KR20000052422A - Printed-Wiring Board Manufacturing Method, the Printed-Wiring Board, and Double-sided Pattern Conducting Component Used Therein - Google Patents

Abstract

PURPOSE: A method for manufacturing a printed circuit board, a printed circuit board, and a components for double sided pattern conduction used therefor are provided to simplify the manufacturing process of the printed circuit board. CONSTITUTION: A method for manufacturing a printed circuit board includes following steps. At the first step, a printed circuit board body on which a first land is implemented on one side as well as a second land(5) is implemented on the other side of the printed circuit board is provided. At the second step, a components for double sided pattern conduction is provided. At the third step, a lead of the components for double sided pattern conduction is inserted in a penetration hole of the printed circuit board body. At the firth step, the first land and an adhesive member of the components for double-sided pattern conduction is combined. At the fifth step, the second land and the lead are combined. The components for double sided pattern conduction includes a plane member(12) and the adhesive member(14).

Description

Printed-Wiring Board Manufacturing Method, the Printed-Wiring Board, and Double-sided Pattern Conducting Component Used Therein}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a printed wiring board manufacturing method for conducting wiring patterns formed on both sides of a printed wiring board for use in electronic devices and the like, and to printed wiring boards and double-sided pattern conductive parts used therein.

8 to 11 are cross-sectional views showing a printed wiring board PB in which a conventional method for conducting the wiring pattern formed on both surfaces of the printed wiring board main body 1 is performed. Lands 4 are formed on the A surface side, which is one side of the printed wiring board main body 1, and lands 5 are formed on the B surface side, which is the other surface. The through hole 8 is formed in the base material 1a of the printed circuit board main body 1 in order to conduct conduction between these lands 4 and 5. The solder resist 3 is applied to portions other than the lands 4 and 5.

In the conventional technique shown in Fig. 8, copper plating is performed in the through hole 8 to form a copper through hole plating portion 6, and is connected to the lands 4 and 5 on each surface. Conduction between both surfaces is achieved. In addition, since the through hole is copper plated, the solder 2 can be filled and soldered in the through hole.

In the conventional technique shown in Fig. 9, the silver paste is filled and hardened in the through hole 8, and the silver through hole paste portion 7 is formed in the through hole 8, so that conduction of the double-sided wiring pattern is achieved. .

In addition, in the conventional technique shown in FIG. 10, an eyelet 9 is inserted into the through hole 8, the solder is filled in the eyelet 9, and soldered on both the A and B sides. By conducting this, conduction is achieved.

In the conventional technique shown in Fig. 11, jumper wires 19 in the form of wires are inserted into two through holes 8, and jumper wires 19 are formed on both sides of the A side and B side. By soldering, conduction between both surfaces is achieved.

However, the copper through hole plating method shown in FIG. 8 has a problem that the manufacturing process of the printed wiring board PB becomes complicated to copper plate the inside of the through hole 8. FIG. In addition, there is a problem that the base material 1a of the glass epoxy clock having a small coefficient of linear expansion needs to be used to prevent disconnection due to the temperature change of the pattern and the plating part, which is expensive.

The silver through hole method shown in Fig. 9 is cheaper than the copper through hole method, but has the same problem in that the manufacturing process is complicated. In addition, due to the nature of the silver through-hole method, since the hole diameter of the through-hole 8 cannot be enlarged, there is a problem that the current flowing through the through-hole 8 is largely constrained and cannot be used throughout the circuit.

Moreover, in the conduction method using the eyelet 9 shown in FIG. 10, although existing equipment can be used and it can manufacture comparatively cheaply, since the eyelet 9 itself is covered with the solder 2, When the temperature change occurs repeatedly, the stress generated between the base material 1a and the solder 2 having different linear expansion coefficients concentrates on the soldering portions in the lands 4 and 5, causing cracks in the soldering portions. There is a reliability problem.

The conduction method by the jumper wire 19 shown in FIG. 11 can use existing equipment, and can be manufactured relatively inexpensively, and at the same time, the stress applied to the soldering part according to the temperature change is not soldered to the jumper wire 19. Since it is dispersed in, it is superior to the conduction method using the eyelet 9.

However, in the conductive method by the jumper wire 19, after the cream solder 11 is printed on the printed circuit board main body 1 in the cream solder spreading process constituting the surface mounting line, the jumper wire is once inserted from the surface mounting line to insert the jumper wire. It is necessary to proceed to the lead component insertion process by means of a device or the like. After the jumper wire 19 is inserted in the lead part inserting process, the surface mount part is returned to the surface mounting line for mounting of the surface mount component and melting soldering of the cream solder 11, and then transferred to the surface mount component mounting process and the reflow process. It is necessary to do. As described above, in the conduction method by the jumper wire 19, the manufacturing process becomes complicated and the productivity is lowered.

In addition, in the conduction method by the jumper wire 19, since the jumper wire 19 is inserted on the cream solder 11 before melting, the cream solder 11 may scatter and be removed at the time of insertion. It will also be necessary to add. Therefore, the manufacturing process becomes more complicated, so that a decrease in productivity is a big problem.

An object of the present invention is to solve the above problems, to realize a high-density mounting, a printed wiring board manufacturing method for conducting the wiring pattern formed on both sides of the printed wiring board inexpensive and high reliability without lowering productivity And a printed wiring board and a double-sided pattern conductive part used therein.

1 is a perspective view showing a double-sided pattern conductive part in Example 1 of the present invention;

Fig. 2 is a conceptual perspective view showing one example of suction holding when mounting the conductive component in Example 1 of the present invention to a printed wiring board main body;

3 is a cross-sectional view showing the printed circuit board main body and the conductive parts mounted therein in Example 1;

4 is a process chart when manufacturing a printed wiring board in which a wiring pattern formed on both surfaces is conducted using a conductive component;

Fig. 5 is a perspective view showing a double-sided pattern conductive part in Example 2 of the present invention.

FIG. 6 is a conceptual perspective view showing an example of suction holding when mounting the conductive component in Example 2 of the present invention to a printed wiring board main body; FIG.

FIG. 7 is a cross-sectional view showing the printed circuit board main body and the conductive parts mounted therein in Example 2;

8 is a cross-sectional view showing a printed wiring board subjected to double-sided conducting according to a conventional method;

9 is a cross-sectional view showing a printed wiring board subjected to double-sided conducting by a conventional method;

10 is a cross-sectional view showing a printed wiring board subjected to double-sided conducting by a conventional method;

11 is a cross-sectional view showing a printed wiring board subjected to double-sided conducting by a conventional method.

[Description of the code]

1: printed wiring board, 1a: base material, 2: solder, 3: solder resist, 4, 5: land, 8: through hole, 10a, 10b: double-sided pattern conductive part (conductive part), 11: cream solder ( Solder paste), 12: flat part, 13: lead section, 13a to 13c: lead plate, 14: bonded part, F: upper body, PB: printed wiring board.

In order to achieve the above object, the first invention of the present application is a printed wiring board manufacturing method for manufacturing a printed wiring board in which the wiring patterns formed on both sides are conducted between both surfaces, wherein a first land is formed on one side and a second is formed on the other side. A step of preparing a printed wiring board main body having lands formed thereon and through-holes from one side to the other side, a flat portion having an upper surface having an adsorptive suction surface that can be held by a surface mount mounter and a lower surface side of the flat portion. A step of preparing a double-sided pattern conducting part having an upper part having a junction part joinable to the wiring pattern and a lead part protruding downward from the upper part, wherein the suction face is held by the surface mount component mounter. While inserting the lead portion of the double-sided pattern conductive part into the through hole of the main body of the printed wiring board By joining both sides of the first land and the double-sided pattern conductive component by soldering both sides of the main body of the printed wiring board on which the adsorption insertion step and the double-sided pattern conductive component are mounted, the second land and the lead are simultaneously joined. It has a joining process for joining parts.

According to a second aspect of the present application, in the method for manufacturing a printed wiring board according to the first aspect of the present invention, the two-sided pattern conductive part is formed by bending one sheet-like base material.

According to a third aspect of the present invention, in the method for manufacturing a printed wiring board according to the second aspect of the invention, the lead portion of the double-sided pattern conductive component includes a plurality of leads arranged in close proximity to each other, and the joining process includes: It is characterized by including the process of making solder penetrate between several leads.

In the fourth invention of the present application, in the method for manufacturing a printed wiring board according to the second invention, the lead portion of the double-sided pattern conductive component is composed of a single lead.

The fifth invention of the present application includes a printed wiring board main body having wiring patterns formed on both sides and a double-sided pattern conducting component inserted into a through hole formed in the printed wiring board main body to electrically conduct the two-sided wiring patterns. An upper body having a flat portion having a suction surface on the upper side of which a conductive component can be held and held by a surface mount mounter, and a joint portion defined on a lower surface side of the flat portion and joined to a wiring pattern on one side of the main body of the printed circuit board by soldering. And a lead portion which protrudes downward from the upper body and is inserted into the through hole and whose end portion is soldered to the wiring pattern on one side of the main body of the printed wiring board.

In a sixth invention of the present application, in the printed circuit board according to the fifth invention, the lead portion includes a plurality of leads arranged in proximity to each other, and solder is infiltrated between the plurality of leads. have.

The seventh invention of the present application is a double-sided pattern conducting part for conducting wiring patterns formed on both sides of a printed wiring board main body between both sides, the flat portion having an adsorptive surface on the upper side having a suction surface which can be held by a surface mount mounter and the flat portion The upper part has a junction part which is prescribed | regulated on the lower surface side, and which can be joined to the said wiring pattern, and the lead part which protrudes below from the said upper part is provided.

The eighth invention of the present application is formed by bending one sheet-like base material in the double-sided pattern conductive component according to the seventh invention.

A ninth invention of the present application is the double-sided pattern conducting component according to the eighth invention, wherein the lead portion includes a plurality of leads arranged in proximity to each other.

The tenth invention of the present application is the double-sided pattern conductive component according to the eighth invention, wherein the lead portion is constituted by a single lead.

EXAMPLE

Example 1.

Embodiment 1 of the present invention will be described with reference to FIGS. In addition, in each figure, the same code | symbol is attached | subjected about the member same as or corresponding to the member mentioned above.

Fig. 1 is a perspective view showing a double-sided pattern conductive part 10a (hereinafter, simply referred to as a “conductive part 10a”) according to the first embodiment of the present invention, and Fig. 2 is a first embodiment of the present invention. Is a conceptual perspective view showing an example of suction holding when the conductive component 10a in the present invention is attached to the printed circuit board main body 1, and FIG. 3 is a conductive component mounted on the printed circuit board main body 1 and soldered thereto. It is sectional drawing which shows the printed wiring board PB obtained by (10a).

As shown in Fig. 1, the conductive part 10a includes a laminated flat upper body F formed by bending one sheet metal base material and a narrow portion integrally formed at both ends of the plate base material. By bending, the lead part 13 which protrudes downward from the upper body F is formed, and it is formed in substantially T shape from the side.

Among them, the upper body F is defined on the flat part 12 having the adsorption face 12s on the upper side which can be held by the surface mount component mounter, and on the lower surface side of the planar part 12 so that one side of the printed circuit board main body 1 is provided. It has the joining part 14 which can be joined to the land 5 (refer FIG. 3) formed in the surface (A surface) side. Further, the lead portion 13 is inserted from one side (A side) side of the printed circuit board main body 1 with respect to one through hole 8 of any number of through holes formed in the printed circuit board main body 1, and the other. It protrudes toward the side (B surface) side.

For this purpose, the suction surface 12s of the flat portion 12 is a flat surface having no substantial unevenness or through-holes, and the length of the lead portion 13 is longer than the thickness of the printed wiring board main body 1 and also. It requires a length that can form a good solder fillet.

Therefore, as shown in Fig. 2, the conductive part 10a can be held by the adsorption holding nozzle 31 of the surface mount component mounter so that the flat portion 12 can be held by the adsorption holding nozzle 31. The conductive component 10a can be attached to the surface mounting component mounting step in the surface mounting line.

Moreover, the lead part 13 in this Example 1 is comprised by the two lead plates 13a and 13b arrange | positioned at the mutually adjacent state at the small space | interval, and the junction part 14 is a flat part. Two places are provided symmetrically with respect to the back surface side of (12).

As shown in FIG. 3, in the printed wiring board main body 1 and the conductive part 10a, the land 4 and the joining portion 14 on the A surface side of the printed wiring board main body 1 are formed by the cream solder 11. At the same time, the land 5 formed around the through-hole 8 on the B surface side and the tip portion of the lead portion 13 are joined by the solder 2 to realize electrical conduction of the double-sided pattern.

The conductive component 10a is a relatively inexpensive component obtained by performing sheet metal processing on one metal plate, and is provided between the flat portion 12 and the joint portion 14 and between the joint portion 14 and the lead portion 13, respectively. It is realized by the bending structure in which the bent portion is formed. Therefore, even when the base member 1a of the printed circuit board 1 shrinks and expands in accordance with the temperature change, the stress generated at that time is absorbed by the bent portion, so that the soldered portion of the land 4 and the junction portion 14 and The occurrence of cracks in the soldered portions of the lands 5 and the lead portions 13 can be avoided. For this reason, disconnection by temperature change etc. can be prevented and reliability can be improved.

Moreover, since the lead part 13 of the conductive part 10a is comprised by the two lead plates 13a and 13b arrange | positioned adjacent to each other as mentioned above, it is the lead part 13 with respect to the lead part 13; When soldering is performed, a capillary phenomenon occurs, and the solder 2 penetrates and rises between the two lead plates 13a and 13b. As a result, since the volume which is electrically integrated with the lead part 13 in the inside of the through hole 8 increases with the solder 2, it becomes possible to enlarge the permissible value of electric current. For this reason, the micro-interval provided between two lead plates 13a and 13b should just be an interval which can generate the capillary phenomenon in the solder 2 suitably.

Next, the process for attaching the conducting component 10a to the printed wiring board main body 1 to achieve conduction of the double-sided pattern will be described. FIG. 4 is a process chart when manufacturing the printed wiring board PB in which the wiring patterns formed on both surfaces are conducted using the conductive component 10a.

First, lands 4 (first lands) are formed on one side (A side) as shown in FIG. 3 and lands 5 (second lands) are formed on the other side (B side) prior to each step. At the same time, a printed wiring board main body 1 having a through hole 8 extending from one surface to the other surface is prepared. Further, the conductive parts 10a, other mounting parts, and the like, which realize conduction of the double-sided pattern, are also prepared.

Then, in the solder solder printing process S1, the cream solder 11 is printed on the land 4 on the A surface side arranged on the printed circuit board main body 1 by a predetermined cream solder printing machine.

Next, in the surface mounting component mounting step S2, the suction holding nozzle 31 of the surface mounting component mounting machine sucks and holds the suction surface 12s of the conductive component 10a so that the lead portion 13 passes through the through hole 8. It inserts into the printed wiring board main body 1 by pressing the junction part 14 on the cream solder 11 printed on the land 4 of the A surface side at the same time. Here, since the conductive component 10a is mounted by the surface mount component mounter, there is no possibility that the unmelted cream solder 11 will scatter. In addition, other surface mounting components are also mounted in this step.

And in the reflow process S3, the junction part of the conducting parts 10a is moved by moving the printed wiring board main body 1 which attached the conducting parts 10a to the reflow apparatus, and melting the cream solder 11. 14) and the land 4 on the A surface side are soldered.

Next, in the insertion-mounting component insertion step S4, the insertion-mounting components are respectively inserted into the other through-holes, and then the flow soldering step S5 is carried out, and the lead portion 13 protruding from the conductive component 10a simultaneously with the insertion-mounting component. And the land 5 on the B surface side are collectively executed by the soldering apparatus. At this time, the solder 2 rises to the A surface side between the two lead plates 13a and 13b protruding from the conductive component 10a by the capillary phenomenon of the solder 2 described above.

The two-sided conduction of the printed wiring board main body 1 is obtained above, and it is set as the completed printed wiring board PB. Here, since it is not necessary to move to the lead component insertion process by a jumper wire inserter etc. before reflow process S3 like conventionally, productivity can be improved. That is, by using the conducting component 10a described in this embodiment, since both-side conduction can be realized in a series of surface mounting line processes, the process is not complicated and productivity can be improved.

In addition, the number of lead plates for generating the capillary phenomenon of the solder in the lead portion 13 of the conductive part 10a is not limited to two sheets but may be complicated by two or more sheets. In consideration of the cost, it is preferable to comprise two sheets. The lead portion 13 is not particularly limited to being plate-shaped, but is preferably plate-shaped to face each other in that capillary phenomenon of solder is effectively generated.

As described above, the conductive component 10a has one through-hole formed in the surface portion 12 and the printed circuit board main body 1 having the adsorption surface 12s whose upper body F is capable of being adsorbed and held by the surface mount component mounting device. Joined with the land formed in the lead portion 13 and the land formed on one side side (the A side side) of the printed wiring board main body 1 inserted into one side of the hole 8 and protruding toward the other side side (the B side). Since it is realized by providing the junction part 14, it is inexpensive and highly reliable, and can be mounted in a series of surface mounting line processes, and it is possible to conduct the wiring pattern formed on both sides of the printed wiring board main body 1, without reducing productivity. Done.

In addition, since the lead portion 13 of the conductive component 10a includes a plurality of lead plates 13a and 13b arranged in close proximity to each other, the solder can be increased by capillary action and allowable current can be obtained. Since it is possible to increase the size, the restriction of the current flowing through the through-hole 8 can be reduced, so that it can be applied to the entire circuit.

In the surface mounting component mounting step S2 which is a series of surface mounting line processes, the conductive component 10a is mounted on the printed wiring board main body 1 by the surface mounting component mounting device, and the reflow step S3 and the soldering step S5 are used. Of the land 4 formed on one surface side (A surface side) of the printed circuit board main body 1 and the conductive component 10a by soldering both surfaces of the printed circuit board main body 1 on which the conductive component 10a is mounted. It is formed on both sides by joining the joining portions 14 and simultaneously joining the leads 13 and the lands 5 formed around the through holes 8 on the other surface side (B surface side) of the printed circuit board main body 1. Since the printed wiring board PB in which the wiring patterns are conducted can be manufactured, it is inexpensive, reliable, and does not reduce productivity.

In addition, since the conductive part 10a is obtained by sheet metal processing such as folding or bending, one sheet-like base material formed by blanking can be mass produced at low cost. That is, the T-shaped conductive part whose upper surface is a flat part can also be obtained as an assembly structure of each plate member which comprises the flat part 12, the joining part 14, and the lead plates 13a, 13b. By forming in the same manner as in Example 1, the manufacturing cost of the printed wiring board can be reduced.

In addition, by forming the lead portion 13 in the symmetrical manner as in the first embodiment, there is no need to distinguish the left and right directions at the time of mounting.

Example 2

Next, Example 2 will be described with reference to FIGS. 5 to 7. In addition, in each figure, the same code | symbol is attached | subjected about the member same as or corresponding to the member demonstrated by the said Example 1.

Fig. 5 is a perspective view showing a double-sided pattern conductive part 10b (hereinafter, simply referred to as a “conductive part 10b”) according to the second embodiment of the present invention, and Fig. 6 is a second embodiment of the present invention. Is a conceptual perspective view showing an example of the suction holding when the conductive component 10b in the printed circuit board is mounted on the printed circuit board main body 1, and FIG. 7 is a conductive component mounted on the printed wiring board main body 1 and soldered thereto ( It is sectional drawing which shows 10b).

This conductive part 10b is for bending a flat plate-shaped upper body F formed by bending one end of one sheet metal base material and a narrow portion integrally formed at the other end of the plate base material. It is formed with the lead part 13 protruding downward from the upper body F, and is formed in substantially L shape (inverse L shape when it sees from the positional relationship of FIGS. 5-7 from a side view).

One surface of the printed circuit board main body 1 is defined on the lower surface side of the flat portion 12 and the lower surface of the flat portion 12 having the upper surface F having a suction surface 12s that can be held by the surface mount component mounter. The point of having the junction part 14 which can be joined to the land 5 formed in A side) side is the same as Example 1, but the junction part 145 exists only in one side of the upper body F, and the lead part 13 is the upper body. Protrude from the other side of F;

Any other configuration, that is, the suction surface 12s of the flat portion 12 is a flat surface having substantially no unevenness or through-holes, or any number of the lead portions 13 formed in the printed circuit board main body 1 The point of insertion of one through-hole 8 among the through-holes from one side (A side) side of the printed wiring board body 1 to protrude toward the other side (B side) side is the same as that of the first embodiment.

Therefore, as shown in Fig. 6, the conductive part 10b can also be sucked and held by the suction holding nozzle 31 of the surface mount component mounting machine, and the printed wiring board main body ( Mounting of the conductive component 10b with respect to 1) can be performed in the surface mounting component mounting step in the surface mounting line.

As shown in Fig. 7, the printed wiring board main body 1 and the conductive part 10b have the same cream as the land of the A side of the printed wiring board main body 1 and the bonding portion 14 as in the case of the first embodiment. By adhering with the solder 11 and adhering the land 5 on the B surface side and the tip portion of the lead portion 13 with the solder 2, the conduction of the double-sided pattern can be realized.

As described above, the conducting component 10b in the second embodiment differs from the conducting component 10a in that the lead portion 13 is constituted by a single lead plate 13c, and It is two points of the point in which only one location is provided in the position on the opposite side to the position in which the junction part 14 is formed as the back surface side of the planar part 12, and is formed.

Therefore, in this conductive part 10b, since the capillary phenomenon of the solder as shown in the conductive part 10a cannot be generated, the effect of increasing the volume of the lead portion 13 by solder is small. However, since four bends are formed in the conductive part 10a, the conductive part 10b can be realized by simply forming two bent parts in two places. 10b) It is characterized by making its own manufacturing cost low.

In addition, although there are two bends of the conductive part 10b, the stresses generated when the base member 1a of the printed circuit board 1 shrinks and expands in accordance with the temperature change are absorbed by the bent parts formed at these two places. Therefore, the occurrence of cracks in the soldered portions of the lands 4 and the joining portions 14 and the soldered portions of the lands 5 and the lead portions 13 can be avoided. For this reason, even the conducting component 10b can prevent disconnection by temperature change, etc., and can improve reliability.

In addition, the process for attaching the electrically-conductive part 10b to the printed wiring board main body 1, and for carrying out the conduction of a double-sided pattern can be performed by the process similar to FIG. 4 demonstrated in Example 1. As shown in FIG. Therefore, even if this conductive part 10b is used, double-sided conduction of the printed wiring board main body 1 is obtained, and since it does not need to transfer to a lead part insertion process by a jumper wire inserter etc. before reflow process S3 like conventionally, productivity Can increase.

As described above, the conductive part 10b has one through-hole formed in the flat part 12 and the printed wiring board body 1 which can be held and adsorbed by the surface mount part mounter, similarly to the conductive part 10a described above. (8) A lead portion 13 inserted from one surface side (A surface side) of the printed circuit board main body 1 and projecting to the other surface side (B surface side) and a land formed on one surface side (A surface side) of the printed wiring board; Since it is realized by including the bonding portion 14 to be bonded, it is inexpensive and highly reliable, and can be mounted in a series of surface mounting line processes so that wiring patterns formed on both sides of the printed circuit board main body 1 are conducted without lowering productivity. It becomes possible to make it.

In addition, since the lead portion 13 of the conductive component 10b is composed of a single lead, it has a feature that the shape is simple and can be realized at a lower cost.

Also in this embodiment, as shown in Fig. 4, in the surface mounting component mounting step S2 which is a series of surface mounting line processes, the conductive component 10b is mounted on the printed wiring board main body 1 by the surface mounting component mounting machine. Land formed on one surface side (A surface side) of the printed circuit board main body 1 by soldering both surfaces of the printed circuit board main body 1 on which the conductive component 10b is mounted in the reflow step S3 and the flow soldering step S5. Lands formed around the through hole 8 on the other side (B side) of the lead portion 13 and the printed wiring board main body 1 at the same time as joining the joining portion 14 of the conductive part 10a to the conductive part 10a. The effect of being able to manufacture the printed wiring board which electrically connected between the wiring patterns formed on both surfaces only by joining (5) is acquired, so it is inexpensive, highly reliable, and does not reduce productivity.

In addition, the conductive parts 10b of the second embodiment can be inexpensively mass-produced by obtaining only one sheet-like base material formed by blanking by sheet metal processing such as folding or bending. There is a similar advantage.

As described above, the method for manufacturing a printed wiring board according to the first invention of the present application is a flat portion having an upper surface having a suction surface that can be held by a surface mount component mounter, and a joint portion that is defined on the lower surface side of the flat portion and can be joined to a wiring pattern. Inserting the lead portion of the double-sided pattern-conducting part into the through hole of the main body of the printed wiring board while adsorbing and holding the double-sided pattern-conducting part having the upper body having the upper body and the lead portion protruding downward from the upper-body by the surface mount component mounting device. Since both surfaces of the main body of the printed wiring board on which the obtained double-sided pattern conductive component is mounted are soldered, the process is not complicated, and thus the double-sided conduction of the printed wiring board can be achieved without lowering the productivity.

Since the printed wiring board manufacturing method which concerns on the 2nd invention of this application uses the thing formed by the bending of one plate-shaped base material as a double-sided pattern conduction part, the cost of the parts to be used is also low and the double-sided conduction of a printed wiring board is inexpensive. It can be realized.

In the method for manufacturing a printed wiring board according to the third invention of the present application, the lead portions of the double-sided pattern conductive parts have a plurality of leads arranged in close proximity to each other, and the soldering is made to penetrate the solder between the plurality of leads. Since the allowable value of the electric current which flows through a hole can be enlarged, it becomes possible to manufacture the printed wiring board with high reliability and wide application range.

In the method for manufacturing a printed wiring board according to the fourth aspect of the present application, since the lead portion of the double-sided pattern conductive part is composed of a single lead, the cost of the parts to be used becomes lower and the double-sided conduction of the printed wiring board can be realized at low cost. .

The printed wiring board according to the fifth invention of the present application has an adsorptive surface on which a double-sided pattern conducting component, which is inserted into a through hole formed in the main body of the printed wiring board, electrically conducting the wiring patterns on both sides, can be adsorbed and held by the surface mount component mounter. A flat portion having a flat portion, a top portion having a joint portion joined to a wiring pattern on one side of the printed circuit board main body by soldering, and protruding downward from the upper portion to be inserted into a through hole, and at the end thereof, the printed wiring board Since the lead portion joined to the wiring pattern on one side of the main body by soldering is provided, it is inexpensive and highly reliable.

The printed circuit board according to the sixth invention of the present application has a plurality of leads in which the lead portions are arranged in close proximity to each other, and solder is infiltrated between the plurality of leads, so that the printed wiring board is highly reliable and has a wide application range. .

The double-sided pattern conductive component according to the seventh invention of the present application has an upper body and an upper part having a flat portion having a suction surface that can be held by a surface mount mounter on the upper side and a joint portion that is defined on the lower surface side of the flat portion and can be joined to a wiring pattern Since the lead part which protrudes downward from the sieve is provided, the productivity at the time of double-sided conduction is not reduced.

Since the double-sided pattern conduction part which concerns on 8th invention of this application is formed by bending of one plate-shaped base material, it is a cheap and highly reliable double-sided pattern conduction part.

The double-sided pattern conductive part according to the ninth invention of the present application has a plurality of leads arranged in close proximity to each other, so that solder can be infiltrated between the leads by capillary action, so that the reliability is high and the scope of application is as follows. The conduction of the wide double sided pattern can be achieved.

The double-sided pattern conductive component according to the tenth invention of the present application can be realized at a lower cost since the lead portion is composed of a single lead.

Claims (3)

A printed wiring board manufacturing method for manufacturing a printed wiring board in which wiring patterns formed on both sides are conducted between both sides, Preparing a printed wiring board body having a first land formed on one side and a second land formed on the other side, and a through hole passing from the one side to the other side; A flat portion having an upper surface having an adsorptive holding surface adsorbable by a surface mount component mounter, an upper body having a junction portion defined on a lower surface side of the flat portion and capable of joining to the wiring pattern, and a lead portion projecting downward from the upper body; Preparing a double-sided pattern conductive component; An adsorption insertion step of inserting the lead portion of the double-sided pattern conductive component into the through hole of the main body of the printed wiring board while holding the suction surface by the surface mount component mounter; Bonding both the first land and the junction portion of the double-sided pattern conductive component by soldering both sides of the main body of the printed wiring board on which the double-sided pattern conductive component is mounted, and simultaneously joining the second land and the lead portion. The manufacturing method of the printed wiring board which has a process. The printed circuit board main body with wiring patterns formed on both sides A double-sided pattern conductive component inserted into a through hole formed in the printed wiring board main body to electrically conduct the two-sided wiring patterns; The double-sided pattern conductive parts An upper body having a flat portion having an adsorptive surface on the upper side thereof which can be held by a surface mount component mounter, and a joint portion which is defined on a lower surface side of the flat portion and bonded to a wiring pattern on one side of the main body of the printed wiring board by solder; And a lead portion which protrudes downward from the upper body and is inserted into the through hole and whose end portion is soldered to the wiring pattern on one side of the main body of the printed wiring board. A double-sided pattern conductive component for conducting wiring patterns formed on both sides of a printed wiring board main body between both sides. An upper body having a flat portion having an adsorption surface on the upper side thereof which can be held by a surface mount component mounter, and a joint portion defined on a lower surface side of the flat portion and capable of joining to the wiring pattern; Two-sided pattern conductive component characterized in that it comprises a lead portion protruding downward from the upper body.