DE10001180A1 - Manufacturing PCB involves holding suction surface, inserting conducting section into through hole, and soldering substrate sides to connect bridges to connection part and conducting section - Google Patents

Abstract

The method involves manufacturing a board substrate (1) with a first bridge (4) on one side and a second bridge (5) on the other side and a through hole (8) leading from one side to the other; manufacturing a double-sided layout connection component (10a) with an upper section with a flat level with a suction surface on its upper side that can be held by suction by an external fitting device, a connection part (14) for connection to the connection layout and a conducting section (13); holding the suction surface and inserting the conducting section into the through hole; soldering both sides of the board substrate to connect the first bridge to the connection part and the second bridge to the conducting section Independent claims are also included for a printed circuit board and double sided connection component layouts.

Description

The present invention relates to a ver drive to manufacture a printed circuit plate with a conductive connection between Connection patterns is established, which on both Formed sides of a printed circuit board are in electronic devices and the like is used on a printed circuit board as well as a connecting part used therein for a double-sided pattern.

Figs. 8 to 11 are sectional views ge printed circuit boards PB show which were processed according to conventional procedures forth to a tendency lei connection between the interconnect patterns formed on both sides of the disc substrate 1, to manufacture. The plate substrate 1 has a web 4 formed on one side, the side A, and a web 5 formed on the other side, the side B. The substrate material 1 a of the plate substrate 1 has a through hole 8 for producing a conductive connection between the webs 4 and 5 . Soldering resist 3 is applied to the parts with the exception of the webs 4 and 5 .

In the method shown in FIG. 8, the copper-plated through hole portion 6 is formed by plating the inside of the through hole 8 with copper, and is connected to the lands 4 and 5 on both sides to produce a wire. The through hole 8 can be filled with solder 2 ge because it is plated with copper.

In the conventional method shown in Fig. 9, silver paste is introduced into the through hole 8 and hardened to form a silver paste through hole region 7 in the through hole 8 , through which a line is formed between the connection patterns on both sides.

In the conventional method shown in Fig. 10, an eyelet 9 is inserted into the through hole 8 and filled with solder, and soldering is performed on both sides A and B to obtain a conductive connection.

In the conventional method shown in Fig. 11, a support bridge 19 is inserted into two through holes 8 , and the support bridge 19 m is soldered on both sides A and B in order to obtain a conductive connection between the two sides.

However, in the through hole copper plating method shown in FIG. 8, plating the inside of the through hole 8 with copper complicates the manufacturing process for the printed circuit board PB. Furthermore, a glass iboxide material with a low linear expansion coefficient must be used as the substrate material 1 a in order to avoid an interruption due to temperature fluctuations in the pattern and the plated part, where the problem of increased costs arises.

In the case of the silver through-hole method shown in FIG. 9, while the cost can be reduced in comparison with the copper through-hole method, the manufacturing process is also complicated. Furthermore, since the silver passage not allowing hole punching process, the use of a passage 8 with a large diameter, the current flowing through the through hole 8 current so severely limited that this method can not be generally applied to all types of circuits.

The connection method in FIG. 10 using the eyelet 9 enables production at relatively low costs since it allows the use of existing tooling. However, if the temperature changes repeatedly, concentrate between the substrate material 1 a and the solder 2 due to different linear expansion coefficients occurring stresses on the ge soldered parts in the webs 4 and 5 , since the eyelet 9 is covered by solder 2 , and then cracks appear in the soldered parts, so that the problem of lack of reliability arises.

The connection method shown in Fig. 11 with the support bridge 19 allows the use of existing tooling and therefore enables a manufacture at a relatively low cost. Furthermore, since the stresses exerted on the soldered parts during temperature fluctuations are transferred to the unsoldered part of the support bridge 19 , this method is superior to the connection method using the eyelet 9 .

However, in the case of the support bridge 19 used, after the solder paste 11 is printed on the substrate board 1 in the solder paste application step in the soldering process line, it has to be taken out of the soldering process line once and moved to the line component insertion step which is a support bridge insertion device or the like used. Then, after the support bridge 19 has been inserted in the line component insertion step, it must be moved back to the soldering process line for the soldering component fixing step and the reflow step to solder components and melt solder the solder paste 11 to use.

Thus, the connection method using the support bridge 19 has the problem that the productivity is reduced due to the complicated manufacturing process.

The supporting bridge can 19, the solder paste 11 are zer scatters when the supporting bridge is used 19, since they ste on the not yet molten Lötpa used 11, and then an operation is also required for the removal of these Further, in the connecting method using. This further complicates the manufacturing process and reduces productivity.

To solve the above task, he refers most aspect according to the present invention Method of making a printed circuit plate, with the verb formed on both sides pattern can be conductively interconnected. Ge According to the invention, the method has the steps on: making a disk substrate with one on one side formed on one side, one on the other side formed second web and one leading from one side to the other Through hole; How to make a double-sided pattern Connection component with an upper section with a flat level, which is on its upper side has a suction surface which is able to Sucking from an external fastening component Attachment device to be held, and one Connecting part, which on the lower side of the fla Chen level and is able to with the Connection pattern to be connected, and with a Pipe section that goes from the top section protrudes below; Holding the suction surface by suction by means of the external fastening components Attachment device and insertion of the cable section of the double-sided pattern connection component into the through formed in the disk substrate passage hole; and soldering both sides of the board sub strats, in which the double-sided pattern Connection component is arranged to the first Bridge and the connecting part of the double-sided pattern Connection component and the second web and the To connect line section.

According to a second aspect, preference is given to the Manufacturing process for the printed circuit plate the double-sided pattern connection component formed by bending a sheet material.  

Preferably, according to the third aspect of the Manufacturing process for a printed circuit plate the line section of the double-sided pattern Connection component several close together ordered conductors, and the soldering step includes one Step in which the solder is caused between the multiple conductors.

Preferably, according to the fourth aspect of the Manufacturing process for a printed circuit plate the line section of the double-sided pattern Connection component a single conductor.

According to a fifth aspect of the invention, a printed circuit board on: a board substrate with connection patterns formed on both sides; and a double-sided pattern connection component, which in a formed in the plate substrate Through hole is used to make an electrical Line between those formed on both sides Establish connection patterns, and the double egg tenmuster connection component has: an above ren section with a flat plane, which on her The upper side has a suction surface that is able to by sucking an external fastening component Attachment device to be held, and one Connecting part, which on the lower side of the fla Chen level is defined and by solder with the Connection pattern on one side of the plate substrate connected is; and a pipe section that is formed by protrudes down into the top section and into that Through hole is inserted, its end with out on the other side of the disk substrate formed connection patterns connected by solder is.  

Preferably comprises according to the sixth aspect the printed circuit board the line section conductors placed together several times, whereby there is solder between the multiple conductors det.

According to a seventh aspect of the invention, a Double-sided pattern connection component for routing connecting on both sides of a disk sub Strats formed connection patterns on: an above ren section with a flat plane, which on her rer upper side has a suction surface, which in the Is able to by suction using an external fixation supply component attachment device held to and a connector that is on the bottom Defined and capable side of the flat plane is to be connected to the connection pattern; and a pipe section extending from the upper Ab cut down protrudes.

According to the eighth aspect, double is preferred side pattern connection component by bending one Sheet formed.

Preferably, according to the ninth aspect in the Lei double-sided pattern connection component section several arranged close to each other Ladder on.

Preferably, according to the tenth aspect in the Lei double-sided pattern connection component section on a single conductor.

As stated above, according to the Manufacturing process for a printed circuit According to the first aspect, a double-sided plate  ster connection component with an upper section a flat plane, which is on its upper side ne suction surface that is able to by suction by means of an external fastening component Attachment device to be held, as well as egg NEN connecting part on the lower side of the flat level is defined and is able to with a connection pattern to be connected, and ei NEN pipe section that from the upper section protrudes downwards. The double-sided pattern Connection component is sucked from an Au External fastening component attachment device hold and the line section of the double-sided ster connection component is in a in the Plat through hole formed. Then the two with the double-sided pattern Connection component connected sides of the plates soldered substrate. This will make a conductive ver binding between the two sides of the printed Circuit board made without the process steps are complicated and therefore without the pros productivity is reduced.

According to the manufacturing process for a printed Circuit board according to the second aspect becomes one component formed by bending a sheet as Double-sided pattern connection component used. Thus, an inexpensive component can be used to be a conductive connection between pages the printed circuit board at low cost to manufacture.

According to the manufacturing process for a printed Circuit board according to the third aspect of Line section of double-sided pattern Line component multiple conductors that are close to  are arranged one above the other, and solder is applied brings and enters between the multiple conductors. Then the allowable value of the by the current flowing through the hole, thereby increasing the manufacture of a printed circuit board with high reliability and a wide range of applications richly enabled.

According to the manufacturing process for a printed Circuit board according to the fourth aspect of Line section of double-sided pattern Connection component on a single conductor, which further reduces component costs and a conductive connection between both sides the printed circuit board at low cost enables.

According to the printed circuit board after the five aspect includes a double-sided pattern Connection component that in a in the disk sub Strat through hole is used to a conductive connection between the connecting mu to create a star on both sides, an upper one Section with a flat plane at its top a suction surface that is able to pass through Sucking using an external fastening component Attachment device to be held, and one Has connecting part, which on the lower side of the flat level and using solder with the Connection pattern on one side of the disk sub strats is connected, and a line section, protruding down from the top section and in which the through hole is inserted, being End with solder on one of the board sub strats formed connection pattern is connected. This printed circuit board can be low  Costs are produced and has a high reliability liquidity

According to the printed circuit board after the sixth Most aspect, the line section has several conductors, which are arranged close together, with solder between the several conductors. This printed circuit board has a high reliability and enables a wide range of applications.

According to the double-sided pattern connection component according to the seventh aspect, it has an upper ab cut with a flat plane at its top Side a suction surface, which is able to Sucking from an external fastening component Attachment device to be held, and one Has connecting part that on the lower side of the flat level is defined and is able to with egg to be connected to a connection pattern, and one Pipe section that goes from the top section protrudes below. This double-sided pattern Connection component does not set productivity when a conductive connection between two Pages is made.

According to the double-sided pattern connection component According to the eighth aspect, this is by bending one sheet material formed. The double-sided The most connection component can be made at low cost be produced and results in a high reliability speed.

According to the double-sided pattern connection component according to the ninth aspect, the line section effects of several conductors arranged close to each other, that solder by capillary action between these  occurs what a line between the double pages pattern with high reliability and a wide Scope allows.

According to the double-sided pattern connection component according to the tenth aspect, the pipe section a single conductor and the component can can be manufactured at even lower costs.

The present invention has been accomplished to the front solve the problems described, and it's the on gabe of the present invention, a manufacturing ver drive for a printed circuit board to indicate with a conductive connection between on both Sides of the printed circuit board Connection patterns are obtained to a high Pac density at low cost and with great confidence permissibility without reducing productivity realize.

The invention is described in the following in the Figures illustrated embodiments he closer purifies. Show it:

Fig. 1 is a perspective view of the double-sided pattern connection component according to the first before ferred embodiment of the invention,

Fig. 2 is a perspective view of the connection component, which is held by means of vacuum, in order to be mounted on the substrate of a printed TIC plate,

Fig. 3 is a sectional view of the disk substrate and mounted thereon with solder Verbindungskom component according to the first embodiment,

Fig. 4 is a diagram showing the process steps in the manufacturing of printed TIC plate with connecting patterns on both sides which are connected by using the connection component lei tend each other,

Fig. 5 is a perspective view of a Doppelsei tenmuster connection component according to the second be preferred exemplary embodiment according to the invention,

Fig. 6, the Verbindungskom held by vacuum component according to the second embodiment in the mounting on the substrate of the printed TIC plate,

Fig. 7 is a sectional view of the disk substrate and the subsequent component with lötmittelbefestigten Verbindungskompo according to the second embodiment, and

Figs. 8 to 11 are sectional views of printed TIC plates, both sides of which are connected conductively to one another by conventional methods.

First embodiment

A first preferred embodiment of the inven tion will now be described with reference to FIGS . 1 to 4 be. In the drawings, the syllables or corresponding parts are identified by the same reference signs.

Fig. 1 is a perspective view showing a double-side pattern connection component 10 a according to the first preferred embodiment of the present invention; Fig. 2 is a perspective view showing the connection component 20 a of Fig. 1 in the state in which it is held by negative pressure to be inserted into the board substrate 1 of the printed circuit; and FIG. 3 is a sectional view showing the printed circuit board PB obtained after the connection component 10 a was attached to the substrate 1 by soldering.

As shown in Fig. 1, the connecting component 10 a includes an upper portion F of superimposed plates, which was formed by bending a sheet metal, and a line section 13 , which is formed by bending the narrower parts, which are integral at both ends of the Sheets are arranged and extends downward from the upper section F, so that the entire structure is approximately T-shaped in cross section.

In this structure, the upper portion F s has maintained a flat plane 12 with a suction surface 12 on its upper side, which is capable of sucking a Außenbefestigungskomponenten- mounting device being, and Ver binding parts 14 of the lower side fla chen plane 12 are defined and are able to be connected to the web 5 ( Fig. 3), which is formed on one side (side A) of the plate substrate 1 . The line section 13 is inserted into a through hole 8 from any number of through holes formed in the disc substrate 1 from one side (the side A) and protrudes on the other side (the side B) of the disc substrate 1 .

For these purposes, the suction surface 12 s of the flat plane is substantially flat without irregularities and through holes, and the line section 13 has a length which is greater than the thickness of the plate substrate 1 and is sufficient to form a good soldering throat.

Accordingly, as shown in Fig. 2, the connec tion component 10 a can be held by suction on its flat plane 12 through a negative pressure holding nozzle 31 of the outer mounting component mounting device, and therefore the connecting component 10 a can be on the plate substrate 1 in the outer fastening Attachment component attachment step in the external fastening line.

The line section 13 according to the first preferred embodiment is formed from two printed circuit boards 13 a and 13 b, which are arranged at a short distance from one another and two connecting parts 14 are provided symmetrically on the back of the flat plane 12 .

As shown in Fig. 3, which shows the plate substrate 1 and the connection component 10 a, the connection parts 14 with the web 4 on the side A of the plate substrate 1 by means of the solder paste 11 connected, and the ends of the line section 13 are with the web 5 , which is formed around the through hole 8 on the side B, by means of the solder 2 , so that the patterns on both sides are electrically connected here.

The connecting component 10 a can be obtained at relatively low costs by processing a metal sheet, which is realized as a curved structure, in which bends between the flat plane and the connecting parts 14 and between the connecting parts 14 and the line section 13 are performed. Accordingly, the stresses are even when the material 1 shrinks peraturänderungen at Tem a of the disc substrate 1 or expands, absorbed in the bends, and since her no cracks in the soldered portions between the webs 4 and the connecting portions 14 as well as between the web 5 and the line section 13 . This prevents an interruption due to temperature changes, and therefore the reliability is increased.

As stated above, the line section 13 of the connection component 10 a is formed from two circuit boards 13 a and 13 b, which are arranged close to each other. This causes a capillary phenomenon when the line section 13 is soldered, and therefore the solder 2 occurs between the two circuit boards 13 a and 13 b and rises between them upwards, then the solder 2 increases the volume in the through hole 8 , which with the line section 13 is integrated, which enables a higher current value. Accordingly, the small distance between the two circuit boards 13 a and 13 b can be adjusted so that an adequate capillary effect for the solder 2 occurs.

Next, the process for attaching the connection component 10 a to the plate substrate 1 will be described to make a conductive connection between the pattern on the two sides. Fig. 4) is a diagram showing the process steps of the Her position of the printed circuit board PB, wherein the extension component on both sides of this fabric th connection pattern by using the compound 10a are in a conductive state associated with each other.

First, before the process, the plate substrate 1 is produced as shown in FIG. 3, which has the web 4 (first web) formed on one side (side A), the web 5 (second web) formed on the other side (side B) and which has through hole 8 extending from one surface to the other. Also produced are the connection components 10 a for producing a conductive connection between the double-sided patterns, other fastening components, etc.

Then, in the solder paste printing step S1, the solder paste 11 is printed on the web 4 formed on the side A of the board substrate 1 with a given solder paste printing device.

Next, in the outer mounting component mounting step S2, the vacuum holding nozzle 31 of the external mounting component mounting device holds the suction surface 12 S of the connection component 10 a by suction and introduces the pipe portion 13 into the through hole 8 . Then she presses the connec tion parts 14 down on the solder paste 11 , which is printed on the web 4 on the side A in order to fasten the connection component 10 a on the plate substrate 1 , since the connection component 10 a is fastened by the external fastening component attachment device , the not yet melted solder paste 11 is not scattered. Other external mounting components are also attached in this step.

Then, in the Auflötschritt S3, the disc substrate 1 of the printed circuit with the attached connector component 10 a is moved to a Auflötvorrichtung to melt the solder paste 11, so that the connecting parts 14 of the connection component 10 a and the web 4 soldered to one another on the side A who the.

Next, insert mounting components are introduced S4 in other through-holes in the insert mounting component-insertion step, and then be the production process moves to the surge soldering step S5, in which the projecting Leitungsab section 13 of the connecting component 10 a and the web 5 on the side B at the same time how the insert fastening components are soldered together with a wave soldering device. At this time, due to the above-described capillary phenomenon, the solder 2 between the above two circuit boards 13 a and 13 b of the Verbindungskom component 10 a increases towards the side A.

In this way, the two sides of the plate substrate 1 are connected to one another in a conductive state and a printed circuit board PB has been produced. Unlike the conventional method, this method does not require the step of moving to the conductor component insertion step using a truss bridge insertion device or the like before the soldering step S3, thereby improving productivity. That is, the using the compound described in this example, be preferred exemplary extension component 10 a enables the realization of the double-sided conductive compound in the row of outer line of attachment steps is complicated without the process whereby the production tivity is improved.

While the line section 13 of the connecting component 10 a can have three or more printed circuit boards in order to bring about the capillary phenomenon for the solder, the two-board structure is preferred, taking into account the part costs, from a structural and processing point of view: even if the line section 13 does not relate to the board-like structure is restricted, the structure of the facing plates is preferred in order to effectively effect the capillary appearance for the solder.

As described above, the connecting component 10 a is formed from the flat plane 12 in its upper portion F with the suction surface 12 S, which surface is capable of being held by suction by means of an external fastening component attachment device, and the conductor portion 13 , which cher in a through hole 8 formed in the plate substrate 1 from one side (side A) is inserted and protrudes on the other side (side B), and the connecting parts 14 , which with the one side (side A) of the plate substrate 1 of the printed circuit web are connected. This structure enables cost reduction and high reliability, and enables the component to be fixed in the series of external fastening line steps, and therefore, the connection patterns formed on both sides of the plate substrate 1 can be connected in a conductive state without lowering productivity .

The line section 13 of the connection component 10 a has a plurality of printed circuit boards 13 a and 13 b, which are arranged close to one another. This structure causes a capillary phenomenon to enable soldering with a larger amount of solder, and the permissible current can be increased. This loosens the restriction on the current flowing through the through hole 8 , allowing general application to all circuits.

In the series of outer mounting line steps, the connection component 10 a is arranged in the outer mounting component mounting step 2 by an external mounting component mounting device on the circuit board substrate 1 of the printed circuit and the two sides of the board substrate 1 on which the connection component 10 a is arranged are in the soldering step S3 and the wave soldering step S5 soldered. Thus, the connecting parts 14 of the connecting part 10 a are connected to the web 4 formed on one side (side A) of the plate substrate 1 , and the line section is connected to the web 5 , which is around the through hole 8 on the other side (side B) of the plate substrate 1 is formed, and the printed circuit board PB, the connection patterns of which are conductively connected to one another on both sides, can be produced by these simple process steps. This method enables a cost reduction and improves reliability without reducing productivity.

Furthermore, this connection component 10 a can be mass-produced at a low cost because it can be obtained by performing only a sheet metal working process of folding or bending a sheet formed by punching out. That is, while the T-shaped connection component can be formed with a flat top surface as a structure obtained by assembling plate pieces according to the flat plane 12 , the connection parts 14 and the circuit boards 13 a and 13 b, the Connection component as described in the first preferred embodiment example to reduce the manufacturing costs for a large number of components that are used for the production of the printed circuit boards.

Furthermore, forming the entire structure in a symmetrical shape with respect to the line portion 13 as in the first embodiment eliminates the need to pay attention to the lateral alignment of the components when they are assembled.

Second preferred embodiment

Next, a second preferred embodiment will be described with reference to FIGS . 5 to 7. In the figures, the same or corresponding parts, which are shown in the first embodiment example, are identified by the same reference numerals.

Fig. 5 is a perspective view of a double side pattern connection component 10 b according to the second preferred embodiment of the present invention; Fig. 6 is a perspective view in which the connection component 10 b is held by negative pressure while it is being applied to the printed circuit board substrate 1 ; and FIG. 7 is a sectional view of the plate substrate 1 on which the connection component 10 b is fixed by soldering.

The connecting component 10 b includes a layered upper portion F, which is formed by bending an end of a sheet, and a section 13 , which is formed by bending the one-piece, narrow part at the other end of the sheet and from the upper portion F protrudes down. The entire structure is approximately L-shaped in cross-section (reversed L-shaped as viewed from the direction of FIGS. 5 to 7).

Similarly to the first embodiment, the upper portion F a flat plane 12, which s provided at its upper side a suction surface 12, wel surface is able to be held by suction by means of an external attachment component-mounting apparatus and a connecting portion 14 which is defined on the lower side of the flat plane 12 and is able to be connected to the web 5 formed on one side (side A) of the plate substrate 1 . However, the connection part 14 is formed only on one side of the upper portion F, and the conductor portion 13 protrudes from the other side of the upper portion F.

In other features, this structure is the same as that shown in the first embodiment. That is, the suction surface 12 s on the flat surface 12 is substantially flat with no irregularities and through holes, and the line section 13 is inserted into a through hole 8 from any number of through holes formed in the plate substrate 1 from one side ( Side A) is inserted and protrudes on the other side (side B) of the plate substrate 1 .

Accordingly, as shown in FIG. 6, there is shown Ver binding component 10 b by suction to their flat plane 12 by a Vakuumhaltedüse 31 ei ner Außenbefestigungskomponenten- attachment device are held, and therefore, the connection component 10 may b in the Außenbefe stigungskomponenten attachment step in the outer attachment line on the plate substrate 1 are brought up.

As shown in Fig. 7, by means of the Plat tensubstrats 1 and the connection component 10 b as in the first embodiment, the double-sided electrically interconnected pattern, wherein the connecting part 14 by the solder 11 with the web 4 on the side A of the disk substrate 1 and the end of the line section 13 is connected by the solder 2 to the web 5 on the side B.

As explained above, the connection component 10 b according to the second preferred embodiment differs from the connection component 10 a by the following two features: the line section 13 is formed from a single circuit board 13 c, and the connection part 14 is on the back of the flat plane 12 forms only on one side opposite the position of the line section 13 ge.

Accordingly, the connection component 10 b can not cause the capillary phenomenon for the solder as the Ver connection component 10 a, and it therefore results in a reduced effect in increasing the volume of the line portion 13 by solder. However, the connection component 10 b has only two bends, while the connection component 10 a has four bends, and this simple shape can reduce the manufacturing costs of the connection component 10 b itself in relation to the production of parts.

Although the connection component 10 b only two Bie has conditions, can the stresses to which it are generated when the material 1 shrinks a of Plattensub strats 1 when the temperature changes or expands, are absorbed in the two bends, so that no cracks in the soldered parts occur between the web 4 and the connecting part 14 and between the web 5 and the line section 13 . Therefore, the connection component 10 b can prevent an interruption due to temperature fluctuations, so that the reliability is increased.

The connection component 10 b can be fastened to the plate substrate 1 by the same process steps as those shown in FIG. 4 and described in connection with the first exemplary embodiment, in order to produce the electrical line between the connection patterns on the two sides. The connection component 10 b can thus also connect the two sides of the plate substrate 1 in a conductive state. Unlike the conventional method, this method can improve productivity because it does not require the step of moving to the line component insertion step using a truss bridge insertion device or the like before the opening step S3.

As described above, the connection has Component B 10 as the connection component 10 a flat plane 12, which can be held by suction by means of an external attachment component-mounting apparatus, the conduit section 13, wel cher in a hole formed in the disc substrate 1 through hole 8 from the one side (side A) is inserted to project on the other side (side B) of the board substrate 1 , and the connecting part 14 , which is connected to the web formed on one side (side A) of the printed circuit board. This structure enables a cost reduction and improves reliability, and the component can be attached in the series of external attachment line steps. You can thus create a conductive connection between the formed on the two Be th of the plate substrate 1 Verbindungsmu star without reducing productivity.

Furthermore, the line section 13 of the connec tion component 10 b is formed from a single conductor, and this simple shape further reduces the manufacturing costs.

Also, in this preferred embodiment, in the series of Außenbefesti shown in Fig. 4, the connection component 10 supply line steps b in the outer fastening component application step S2 by a Außenbefestigungskomponenten- applying device to the disk substrate 1, and both sides of the disc substrate 1 to which the connection component 10 b is applied, are soldered in the soldering step S3 and the wave soldering step S5. Thus, the connection part 14 of the connection component 10 b is connected to the web 4 formed on one side (side A) of the plate substrate 1 , and the line section 13 is connected to the web 5 which extends around the through hole 8 on the other side (side B) of the Disk substrate 1 is formed around; and the printed circuit board whose double-sided connection patterns are conductively connected to each other can be manufactured by these simple process steps. Therefore, this method enables a cost reduction and improves reliability without reducing productivity.

Furthermore, this connection component 10 b like the one in the first embodiment is advantageous in that it can be mass-produced at a low cost because it can be obtained by performing only a sheet metal processing operation of folding or bending on a punched sheet .

Claims (12)

1. A method for producing a printed circuit board (PB), in which connection patterns formed on both sides are conductively connected to one another,
characterized by the steps:
Producing a printed circuit board substrate ( 1 ) with a first web ( 4 ) formed on one side, a second web ( 5 ) formed on the other side and a through hole ( 8 ) leading from one side to the other,
Manufacture a double-sided pattern connection component ( 10 a, 10 b), which has an upper section (F) with a flat plane ( 12 ), on its upper side a suction surface ( 12 s), which is capable of suction by means of means an external fastening component applicator to be held, and has a connection part ( 14 ), which is defined on the lower side of the flat plane ( 12 ) and is capable of being connected to the connection pattern, and a line section ( 13 ) which protrudes downward from the upper section (F),
Holding the suction surface ( 12 s) by suction by means of the external fastening component application device and inserting the line section ( 13 ) of the double-sided pattern connecting component ( 10 a, 10 b) into the through hole ( 8 ) formed in the plate substrate ( 1 ), and
Solder both sides of the plate substrate ( 1 ), on which the double-sided pattern connection component ( 10 a, 10 b) is applied to the first web ( 4 ) with the connecting part ( 14 ) of the double-sided pattern connection component ( 10 a, 10 b) and to connect the second web ( 5 ) to the line section ( 13 ). 2. The method according to claim 1, characterized in that the double-sided pattern connecting component ( 10 a, 10 b) is formed by bending a sheet. 3. The method according to claim 1 or 2, characterized in that the line section ( 13 ) of the Doppelsei tenmuster-connecting component ( 10 a, 10 b) comprises multiple re conductors ( 13 a, 13 b) which are arranged close to each other, and that the step of soldering comprises a step by which the solder ( 2 ) enters between the plurality of conductors ( 13 a, 13 b). 4. The method according to claim 1 or 2, characterized in that the line section ( 13 ) of the double-sided pattern-connecting component ( 10 a, 10 b) has a single conductor ( 13 c). 5. Printed circuit board PB, characterized by:
a plate substrate ( 1 ) with connection patterns formed on both sides, and
a double-side pattern connection component ( 10 a, 10 b), which is inserted into a through hole ( 8 ) formed in the plate substrate ( 1 ) to establish an electrical connection between the connection patterns formed on both sides, which has double-side pattern connection component.
an upper portion (F) having a flat plane ( 12 ) which has on its upper side a suction surface ( 12 s) capable of being held by an external fastening component applicator by suction, and a connecting part ( 14 ), which is defined on the lower side of the flat plane ( 12 ) and is connected by means of solder ( 11 ) to the connection pattern on one side of the plate substrate ( 1 ), and
a lead portion ( 13 ) which protrudes downward from the upper portion (F) and is inserted into the through hole ( 8 ), its end being connected by solder ( 2 ) to the connection pattern formed on the other side of the plate substrate ( 1 ) is. 6. Printed circuit board according to claim 5, characterized in that the double-sided pattern connection component ( 10 a, 10 b) is formed by bending a sheet. 7. Printed circuit board according to claim 5 or 6, characterized in that the line section ( 13 ) comprises a plurality of conductors ( 13 a, 13 b), which are arranged close together, and in that the solder ( 2 ) between the plurality of conductors ( 13 a, 13 b) is present. 8. Printed circuit board according to claim 5 or 6, characterized in that the line section ( 13 ) has a single conductor ( 13 c). 9. double-sided pattern connection component ( 10 a, 10 b) for producing a conductive connection between connection patterns, which are formed on both sides of a plate substrate ( 1 ) of a printed circuit,
marked by
an upper portion (F) having a flat plane ( 12 ) which has on its upper side a suction surface ( 12 s) which is capable of being held by an external fastening component application device by suction, and a connecting part ( 14 ) defined on the lower side of the flat plane ( 12 ) and capable of being connected to the connection pattern,
and a line section ( 13 ); protruding down from the upper section (F). 10. Connection component according to claim 9, characterized, that this is formed by bending a sheet is. 11. Connection component according to claim 9 or 10, characterized in that the line section ( 13 ) comprises a plurality of conductors ( 13 a, 13 b) which are arranged close to one another. 12. Connection component according to claim 9 or 10, characterized in that the line section ( 13 ) has a single conductor ( 13 c).