the first leg (44) is formed to satisfy the following relationships: ‶S1b>S1s″ and ‶S2s >S1s″,‶W1u=W1d″, ‶W1b=W1s″ and ‶W2s=W1b″, wherein- "S1b" describes a cross-sectional area at a first boundary line (46a) between the first and second leg portions (46, 48), the first boundary line (46a) coinciding with a plane of the front panel surface (16a),- "S1s" a describes cross-sectional area at a second boundary line (46b) of the second leg portion (46), the second boundary line (46b) coinciding with a plane of the back panel surface (16b),- "S2s" describes a lowest value among cross-sectional areas of the first leg portion (48) of the first leg (44) describes,- "W1u" describes a width of the first leg (44) at the first optional line in a panel width direction perpendicular to a panel thickness direction of the body portion (40) and perpendicular to the panel extension direction of the leg portion (42),- " W1d" denotes a width of the first leg (44) at the second optional line in the panel width direction, - "W1b" denotes a width of the first leg (44). of the first boundary line (46a) in the plate width direction,- "W1s" describes a width of the first leg (44) at the second boundary line (46b) in the plate width direction,- "W2S" describes a lowest value among widths of the first leg portion (48) of the first leg (44) in the panel width direction, - the first leg (44) has a bending portion (54) extending in the panel extending direction, and the bending portion (54) in the first leg (44) from an intermediate point of the second leg portion (46) is formed between the first and second boundary lines (46a, 46b),- the bend portion (54) extends from the intermediate point to a point of the first leg portion (48) not covered by the solder (34). , the bending portion (54) on the first leg (44) does not contact an inner surface of the through hole (30), and - the solder (34) between the bending portion (54) on the first leg (44) and the through hole (30) is filled.

Description

The present invention relates to a connector fixed to a printed circuit board with a holding member, the holding member being inserted into a through hole of the printed circuit board and fixed thereto by a reflow soldering process to hold the connector to the printed circuit board.

In recent years, all electrical parts and components that are attached to a circuit board have been soldered to the circuit board by an ordinary solder application process and/or an ordinary reflow soldering process for cost reduction. In the event that an electrical part or component has a terminal that is inserted into a through hole of the circuit board, solder paste is applied to one of the board surfaces of the circuit board on an area adjacent to the through hole, the terminal is inserted into the through hole, and the reflow Soldering process carried out.

the JP 4 626 680 B2 for example, discloses a retainer for retaining a connector on a circuit board, wherein the retainer is connected to the circuit board by a reflow soldering process. The holding member has a body portion fixed to an electrical part or component and a leg portion extending from the body portion toward a through hole of the circuit board. The leg section is inserted into the through hole and connected to the circuit board by the reflow soldering process.

According to the prior art in the above Japanese patent, a part of the leg portion to be inserted into the through hole is formed in a flat plate shape and has a constant width. According to the 19 in the JP 4 626 680 B2 a second leg protrudes from a back plate surface of the circuit board and has a constant width toward its front end.

In the present application, a portion of the leg portion that is inserted into the through hole and is on the same plane as a faceplate surface of the circuit board is defined as a first boundary line, while a portion of the leg portion that is inserted into the through hole and is on located on the same plane as a back panel surface of the circuit board is defined as a second boundary line.

If a width of the leg portion at the second boundary line with respect to an inner diameter of the through hole is large, a large amount of solder paste is squeezed out of the through hole through the leg portion when the leg portion is inserted into the through hole, and this solder paste may fall off the circuit board. Even if the solder paste does not fall off the circuit board, the solder paste adhering to a front end of the leg portion is separated from the solder paste remaining in the through hole. Thereafter, even when the reflow soldering process has been performed, the solder paste at the front end of the leg portion remains separate from the other solder paste in the through hole. As a result, the amount of solder paste for connecting the holding member to the circuit board is insufficient, and high holding strength for holding a connector to the circuit board cannot be obtained.

On the other hand, when the width of the leg portion at the second boundary line is small with respect to the inner diameter of the through hole, the amount of solder paste to be squeezed out of the through hole can be reduced and the solder paste can be prevented from falling off the circuit board. However, since the width of the leg portion is constant, a width of the leg portion at the first boundary line also becomes narrow. Consequently, a contact area of the leg portion that is in contact with the solder paste for connecting the leg portion to the circuit board becomes smaller. And consequently, the high holding strength for holding the connector to the circuit board cannot be obtained either.

The leg portion has a body portion fixed to the connector, and the leg portion extends from the body portion into the through hole so that a portion of the leg portion inserted into the through hole is soldered to the circuit board. If any stress is applied to the support member, the stress may concentrate at a portion of the leg portion between the body portion and the brazed leg portion. If the width of the leg portion is narrow, the leg portion may be damaged by such a load.

From the EP 2 451 015 A1 a holding member to be inserted into a through hole formed in an electric circuit board to hold an electronic component on the electric circuit board and an electronic component provided with the holding member are also known. the DE 21 32 718 A refers to a solder support for printed circuit boards made by bend stamping.

It is an object of the present invention to provide a connector fixed to a circuit board with a holding member having sufficient strength to hold the connector on the circuit board and according to which any damage to the holding member can be avoided.

The object is achieved by a connector, which is attached to a circuit board with a holding element, according to claim 1. Advantageous developments are the subject of the subclaims.

According to the present invention, since a leg portion is inserted into a through hole, an inner diameter of the through hole into which the leg portion is inserted can be reduced. Consequently, a difference in inner diameters between the through hole for the leg portion and another through hole into which a terminal of an electrical part or component is inserted can be reduced. Accordingly, the solder paste can be prevented from falling off the through hole even when the solder paste is collectively applied to the through hole for the leg portion of the holding member and the through hole for the connection of the electrical part or the component.

Since the relationship "S1b > S1s" is satisfied, a situation can be avoided in which a larger amount of solder paste is squeezed out of the through hole to a back plate surface of the circuit board compared to a case in which the cross-sectional area at the second boundary line is the same that at the first boundary line, ie when "S1b = S1s". Furthermore, a contact area between the solder paste and the leg portion can be increased compared to the case where "S1b=S1s".

Since the relationship of “S2s>S1s” is satisfied, any damage to the leg portion can be suppressed even if the stress is concentrated on a portion of the leg portion that is not covered with the solder paste.

As described above, according to the present invention, sufficient holding strength for the holding member can be maintained and damage to the leg portion can be suppressed with the first leg inserted into the through hole and connected thereto by the reflow soldering process.

According to another feature of the present invention, the relation “S2s≧S1b” is further satisfied in the first leg.

According to the above feature, the strength of the first leg portion of the leg portion can be further increased, and the damage of the leg portion can be suppressed more effectively.

According to another feature of the present invention, the first leg is formed to further satisfy the relation “S1u≧S1d”.

In the above relationship, “S1u” describes a cross-sectional area at a first optional line of the second leg portion, while “S1d” describes a cross-sectional area at a second optional line of the second leg portion. Further, the second optional line is located at a position farther from the body portion in a plate extending direction of the leg portion than that for the first optional line.

According to the above feature (“S1u ≥ S1d”), through the entire portions of the second leg portion of the leg portion (including the portion accommodated in the through hole and the projection portion), the amount of solder paste pushed out of the through hole to the back plate surface would be reduced.

According to the invention, the first leg is formed to further satisfy the following relationships: "W1u ≥ W1d", "W1b > W1s", and "W2s ≥ W1b".

In the above relationships, “W1u” describes a width of the first leg at the first optional line in a board width direction perpendicular to a board thickness direction of the body portion and perpendicular to a board extending direction of the leg portion.

"W1d" describes a width of the first leg at the second optional line in the panel width direction.

"W1b" describes a width of the first leg at the first boundary line in the plate width direction.

"W1s" describes a width of the first leg at the second boundary line in the plate width direction.

“W2S” describes a bottom among widths of the first leg portion of the first leg in the plate width direction.

As described above, the above predetermined ratios for the widths of the leg portion are satisfied, so that the predetermined ratios for the cross-sectional areas of the leg portion can be satisfied. If the predetermined ratios for the cross-sectional areas of the leg portion are satisfied by adjusting the widths of the leg portion, the Holding element can be manufactured with the predetermined shape in a simple manner.

According to still another feature of the present invention, the first leg is formed to satisfy the relation “W2b>W1b”, where “W2b” describes a maximum value among widths of the first leg portion of the first leg in the board width direction. According to the above feature, the strength of the first leg portion of the leg portion can be further increased, and the damage of the leg portion can be suppressed more effectively.

According to the invention, the first leg has a bending portion which extends in the board extension direction. The bending portion extends from an upper portion of the first leg not covered by solder to a lower portion of the first leg covered by the solder.

According to the above feature, the cross-sectional area of the leg portion can be made larger by such a bend portion than that in the case where the leg portion has the same width but no bend portion. Consequently, the contact area of the leg portion with the solder paste (solder) can be increased so as to increase the holding strength of the holding member. On the other hand, the width of the leg portion can be made smaller by such a leg portion than that in the case where the leg portion has the same cross-sectional area but has no bending portion. Consequently, the difference in inner diameters between the through hole for the leg portion and the other through hole into which the terminal of the other electrical part or component is inserted can be reduced.

• 1 eine schematische Abbildung zur Veranschaulichung einer Umrissstruktureiner elektronischen Steuervorrichtung mit einem Verbinder und einem Halteelement gemäß einer ersten Ausführungsform;
• 2 eine vergrößerte schematische Draufsicht einer Leiterplatte zur Veranschaulichung relevanter Abschnitte einschließlich des Halteelements;
• 3 eine vergrößerte schematische Querschnittsansicht entlang der Linie III-III in der 2;
• 4 eine schematische Perspektivansicht zur Veranschaulichung des Halteelements;
• 5 eine vergrößerte schematische Querschnittsansicht zur Veranschaulichung relevanter Abschnitte, die durch einen Reflow-Lötprozess verbunden werden, in einem Zustand, in dem das Halteelement an der Leiterplatte befestigt ist;
• 6 eine vergrößerte schematische Querschnittsansicht einer zweiten Ausführungsform entsprechend der 5 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 7 eine vergrößerte schematische Querschnittsansicht einer dritten Ausführungsform entsprechend der 5 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 8 eine schematische Perspektivansicht entsprechend der 4 zur Veranschaulichung einer Umrissstruktur eines Halteelements gemäß einer vierten Ausführungsform;
• 9 eine schematische Querschnittsansicht entlang der Linie IX-IX in der 8;
• 10 eine vergrößerte schematische Querschnittsansicht der vierten Ausführungsform entsprechend der 5 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 11 eine schematische Querschnittsansicht entlang der Linie XI-XI in der 10;
• 12 eine vergrößerte schematische Querschnittsansicht einer fünften Ausführungsform entsprechend der 5 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 13 eine schematische Querschnittsansicht entlang der Linie XIII-XIII in der 12;
• 14 eine schematische Draufsicht zur Veranschaulichung einer Umrissstruktur eines Halteelements gemäß einer sechsten Ausführungsform;
• 15 eine schematische Querschnittsansicht entlang einer Linie XV-XV in der 14;
• 16 eine schematische Abbildung zur Veranschaulichung eines Prozesses zur Fertigung des Halteelements in der 14;
• 17 eine vergrößerte schematische Querschnittsansicht einer siebten Ausführungsform entsprechend der 5 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 18 eine schematische Querschnittsansicht entlang einer Linie XVIII-XVIII in der 17;
• 19 eine schematische Querschnittsansicht entlang einer Linie XIX-XIX in der 17;
• 20 eine schematische Perspektivansicht zur Veranschaulichung einer Umrissstruktur eines Halteelements gemäß einer achten Ausführungsform;
• 21 eine schematische Abbildung zur Veranschaulichung eines Prozesses zur Fertigung des Halteelements in der 20;
• 22 eine schematische Querschnittsansicht entsprechend der 3 zur Veranschaulichung relevanter Abschnitte in einem Halteelementbefestigungszustand;
• 23 eine vergrößerte schematische Querschnittsansicht zur Veranschaulichung relevanter Abschnitte, die durch den Reflow-Lötprozess verbunden werden, unter der Bedingung, dass das Halteelement an der Leiterplatte befestigt ist;
• 24 eine schematische Querschnittsansicht entlang der Linie XXIV-XXIV in der 23; und
• 25 eine schematische Abbildung entsprechend 3 zur Veranschaulichung relevanter Abschnitte gemäß einer neunten Ausführungsform in einem Halteelementbefestigungszustand.

The object, characteristics and advantages of the present invention are more apparent from the following detailed description with reference to the accompanying drawings. In the drawings shows:

• 1 Fig. 12 is a schematic diagram showing an outline structure of an electronic control device having a connector and a holding member according to a first embodiment;
• 2 12 is an enlarged schematic plan view of a circuit board showing relevant portions including the holding member;
• 3 FIG. 12 is an enlarged schematic cross-sectional view taken along line III-III in FIG 2 ;
• 4 a schematic perspective view illustrating the holding element;
• 5 12 is an enlarged schematic cross-sectional view showing relevant portions connected by a reflow soldering process in a state where the holding member is fixed to the circuit board;
• 6 an enlarged schematic cross-sectional view of a second embodiment according to FIG 5 for showing relevant portions in a holding member attachment state;
• 7 an enlarged schematic cross-sectional view of a third embodiment according to FIG 5 for showing relevant portions in a holding member attachment state;
• 8th a schematic perspective view according to FIG 4 for illustrating an outline structure of a holding member according to a fourth embodiment;
• 9 a schematic cross-sectional view along line IX-IX in FIG 8th ;
• 10 an enlarged schematic cross-sectional view of the fourth embodiment according to FIG 5 for showing relevant portions in a holding member attachment state;
• 11 a schematic cross-sectional view along line XI-XI in FIG 10 ;
• 12 an enlarged schematic cross-sectional view of a fifth embodiment according to FIG 5 for showing relevant portions in a holding member attachment state;
• 13 a schematic cross-sectional view along line XIII-XIII in FIG 12 ;
• 14 12 is a schematic plan view showing an outline structure of a holding member according to a sixth embodiment;
• 15 FIG. 12 is a schematic cross-sectional view taken along a line XV-XV in FIG 14 ;
• 16 a schematic diagram for illustrating a process for manufacturing the holding element in FIG 14 ;
• 17 an enlarged schematic cross-sectional view of a seventh embodiment according to FIG 5 for showing relevant portions in a holding member attachment state;
• 18 a schematic cross-sectional view taken along a line XVIII-XVIII in FIG 17 ;
• 19 FIG. 12 is a schematic cross-sectional view taken along a line XIX-XIX in FIG 17 ;
• 20 12 is a schematic perspective view showing an outline structure of a holding member according to an eighth embodiment;
• 21 a schematic diagram for illustrating a process for manufacturing the holding element in FIG 20 ;
• 22 a schematic cross-sectional view corresponding to FIG 3 for showing relevant portions in a holding member attachment state;
• 23 12 is an enlarged schematic cross-sectional view showing relevant portions connected by the reflow soldering process under the condition that the holding member is fixed to the circuit board;
• 24 a schematic cross-sectional view along line XXIV-XXIV in FIG 23 ; and
• 25 a schematic figure accordingly 3 12 for illustrating relevant portions according to a ninth embodiment in a retainer attachment state.

The present invention is described below with reference to several embodiments, of which the fourth to ninth embodiments embody the invention and the first to third embodiments are merely illustrative thereof. In the embodiments, the same or similar portions and/or structures are denoted by the same reference numerals and will not be described repeatedly.

Hereinafter, a direction in which a leg portion of a holding member extends from a body portion of the holding member toward a circuit board is referred to as a board extending direction or vertical direction. The board extending direction (the vertical direction) corresponds to a thickness direction of the circuit board. A thickness direction of the body portion is referred to as a plate thickness direction. The board thickness direction corresponds to a direction in which multiple terminals of a connector are arranged. A direction perpendicular to both the board extending direction and the board width direction is referred to as a board width direction. The board thickness direction and the board width direction are parallel to a board surface of the circuit board.

(First embodiment)

A first embodiment will be described below with reference to the drawings. First, an outline structure of an electronic control device 10 having a connector and a holding member according to a first embodiment will be described with reference to FIG 1 described. In the 1 1, a case 12 is shown in a state where the case 12 is disassembled from a circuit board 16 for convenience.

The electronic control device 10 formed in a non-waterproof structure is used as an electronic control unit (the ECU) for an internal combustion engine of a vehicle. The electronic control device 10 is composed of the case 12, a circuit board 14 housed in the case 12, and the like.

The housing 12 is constructed of metal (such as aluminum, iron, or the like) or resin, and serves to house the circuit board 14 for protection. A number of components for the housing 12 is not limited to a specific number, so that the housing 12 may be composed of one component or multiple components.

In the present embodiment, the housing 12, as in FIG 1 shown, is made up of two components divided in the panel extending direction (in the vertical direction). The case 12 is constructed of a box-shaped lower case 12a having an open end at the top with a flat bottom and an upper case 12b for closing the open end at the top of the lower case 12a. When the upper case 12b and the lower case 12a are connected to each other by screws or bolts, for example, an internal space for accommodating the circuit board 14 is formed.

In the circuit board 14, electronic parts and/or components 18 such as a microcomputer, power transistors, resistors, capacitors and the like are attached to the circuit board 16. The electronic parts and/or components 18 are arranged on at least one of the board surfaces (a front-side board surface 16a and a back-side board surface 16b) of the circuit board 16 . In the present embodiment, the electronic parts and components 18 are mounted on both sides 16a and 16b of the circuit board 16. FIG.

Electrical circuit patterns are formed on the circuit board 16 . A connector 20, the external electrical and/or electronic device connections (not shown) to the electronic parts and/or components 18 is also attached to the circuit board 16. The connector 20 is made up of a plurality of terminals 22 made of a conductive material and a connector housing 24 made of an insulating material (such as resin) and holding the terminals 22 .

In the present embodiment, each of the terminals 22 is formed into a through hole (in Fig 1 not shown) formed in the circuit board 16 and electrically connected to a land portion via solder, the land portion being formed on a cylindrical wall of the through hole or on a portion adjacent to a circumferential open end of the through hole. The terminals 22 are attached to the circuit board 16 using through-hole attachment technology and are electrically connected to the circuit board 16 by a reflow soldering process. Alternatively, the terminals 22 may be attached to the circuit board 16 using surface mount technology and a surface mount reflow process.

The connector 20 further includes a pair of retainers 26 . In the present embodiment, one of the holding members 26, as shown in FIG 2 shown, at an end 24a of the connector housing 24 in the board thickness direction (at a right end in Fig 2 ) intended. Although not shown in the drawings, another holding member 26 is provided at another end of the connector housing 24 in the panel thickness direction (at a left end in the 2 ) intended. The multiple terminals 22 are provided in the connector 20 between the above pair of holding members 26 .

The holding member 26 is described below with reference to FIG 3 until 5 described in more detail. In the 3 a dummy pad is omitted for the sake of simplicity.

The holding element 26 is, as in 3 shown inserted into a through hole 30 formed in circuit board 16 and bonded thereto by the reflow soldering process. Consequently, the holding member 26 or holding members 26 hold the connector 20 firmly on the circuit board 16. A dummy pad 32 is, as in FIG 5 1, formed on a cylindrical wall of the through hole 30, more specifically, on peripheral portions of open ends of the through hole 30 in the front panel surface 16a and the back panel surface 16b of the circuit board 16. The dummy pad 32 is not electrically connected to the electronic parts and/or components 18 connected, which are attached to the printed circuit board 16. More specifically, the dummy pad 32 has no electrical connection function. In the present embodiment, lands for the terminals 22 are formed in the circuit board 16 by copper plating. The dummy pad 32 is formed by the copper plating like the pads for the terminals 22 . The holding element 26 is, as in the 3 and 5 shown inserted into through hole 30 and mechanically connected to dummy pad 32 by solder 34 .

The holding element 26 is, as in 4 1, is constructed of a metal plate of a predetermined thickness which is processed to have a body portion 40 and a leg portion 42 extending from the body portion 40. FIG.

The body portion 40 is a part of the support member 26 which is fixed to the connector housing 24 and is positioned above the front panel surface 16a of the printed circuit board 16. As shown in FIG. In the present embodiment, the body portion 40 is formed in a flat plate shape and has a rectangular portion 40a and a forked portion 40b. The rectangular portion 40a is formed in a rectangular shape of which one side extends in the plate extending direction (the vertical direction) to form the leg portion 42 and the other side extends in the plate width direction to form the fork portion 40b. Each of the arms of the fork portion 40b extends from the rectangular portion 40a in the plate width direction. The connector housing 24 has an open-ended groove 24c on a front side 24b of the connector housing 24 . The body portion 40 is inserted into the groove 24c such that the holding member 26 is fixedly fixed to the connector housing 24 with the pair of arms of the fork portion 40b on a bottom side of the groove 24c (at the left end in Fig 3 ) is located.

The leg portion 42 is formed as another part of the holding member 26 to extend from the rectangular portion 40a of the body portion 40 toward the through hole 30 in the vertical direction. The leg portion 42 has at least one leg (a first leg 44).

The first leg 44 passes through the through hole 30 such that a part (a front end) of the first leg 44 protrudes on one side of the back plate surface 16b. The first leg 44 includes a first leg portion 48 and a second leg portion 46 . The second leg portion 46 is an insertion portion 46 inserted into the through hole 30, and the first leg portion 48 is a base portion 48 for connection The second leg portion 46 (the insertion portion 46) of the first leg 44 corresponds to a part of the leg portion 42 extending from a first boundary line 46a to a front end of the leg portion 42. The first boundary line 46a corresponds to a line located in the board extending direction at the same position (or at the same level) as that of the front side board surface 16a under the condition that the inserting portion 46 is fixed to the dummy pad 32 by the solder 34 is.

The insertion portion 46 has, as shown in FIGS 3 until 5 1, has an accommodation area between the first boundary line 46a and a second boundary line 46b. More specifically, the accommodating area corresponds to a part of the leg portion 42 that is arranged (ie, housed) in the through hole 30 in the plate extending direction (the vertical direction). The second boundary line 46b corresponds to a line that is at the same position (or at the same level) as that of the back plate surface 16b in the plate extending direction, under the condition that the inserting portion 46 is fixed to the dummy pad 32 by the solder 34 is. The insertion portion 46 further has a projection portion 46c protruding from the back plate surface 16b in the plate extending direction. In the present embodiment, the leg portion 42 (the first leg 44) is also formed in the flat plate shape. More specifically, the entire area of the holding member 26 is formed in the flat plate shape with no bent or curved portions.

Ferner ist, gemäß der vorliegenden Ausführungsform, das erste Bein 44 gebildet, um das folgende Verhältnis zu erfüllen: $$‶S1u\ge \text{S}1\text{d}″,$$

wobei
„S1u“ einer Querschnittsfläche an einem ersten optionalen Punkt des ersten Beines 44 in der Plattenerstreckungsrichtung entspricht, während „S1d“ einer Querschnittsfläche an einem zweiten optionalen Punkt des ersten Beines 44 entspricht, wobei sich der zweite optionale Punkt weiter entfernt vom Körperabschnitt 40 befindet als der erste optionale Punkt. D.h., der zweite optionale Punkt befindet sich näher als der erste optionale Punkt zum vorderen Ende des ersten Beines 44.When a cross-sectional area of the leg portion 42 at the first boundary line 46a is defined as “S1b”, a cross-sectional area at the second boundary line 46b is defined as “S1s”, and a bottom of a cross-sectional area of the first leg portion 48 (the base portion 48) is defined as “S2s”. where the first leg 44 is formed to satisfy the following relationships: $$‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s>\text{S}1\text{s}″$$

Further, according to the present embodiment, the first leg 44 is formed to satisfy the following relationship: $$‶S1\mathrm{and}\ge \text{S}1\text{i.e}″,$$

whereby
"S1u" corresponds to a cross-sectional area at a first optional point of the first leg 44 in the plate extension direction, while "S1d" corresponds to a cross-sectional area at a second optional point of the first leg 44, the second optional point being further away from the body portion 40 than that first optional point. That is, the second optional point is closer than the first optional point to the front end of the first leg 44.

More specifically, among cross-sectional areas of those points of the insertion portion 46 accommodating area that are in the space of the through hole 30, the cross-sectional area “S1b” is maximum at the first boundary line 46a, while the cross-sectional area “S1s” is minimum at the second boundary line 46b.

wobei
„S2s“ einen Tiefstwert der Querschnittsfläche des ersten Beinabschnitts 48 (des Grundabschnitts 48) beschreibt und „S1b“ die Querschnittsfläche der ersten Grenzlinie 46a beschreibt, so wie es vorstehend beschrieben ist.Furthermore, the first leg 44 is formed to satisfy the following relationship: $$‶S2s\ge \text{S}1\text{b}″,$$

whereby
“S2s” describes a bottom of the cross-sectional area of the first leg portion 48 (the base portion 48) and “S1b” describes the cross-sectional area of the first boundary line 46a, as described above.

In the present embodiment, the first leg 44 is formed in the flat plate shape, a plate thickness thereof is constant and no step portion exists in the plate thickness direction. A width of the first optional point of the inserting portion 46 is as shown in FIG 5 shown is defined as "W1u", a width of the second optional point is defined as "W1d", a width of the first boundary line 46a is defined as "W1b", and a width of the second boundary line 46b is defined as "W1s". Further, a bottom of a width of the first leg portion 48 (the base portion 48) is defined as “W2s”.

Ferner ist ein Innendurchmesser des Durchgangslochs 30 größer als die Breite „W1b“ an der ersten Grenzlinie 46a ausgelegt. Der Einfachheit halber ist in der 5 jedes der Symbole (S1b, S1s, S2s, S1u und S1d) für die jeweiligen Querschnittsflächen nach jedem entsprechenden Symbol für die Breite (W1b, W1s, W2s, W1 u und W1 d) in Klammern gesetzt.The first leg 44 is formed to meet the following width relationships to meet the above cross-sectional area relationships (“S1b > S1s” and “S2s > S1s”): $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b>\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s\ge \text{W}1\text{b}″$$

Further, an inner diameter of the through hole 30 is set larger than the width “W1b” at the first boundary line 46a. For the sake of simplicity, in the 5 each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas are placed in parentheses after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d).

The first leg 44 extends in a straight line along the panel extending direction. The first leg 44 extends from a trunk portion between the body portion 40 and the first leg portion 48 (the base portion 48) to a step portion 50 located in the accommodation tion area of the second leg portion 46 is formed, has a constant width. The step portion 50 is inserted into the through hole 30 . Thus, the first leg portion 48 has the constant width (the width "W2") throughout its length from the trunk portion to the first boundary line 46a. The width "W2" corresponds to the lowest value "W2s" for the width of the first leg portion 48. Also, the width "W1b" at the first boundary line 46a is equal to the width "W2s".

The second leg portion 46 (the insertion portion 46) has a large width area from the first boundary line 46a to the step portion 50 and a small width area from the step portion 50 to the front end. The large width area has a width equal to that (W1b) of the first leg portion 48, and the width is constant from the first boundary line 46a to the step portion 50. FIG. The narrow width region has a constant width (W1u, W1s, W1d) smaller than the width “W1b” (=W2s). Consequently, in the accommodating area of the second leg portion 46 between the first and second boundary lines 46a and 46b accommodated in the through hole 30, the width "W1b" at the first boundary line 46a is a maximum width, while the width "W1s" at the second Boundary line 46b is a minimum width. More specifically, the cross-sectional area “S1b” at the first boundary line 46a describes a maximum value for the cross-sectional area, while the cross-sectional area “S1s” at the second boundary line 46b describes a minimum value for the cross-sectional area. As described above, the second leg portion 46 (the insertion portion 46) has two widths “W1b” and “W1u” (=W1s) defined by the step portion 50 in the insertion area of the through hole 30. FIG. In the present embodiment, the inserting portion 46 has a pair of step portions 50 formed on both sides in the plate width direction. The small-width portion of the inserting portion 46 having the constant width extends from a center of the inserting portion 46 between the pair of step portions 50 straight in a direction toward the back plate surface 16b.

The solder 34 is disposed in the through hole 30 and connected to the accommodating area of the leg portion 42 between the first and second boundary lines 46a and 46b. The solder 34 has, as in 5 1, has a fillet portion (a protrusion portion) on the face plate surface 16a of the circuit board 16, so that such a fillet portion of the solder 34 is also connected to a portion of the first leg portion 48 (a portion above the first boundary line 46a). Likewise, the solder 34 has another fillet portion on the back plate surface 16b of the circuit board 16, so that such fillet portion is also connected to a portion of the projection portion 46c of the second leg portion 46 (the insertion portion 46).

A process for fixing the holding member 26 to the circuit board 16 will be described below.

First, a metal plate (not shown) is punched out to prepare the holding member 26 having a predetermined shape. The holding member 26 is fixed to the connector housing 24 of the connector 20, which is prepared separately.

A solder paste, which later becomes solder 34, is applied to the dummy pad 32 and the through hole 30 by using a screen printing process, from one of the board surfaces (such as the face board surface 16a). In the screen printing process, the solder paste is applied not only to the through hole 30 (including the dummy pad 32) for the holding member 26 but also to through holes (including pads) for the terminals 22 of the connector 20 and other pads for the electronic parts and Components 18. As described above, the screen printing process is carried out collectively for the through holes (the land) for the holding member 26, the terminals 22 of the connector 20, and the electronic parts and components 18.

Then, the first leg 44 of the holding member 26 is inserted into the through hole 30 while pushing down the solder paste toward the back plate surface 16b. In the above process, the terminals 22 of the connector 20 are likewise inserted into the respective corresponding through holes. Furthermore, the electronic parts and components 18 are mounted on the solder paste.

Following this, the reflow soldering process is performed on the holding member 26, the connector 20, and the electronic parts and components 18. The holding element 26 is attached to the printed circuit board 16 in this way. At the same time, the terminals 22 of the connector 20 and the electronic parts and components 18 are electrically connected to the corresponding pads. In this way the circuit board 14 is completed.

Advantages of the holding member 26 and the connector 20 of the present embodiment will be described below.

• Der Durchmesser des Anschlusses 22 beträgt 0,5 mm;
• Der Innendurchmesser des Durchgangslochs für den Anschluss 22 beträgt 0,9 mm;
• Die Breite „W1s“ der zweiten Grenzlinie 46b beträgt 0,5 mm;
• Die Breite „W1b“ der ersten Grenzlinie 46a beträgt 1,1 mm;
• Der Innendurchmesser des Durchgangslochs 30 liegt zwischen 1,2 und 1,4 mm.

According to the present embodiment, a leg portion 42 is disposed in a through hole 30 . Consequently, the inner diameter of the through hole 30 into which the first leg 44 is inserted can be reduced. As a result, a difference in the inner diameter of the through holes between the through hole 30 for the leg portion 42 and the through holes for the other electronic parts and components can be reduced. More specifically, the difference between the inner diameter of the through hole 30 and the inner diameter of the through holes for the terminals 22 of the connector 20 can be reduced. For example, the present embodiment has the following dimensions:

• The diameter of the terminal 22 is 0.5 mm;
• The inner diameter of the through hole for terminal 22 is 0.9mm;
• The width "W1s" of the second boundary line 46b is 0.5 mm;
• The width "W1b" of the first boundary line 46a is 1.1 mm;
• The inner diameter of the through hole 30 is between 1.2 and 1.4 mm.

As a result, the reflow soldering process can be performed collectively for the through hole 30 and the through holes for the other parts and/or components (such as the through hole for the terminals 22 of the connector 20) to apply the solder paste to those of the through holes simultaneously to bring up.

As the difference in the inner diameters of the through holes becomes larger, i.e., as the inner diameter of the through hole 30 becomes larger, a moving distance of a squeegee becomes larger. Consequently, since an increased amount of the solder paste is pressed into the through hole 30, the solder paste may fall out of the through hole 30. FIG. However, according to the present embodiment, the difference in the inner diameters of the through holes can be reduced. Consequently, the circuit board can be prevented from falling out of the through hole 30 .

According to the present embodiment, the inner diameter of the through hole 30 is reduced while the width of the first leg 44 satisfies the relation “W1b>W1s” as shown in FIG 5 is shown. Consequently, the cross-sectional area for the first leg 44 satisfies the relationship “S1b > S1s”. As a result, the present embodiment is advantageous in that the solder paste does not fall out of the through hole 30, compared to the case where the width “W1s” at the second boundary line 46b is equal to the width “W1b” at the first boundary line 46a toward the back plate surface 16b can be prevented (or restricted) when the second leg portion 46 (the insertion portion 46) is inserted into the through hole 30. Consequently, not only can the solder paste be prevented from falling out of the through hole 30, but also the solder paste required for connecting the holding member 26 to the circuit board 16 (having the dummy pad 32) can be prevented from being in the space of the through hole 30 , is running out.

Further, since the cross-sectional area "S1b" at the first boundary line 46a is larger than the cross-sectional area "S1s" at the second boundary line 46b (S1b > S1s), a contact area between the leg portion 42 and the solder 34 compared to the case that the Width "W1s" at the second boundary line 46b is equal to the width "W1b" at the first boundary line 46a can be increased. Due to the relation of “S1b>S1s”, the holding member 26 can be provided with a sufficient connector holding strength.

According to the present embodiment, the second leg portion 46 (the inserting portion 46) satisfies the relation “W1u≧W1d”, and hence the relation “S1u≧S1d”. Further, in the accommodating area of the inserting portion 46, the cross-sectional area “S1b” at the first boundary line 46a is maximum, while the cross-sectional area “S1s” at the second boundary line 46b is minimum. Therefore, compared to the case where the accommodating area of the inserting portion 46 (between the first and second boundary lines 46a and 46b) has a constant cross-sectional area, such as the constant cross-sectional area “S1b”, the present embodiment is advantageous in that the solder paste is suppressed from the through hole 30 toward the back plate surface 16b can be prevented (or restricted) when the inserting portion 46 is inserted into the through hole 30 . Further, the solder paste squeezing-out, which may be caused by the projection portion 46c protruding toward the back plate surface 16b, can be prevented (or restricted). As described above, the entire area of the insertion portion 46 (not only the accommodation area but also the projection area 46c) prevents the solder paste from being pushed out to the back plate surface 16b.

Further, since the second leg portion 46 of the leg portion 42 (the inserting portion 46) satisfies the relationship "S1u ≥ S1d", a contact area between the accommodating area of the inserting portion 46 and the solder 34 can be reduced compared to the case where the accommodating area has a con constant width (such as the width of "W1s") throughout its length, ie, the accommodation region has a constant cross-sectional area (such as the cross-sectional area of "S1s") throughout its length. As a result, the connector holding strength of the holding member 26 can be increased.

According to the present embodiment, the front end of the insertion portion 46 (i.e., the projecting portion 46c) protrudes outward from the back plate surface 16b. In the structure of this embodiment, the solder paste is more likely to be squeezed out when the inserting portion 46 is inserted into the through hole 30 compared to the case where the front end of the inserting portion does not protrude outward from the back plate surface. However, according to the present embodiment, since the above relationships are satisfied for the width and for the cross-sectional areas, the solder paste can be prevented (or restrained) from falling off.

Although the solder paste does not fall off, a large amount of the solder paste may stick to the front end of the first leg 44 . Consequently, such solder paste can be separated from the solder paste in the through hole 30 after the reflow soldering process is performed. According to the present embodiment, since the above relationships for the width and for the cross-sectional areas are satisfied, an amount of the solder paste to be squeezed out through the leg portion can be reduced, so that part of the solder paste can be prevented from leaking from the remaining part of the solder paste in the through hole 30 is separated. Consequently, a required amount of the solder can be held in the space of the through hole 30 .

The body portion 40 of the retention member 26 is attached to the connector 20 while the housing area of the first leg 44 (including areas adjacent to the housing area) is bonded to the solder 34 . If any load is applied to the support member 26, the load may build up on a portion of the first leg 44 between the body portion 40 and the housing area that is attached to the circuit board 16 by the solder 34, ie, a portion of the leg portion 42 with the Low for latitude, focus.

According to the present embodiment, the first leg 44 is formed to satisfy the relation “S2s>S1s”. Since the first leg portion 48 (the base portion 48) has a cross-sectional area larger than that at the second boundary line 46b, damage to the leg portion can be prevented even if stress is concentrated on a portion of the first leg portion 48 which is not covered by the solder 34 is covered.

Specifically, in the present embodiment, the first leg 44 is formed to satisfy the relation “S2s≧S1b”. More specifically, the first leg 44 satisfies the relation "W2s = W1b", i.e. "S2s = S1b". That is, the cross-sectional area of the first leg portion 48 is equal to that at the first boundary line 46a. Consequently, the possible damage in the first leg 44 can be effectively prevented.

According to the present embodiment, a height (or a length) of the protruding portion 46c of the first leg 44 protruding outward from the back plate surface 16b becomes larger than a height (or a length) of a protruding portion (not shown) of the terminal(s). 22 of connector 20, which also projects outwardly from back panel surface 16b. This results in the first leg 44 being inserted into the through hole 30 before the terminal or terminals 22 of the connector 20 is or are inserted into the corresponding through hole. Consequently, the first leg 44 has a function of positioning the terminals 22 of the connector 20 with respect to the circuit board 16 . Accordingly, the terminals 22 can be prevented from being bent and further a plated layer can be prevented from being removed.

(Second embodiment)

A second embodiment is described below. Since the connector 20 and the electronic control device 10 of the first embodiment are equally applied to the second embodiment, the description thereof is omitted below.

According to the second embodiment, as in FIG 6 1, at least a portion of the first leg 44 is tapered in the panel extension direction such that the width of the first leg 44 decreases in a direction away from the body portion 40. As shown in FIG. A part of the tapered portion of the first leg 44 is accommodated in the through hole 30 . In the present embodiment, the first leg 44 is formed in the flat plate shape. In the 6 For convenience, each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d).

In the second embodiment according to FIG 6 For example, an entire area of the first leg 44 (the first leg portion 48 and the second leg portion 46 (the insertion portion 46)) is tapered from the trunk portion between the body portion 40 and the first leg portion 48 to the front end of the leg portion 42. In the tapered shape, a change in width is constant for a unit length in the plate extending direction. Both sides of the leg portion 42 in the plate width direction are tapered, each of the changes for the unit length on the both sides being equal to each other.

In the tapered shape, the width “W2” of the first leg portion 48 becomes minimum at the first boundary line 46a (a minimum width “W2s”). The width "W2" of the first leg portion 48 increases toward the trunk portion between the body portion 40 and the first leg portion 48 . The width of the first leg portion 48 becomes maximum at the trunk portion (a maximum width “W2b”: not shown).

In the second leg portion 46 of the first leg 44 (the insert portion 46), the width of the insert portion 46 increases toward the body portion 40 as well. The insertion portion 46 satisfies a relationship of “W1u>W1d” over its entire length. In an accommodation area of the inserting portion 46 (an area of the inserting portion 46 to be accommodated in the through hole 30), the width "W1b" at the first boundary line 46a is a maximum width, while the width "W1s" at the second boundary line 46b is a minimum width is. More specifically, the accommodation region has a peak “S1b” in cross-sectional area at the first boundary line 46a and a valley “S1s” in cross-sectional area at the second boundary line 46b.

The first leg 44 satisfies the following width relationships: "W1u > W1d", "W1b > W1s", and "W2s = W1b". Consequently, the first leg 44 satisfies the following relationships for the cross-sectional area: "S1u > S1d", "S1b > S1s", and "S2s = S1b". Further, the first leg 44 satisfies a relation of “W2b>W1b”. As a result, the maximum value “S2b” for the cross-sectional area of the first leg portion 48 satisfies a relationship “S2b > S1b”.

According to the second embodiment (the tapered shape of the leg portion), the same advantages as in the first embodiment can be brought about. Further, when the inserting portion 46 is inserted into the through hole 30, the solder paste goes away to a vicinity of the inserting portion 46 due to the tapered shape. As a result, an amount of the solder paste that would be squeezed out to the back plate surface 16b can be reduced compared to the first embodiment (in which the leg portion 44 has the step portion 50). Consequently, the connector holding strength of the holding member 26 can be increased.

In the embodiment according to FIG 6 the entire area of the first leg 44 is tapered. However, the same advantages can be brought about if only such a portion of the first leg portion 48 covered by the solder 34 and the second leg portion 46 (the insertion portion 46) are tapered.

(Third embodiment)

A third embodiment is described below. Since the connector 20 and the electronic control device 10 of the first embodiment are equally applied to the third embodiment, the description thereof is omitted below.

The first leg 44 has, as in 7 shown has a tapered region. More specifically, a portion of the first leg 44 from the trunk portion between the body portion 40 and the leg portion 42 to an intermediate portion 52 of the accommodation portion is formed in the tapered shape. The intermediate portion 52 corresponds to a portion between the first and second boundary lines 46 a and 46 b and is accommodated in the through hole 30 . A bottom portion area of the inserting portion 46 from the intermediate portion 52 to the second boundary line 46b has a constant width equal to the width of the intermediate portion 52 (the bottom portion area is also referred to as a constant width area). Consequently, the intermediate portion 52 corresponds to a boundary line of the inserting portion 46 between the tapered portion and the constant-width portion. The first leg 44 is formed in the flat plane shape as in the first embodiment. That is, the first leg 44 has the constant thickness over its entire length. In the 7 For convenience, each of the symbols (S1b, S1s, S2s, S1u, and S1d) for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width (W1b, W1s, W2s, W1u, and W1d).

In the inserting portion 46, a lowermost portion from the intermediate portion 52 (from the boundary line 52) to the front end of the first leg 44 also has a constant width.

In the first leg portion 48 (the base portion 48 of the first leg 44) is a lower part (ie, the tapered portion up to the first boundary line 46a) is referred to as a first connecting portion 48a, while an upper portion having a constant width is referred to as a second connecting portion 48b. In the first connecting portion 48a (the tapered portion), a lower portion is covered by the solder 34 while an upper portion is not covered by the solder 34. FIG. The second connecting portion 48b located on one side of the body portion 40 has the constant width that is larger than a maximum width of the first connecting portion 48a. A center line of the insertion portion 46 (including the tapered portion and the constant width portion) and a center line of the first connecting portion 48a (the tapered portion of the first leg portion 48) coincide with a center line of the second connecting portion 48b.

According to the above structure, a width "W2" of the first leg portion 48 becomes minimum (a minimum width " W2s"). The width “W2” of the first connection portion 48a increases toward the body portion 40 . A width "W2b" of the second connection region 48b is a maximum width of the first leg portion 48. Accordingly, a cross-sectional area at the portion of minimum width "W2s" (ie, at the first boundary line 46a) corresponds to a minimum value "S2s" while a cross-sectional area at the portion of the maximum width "W2b" (ie, in the second connection area 48b) corresponds to a maximum value "S2b" for the cross-sectional area of the leg portion 42.

In the insertion portion 46, the width thereof increases from the intermediate portion 52 toward the body portion 40 as well, while the width thereof from the intermediate portion 52 to the front end of the leg portion 44 is constant. That is, the inserting portion 46 satisfies a relationship of "W1u ≥ W1d". A width "W1s" of the inserting portion 46 at the second boundary line 46b corresponds to a minimum value among the widths of the accommodating area of the inserting portion 46. A width "W1b" of the inserting portion 46 at the first boundary line 46a corresponds to a maximum value, ie, is larger than the width " W1s” at the second boundary line 46b.

Folglich sind die folgenden Verhältnisse erfüllt: $$‶S1u\ge \text{S}1\text{d}″,‶S1b>\text{S}1\text{s}″\text{und}‶S2s=\text{S}1\text{s}″$$

Ferner sind die folgenden Verhältnisse erfüllt: $$‶W2b>\text{W}1\text{b}″\text{und folglich}‶S2b>\text{S}1\text{b}″$$

Gemäß der obigen Struktur des Halteelements 26 bringt die dritte Ausführungsform die gleichen Vorteile wie die erste und die zweite Ausführungsform hervor. D.h., die Lötpaste entfernt sich aufgrund der sich verjüngenden Form zum Umgebungsbereich des Einfügeabschnitts 46, wenn der Einfügeabschnitt 46 in das Durchgangsloch 30 eingefügt wird. Dies führt dazu, dass eine Menge der Lötpaste, die zur Rückseitenplattenoberfläche 16b herausgedrückt werden würde, verglichen mit derjenigen der ersten Ausführungsform (in der das erste Bein 44 den Stufenabschnitt 50 aufweist) reduziert werden kann. Folglich kann die Verbinderhaltefestigkeit des Halteelements 26 erhöht werden.In the first leg 44 of the present embodiment, the following relationships are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b>\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s=\text{W}1\text{b}″$$

Consequently, the following conditions are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

Furthermore, the following conditions are fulfilled: $$‶W2b>\text{W}1\text{b}″\text{and consequently}‶S2b>\text{S}1\text{b}″$$

According to the above structure of the holding member 26, the third embodiment brings about the same advantages as the first and second embodiments. That is, when the inserting portion 46 is inserted into the through hole 30, the solder paste goes away to the vicinity of the inserting portion 46 due to the tapered shape. As a result, an amount of solder paste that would be squeezed out to the back plate surface 16b can be reduced compared with that of the first embodiment (in which the first leg 44 has the step portion 50). Consequently, the connector holding strength of the holding member 26 can be increased.

Compared with the second embodiment ( 6 ) in which the inserting portion 46 has the tapered shape throughout its length up to the front end of the first leg 44, and the width “W1b” (ie, the cross-sectional area “S1b”) at the first boundary line 46a is the same as that of the third embodiment , a cubic volume of the accommodating area of the inserting portion 46 (inserted into the through hole 30) can be reduced. As a result, the amount of solder paste to be squeezed out to the back plate surface 16b can be reduced. Consequently, the connector holding strength of the holding member 26 can be increased.

(Fourth embodiment)

A fourth embodiment is described below. Those parts and portions which are used in the fourth embodiment in the same way (such as the connector 20, the electronic control device 10 and the like) are not described again below.

The fourth embodiment differs as shown in FIGS 8th until 11 shown in the following points from the third embodiment. The body portion 40 and the first leg 44 have a bending portion 54 formed in a convex shape in its cross section. More specifically, part of one of the plate surfaces of the holding member 26 is recessed in the plate thickness direction, while part of the other plate surface of the holding member 26 is expanded in the plate thickness direction. The bending portion extends in the plate extending direction. An upper end of the bending portion 54 is located in an area of the body portion 40 not covered by the solder 34, while a lower end of the bending portion 54 is in a portion of the first leg 44 covered by the solder 34 . In the 10 For convenience, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

Folglich sind die folgenden Verhältnisse für die Querschnittsflächen erfüllt: $$‶S1u\ge \text{S}1\text{d}″,‶S1b>\text{S}1\text{s}″\text{und}‶S2s=\text{S}1\text{s}″$$

Ferner sind die folgenden Verhältnisse erfüllt: $$‶W2b>\text{W}1\text{b}″\text{und folglich}‶S2b>\text{S}1\text{b}″$$

Der Biegeabschnitt 54 ist, wie in 9 gezeigt, in der Plattendickenrichtung derart vertieft und ausgedehnt, dass eine der Plattenoberflächen des Halteelements 26 vertieft (nach innen gekrümmt) ist, während die andere der Plattenoberflächen des Halteelements 26 ausgedehnt (nach außen gekrümmt) ist. Der Biegeabschnitt 54 ist in seinem Querschnitt, wie vorstehend beschrieben, bogenförmig ausgebildet.In the first leg 44 of the present embodiment, the following width relationships are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b>\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s=\text{W}1\text{b}″$$

Consequently, the following relationships for the cross-sectional areas are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

Furthermore, the following conditions are fulfilled: $$‶W2b>\text{W}1\text{b}″\text{and consequently}‶S2b>\text{S}1\text{b}″$$

The bending section 54 is, as in 9 1, is recessed and expanded in the plate thickness direction such that one of the plate surfaces of the holding member 26 is recessed (inwardly curved) while the other of the plate surfaces of the holding member 26 is expanded (outwardly curved). The bending portion 54 is formed into an arc shape in cross section as described above.

The bending portion 54 extends as shown in FIGS 8th and 10 shown, from the upper end of the body portion 40 to a midpoint of the housing area of the insertion portion 46 (equal to or near the intermediate portion 52 in FIG 7 ), over the first leg portion 48 of the leg portion 42, with the midpoint being in the space of the through hole 30, ie between the first and second boundary lines 46a and 46b.

According to the above structure of the fourth embodiment, the cross-sectional area of the leg portion 42 due to the bending portion 54 can be made larger than that of the third embodiment when the width of the leg portion between the third and fourth embodiments is equal to each other. 11 shows a cross-sectional view along the line XI-XI in FIG 10 , wherein a cross-sectional shape of the leg portion is shown by a dotted line as a comparative example. The insertion portion 46 of the leg portion of the comparative example has, as in FIG 11 1 does not include the bent or curved portion 54, although the thickness and the width of the comparative example are the same as those of the present embodiment. According to the present embodiment, a contact area between the insertion portion 46 of the leg portion and the solder 34 can be increased. The connector holding strength of the holding member 26 can thus be increased.

On the other hand, when the cross-sectional areas between the present embodiment and the connector are formed to be equal to each other, the width of the leg portion 42 of the present embodiment can be reduced by such an amount corresponding to the bend portion 54 . More specifically, the inner diameter of the through hole 30 can be reduced. As a result, the difference in the inner diameter of the through holes between the through hole 30 for the holding member 26 and the through holes for the other parts or components (such as the terminals 22 of the connector 20) can be reduced.

In the present embodiment, the bending portion 54 is formed as the depressed and expanded portion. Consequently, the bending portion 54 can be easily formed by pressing the metal plate.

However, the bending portion 54 is not limited to the recessed and expanded portion having the arcuate cross section. The bending portion may have an angular cross section. The number of bending portions 54 is not limited to one. Multiple bending portions may be formed in the plate width direction. The bending portion is not limited to a continuously expanding shape in the plate extending direction. The bending portion may be divided into multiple portions in the plate extending direction.

Wie bereits in der ersten Ausführungsform beschrieben, kann sich dann, wenn irgendeine Belastung auf das Halteelement 26 aufgebracht wird, die Belastung am Abschnitt des ersten Beines 44 zwischen dem Körperabschnitt 40 und dem Unterbringungsbereich, der durch das Lötmittel 34 an der Leiterplatte 16 befestigt ist, d.h. am Abschnitt des Beinabschnitts 42 mit dem Tiefstwert für die Breite, konzentrieren. Folglich ist der Biegeabschnitt 54 vorzugsweise im Beinabschnitt 42 vom Abschnitt des Einfügeabschnitts 46, der im Durchgangsloch 30 untergebracht ist, bis zum Abschnitt des ersten Beinabschnitts 48, der nicht durch das Lötmittel 34 bedeckt ist, gebildet.Furthermore, the bending portion 54 can be formed only in the area of the leg portion 42 as long as the following conditions are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

As previously described in the first embodiment, if any stress is applied to the support member 26, the stress on the portion of the first leg 44 between the body portion 40 and the housing area, which is attached to the circuit board 16 by the solder 34, may increase. ie, at the portion of leg portion 42 having the lowest width value. Accordingly, the bending portion 54 is preferably formed in the leg portion 42 from the portion of the insertion portion 46 accommodated in the through hole 30 to the portion of the first leg portion 48 not covered by the solder 34.

(Fifth embodiment)

A fifth embodiment is described below. Those parts and portions which are used in the same way in the fifth embodiment (such as the connector 20, the electronic control device 10 and the like) are not described again below.

As in the 12 and 13 1, a bending portion 54 is formed in a crank shape in the fifth embodiment. The other portions are substantially the same as those in the fourth embodiment. In the 13 A comparative example is shown by a dotted line, in which the inserting portion 46 of the holding member 26 is constructed of a metal plate having a plate thickness and a plate width equal to those of the present embodiment but without a bending portion. In the 12 For convenience, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

Folglich sind die folgenden Verhältnisse für die Querschnittsflächen erfüllt: $$‶S1u\ge \text{S}1\text{d}″,‶S1b>\text{S}1\text{s}″\text{und}‶S2s=\text{S}1\text{s}″$$

Ferner sind die folgenden Verhältnisse erfüllt: $$‶W2b>\text{W}1\text{b}″\text{und folglich}‶S2b>\text{S}1\text{b}″$$

Ferner ist der Biegeabschnitt 54 gebildet.In the first leg 44 of the present embodiment, the following relationships are also satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b>\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s=\text{W}1\text{b}″$$

Consequently, the following relationships for the cross-sectional areas are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

Furthermore, the following conditions are fulfilled: $$‶W2b>\text{W}1\text{b}″\text{and consequently}‶S2b>\text{S}1\text{b}″$$

Furthermore, the bending portion 54 is formed.

The bending portion 54 extends as shown in FIGS 12 and 13 1, in the board extending direction from an intermediate point (corresponding to a point of the step portion 50) of the second leg portion 46 between the first and second boundary lines 46a and 46b to a point of the first leg portion 48 not covered by the solder 34. A part of the first leg 44 is shifted in the plate thickness direction so that the bending portion 54 has the crank shape cross section. The bending portion 54 having the step portion 50 can be easily manufactured by applying pressing to the metal plate in a manner similar to the first embodiment.

In the fifth embodiment having the bending portion 54 above, the same advantages as in the fourth embodiment can be brought about.

In the 13 For example, the crank shape of the bending portion 54 is shown as having a right angle (90 degrees). However, the step portion 50 may be connected to the leg portion via a rounded portion or a beveled surface.

(Sixth embodiment)

A sixth embodiment will be described below. Those parts and portions which are used in the same way in the sixth embodiment (such as the connector 20, the electronic control device 10 and the like) are not described again below.

The bending portions 54 are, as in FIGS 14 and 15 shown formed by bending an outer peripheral portion of the leg portion 42 in the sixth embodiment. In the 14 For convenience, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

Folglich sind die folgenden Verhältnisse für die Querschnittsflächen erfüllt: $$‶S1u\ge \text{S}1\text{d}″,‶S1b>\text{S}1\text{s}″\text{und}‶S2s=\text{S}1\text{s}″$$

Ferner sind die folgenden Verhältnisse erfüllt: $$‶W2b>\text{W}1\text{b}″\text{und folglich}‶S2b>\text{S}1\text{b}″$$

Ferner sind die Biegeabschnitte 54 gebildet.In the first leg 44 of the present embodiment, the following relationships are also satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b>\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s=\text{W}1\text{b}″$$

Consequently, the following relationships for the cross-sectional areas are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

Furthermore, the following conditions are fulfilled: $$‶W2b>\text{W}1\text{b}″\text{and consequently}‶S2b>\text{S}1\text{b}″$$

Furthermore, the bending portions 54 are formed.

In the holding element 26 in the 14 and 15 As shown, each of the bending portions 54 is formed in the leg portion 42 from an intermediate point (corresponding to the intermediate point of the fifth embodiment) of the second leg portion 46 between the first and second boundary lines 46a and 46b to a point of the first leg portion 48 that is not defined by the Solder 34 is covered. An outer peripheral portion of the leg portion 42 is of a tapered shape as shown in FIG 16 shown bent in a valley-folding manner along dotted lines on both sides of the leg portion 42 in the plate width direction.

In the sixth embodiment having the bending portions 54 above, the same advantages as in the fourth embodiment can be brought about.

In the sixth embodiment, the bending portions 54 are formed on both sides of the leg portion 42 in the plate width direction. However, the leg portion may be formed on one side of the leg portion 44 in the plate width direction.

(Seventh embodiment)

A seventh embodiment will be described below. Those parts and portions which are used in the same way in the seventh embodiment (such as the connector 20, the electronic control device 10 and the like) are not described again below.

In the seventh embodiment, as in FIGS 17 until 19 As shown, the width of the first leg 44 is constant over the entire length thereof, while a bending portion 54 is formed in a part of the first leg 44 in the board extending direction such that the following relationships are satisfied: $$‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s>\text{S}1\text{s}″$$

In the 17 For convenience, each of the symbols for the respective cross-sectional areas is similarly bracketed after each corresponding symbol for the width.

The bending section 54 is, as in 17 1, formed in the first leg 44 from an intermediate point of the second leg portion 46 between the first and second boundary lines 46a and 46b to a point of the first leg portion 48 not covered by the solder 34. The width of the leg portion in which the bending portion 54 is formed is as shown in FIGS 18 and 19 shown, almost equal to that of the leg portion in which the bending portion 54 is not formed. The insertion portion 46 of the leg portion formed with the bending portion 54 is, as in FIG 18 shown recessed and expanded (expanded) in the plate thickness direction. The insertion section 46 of the leg section without the bending section 54 has, as in FIG 19 shown, has a rectangular cross-section.

According to the present embodiment, therefore, the following relationships are satisfied: $$‶\mathrm{<figure-callout\; id="1"\; label="W"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">W</figure-callout>}1\mathrm{and}=\text{<figure-callout id="1" label="W" filenames="DE102013222919B4\_0043.png" state="{{state}}">W</figure-callout>}1\text{i.e}″,‶W1b=\text{W}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="W"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">W</figure-callout>}2s=\text{W}1\text{b}″$$

The cross-sectional area of the bending portion 54 is constant over the entire length thereof in the plate extending direction and is larger than the cross-sectional area of the leg portion without the bending portion 54. As shown in FIGS 18 and 19 shown, the following conditions are fulfilled: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}>\text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

As described above, the bending portion 54 is partially formed in the first leg 44 to satisfy the following relationships: $$‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s>\text{S}1\text{s}″$$

Furthermore, the first leg 44 can be formed to satisfy the following relationships: $$‶\mathrm{<figure-callout\; id="1"\; label="S"\; filenames="DE102013222919B4\_0043.png"\; state="\{\{state\}\}">S</figure-callout>}1\mathrm{and}\ge \text{<figure-callout id="1" label="S" filenames="DE102013222919B4\_0043.png" state="{{state}}">S</figure-callout>}1\text{i.e}″,‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s\ge \text{S}1\text{s}″$$

(Eighth embodiment)

An eighth embodiment will be described below. Those parts and portions which are used in the same way in the eighth embodiment (such as the connector 20, the electronic control device 10 and the like) are not described again below.

According to the eighth embodiment shown in FIGS 20 until 24 As shown, the leg portion 42 is made up of a first leg 44 and a pair of second legs 56 arranged on both sides of the first leg 44 in the board width direction. The pair of second legs 56 is formed in a symmetrical shape with respect to a center line of the first leg 44 .

In a holding member 26 of the present embodiment according to FIG 20 is a body portion 40c in an L-shape (letter L-shape) instead of the body portion 40a of the rectangular shape of the fourth embodiment ( 8th ) is formed and the pair of second legs 56 are added to the body portion 40c. The second legs 56 are formed in the same metal plate of the body portion 40c through a stamping process and a bending process.

In the present embodiment, a leg portion 42 (the first leg 44) is inserted into a through hole 30, similar to the above embodiments. That is, each of the second legs 56 is inserted into a respective through hole different from the through hole 30 for the first leg 44 .

A hook portion 58 is formed at a front end of each second leg 56 such that the hook portion 58 is hooked to the circuit board 16 . Hence the two prevent th legs 56 that the support member 26 (ie the connector 20) falls off the circuit board 16 prior to the reflow soldering process.

Each front end of the second leg 56 (the hook portion 58) protrudes as shown in FIGS 22 and 23 shown, protrudes outwardly from the through hole 30 on the back plate surface 16b when the second leg 56 is inserted into the corresponding through hole 30. FIG. The hook portion 58 is hooked to an outer periphery of an opening on a lower side of the through hole 30 . Since the structure of the second leg in the Japanese Patent No. 4,626,680 is described, this will not be discussed in detail below or only in simplified form.

In addition to the hook portion 58, the second leg 56 is constructed of a first link portion 60, a spring portion 62, and a second link portion 64. As shown in FIG. A width of the second leg 56 is greater over its entire length than a thickness of the second leg 56.

The first connecting portion 60 connects the hook portion 58 to the spring portion 62. The first connecting portion 60 is as shown in FIGS 20 and 21 shown formed in an L-shape (letter L-shape). A lower end of the first connecting portion 60 is connected to the hook portion 58 while an upper end thereof is connected to the spring portion 62 . A part of the lower end of the first connection portion 60 is accommodated in the through hole 30 . The first connection portion 60 and the hook portion 58 are located on a plane that is the same as a plane for the body portion 40 and the first leg 44 (except for the flex portion 54).

The spring portion 62 is elastically deformable in the plate width direction. Consequently, when the hook portion 58 and the first connecting portion 60 are inserted into the through hole 30, the spring portion 62 is elastically deformed, so that the hook portion 58 is hooked to the back plate surface 16b of the circuit board 16. The spring portion 62 is formed in a C-shape (letter C-shape). Each of the spring portions 62 is defined in the plate thickness direction along a chain line ( 21 ) is bent in a valley-folding manner so that each of the spring portions 62 faces each other in the plate width direction ( 20 ). The bending portion 54 is formed by pressing along the dotted lines in FIG 21 educated.

In the present embodiment, since the spring portion 62 is bent 90 degrees with respect to the body portion 40, the thickness direction of the spring portion 62 coincides with the plate width direction. The first connection portion 60 is connected to a lower end of the spring portion 62 and the second connection portion 64 is connected to an upper end of the spring portion 62 .

The second connecting portion 64 connects the spring portion 62 to the body portion 40. The first leg 44 and the pair of second legs 56 are connected to a lower side of the body portion 40 (the L-shaped body portion 40c).

A fastening state of the holding member 26 is in the 22 until 24 shown. In the 22 and 23 the dummy pads are omitted for simplicity. The second legs 56 are connected to the circuit board 16 by the reflow soldering process. The second legs 56 are not necessarily connected to the circuit board by the reflow soldering process.

Each of the legs of the leg portion 42 (the first leg 44 and the second legs 56) is respectively inserted into a respective one of the through holes 30 different from each other. Three of the through holes 30 are, as in 24 shown arranged in a straight line and at equal intervals in the plate width direction.

The first leg 44 is inserted into the through hole 30 located at a center of the three through holes. Same as the fourth embodiment ( 8th and 9 ), the leg portion 42 includes the bend portion 54 and the intermediate portion 52 between the first and second boundary lines 46a and 46b. Consequently, the connector holding strength of the holding member 26 under the condition that the first leg 44 is connected to the circuit board 16 by the solder 34 can be increased.

Each of the second legs 56 is inserted into a respective one of the through holes located on both sides of the through hole 30 for the first leg 44 . Each of the hook portions 58 is hooked to the outer periphery of the opening on the lower side of the through hole 30 on the back plate surface 16b. The portion of the first connection portion 60 is located in the through hole 30. The hooked portion and the first connection portion 60 are connected to the through hole 30 by the solder 34. As shown in FIG.

When the second legs 56 are connected to the circuit board 16 by the solder 34 as described above, the connector holding strength of the holding member 26 can be further increased.

Further, according to the present embodiment, since the second legs 56 are provided in addition to the first leg 44, the connector 20 can be prevented from being inclined with respect to the circuit board 16 before the reflow soldering process by the multiple legs. In particular, since the holding member 26 has the pair of second legs 56, the inclination of the connector 20 can be effectively prevented.

Each of the second legs 56 has the hook portion 58 hooked to the back plate surface 16b of the circuit board 16 . Consequently, even if any external force that would pull the leg portion 42 out of the through hole 30 in the board extending direction is applied to the connector 20 and/or the leg portion 42, the hook portion 58 can prevent the leg portion 42 from being pulled out will. Further, each of the hook portions 58 extends outward from the first connecting portion 60 in the plate width direction, i.e., in a direction away from each other. Backlash and/or slipping of the connector 20 with respect to the circuit board 16 can be prevented.

In the second leg 56, the hook portion 58 and the spring portion 62 are formed at different positions, and the spring portion 62 is located above the front panel surface 16a of the circuit board 16. According to the above structure, the spring portion 62 is not directly on the cylindrical side wall of the through hole by the spring force itself 30 hooked. The spring portion 62 applies its spring force to the hook portion 58 such that the hook portion 58 is inserted into the through hole 30 and hooked to the back plate surface 16b of the circuit board 16 . Consequently, it is not necessary to provide the hook portion 58 with a large spring force in order to bring the hook portion 58 into strong contact with the cylindrical side wall of the through hole 30 when the hook portion 58 is inserted into the through hole 30. Accordingly, a force for inserting the hook portion 58 into the through hole 30 can be reduced. Consequently, any damage to the dummy pad 32 can be prevented.

According to the present embodiment, a projection height of the first leg 44 projecting downward from the back plate surface 16b is larger than that of the second legs 56. Consequently, the first leg 44 is first inserted into the through hole 30 before the second legs 56 into the respective through holes 30 to be inserted. As a result, the first leg 44 has a function of positioning the second legs 56 with respect to the corresponding through holes 30 . The second legs 56 having the spring portions 62 can be inserted into the corresponding through holes 30 smoothly.

Even in the event that the second legs 56 are not connected to the circuit board 16 by the reflow soldering process, the hook portions 58 can be prevented from being released from their retained states by any pull-out force since the first leg 44 is attached to the circuit board 16 is soldered.

In the present embodiment, the holding member 26 has the pair of second legs 56 . However, the support member 26 may include a first leg 44 and a second leg 56 .

In the present embodiment, the second legs 56 are joined to the holding member 26 of the fourth embodiment ( 8th until 11 ) added. However, the second leg 56 or legs 56 of the present embodiment may also be added to the holding member 26 of the other embodiments (the first to third embodiments or the fifth to seventh embodiments).

(Ninth embodiment)

A ninth embodiment will be described below. Those parts and portions which are used in the same manner in the ninth embodiment (such as the connector 20, the electronic control device 10 and the like) are not described again below.

According to the present embodiment, as in FIG 25 1, each of the hook portions 58 is hooked to a wall surface of the through hole 30 by a spring force. The first leg 44 has a stepwise bent portion 66 so that the first leg 44 and the pair of second legs 56 are located on the same plane extending in the panel width direction. Each of the first leg 44 and the second leg 56 is respectively inserted into a respective one of the through holes 30 arranged in a straight line at equal intervals in the board width direction. The other portions different from the above points are the same as or similar to those of the eighth embodiment ( 20 until 24 ).

The first leg 44 has the stepwise bent portion 66 formed at an upper end of the first leg portion 48 of the tapered shape. The gradually curved one Portion 66 is bent stepwise so that a cross section of bent portion 66 in the plate extending direction has a crank shape. More specifically, the first leg portion 48 of the tapered shape and the second leg portion 46 (the inserting portion 46) are extended from the body portion 40c in a direction perpendicular to the plane of FIG 25 elevated. Raised first leg portion 48 and second leg portion 46 are parallel to the plane of body portion 40c. When the second leg portion 46 is inserted into the through hole 30 , the first leg 44 and the second legs 56 are connected to the circuit board 16 by the solder 34 .

Each of the second legs 56 is bent 90 degrees with respect to the body portion 40 over its entire length in the board extending direction. Each of the second legs 56 includes a first flex portion 68, a second flex portion 70, and a third flex portion 72. As shown in FIG. The first bending portion 68 extends from the body portion 40c in the board extending direction nearly perpendicular to the circuit board 16 . The first bending section 68 is also referred to as a vertical section. The second bending portion 70 extends from the first bending portion 68 in the board width direction, which is nearly parallel to the circuit board 16 . The second bending section 70 is also referred to as a parallel section. The third bending portion 72 extends from the second bending portion 70 in the board extending direction such that a part of the third bending portion 72 is inserted into the through hole 30 . The third bending portion 72 is also referred to as an insertion portion. The hook portion 58 is formed at a portion near a front end of the third bending portion 72 . The second legs 56 are formed in a symmetrical shape with respect to a center line of the first leg 44 .

A thickness direction of the first bending portion 68 coincides with the plate width direction. The second bending portion 70 is bent 90 degrees with respect to the first bending portion 68 so that a thickness direction of the second bending portion 70 coincides with the plate extending direction. The third bending portion 72 is also bent with respect to the second bending portion 70 .

In the pair of second legs 56, each of the third bending portions 72 extends almost in the plate extending direction but not in parallel with each other. Each of the third flexure sections 72 is inclined slightly relative to the centerline of the first leg 44 such that the third flexure section 72 extends outwardly from the first leg 44 as the distance of the third flexure section 72 from the second flexure section 70 increases. Consequently, a distance between the third bending portions 72 opposed to each other in the plate width direction at the hook portions 58 at the maximum. The distance between the third bending portions 72 narrows toward the front end of the second leg 56 .

When the first leg 44 and the second legs 56 are inserted into the respective through holes 30 , each of the hook portions 58 is brought into contact with the inner peripheral wall of the through hole 30 by the spring force of the second leg 56 . Subsequently, the third bending portion 72 (the inserting portion 72) is connected to the circuit board 16 by the solder 34. As shown in FIG.

The holding member 26 of the present embodiment having the above structure brings about the same advantages as the holding member 26 of the eighth embodiment.

Further, even if the second legs 56 are not connected to the circuit board 16 by the reflow soldering process, the hook portions 58 can be prevented from being released from their hooked state by any pull-out force since the first leg 44 is fixed to the circuit board 16 is soldered.

In the present embodiment, the holding member 26 has the pair of second legs 56 . However, the support member 26 may include a first leg 44 and a second leg 56 . In such a case, the first leg 44 is also brought into contact with the inner peripheral wall of the through hole 30 so that the backlash and/or slippage between the connector and the circuit board is restricted or suppressed by the first leg 44 and the second leg 56 can be. However, the pair of second legs 56 is preferable to the second leg 56 alone in view of the damages of the dummy pad 32 by the direct contact between the first leg 44 and the inner peripheral wall of the through hole 30 .

In the present embodiment, the second legs 56 are added to the holding member 26 of the fourth embodiment ( 8th until 11 ). However, the second leg 56 or legs 56 of the present embodiment may also be added to the holding member 26 of the other embodiments (the first to third embodiments or the fifth to seventh embodiments).

The present invention should be understood that it is not limited to the above embodiments but can be extended to can be modified in various ways without departing from its scope.

In the above embodiments, the leg portion 42 includes a first leg 44 . However, the leg portion 42 may include multiple first legs.

A number of the holding members 26 fixed to a connector 20 is not limited to two. One or more than two retainers may be attached to one connector 20 . The plural holding members may preferably be arranged in a direction corresponding to an arrangement line of plural terminals 22 of the connector.

Das erste Bein 44 kann jedoch gebildet sein, um die folgenden Verhältnisse zu erfüllen: $$‶S1b>\text{S}1\text{s}″\text{und}‶S2s>\text{S}1\text{s}″$$

In the above embodiments, the following relationships are satisfied: $$‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s=\text{S}1\text{s}″$$

However, the first leg 44 may be formed to meet the following relationships: $$‶S1b>\text{S}1\text{s}″\text{and}‶\mathrm{<figure-callout\; id="2s"\; label="S"\; filenames="DE102013222919B4\_0035.png"\; state="\{\{state\}\}">S</figure-callout>}2s>\text{S}1\text{s}″$$

The support member 26 of the first embodiment may be modified such that the width of the first leg 44 at the first boundary line 46a coinciding with the plane of the front panel surface 16a is reduced and the following relationship is satisfied: $$‶S1b>\text{<figure-callout id="2s" label="S" filenames="DE102013222919B4\_0035.png" state="{{state}}">S</figure-callout>}2\text{s}>\text{S}1\text{s}″$$

Even with such a modification, the connector holding strength of the holding member 26 can be increased in a manner similar to the first embodiment.

Further, since the relation “S2s>S1s” is satisfied, the damage of the leg portion can be prevented even if the stress is concentrated on the portion of the first leg portion 48 that is not covered by the solder 34.

The first leg 44 may be formed such that the relation “S2s>S1b” is satisfied. For example, in the first embodiment, another step portion may be formed on the first boundary line 46a of the first leg 44 to satisfy the relation “W2s>W1b”. As a result, the width of the first leg 44 is reduced twice and the first leg 44 thus has three different widths. According to such a modification, the damages of the leg portion can be prevented more effectively compared to the case where the relationship is "S2s=S1b".

Furthermore, the holding member 26 may be modified such that the relation “S1u≧S1d” is not satisfied. In the first embodiment, for example, a depressed and/or expanded portion may be formed in the projection portion 46c of the first leg 44 so that a cross-sectional area of such depressed and/or expanded portion becomes larger than the cross-sectional area “S1s” at the second boundary line 46b. Alternatively, the holding member may have such an intermediate portion between the first and second boundary lines 46a and 46b, the intermediate portion having a smaller cross-sectional area than that at the second boundary line 46b.

Claims (9)

A connector (20) attached to a printed circuit board (16) with a holding element (26), the holding element (26) being inserted into a through hole (30) of the printed circuit board (16) and having solder applied by a reflow soldering process of the circuit board (16) such that the retaining member (26) retains the connector (20) on the circuit board (16), the retaining member (26) having: - a body portion (40) extending above a faceplate surface (16a ) of the circuit board (16) and attached to the connector (20); and - a leg portion (42) composed of a metal plate and formed integrally with the body portion (40), wherein - a leg portion (42) is inserted into a through hole (30), - the leg portion (42) extends from the body portion ( 40) extends in a direction toward the through hole (30), - the leg portion (42) includes a first leg (44) having a front end (46c) protruding from a back panel surface (16b) of the circuit board (16) and over which the reflow soldering process is connected to the printed circuit board (16), - the first leg (44) has a first leg section (48) and a second leg section (46), the second leg section (46) being inserted into the through hole (30 ) is inserted and the first leg portion (48) connects the second leg portion (46) to the body portion (40), and - the first leg (44) is formed to satisfy the following relationships: $$‶S1b>\text{S}1\text{s}″\text{and}‶S2s>\text{S}1\text{s}″,$$

$$‶W1\mathrm{and}=\text{W}1\text{i.e}″,‶W1b=\text{W}1\text{s}″\text{and}‶W2s=\text{W}1\text{b}″,$$

where - "S1b" is a cross-sectional area at a first boundary line (46a) between the first and the two th leg portion (46, 48) wherein the first boundary line (46a) coincides with a plane of the front panel surface (16a), - "S1s" describes a cross-sectional area at a second boundary line (46b) of the second leg portion (46), wherein the second Boundary line (46b) coincides with a plane of the back panel surface (16b), - "S2s" describes a lowest among cross-sectional areas of the first leg portion (48) of the first leg (44), - "W1u" describes a width of the first leg (44) at the first optional line in a panel width direction that is perpendicular to a panel thickness direction of the body portion (40) and perpendicular to the panel extension direction of the leg portion (42), - "W1d" describes a width of the first leg (44) at the second optional line in the panel width direction , - “W1b” describes a width of the first leg (44) at the first boundary line (46a) in the plate width direction, - “W1s” describes a width of the er first leg (44) at the second boundary line (46b) in the plate width direction, - "W2S" describes a lowest value among widths of the first leg portion (48) of the first leg (44) in the plate width direction, - the first leg (44) one has a bending portion (54) extending in the plate extending direction, and the bending portion (54) is formed in the first leg (44) from an intermediate point of the second leg portion (46) between the first and second boundary lines (46a, 46b), - the flexing portion (54) extends from the intermediate point to a point of the first leg portion (48) not covered by the solder (34), the flexing portion (54) on the first leg (44) not having an inner surface of the through hole (30) comes into contact, and - the solder (34) is filled between the bending portion (54) on the first leg (44) and the through hole (30). Connector (20) after claim 1 wherein the first leg (44) is formed to further satisfy the following relationship: $$‶S2s\ge \text{S}1\text{b}″.$$

Connector (20) after claim 2 wherein the first leg (44) is formed to further satisfy the following relationship: $$‶S1\mathrm{and}\ge \text{S}1\text{i.e}″,\text{whereby}$$

- "S1u" describes a cross-sectional area at a first optional line of the second leg portion (46), - "S1d" describes a cross-sectional area at a second optional line of the second leg portion (46), and - the second optional line is at a position, which is farther from the body portion (40) in a board extending direction of the leg portion (42) extending from the body portion (40) to the circuit board (16) than that for the first optional line. Connector (20) according to one of Claims 1 until 3 wherein the first leg (44) is formed to further satisfy the following relationship: $$‶W2b>\text{W}1\text{b}″,\text{whereby}$$

- "W2b" describes a maximum among widths of the first leg portion (48) of the first leg (44) in the board width direction. Connector (20) according to one of Claims 1 until 4 wherein the bending portion (54) is formed convex such that part of one plate surface of the first leg (44) is recessed in the plate thickness direction and part of the other plate surface of the first leg (44) is expanded in the plate thickness direction. Connector (20) according to one of Claims 1 until 5 wherein - the leg portion (42) has a second leg (56) inserted in a through hole (30) different from the through hole of the first leg (44); and - the second leg (56) has a hook portion (58) which hooks to the circuit board (16). Connector (20) after claim 6 wherein - a front end of the second leg (56) protrudes from the back panel surface (16b) of the circuit board (16); and - the hook portion (58) is hooked at a peripheral portion of an open end of the through hole (30) in the back plate surface (16b). Connector (20) after claim 6 wherein the hook portion (58) is hooked to an inner peripheral wall of the through hole (30) by a spring force of the second leg (56). Connector (20) according to one of Claims 6 until 8th wherein - the leg portion (42) is made up of a first leg (44) and a pair of second legs (56); and - the first leg (44) is located between the second legs (56) in the panel width direction.

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