CN216146519U

CN216146519U - Connecting structure of surface-mounted element

Info

Publication number: CN216146519U
Application number: CN202121950945.1U
Authority: CN
Inventors: 李强
Original assignee: Jieyandi Electronic Technology Shanghai Co ltd
Current assignee: Jieyandi Electronic Technology Shanghai Co ltd
Priority date: 2021-08-19
Filing date: 2021-08-19
Publication date: 2022-03-29
Anticipated expiration: 2031-08-19

Abstract

The surface-mounted component connecting structure comprises a surface-mounted component connecting structure, a to-be-welded plug-in component and a circuit board, wherein the to-be-welded plug-in component is arranged on the circuit board, and a groove is formed in the to-be-welded position on the circuit board and corresponds to a pin of the plug-in component; before welding, the pins are placed in the grooves. According to the utility model, the groove is formed at the welding position corresponding to the plug-in element, so that the pin of the plug-in element can be placed in the groove, and the displacement, the deflection and the toppling can be effectively prevented. The groove can be metallized, and has electrical characteristics, thereby increasing the contact area between the pins of the plug-in component and the circuit board, improving the welding firmness and improving the thermal performance.

Description

Connecting structure of surface-mounted element

Technical Field

The utility model relates to the field of circuit board manufacturing, in particular to a connecting structure of a surface-mounted element.

Background

Surface Mount Technology (SMT) is a common technique and process in the electronic assembly industry, and Surface mount devices without leads or short leads are Mounted on the Surface of a printed circuit board or other substrates and then soldered and assembled by reflow soldering or dip soldering.

Referring to fig. 1, the surface mounting process generally includes the steps of coating solder paste on a pad of a circuit board, placing a component on the solder paste, performing a fixing process (dispensing or using a special fixing jig), and feeding the component into a high temperature furnace; and finally, welding the product. In the production process, the plug-in components are easy to shift, incline, topple, have insufficient weldable surface and other problems, and can cause poor production.

In a circuit board that supports only single sided ornaments, no components are allowed to penetrate the circuit board; and common surface mount components can be directly mounted on the surface of the PCB. If the package component is also to be attached to the PCB surface, then special fixing measures are required, either additional fixing is required or the component is subjected to corresponding special pin handling, which increases the production process and cost.

Disclosure of Invention

The present invention is directed to solving the existing problems and providing a connection structure for surface-mounted components.

In order to achieve the purpose, the technical scheme adopted by the utility model is that a plug-in component to be welded is arranged on a circuit board, a groove is arranged at the position to be welded on the circuit board, and the groove corresponds to a pin of the plug-in component; before welding, the pins are placed in the grooves.

In some embodiments, the surface of the recess is provided with a conductive metal layer.

In some embodiments, the metal layer is copper.

In some embodiments, the circuit board has several layers, and the bottom of the groove is non-penetrating.

In some embodiments, the circuit board is a PCB board.

In some embodiments, the number of layers of the circuit board is 4-10.

In some embodiments, the recess is filled with solder paste.

In some embodiments, the opening of the recess is rectangular and the shape of the pin is adapted to the shape of the recess.

The utility model also provides a circuit board, and a connecting structure of any surface-mounted element is arranged between the circuit board and the plug-in element on the surface of the circuit board.

Compared with the prior art, the groove is formed in the welding position corresponding to the plug-in element, so that the pin of the plug-in element can be placed in the groove, and displacement, deflection and toppling can be effectively prevented.

The plug-in components can be produced on a patch production line, additional fixing treatment is not needed, and production consumables (glue for dispensing, fixing clamps and the like) are saved, so that the processes are reduced, and the production efficiency is improved.

The groove can be metallized, and has electrical characteristics, thereby increasing the contact area between the pins of the plug-in component and the circuit board, improving the welding firmness and improving the thermal performance.

Drawings

FIG. 1 is a schematic view of a conventional connecting structure of a package component and a circuit board;

FIG. 2 is a schematic structural diagram of an embodiment of the present invention;

FIG. 3 is a cross-sectional view of another embodiment of the present invention;

referring to the drawing, a circuit board 1, a package element 2, a recess 3, a lead 4, a pad 5, a metal layer 6.

Detailed Description

The utility model will now be further described with reference to the accompanying drawings.

Example one

Referring to fig. 2, fig. 2 shows an embodiment of the present invention, which is a connection structure of surface mount components. The structure is used for fixing and plays a role in fixing.

The circuit board of the embodiment is a PCB circuit board, and has six layers. The groove does not need to penetrate through the circuit board, and can be used for fixing the plug-in component and preventing displacement, deflection and toppling over only by performing slotting treatment on any layer except the last layer.

Preferably, the opening of the groove is rectangular, and the shape of the pin is matched with the opening of the groove, so that stability is improved, and the pin is not prone to toppling.

When welding, the pins of the plug-in components are placed in the grooves, and then the welding process of the surface mounting process is carried out, so that the product processing is completed. The embodiment enables the plug-in components to be produced on a patch production line without carrying out additional fixing treatment on the plug-in components or pins thereof, thereby reducing the working procedures, improving the production efficiency and saving the production consumables (glue for dispensing, fixing clamps and the like)

Example two

Referring to fig. 3, fig. 3 shows another embodiment of the present invention, which is a connection structure of a surface mount component. On the basis of the first embodiment, the surface of the groove is metallized to form a conductive metal layer. In this embodiment, the metal layer is made of copper. The design enables the groove to have electrical characteristics, the inner portion of the groove can be welded together with the plug-in component after being coated with the solder paste, and welding firmness is improved.

On the basis of the technical advantages of the first embodiment, the contact area between the welding surface of the element and the welding surface of the PCB is further increased, the welding firmness is increased, the thermal performance of the element is improved, and the welding firmness is improved.

In addition, the present embodiment may further provide a circuit board, and the connection structure of the surface mount device according to any of the above embodiments is disposed between the circuit board and the surface plug-in device, which has similar technical advantages and effects, and therefore, is not described herein again.

The embodiments of the present invention have been described in conjunction with the accompanying drawings and examples, the structures of which are given by way of illustration and not limitation, and those skilled in the art can make modifications as required, and various changes and modifications can be made within the scope of the appended claims.

Claims

1. A connection structure of a surface-mounted component in which a card component to be soldered is placed on a circuit board, characterized in that: a groove is arranged at the position to be welded on the circuit board and corresponds to the pin of the plug-in element; the pins are arranged in the grooves; the circuit board is provided with a plurality of layers, and the bottom of the groove is non-penetrating.

2. The attachment structure of a surface-mounted component according to claim 1, characterized in that: and a conductive metal layer is arranged on the surface of the groove.

3. The attachment structure of a surface-mounted component according to claim 2, characterized in that: the metal layer is copper.

4. The attachment structure of a surface-mounted component according to claim 1, characterized in that: the circuit board is a PCB board.

5. The attachment structure of a surface-mounted component according to claim 1, characterized in that: the number of layers of the circuit board is 4-10.

6. The attaching structure of a surface mounting component according to any one of claims 1 to 5, wherein: and tin paste is injected into the groove.

7. The attaching structure of a surface mounting component according to any one of claims 1 to 5, wherein: the opening of the groove is rectangular, and the shape of the pin is matched with the shape of the groove.