CN102056405B - Surface mount structure and circuit board with same - Google Patents
Surface mount structure and circuit board with same Download PDFInfo
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- CN102056405B CN102056405B CN2009103091266A CN200910309126A CN102056405B CN 102056405 B CN102056405 B CN 102056405B CN 2009103091266 A CN2009103091266 A CN 2009103091266A CN 200910309126 A CN200910309126 A CN 200910309126A CN 102056405 B CN102056405 B CN 102056405B
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Abstract
The invention provides a surface mount structure used for fixedly mounting an electronic element with a pin and a welding chassis onto a circuit board. The surface mount structure comprises a pad formed on the circuit board, wherein the pad comprises a first pad welded with the bottom surface of the pin, a second pad welded with the bottom surface of the welding chassis and a connecting wire for connecting the first pad and the second pad. The structure is characterized in that the area of the surface of the second pad, which is opposite to the bottom surface of the welding chassis, is larger than the area of the surface of the first pad, which is opposite to the bottom surface of the pin; the space between the first pad and the second pad is smaller than 0.3mm; the connecting wire comprises a current-limiting part and a non-current-limiting part; the current-limiting part is connected with the first pad, and the non-current-limiting part is connected with the second pad; and the partial or overall wire width of the current-limiting part is smaller than the wire width of the non-current-limiting part.
Description
Technical field
The present invention relates to circuit board technology, particularly a kind of circuit board that can be used for the surface mounting structure of mounted with electronic components and have this surface mounting structure.
Background technology
Along with the develop rapidly of electronic industry, seem more and more important as the manufacturing technology of the circuit board of electronic product basic building block.Circuit board generally by copper-clad base plate through cut, series of process such as boring, etching, exposure, development, pressing, moulding is made.Specifically can consult people such as C.H.Steer at Proceedings of the IEEE, " Dielectric characterization of printed circuit board substrates " literary composition that Vol.39, No.2 delivered in (in August, 2002).
Usually, circuit board making also need mount various electronic components to circuit board after accomplishing.Therefore, circuit board surface need be provided with the pad that exposes, and this pad can realize that electronic component is connected with electrical connection or signal between the circuit board internal wiring.Along with the miniaturization and the integration of function of electronic component, electronic component also can be provided with different welding chassis in the bottom except the edge has pin.So accordingly, the circuit board that can be used for mounting this kind electronic component also need be offered the welding chassis corresponding bonding pad with the electronic component bottom in the center except being provided with in the edge corresponding with electronic component the pad.Wherein, with the surface area of welding chassis corresponding bonding pad generally greater than with the surface area of pin corresponding bonding pad.And, because the densification of circuit, the larger area pad that circuit board is adjacent with than also having interconnected relationship between the pad of small size, so connecting line need be set be connected between the adjacent pad.
When electronic component is mounted on circuit board, also need passes through the reflow stove and just can make scolding tin remelting on the circuit board can electronic component fixedly being soldered to circuit board.And in the scolding tin reflow process because the characteristic of fluid; Scolding tin has the tendency via the bigger pad of connecting line flow chart area; Therefore can make the less pad region of surface area cause failure welding because of scolding tin is not enough; Cause the connection reliability between electronic component and the circuit board to reduce, and influence the signal transmitting quality between electronic component and the circuit board.
In the prior art, the scolding tin that the method for coating or solder-mask printing bar of generally being employed on the connecting line between the less pad of bigger pad of surface area and surface area stops remelting is from the less bigger pad of pad flow chart area of surface area.But; Distance between the bigger pad of the less pad of surface area and surface area is shorter; Be under the short situation of connecting line (for example less than 0.3mm); Can't be coated with or during the solder-mask printing bar, the scolding tin of above-mentioned remelting still exists from the problem of the bigger pad of the less pad flow chart area of surface area, it has had a strong impact on the quality that mounts of electronic component.
Therefore; To the problems referred to above; Be necessary to provide a kind of circuit board that can stop the scolding tin of remelting more effectively from the bigger pad of the less pad flow chart area of surface area; To improve the quality that mounts of on circuit board mounted with electronic components, promote the signal transmitting quality between electronic component and the circuit board.
Summary of the invention
To a kind of surface mounting structure be described and have the circuit board of this surface mounting structure with specific embodiment below.
A kind of surface mounting structure; The electronic component that will have pin and welding chassis mounts on the circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board, and wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis; And the connecting line that connects this first pad and second pad; It is characterized in that the area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, the spacing of this first pad and second pad is less than 0.3mm; This connecting line comprises restriction and non-restriction; This restriction is connected with first pad, and this non-restriction is connected with second pad, and the part or all of live width of this restriction is less than the live width of this non-restriction.
A kind of surface mounting structure; The electronic component that will have pin and welding chassis mounts on the circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board; Wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis, and the connecting line that connects this first pad and second pad; It is characterized in that; The area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, and the spacing of this first pad and second pad is less than 0.3mm, and this connecting line comprises restriction, the first non-restriction and the second non-restriction; This restriction is connected between the first non-restriction and the second non-restriction; This first non-restriction is connected between first pad and the restriction, and this second non-restriction is connected between second pad and the restriction, and the live width of this restriction is less than the live width of this first non-restriction, the second non-restriction.
A kind of circuit board; It comprises that the electronic component that will have pin and welding chassis mounts the surface mounting structure on this circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board, and wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis; And the connecting line that connects this first pad and second pad; It is characterized in that the area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, the spacing of this first pad and second pad is less than 0.3mm; This connecting line comprises restriction and non-restriction; This restriction is connected with first pad, and this non-restriction is connected with second pad, and the part or all of live width of this restriction is less than the live width of this non-restriction.
A kind of circuit board; It comprises that the electronic component that will have pin and welding chassis mounts the surface mounting structure on this circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board; Wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis, and the connecting line that connects this first pad and second pad; It is characterized in that; The area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, and the spacing of this first pad and second pad is less than 0.3mm, and this connecting line comprises restriction, the first non-restriction and the second non-restriction; This restriction is connected between the first non-restriction and the second non-restriction; This first non-restriction is connected between first pad and the restriction, and this second non-restriction is connected between second pad and the restriction, and the live width of this restriction is less than the live width of this first non-restriction, the second non-restriction.
With respect to prior art; The surface mounting structure of present technique scheme and the area of second pad and the basal surface facing surfaces on welding chassis of circuit board with this surface mounting structure are greater than the area of the basal surface facing surfaces of this first pad and pin; Spacing with the first continuous pad of connecting line and second pad is less than 0.3mm; And because the part or all of live width of the restriction of connecting line is less than the live width of the non-restriction (the perhaps first non-restriction, the second non-restriction) of connecting line; Thereby can be under the short situation of connecting line (less than 0.3mm) can't be coated with or during the solder-mask printing bar; The scolding tin that stops remelting effectively is from the less second bigger welding disking area of the first pad region flow chart area of surface area; Avoid the first less pad region of surface area to cause the situation of failure welding because of scolding tin is not enough better, improve the quality that mounts of on circuit board mounted with electronic components, promote the signal transmitting quality between electronic component and the circuit board.
Description of drawings
Fig. 1 is the structural representation with the pin and the electronic component on welding chassis.
Fig. 2 is that the surface mounting structure that present technique scheme first embodiment provides is arranged on the sketch map on the circuit board.
Fig. 3 is the enlarged diagram in III zone among Fig. 2.
Fig. 4 is the part sketch map of the surface mounting structure that provides of present technique scheme second embodiment.
Fig. 5 is the part sketch map of the surface mounting structure that provides of present technique scheme the 3rd embodiment.
Embodiment
To combine accompanying drawing and embodiment that the surface mounting structure of present technique scheme and circuit board with this surface mounting structure are done further explain below.
Present technique scheme implementation example provides a kind of surface mounting structure, and its electronic component that will have pin and welding chassis mounts on the circuit board with being used for fixing.
See also Fig. 1, the above-mentioned electronic component that is used to mount 1 has chip body 2, welding chassis 3 and pin 4.Wherein, welding chassis 3 is formed on the bottom surface of chip body 2, and pin 4 is formed on the edge of chip body 2.This welding chassis 3 has first basal surface 5 that is used to weld.This pin 4 is useful on second basal surface 6 of welding.
See also Fig. 2 and Fig. 3, in first embodiment, this surface mounting structure 10 comprises the pad 12 that is formed on the circuit board 100.Wherein, this pad 12 comprises first pad 110, second pad 120, and the connecting line 130 that connects this second pad 110 and first pad 120.It is to be noted; All need connecting line 130 to be connected between the second not all pad 110 and first pad 120; This connecting line 130 is merely and is connected between second pad 110 and first pad 120 that needs the signal transmission, and the specific requirement that needs according to the signal transmission that specifically is provided with of connecting line 130 is decided.
Wherein, the area of first basal surface, 5 facing surfaces 112 on this first pad 110 and welding chassis 3 is greater than the area of this second pad 110 with second basal surface, 6 facing surfaces 122 of pin 4.Preferably, the area on the surface 112 of first pad 110 and the ratio of the area on the surface 122 of second pad 120 were more than or equal to 1.5: 1.The spacing of second pad 110 and first pad 120 with connecting line 130 is less than 0.3mm.
Connecting line 130 comprises the restriction 132 and non-restriction 134 that is connected.The part or all of live width of this restriction 132 is less than the live width of this non-restriction 134.In the present embodiment, the part live width of restriction 132 is less than the live width of this non-restriction 134.The live width of this restriction 132 and non-restriction 134 refers to that respectively restriction 132 and non-restriction 134 are perpendicular to the width on the bearing of trend of connecting line 130.In the present embodiment, this restriction 132 is connected with second pad 120, and non-restriction 134 is connected with first pad 110.This restriction 132 adopts the design of bottleneck shape.Particularly, restriction 132 comprises the first restricted zone 132a and the second restricted zone 132b.The first restricted zone 132a is connected with second pad 120, and the second restricted zone 132b is connected with non-restriction 134.The live width of the first restricted zone 132a diminishes from the direction away from second pad 120 gradually, and the live width of the second restricted zone 132b becomes big gradually from the direction away from second pad 120.Preferably, the round-corner transition design is all adopted in the junction of the junction of the first restricted zone 132a and second pad 120 and the second restricted zone 132b and non-restriction 134.The tangent line at the tie point place of the outward flange of the first restricted zone 132a and second pad 120 is perpendicular to the outward flange of second pad 120, and the tangent line at the tie point place of the outward flange of the second restricted zone 132b and non-restriction 134 is perpendicular to the outward flange of non-restriction 134.The junction of the first restricted zone 132a and the second restricted zone 132b is the narrowest position of this restriction 132, i.e. the minimum position of live width.
In a preferred design, the live width of narrow position of this restriction 132 be this non-restriction 134 live width 1/2, promptly the live width of the junction of the first restricted zone 132a and the second restricted zone 132b be this non-restriction 134 live width 1/2.Thereby this restriction 132 can more efficiently stop the scolding tin of remelting to flow to first pad 110 from second pad 120 through this connecting line 130 in melting down the weldering process.
See also Fig. 4; In a second embodiment; Surface mounting structure 10 among this surface mounting structure 20 and first embodiment is roughly the same; Its difference is that the restriction 232 of this surface mounting structure 20 further comprises one the 3rd restricted zone 232c, and the 3rd restricted zone 232c is connected between the first restricted zone 232a and the second restricted zone 232b.
The live width of this first restricted zone 232a diminishes from the direction away from second pad 220 gradually, and the live width of this second restricted zone 232b becomes greatly from the direction away from second pad 220 gradually, and the live width of the 3rd restricted zone 232c remains unchanged.The 3rd restricted zone 232c is the narrowest position of restriction 232.Preferably, the live width of the 3rd restricted zone 232c be non-restriction 234 live width 1/2.The junction of the first restricted zone 232a and first pad 210, the 3rd restricted zone 232c, and the round-corner transition design is all adopted in the junction of the second restricted zone 232b and non-restriction 234, the 3rd restricted zone 232c.
See also Fig. 5; In the 3rd embodiment; Surface mounting structure 10 among this surface mounting structure 30 and first embodiment is roughly the same, and its difference is that the connecting line 330 of this surface mounting structure 30 comprises restriction 332, the first non-restriction 334 and the second non-restriction 336.
The first non-restriction 334 is connected between second pad 320 and the restriction 332.The second non-restriction 336 is connected between first pad 310 and the restriction 332.The live width of restriction 332 is less than the live width of first non-restriction 334, the second non-restriction 336.The round-corner transition design both can have been adopted in the junction of the junction of the first non-restriction 334 and second pad 320 and the second non-restriction 336 and first pad 310, also can directly adopt right angle transition design.In the present embodiment, the junction of the junction of the first non-restriction 334 and second pad 320 and the second non-restriction 336 and first pad 310 is adopts the round-corner transition design.The etching moulding of this round-corner transition design can convenience connecting line 330 is effectively avoided connecting line 330 causing acid trip with the junction of first pad 310, second pad 320, thereby is improved the moulding quality of connecting line 330.
It is understandable that the surface mounting structure 10,20,30 among above-mentioned three embodiment all can be applicable in circuit board or the other electron component base plate for packaging.
With respect to prior art; The surface mounting structure of present technique scheme and the area of second pad and the basal surface facing surfaces on welding chassis of circuit board with this surface mounting structure are greater than the area of the basal surface facing surfaces of this first pad and pin; Spacing with the first continuous pad of connecting line and second pad is less than 0.3mm; And because the live width of the restriction of connecting line is less than the live width of the non-restriction (the perhaps first non-restriction, the second non-restriction) of connecting line; Thereby can be under the short situation of connecting line (less than 0.3mm) can't be coated with or during the solder-mask printing bar; The scolding tin that stops remelting effectively is from the less second bigger welding disking area of the first pad region flow chart area of surface area; Avoid the first less pad region of surface area to cause the situation of failure welding because of scolding tin is not enough better, improve the quality that mounts of on circuit board mounted with electronic components, promote the signal transmitting quality between electronic component and the circuit board.
It is understandable that, for the person of ordinary skill of the art, can make other various corresponding changes and distortion, and all these change the protection range that all should belong to present technique scheme claim with distortion according to the technical conceive of present technique scheme.
Claims (13)
1. a surface mounting structure will have pin with being used for fixing and mount on the circuit board with the electronic component that welds the chassis, and this surface mounting structure comprises the pad that is formed on this circuit board, and wherein this pad comprises:
First pad that welds with the basal surface of this pin; Second pad that welds with the basal surface on this welding chassis, and the connecting line that connects this first pad and second pad is characterized in that; The area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin; The spacing of this first pad and second pad is less than 0.3mm, and this connecting line comprises restriction and non-restriction, and this restriction is connected with first pad; This non-restriction is connected with second pad, and the part or all of live width of this restriction is less than the live width of this non-restriction.
2. surface mounting structure as claimed in claim 1 is characterized in that, this restriction comprises first restricted zone and second restricted zone, and this first restricted zone is connected with first pad, and this second restricted zone is connected with non-restriction.
3. surface mounting structure as claimed in claim 2 is characterized in that, the live width of this first restricted zone diminishes from the direction away from first pad gradually, and the live width of this second restricted zone becomes big gradually from the direction away from first pad.
4. surface mounting structure as claimed in claim 3 is characterized in that, the round-corner transition design is all adopted in the junction of this first restricted zone and first pad and the junction of this second restricted zone and non-restriction.
5. surface mounting structure as claimed in claim 4; It is characterized in that; The tangent line at the tie point place of the outward flange of this first restricted zone and first pad is perpendicular to the outward flange of this first pad, and the tangent line at the tie point place of the outward flange of this second restricted zone and non-restriction is perpendicular to the outward flange of this non-restriction.
6. surface mounting structure as claimed in claim 2 is characterized in that, the live width of the junction of this first restricted zone and second restricted zone be this non-restriction live width 1/2.
7. surface mounting structure as claimed in claim 2 is characterized in that, this restriction further comprises one the 3rd restricted zone, and the 3rd restricted zone is connected between first restricted zone and second restricted zone.
8. surface mounting structure as claimed in claim 7; It is characterized in that; The live width of this first restricted zone diminishes from the direction away from first pad gradually, and the live width of this second restricted zone becomes greatly from the direction away from first pad gradually, and the live width of the 3rd restricted zone remains unchanged.
9. surface mounting structure as claimed in claim 8 is characterized in that, the live width of the 3rd restricted zone be this non-restriction live width 1/2.
10. surface mounting structure as claimed in claim 1 is characterized in that, area and this first pad of this second pad and the basal surface facing surfaces on welding chassis and the ratio of the area of the basal surface facing surfaces of pin were more than or equal to 1.5: 1.
11. surface mounting structure; The electronic component that will have pin and welding chassis mounts on the circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board; Wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis, and the connecting line that connects this first pad and second pad; It is characterized in that; The area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, and the spacing of this first pad and second pad is less than 0.3mm, and this connecting line comprises restriction, the first non-restriction and the second non-restriction; This restriction is connected between the first non-restriction and the second non-restriction; This first non-restriction is connected between first pad and the restriction, and this second non-restriction is connected between second pad and the restriction, and the live width of this restriction is less than the live width of this first non-restriction, the second non-restriction.
12. circuit board; It comprises that the electronic component that will have pin and welding chassis mounts the surface mounting structure on this circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board, and wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis; And the connecting line that connects this first pad and second pad; It is characterized in that the area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, the spacing of this first pad and second pad is less than 0.3mm; This connecting line comprises restriction and non-restriction; This restriction is connected with first pad, and this non-restriction is connected with second pad, and the part or all of live width of this restriction is less than the live width of this non-restriction.
13. circuit board; It comprises that the electronic component that will have pin and welding chassis mounts the surface mounting structure on this circuit board with being used for fixing; This surface mounting structure comprises the pad that is formed on this circuit board; Wherein this pad comprises: first pad that welds with the basal surface of this pin, second pad that welds with the basal surface on this welding chassis, and the connecting line that connects this first pad and second pad; It is characterized in that; The area of the basal surface facing surfaces on this second pad and welding chassis is greater than the area of the basal surface facing surfaces of this first pad and pin, and the spacing of this first pad and second pad is less than 0.3mm, and this connecting line comprises restriction, the first non-restriction and the second non-restriction; This restriction is connected between the first non-restriction and the second non-restriction; This first non-restriction is connected between first pad and the restriction, and this second non-restriction is connected between second pad and the restriction, and the live width of this restriction is less than the live width of this first non-restriction, the second non-restriction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103091266A CN102056405B (en) | 2009-10-30 | 2009-10-30 | Surface mount structure and circuit board with same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009103091266A CN102056405B (en) | 2009-10-30 | 2009-10-30 | Surface mount structure and circuit board with same |
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| Publication Number | Publication Date |
|---|---|
| CN102056405A CN102056405A (en) | 2011-05-11 |
| CN102056405B true CN102056405B (en) | 2012-07-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN2009103091266A Active CN102056405B (en) | 2009-10-30 | 2009-10-30 | Surface mount structure and circuit board with same |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108551722B (en) * | 2018-06-05 | 2020-09-08 | 肖国选 | Unit PCB board |
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| CN102056405A (en) | 2011-05-11 |
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Address after: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant after: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant after: Zhending Technology Co., Ltd. Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Applicant before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-applicant before: Honsentech Co., Ltd. |
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Effective date of registration: 20170302 Address after: Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518103 Shenzhen Province, Baoan District Town, Fuyong Tong tail Industrial Zone, factory building, building 5, floor, 1 Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
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Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Peng Ding Polytron Technologies Inc Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Peng Ding Polytron Technologies Inc Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. |