JP2004342888A - Circuit substrate and mounting structure of surface mounting connector - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting structure of a surface mounting connector which can ensure easier assembling work, higher connection reliability, higher mounting density, and higher degree of freedom of wiring layout. <P>SOLUTION: A circuit substrate 10 has a connector connecting area 18 at the principal surface 10a, including a plurality of connector connecting electrodes 16 connected with the surface mounting connector 20, and a groove 11 is formed to the circumferential edge of the connector connecting area 18 by forming the cutout portion toward the depthwise direction of the circuit substrate 10 from the principal surface 10a. The surface mounting connector 20 is connected to the connector connecting electrode 16 of the circuit substrate 10 via a solder bump 30. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a circuit board mounted on an electronic device and a mounting structure of a surface mount connector mounted on the circuit board.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, mounting structures of various surface mount connectors have been proposed. This surface mount type connector is a female connector attached to a connector connection electrode provided on the surface of a circuit board. In recent years, the number of pins has been increased and the density has been increased, and as a mounting method corresponding to this, a bump connection method using solder bumps or the like has been mainly used.
[0003]
In high-speed signal transmission connectors used in high-frequency devices, the number of pins has been increasing with the increase in transmission speed and the amount of transmission, and the density has also increased with the miniaturization of devices. . For this reason, a surface mounting type connector of a bump connection type capable of simultaneously satisfying these requirements is employed.
[0004]
FIG. 12 is a schematic sectional view showing a mounting structure of a conventional surface mount type connector. In the mounting structure of a surface mount type connector employing a conventional bump connection method, as shown in FIG. 12, a plurality of connector connection electrodes 16 provided on the main surface of the circuit board 10 are surface mounted via solder bumps 30. The type connector 20 is mounted, and the respective pins 21 of the surface mount type connector 20 and the respective connector connection electrodes 16 of the circuit board 10 are connected via the solder bumps 30.
[0005]
However, when the mounting structure of the surface mount type connector described above is adopted, the insertion / extraction load applied to the surface mount type connector due to the insertion / removal of the male type connector concentrates on the solder joint, and the solder connection at the time of insertion / removal of the male type connector is performed. In some cases, the parts were damaged and electrical continuity was lost.
[0006]
A mounting structure shown in FIG. 13 has been proposed as a mounting structure of a surface mount connector that solves this problem. The mounting structure of the surface mount type connector shown in FIG. 13 is such that a flange 22 is provided on the periphery of the surface mount type connector 20, and a screw 50 is inserted into a through hole provided in the flange 22 and a through hole provided in the circuit board 10. This is a mounting structure that is inserted and fixed with a nut 51 (for example, see Patent Document 1 or Non-Patent Document 1).
[0007]
When this structure is adopted, the insertion / extraction load applied to the surface mount connector during insertion / extraction concentrates on the screw connection part, and as a result, an excessive load is applied to the solder connection part, so that the solder connection part is damaged. The electrical continuity can be maintained without performing.
[0008]
[Patent Document 1]
JP 2002-252053 A
[0009]
[Non-patent document 1]
Dave Bearley Jr. , "Assuring Reliability of Surface Mounted Connectors", Proc Tech Program Natl Electron Package Prod Conf (Vol. 606-614
[0010]
[Problems to be solved by the invention]
However, when the mounting structure of the surface mount type connector using the fastening means including the screw and the nut as described above is employed, there are the following problems.
[0011]
First, since the screws are arranged so as to penetrate the circuit board, there is a problem that wiring cannot be formed in this portion. As a result, the degree of freedom in the layout of the wiring patterns is impaired, and the increase in the mounting density and the miniaturization of the device are hindered. In particular, in a high-frequency circuit that needs to transmit a signal at high speed, a delay in signal transmission and an increase in transmission loss have been caused, and the effect has been remarkable.
[0012]
Second, there is a problem that the assembling work is complicated. Compared to the mounting structure of the surface-mount connector shown in FIG. 12, in the mounting structure of the surface-mount connector shown in FIG. 13, the operation of connecting the surface-mount connector to the circuit board by bumps and further fixing it using screws and nuts. This necessitates a complicated assembling operation, resulting in an increase in manufacturing cost.
[0013]
Therefore, the present invention has been made in order to solve the above-mentioned problems, and the assembling work can be easily performed, high connection reliability can be obtained, high-density mounting is possible, and the wiring layout has a high degree of freedom. An object of the present invention is to provide a mounting structure of a surface mount connector and a circuit board suitable for the mounting structure.
[0014]
[Means for Solving the Problems]
A circuit board according to an aspect of the present invention is a circuit board on which a surface mount connector is mounted via bumps made of a brazing material. The circuit board has, on its main surface, a connector connection region including a plurality of connector connection electrodes to which the surface mount connector is connected. At the periphery of the connector connection region of the circuit board, a notch is provided from the main surface in the depth direction of the circuit board.
[0015]
A circuit board according to another aspect of the present invention is a circuit board on which a surface mount connector is mounted via bumps made of brazing material. The circuit board has, on its main surface, a connector connection region including a plurality of connector connection electrodes to which the surface mount connector is connected. A reinforcing member is attached to the back surface of the circuit board corresponding to the portion of the circuit board where the connector connection region is located.
[0016]
In addition, the mounting structure of the surface mount type connector according to the present invention is a surface mount type in which any one of the above-described circuit boards and a plurality of connector connection electrodes provided on the circuit board are connected via bumps made of a brazing material. And a type connector.
[0017]
BEST MODE FOR CARRYING OUT THE INVENTION
Prior to describing the embodiment of the present invention, the main stress distribution generated by inserting and removing the male connector when the mounting structure of the conventional surface mount connector shown in FIG. The result of the analysis will be described. FIG. 1 is a view showing a result of simulating a main stress distribution generated in a solder joint in the mounting structure of the surface mount type connector shown in FIG. 12, and FIG. 2 is a view showing a result of simulation of a solder joint in the simulation result shown in FIG. It is an end part enlarged view. In FIGS. 1 and 2, the direction of the arrow indicates the direction of the main stress, and the length of the arrow indicates the magnitude of the main stress.
[0018]
As shown in FIGS. 1 and 2, the insertion / extraction load applied when a male connector is inserted / extracted into / from a female type surface mount type connector 20 connected to the circuit board 10 via solder bumps 30 is mainly the outermost end. It can be seen that it is transmitted to the circuit board 10 through the solder bumps located at the position (1). The insertion / extraction load transmitted to the circuit board 10 acts as a bending stress in the circuit board 10. For this reason, it can be seen that remarkable stress concentration occurs in the solder bump located at the outermost end, and there is a high possibility that this portion is damaged.
[0019]
The inventor paid attention to this point and completed the present invention. Hereinafter, embodiments of the present invention will be described with reference to the drawings.
[0020]
(Embodiment 1)
FIG. 3 is a plan view showing the shape of the circuit board and the mounting structure of the surface mount connector according to Embodiment 1 of the present invention. FIG. 4 is a schematic cross-sectional view showing the shape of the circuit board and the mounting structure of the surface mount connector according to the present embodiment, and is a view cut along line IV-IV in FIG.
[0021]
As shown in FIGS. 3 and 4, in the present embodiment, a so-called multilayer wiring board is used as the circuit board 10. The multilayer wiring board is a wiring board obtained by stacking and sintering single-layer green sheets. In this multilayer wiring board, a three-dimensional circuit pattern can be constructed by connecting planar circuit patterns provided in each layer through via holes.
[0022]
On the main surface of the circuit board 10, a connector connection area 18 on which the surface mount type connector 20 is mounted is located. A plurality of connector connection electrodes 16 are provided in the connector connection area 18. Usually, the arrangement of the pins 21 in the surface mount type connector 20 is often provided in a matrix as shown in FIG. 3, and the connector connection electrodes 16 are also arranged in a matrix corresponding to this.
[0023]
The surface mount connector 20 is connected to the connector connection electrodes 16 of the circuit board 10 via the solder bumps 30 arranged in a matrix. As a result, each pin 21 of the surface mount connector 20 is electrically independently connected to each connector connection electrode 16 provided on the circuit board 10 via the solder bump 30.
[0024]
A notch is provided in the periphery of the connector connection region 18 of the circuit board 10. The cut is formed with a predetermined width, and is provided from the main surface of the circuit board 10 in the depth direction of the circuit board 10. The cut is interrupted at a predetermined depth of the circuit board 10 without reaching the back surface 10b of the circuit board 10. For this reason, the groove 11 is formed at the periphery of the connector connection region 18 of the circuit board 10 by the cut. As shown in FIG. 3, the groove 11 is formed so as to surround the entire periphery of the connector connection region 18.
[0025]
The above-mentioned groove 11 can be formed, for example, by providing a cut in the green sheet before firing, or by mechanically using a cutting tool or the like on the multilayer wiring board after firing. It can be formed.
[0026]
The wiring in the circuit board 10 is constituted by a circuit pattern formed on each layer and a conductor layer filled in the via hole. For this reason, by connecting the planar circuit patterns provided on each layer of the multilayer wiring board via the via holes, it is possible to construct a wiring path bypassing the groove 11.
[0027]
To summarize the characteristic structure of the circuit board in the present embodiment described above, the circuit board 10 has a plurality of surface-mounted connectors 20 connected via solder bumps 30 as bumps made of brazing material. A connector connection region 18 including the connector connection electrode 16 is provided on the main surface 10a, and a notch is provided in the peripheral edge of the connector connection region 18 of the circuit board 10 from the main surface 10a in the depth direction of the circuit board 10. Have been. Further, the cut provided in the circuit board 10 is formed with a predetermined width, and forms the groove 11 without reaching the back surface 10b of the circuit board 10. The groove 11 is provided over the entire periphery of the connector connection area 18.
[0028]
Furthermore, the characteristic structure of the mounting structure of the surface mount type connector according to the present embodiment can be summarized as follows. This mounting structure includes the above-described circuit board 10 and a plurality of connector connection electrodes 16 provided on the circuit board 10. And a surface mount type connector 20 connected via a solder bump 30.
[0029]
A description will be given of a result of analyzing, by using the finite element method, a main stress distribution generated by inserting and removing the male connector when the mounting structure of the surface mount connector according to the present embodiment described above is employed. FIG. 5 is a view showing a result of simulating a distribution of a main stress generated in a solder joint in the mounting structure of the surface mount connector described above. FIG. 6 is a view showing an end of the solder joint in the simulation result shown in FIG. It is an enlarged view. 5 and 6, the direction of the arrow indicates the direction of the main stress, and the length of the arrow indicates the magnitude of the main stress.
[0030]
As shown in FIGS. 5 and 6, an insertion / extraction load applied when a male connector is inserted / extracted into / from a female surface mount connector 20 connected to the circuit board 10 via the solder bump 30 is applied via the solder bump 30. And acts on the circuit board 10. However, unlike the simulation result of the above-described conventional structure, when the present mounting structure is adopted, no remarkable stress concentration is observed on the solder bump located at the outermost end. This is because the groove 11 provided on the circuit board 10 functions as a buffer for reducing the stress applied to the solder bump located at the outermost end. As a result, the stress applied to each solder bump 30 is equalized and reduced. Is achieved. The concentration of stress is concentrated near the groove 11 of the circuit board 10. Since the circuit board 10 is not brittle compared to the solder joint, it is unlikely that the circuit board 10 will be damaged due to the concentration of stress near the groove 11. Therefore, it can be seen that the connection reliability between the surface mount connector 20 and the circuit board 10 is improved.
[0031]
As described above, by adopting the mounting structure using the circuit board having the structure as in the present embodiment, the insertion / extraction load generated by inserting / removing the male connector into / from the female surface mount connector is reduced by soldering. Since it is possible to avoid concentration on the connection part, high connection reliability is ensured. As a result, damage to this portion is prevented.
[0032]
Further, the groove provided in the circuit board can be formed with a width sufficiently smaller than the installation area of the fastening means having the structure shown in FIG. Therefore, it is possible to realize a mounting structure of a surface mount type connector which can be mounted at a higher density than the structure shown in FIG.
[0033]
Furthermore, since there is no need to assemble the surface mount type connector and the circuit board using fastening means such as screws or nuts, the assembling work is greatly simplified, and the number of parts and the manufacturing cost can be reduced. Become.
[0034]
(Embodiment 2)
FIG. 7 is a plan view showing a shape of a circuit board and a mounting structure of a surface mount connector according to Embodiment 2 of the present invention. The mounting structure of the surface mount connector according to the present embodiment is different from the mounting structure according to the first embodiment in that the formation positions of the grooves provided on the circuit board are different. The same parts as those in the first embodiment are denoted by the same reference numerals in the drawings, and description thereof will not be repeated here.
[0035]
As shown in FIG. 7, the circuit board 10 in the present embodiment has grooves 12 at four corners of a connector connection area 18 having a substantially rectangular shape. Each groove 12 has an L-shape when viewed from above, and is arranged so as to surround the connector connection region 18. When the surface mount type connector 20 in which the pins 21 are arranged in a matrix is employed, stress is likely to be concentrated particularly on the solder bumps located at the four corners. Therefore, in the circuit board 10 of the present embodiment, the positions where the groove portions 12 are formed are limited to only four corners.
[0036]
To summarize the characteristic structure of the circuit board in the present embodiment, the circuit board 10 includes a plurality of connector connection electrodes 16 to which the surface mount type connector 20 is connected via solder bumps 30 as bumps made of brazing material. Is provided on the main surface 10a, and a notch is provided in the periphery of the connector connection region 18 of the circuit board 10 from the main surface 10a in the depth direction of the circuit board 10. The connector connection region 18 has a substantially rectangular shape by arranging the plurality of connector connection electrodes 16 in a matrix, and the notch provided on the periphery of the connector connection region 18 has a substantially rectangular connector. It is provided at the four corners of the connection region 18. The cut is formed with a predetermined width, and forms the groove 12 without reaching the back surface 10b of the circuit board 10.
[0037]
Furthermore, the characteristic structure of the mounting structure of the surface mount type connector according to the present embodiment can be summarized as follows. This mounting structure includes the above-described circuit board 10 and a plurality of connector connection electrodes 16 provided on the circuit board 10. And a surface mount type connector 20 connected via a solder bump 30.
[0038]
By adopting the structure described above, since the grooves provided at the four corners of the connector connection region act as buffer portions for releasing the stress, the concentration of the stress on the solder joint portion is avoided, and The same effect as in the first embodiment can be obtained. Further, in a portion where the groove is not formed, that is, in a portion other than the four corners of the periphery of the connector connection region, it is possible to form a wiring path without bypassing the groove, so that the above-described embodiment is performed. The degree of freedom of the wiring layout is further increased as compared with the first embodiment, and the wiring layout is suitable for higher density and smaller size.
[0039]
FIG. 8 is a plan view showing a modification of the shape of the circuit board in the present embodiment. As shown in FIG. 8, in the circuit board 10 according to the present modification, the groove 13 is formed so as to surround only two opposing sides of the connector connection area 18 having a substantially rectangular shape. Each of the grooves 13 has a U-shape when viewed from above, and is arranged so as to surround the connector connection region 18. Even in the case of such a configuration, it is possible to ensure both the connection reliability and the freedom of the wiring layout.
[0040]
(Embodiment 3)
FIG. 9 is a plan view showing a shape of a circuit board and a mounting structure of a surface mount connector according to Embodiment 3 of the present invention. FIG. 10 is a schematic cross-sectional view showing the shape of the circuit board and the mounting structure of the surface mount type connector according to the present embodiment, and is a view cut along line XX in FIG. The mounting structure of the surface mount type connector according to the present embodiment is different from the mounting structure according to the above-described first or second embodiment in that the shape of the cut provided on the circuit board is different. The same parts as those in the above-described first or second embodiment are denoted by the same reference numerals in the drawings, and description thereof will not be repeated here.
[0041]
As shown in FIGS. 9 and 10, a notch is provided in the periphery of the connector connection region 18 of the circuit board 10. The cut is formed with a predetermined width, and is provided from the main surface of the circuit board 10 in the depth direction of the circuit board 10. The cut reaches the back surface of the circuit board 10. For this reason, the cutout forms the through hole 14 in the peripheral edge of the connector connection region 18 of the circuit board 10. The through holes 14 are located at four corners of the connector connection area 18 having a substantially rectangular shape. Each of the through holes 14 has an L-shape when viewed from above, and is arranged so as to surround the connector connection region 18.
[0042]
The above-mentioned through hole 14 can be formed, for example, by providing a cut in a green sheet before firing, or by mechanically processing a multilayer wiring board after firing using a cutting tool or the like. Can also be formed.
[0043]
To summarize the characteristic structure of the circuit board in the present embodiment, the circuit board 10 includes a plurality of connector connection electrodes 16 to which the surface mount type connector 20 is connected via solder bumps 30 as bumps made of brazing material. Is provided on the main surface 10a, and a notch is provided in the periphery of the connector connection region 18 of the circuit board 10 from the main surface 10a in the depth direction of the circuit board 10. The connector connection region 18 has a substantially rectangular shape by arranging the plurality of connector connection electrodes 16 in a matrix, and the notch provided on the periphery of the connector connection region 18 has a substantially rectangular connector. It is provided at the four corners of the connection region 18. The cut has a predetermined width, reaches the back surface 10 b of the circuit board 10, and forms a through hole 14.
[0044]
Furthermore, the characteristic structure of the mounting structure of the surface mount type connector according to the present embodiment can be summarized as follows. This mounting structure includes the above-described circuit board 10 and a plurality of connector connection electrodes 16 provided on the circuit board 10. And a surface mount type connector 20 connected via a solder bump 30.
[0045]
By employing the structure described above, effects similar to those of the above-described second embodiment can be obtained. Note that the stress relaxation effect obtained in this case is greater than that in the above-described second embodiment due to the penetration of the cuts, and the stress can be more effectively relieved.
[0046]
Even in the case where a through hole is provided in a circuit board as in the present embodiment, similarly to the modification in the second embodiment described above, only two opposing sides of the substantially rectangular connector connection region are surrounded. Thus, it is possible to provide a U-shaped through hole. With this configuration, it is possible to ensure both the connection reliability and the degree of freedom in the wiring layout.
[0047]
(Embodiment 4)
FIG. 11 is a schematic sectional view showing a shape of a circuit board and a mounting structure of a surface mount type connector according to Embodiment 4 of the present invention. The same parts as those in the first to third embodiments are denoted by the same reference numerals in the drawings, and description thereof will not be repeated here.
[0048]
As shown in FIG. 8, on the main surface 10a of the circuit board 10, a connector connection area 18 where the surface mount type connector 20 is mounted is located. A plurality of connector connection electrodes 16 are provided in the connector connection area 18.
[0049]
The surface mount connector 20 is connected to the connector connection electrodes 16 of the circuit board 10 via the solder bumps 30 arranged in a matrix. As a result, each pin 21 of the surface mount connector 20 is electrically independently connected to each connector connection electrode 16 provided on the circuit board 10 via the solder bump 30.
[0050]
A reinforcing member 40 is attached to the back surface 10b of the circuit board 10 corresponding to the connector connection region 18. As the reinforcing member 40, for example, a metal plate-like member or a surplus piece of a circuit board can be used. In this case, the reinforcing member 40 and the circuit board 10 are attached using an adhesive. Further, the reinforcing member 40 can also be formed by applying a large amount of resin paste such as an adhesive to the back surface and curing the resin paste. In this case, it is not necessary to separately prepare a reinforcing member.
[0051]
When the circuit board 10 and the reinforcing member 40 are bonded using an adhesive, it is preferable to use a thermosetting adhesive represented by an epoxy resin-based adhesive. When this kind of adhesive is used, the reinforcing member 40 can be attached to the back surface of the circuit board 10 without damaging the wiring provided on the circuit board 10, and the surface mount type connector 20 Since the step of bonding the reinforcing member 40 can be performed at the same time in the reflow step of assembling the substrate 10, the process can be shortened.
[0052]
In addition, as a method of attaching the reinforcing member 40 to the back surface 10b of the circuit board 10, a portion where the wiring patterns are not densely laid out using a screw or a pin is used to avoid the vicinity of the connector connection region 18 where the wiring patterns are densely packed. A method of sticking by mechanically fixing the member 40 is also available.
[0053]
To summarize the characteristic structure of the circuit board in the present embodiment described above, the circuit board 10 has a plurality of surface-mounted connectors 20 connected via solder bumps 30 as bumps made of brazing material. A reinforcing member 40 is provided on the back surface 10b of the circuit board 10 corresponding to a portion of the circuit board 10 where the connector connecting area 18 is located, the connector connecting area 18 including the connector connecting electrode 16 being provided on the main surface 10a. I have.
[0054]
Furthermore, the characteristic structure of the mounting structure of the surface mount type connector according to the present embodiment can be summarized as follows. This mounting structure includes the above-described circuit board 10 and a plurality of connector connection electrodes 16 provided on the circuit board 10. And a surface mount type connector 20 connected via a solder bump 30.
[0055]
By adopting the structure described above, the insertion / extraction load generated by inserting / extracting the male connector into / from the female surface mount connector is prevented from being concentrated on the solder connection portion, so that a high connection can be achieved. Reliability is assured. This is because the bending stress generated on the circuit board is reduced by the reinforcing member attached to the back surface of the circuit board, and the stress concentration particularly generated on the solder bump located at the outermost end of the solder connection portion is reduced. Therefore, damage in this portion is prevented beforehand.
[0056]
In addition, there is no need to secure a space for mounting a fastening means such as a screw or a nut on the circuit board, and further, it is not necessary to secure a space for providing a groove or a through-hole. It is possible to realize a mounting structure of the surface mount type connector with high degree.
[0057]
In the above-described first to fourth embodiments, the case has been described in which the connector connection electrodes are arranged in a matrix on the surface of the circuit board and the connector connection region is formed in a substantially rectangular shape. It is not particularly limited to this shape. The present invention can naturally be applied to, for example, those in which the connector connection electrodes are arranged in a staggered manner or those in which the connector connection areas are arranged in a random manner. Of course, it can be applied to such as.
[0058]
Further, in the above-described first to fourth embodiments, the case where a connection structure of a so-called BGA (Ball Grid Array) system using solder bumps is employed has been described as an example, but the present invention is not particularly limited to this. Instead, the present invention can also be applied to a circuit board in which a solder paste is printed and the circuit board is connected to the surface mount type connector by reflow or the like.
[0059]
As described above, each of the embodiments disclosed above is an example in all respects, and is not restrictive. The technical scope of the present invention is defined by the claims, and includes all modifications within the meaning and scope equivalent to the claims.
[0060]
【The invention's effect】
ADVANTAGE OF THE INVENTION According to this invention, assembling work can be easily performed, high connection reliability is obtained, and the mounting structure of the surface mount type connector which enables high-density mounting and has a high degree of freedom in wiring layout can be obtained. Further, according to the present invention, a circuit board suitable for this mounting structure can be obtained.
[Brief description of the drawings]
FIG. 1 is a view showing a result of simulating a distribution of a main stress generated in a solder joint in a mounting structure of a surface mount type connector shown in FIG.
FIG. 2 is an enlarged view of an end portion of a solder joint in the simulation result shown in FIG. 1;
FIG. 3 is a plan view showing a shape of a circuit board and a mounting structure of a surface mount connector according to Embodiment 1 of the present invention.
FIG. 4 is a schematic sectional view showing a shape of a circuit board and a mounting structure of a surface mount connector according to the first embodiment of the present invention.
FIG. 5 is a diagram showing a result of simulating a distribution of a main stress generated in a solder joint in the mounting structure of the surface mount connector shown in FIGS. 3 and 4;
FIG. 6 is an enlarged view of an end portion of a solder joint in the simulation result shown in FIG. 5;
FIG. 7 is a plan view showing a shape of a circuit board and a mounting structure of a surface mount type connector according to Embodiment 2 of the present invention.
FIG. 8 is a plan view showing a modification of the shape of the circuit board and the mounting structure of the surface mount connector according to the second embodiment of the present invention.
FIG. 9 is a plan view showing a shape of a circuit board and a mounting structure of a surface mount type connector according to Embodiment 3 of the present invention.
FIG. 10 is a schematic sectional view showing a shape of a circuit board and a mounting structure of a surface mount connector according to a third embodiment of the present invention.
FIG. 11 is a schematic sectional view showing a shape of a circuit board and a mounting structure of a surface mount type connector according to a fourth embodiment of the present invention.
FIG. 12 is a schematic sectional view showing a mounting structure of a conventional surface mount type connector.
FIG. 13 is a schematic sectional view showing another example of a mounting structure of a conventional surface mount type connector.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 10 Circuit board, 10a main surface, 10b back surface, 11, 12, 13 groove part, 14 through-hole, 16 connector connection electrode, 18 connector connection area, 20 surface mount type connector, 21 pin, 30 solder bump, 40 reinforcing member.

Claims (8)

A circuit board having a connector connection region on a main surface including a plurality of connector connection electrodes to which a surface mount connector is connected via bumps made of brazing material,
A circuit board, wherein a notch is provided at a periphery of the connector connection region from the main surface in a depth direction of the circuit board. 2. The circuit board according to claim 1, wherein the notch is formed with a predetermined width, and forms a groove without reaching the back surface of the circuit board. 3. The circuit board according to claim 2, wherein the groove is provided over the entire periphery of the connector connection region. The connector connection region has a substantially rectangular shape by arranging the plurality of connector connection electrodes in a matrix,
The circuit board according to claim 1, wherein the cuts are provided at least at four corners of the substantially rectangular connector connection area. The circuit board according to claim 4, wherein the notch is formed with a predetermined width, and forms a groove without reaching the back surface of the circuit board. The circuit board according to claim 4, wherein the notch is formed with a predetermined width, and reaches the back surface of the circuit board to form a through hole. A circuit board having a connector connection region on a main surface including a plurality of connector connection electrodes to which a surface mount connector is connected via bumps made of brazing material,
A circuit board, wherein a reinforcing member is attached to a back surface of the circuit board corresponding to a portion where the connector connection region is located. A surface mount comprising: the circuit board according to claim 1; and a surface mount type connector connected to a plurality of connector connection electrodes provided on the circuit board via bumps made of brazing material. Mounting structure of type connector.

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