CN108551722B - Unit PCB board - Google Patents
Unit PCB board Download PDFInfo
- Publication number
- CN108551722B CN108551722B CN201810570808.1A CN201810570808A CN108551722B CN 108551722 B CN108551722 B CN 108551722B CN 201810570808 A CN201810570808 A CN 201810570808A CN 108551722 B CN108551722 B CN 108551722B
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- CN
- China
- Prior art keywords
- unit pcb
- pcb board
- electronic component
- unit
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 238000004806 packaging method and process Methods 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 22
- 239000003292 glue Substances 0.000 claims abstract description 7
- 238000003860 storage Methods 0.000 claims abstract description 3
- 230000017525 heat dissipation Effects 0.000 claims description 24
- 239000011810 insulating material Substances 0.000 claims description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 6
- 229910052802 copper Inorganic materials 0.000 claims description 6
- 239000010949 copper Substances 0.000 claims description 6
- 238000003466 welding Methods 0.000 claims description 6
- 229920002457 flexible plastic Polymers 0.000 claims description 4
- 230000009286 beneficial effect Effects 0.000 claims description 3
- 238000001035 drying Methods 0.000 claims 3
- 238000006243 chemical reaction Methods 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 8
- 230000001070 adhesive effect Effects 0.000 description 8
- IYZWUWBAFUBNCH-UHFFFAOYSA-N 2,6-dichlorobiphenyl Chemical compound ClC1=CC=CC(Cl)=C1C1=CC=CC=C1 IYZWUWBAFUBNCH-UHFFFAOYSA-N 0.000 description 7
- 239000010410 layer Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 2
- KTXUOWUHFLBZPW-UHFFFAOYSA-N 1-chloro-3-(3-chlorophenyl)benzene Chemical compound ClC1=CC=CC(C=2C=C(Cl)C=CC=2)=C1 KTXUOWUHFLBZPW-UHFFFAOYSA-N 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a unit PCB board, wherein at least 2 copper-clad layer areas and corresponding character marks are arranged on the upper surface of a substrate, each copper-clad layer area comprises a packaging pad, a connecting wire and a connecting pad, the packaging pads and the connecting pads are connected through the connecting wires to form an electric path, all the packaging pads (6) on the unit PCB board jointly form a surface-mounted electronic component PCB package, a non-dry glue layer is arranged on the lower surface of the substrate, the unit PCB board is adhered on a piece of backing paper for storage or taking the unit PCB board from the backing paper, and the unit PCB board is installed in an adhering mode.
Description
Technical Field
The invention relates to a unit PCB (printed circuit board), belonging to the technical field of PCB boards.
Background
The universal board is a circuit board which is fully distributed with bonding pads according to the standard IC spacing and can be inserted with electronic components and connecting wires according to own will, the spacing between the bonding pads is 2.54mm, the diameter of a through hole of each bonding pad is 1mm, and compared with a professional PCB board, the universal board is low in use threshold, low in cost, convenient to use and flexible in expansion, so that the universal board is deeply loved by vast electronic DIY (digital information processing) enthusiasts, and is also frequently used in a laboratory.
The universal plate is very suitable for mounting direct-insertion electronic components, but is not suitable for mounting surface-mount electronic components, so that the problem is solved, and the method in the prior art adopts the following two points:
1. the conversion base is used, the surface-mounted electronic component is arranged on the conversion base, and then the conversion base is arranged on the universal board, but compared with a patch integrated circuit with a few corners, the conversion base is very expensive.
2. The conversion board is used for mounting the surface mounting type electronic component on the PCB conversion board and then mounting the conversion board on the universal board, wherein the conversion board is provided with a plurality of connecting pads with through holes, the center distance between the connecting pads is an integral multiple of 2.54mm or 2.54mm, so that the center of the through holes of the pads can be aligned to the center of the through holes of the pads on the universal board, after a lead passes through the through holes of the pads, the lead is respectively welded with the conversion board and the pads on the universal board together to achieve the purpose of mounting the surface mounting type electronic component.
3. The conversion plate is manufactured by hand by oneself, which is obviously an impossible method, very troublesome, high in cost and difficult to ensure quality.
Surface mount electronic components cannot be mounted cost-effectively by means of the prior art.
Disclosure of Invention
According to the defects of the prior art, the technical problems to be solved by the invention are as follows: provided is a unit PCB board on which surface mount electronic components can be mounted at low cost and efficiently.
In order to achieve the purpose, the technical scheme adopted by the invention for solving the technical problems is as follows:
a unit PCB board comprises a substrate, wherein a copper clad layer is arranged on the upper surface of the substrate and is divided into at least 2 areas, each area comprises a single packaging pad, a single connecting line and a single connecting pad, and the packaging pad and the connecting pads are connected through the connecting lines to form an electric path; the packaging pads are used for welding and mounting electrode pins of the surface mounting type electronic component, all the packaging pads (6) on the unit PCB board jointly form a surface mounting type electronic component PCB package, and the size and the placement position of each packaging pad can meet the surface mounting requirement of at least one surface mounting type electronic component; the connecting pad is used for welding a lead to be connected to other circuits; no heat dissipation holes or no less than 1 through heat dissipation holes are arranged on the substrate; the lower surface of the base plate is provided with an adhesive sticker layer, the unit PCB is adhered to the base paper through the adhesive sticker layer so as to be beneficial to storage of the unit PCB, the base paper can be easily separated from the adhesive sticker layer, and the unit PCB can be adhered to the surfaces of other objects so as to meet the use requirements of the unit PCB.
The distance between the edge of the connecting pad and the edge of the substrate is not less than 0.2mm, so that the insulating effect at the edge is improved.
The substrate is made of flexible plastic insulating materials or hard insulating materials.
The thickness of the substrate is 0.1 mm-1.5 mm.
And arranging serial numbers beside the connecting pads, and sequencing the connecting pads on the unit PCB.
And the unit PCB is provided with identification characters for explaining the packaging form of the surface mounting type electronic component to which the unit PCB can be applied.
The unit PCB board of the invention has the advantages that: the unit PCB is provided with bonding pads and radiating holes to meet the installation and working requirements of surface-mounted electronic components, electrode pins of the surface-mounted electronic components are welded and installed on each packaging bonding pad, the size and the placement position of each packaging bonding pad can meet the surface mounting requirements of at least one surface-mounted electronic component, and the adaptability is high; the unit PCB is adhered to the base paper through the adhesive sticker, and a plurality of unit PCBs can be adhered to one base paper, so that the unit PCBs can be stored conveniently; the backing paper can be easily separated from the adhesive sticker, so that the unit PCB can be stuck to the surfaces of other objects, the unit PCB is very easy to mount, and because the adhesive sticker is used for sticking and mounting, and the lead of an external circuit is also welded on the surface, the unit PCB is very easy to dismount compared with the prior art in which the lead of the external circuit is welded and mounted, and the circuit is favorably changed; the unit PCB is thin, small in size, convenient to use, completely compatible with the existing process and low in production and use cost; and corresponding character marks are arranged, so that the readability of the circuit board is improved.
Compared with the prior art, the unit PCB has outstanding substantive features and remarkable progress.
Drawings
Fig. 1 is a schematic cross-sectional structure view of a unit PCB according to the present invention.
Fig. 2 is a schematic view showing the overall structure of the unit PCB of the present invention.
Fig. 3 is a schematic view of the unit PCB board according to the present invention after being mounted and used.
Fig. 4 is a partially enlarged schematic view of fig. 3.
The packaging structure comprises a substrate 1, a substrate 2, an adhesive layer 3, a piece of backing paper 4, a copper clad layer 5, a heat dissipation hole 6, a packaging pad 7, a connecting wire 8, a connecting pad 9, a universal board 91, a pad 92 of the universal board, a pad through hole 10 of the universal board, a unit PCB 11 and a surface-mounted integrated circuit.
Since the adhesive layer 2 is thin, it cannot be shown in fig. 2, and can be understood only with reference to fig. 1.
In fig. 3 and 4, the surface mount integrated circuit is taken as an example to show the installation of the surface mount electronic component on the unit PCB, only 1 heat dissipation hole 5 is visible in fig. 3, and the other heat dissipation holes are covered by two integrated circuits.
Detailed Description
The technical solution of the unit PCB board of the present invention will be further described in detail with reference to the embodiments shown in the drawings.
As shown in fig. 1 and fig. 2, a unit PCB comprises a substrate 1, a copper clad layer 4 is disposed on the upper surface of the substrate 1, the copper clad layer 4 is divided into at least 2 regions, each region comprises a single package pad 6, a single wire 7 and a single connection pad 8, and the package pad 6 and the connection pad 8 are connected through the wire 7 to form an electrical path; each packaging pad 6 is used for welding and installing an electrode pin of a surface-mounted electronic component, all the packaging pads (6) on the unit PCB board jointly form a surface-mounted electronic component PCB package, and the size and the placement position of each packaging pad 6 can meet the surface mounting requirement of at least one surface-mounted electronic component; the connection pads 8 are used for bonding wires to be connected to other circuits; the substrate 1 is not provided with the heat dissipation holes 5 or is provided with at least 1 through heat dissipation holes 5, the heat dissipation through holes 5 are used for improving the heat dissipation effect of the installed surface mount electronic components, and when the electronic components applicable to the unit PCB do not need the heat dissipation through holes, the heat dissipation through holes 5 do not need to be arranged; the lower surface of base plate (1) sets up not dry glue film 2, the unit PCB board is pasted on base stock 3 through not dry glue film 2 to do benefit to the save of unit PCB board, base stock 3 can be separated with not dry glue film 2 easily, makes the unit PCB board can paste other object surfaces, in order to satisfy the operation requirement of unit PCB board.
As shown in fig. 2, the unit PCB may be attached to the base paper 3 like a sticker label or taken out from the base paper 3, so that it is very convenient to store and use.
In addition, according to the prior art, the main material for making the base paper 3 may be paper, plastic, or the like.
When in use, the unit PCB 10 is taken off from the base paper 3, and then the unit PCB 10 can be adhered to the surface of other objects, as shown in the embodiment of fig. 3 and 4, the unit PCB 10 is adhered to the universal board 9, and 2 surface-mount ics 11 are soldered on the unit PCB 10, but other types of integrated circuits packaged by a chip can be soldered on the unit PCB 10 in this embodiment, so that the use is convenient and flexible, the adaptability is strong, and 1 heat dissipation hole 5 is visible in fig. 3, as can be seen from fig. 2, several heat dissipation holes are covered by the integrated circuits 11 in fig. 3, and the heat dissipation holes are helpful for heat dissipation of the integrated circuits 11.
Sometimes the heat dissipation hole 5 will be blocked by the universal plate 9 below, in order to improve the heat dissipation effect, before the integrated circuit 11 is installed, a drill can be used to drill the universal plate 9 in the heat dissipation hole 5, so that the heat dissipation hole 5 is completely through the universal plate 9, which is beneficial to improving the heat dissipation effect.
When the electronic component suitable for the unit PCB board does not need a heat dissipation through hole, the heat dissipation through hole 5 does not need to be arranged.
As shown in fig. 3 and 4, since the unit PCB is thin, when the edge of the unit PCB 10 is mounted on the pad 91 of the universal board 9, if the connection pad 8 is directly disposed to the edge of the unit PCB, the connection pad 8 may be electrically broken through the pad 91 of the universal board 9 at the edge of the unit PCB, or when a connection wire is soldered to the connection pad 8, the connection wire may be short-circuited by the pad 91 of the universal board 9, so that a gap is formed between the edge of the connection pad 8 and the edge of the substrate 1, which may effectively prevent the occurrence of this situation.
Of course, for the especially thin unit PCB, in order to ensure the insulation of the circuit board, especially the circuit with higher voltage value, the individual pads 91 of the universal board 9 under the unit PCB 10 of the present invention can be removed to prevent the circuit board from being affected by the accidental local insulation damage or the adverse factors of moisture, dust, etc. during the mounting or soldering process, which is easily done.
The substrate 1 is made of flexible plastic insulating materials or hard insulating materials, so that the unit PCB meets different requirements. Especially when the substrate 1 is made of flexible plastic insulating material, the unit PCB is a thin flexible circuit board with adhesive sticker on one surface, the unit PCB can be taken from the backing paper 3 like an adhesive sticker label, and the flexible circuit board is small in size, very convenient to store and use and low in cost.
The thickness of the substrate 1 is 0.1 mm-1.5 mm, so that the unit PCB can meet the requirements of factors such as mechanical strength, welding-resistant high-temperature resistance, insulativity, cost and the like.
The next door of the connecting bonding pads 8 sets up the serial number, right the connecting bonding pads 8 on the unit PCB board are sequenced set up the identification characters on the unit PCB board for explaining the packaging form of the surface mounting type electronic component that the unit PCB board can be suitable for, so that the unit PCB board is very vivid and visual in use, and the readability of the circuit board is improved.
Such serial numbers or identification letters are not shown in the drawings, but do not affect the understanding of the aspects of the present invention.
The surface mount electronic components are in many forms, and based on the technical scheme of the invention, other embodiments can be provided, and the embodiments cannot be listed.
Of course, there are other alternatives and developments and equivalent means that we can envision without departing from the framework of the invention.
Claims (6)
1. A unit PCB board comprises a substrate (1), a copper clad layer (4) is arranged on the upper surface of the substrate (1), and the unit PCB board is characterized in that: the lower surface of the base plate (1) is provided with the non-drying glue layer (2), the unit PCB is adhered to the backing paper (3) through the non-drying glue layer (2) so as to be beneficial to storage of the unit PCB, the backing paper (3) can be easily separated from the non-drying glue layer (2), and the unit PCB can be adhered to the surface of the universal plate (9) so as to meet the use requirement of the unit PCB; the copper clad layer (4) is completely divided into no less than 2 areas, each area comprises a single packaging pad (6), a single connecting wire (7) and a single connecting pad (8), and the packaging pad (6) and the connecting pads (8) are connected through the connecting wires (7) to form an electric path; each packaging pad (6) is used for welding and installing an electrode pin of a surface-mounted electronic component, the electrode pin of the surface-mounted electronic component is led out to the side edge of the surface-mounted electronic component, all the packaging pads (6) on the unit PCB board jointly form a surface-mounted electronic component PCB package, and at least 1 surface-mounted electronic component can be installed on the surface-mounted electronic component PCB package; the connection pads (8) are used for manually welding wires to be connected to the circuit on the universal board (9); the base plate (1) is not provided with heat dissipation holes (5) or is provided with at least 1 through heat dissipation holes (5).
2. The unit PCB board of claim 1, wherein: the distance between the edge of the connecting pad (8) and the edge of the substrate (1) is not less than 0.2 mm.
3. The unit PCB board of claim 1, wherein: the substrate (1) is made of flexible plastic insulating materials or hard insulating materials.
4. The unit PCB board of claim 1, wherein: the thickness of the substrate (1) is 0.1 mm-1.5 mm.
5. The unit PCB board of claim 1, wherein: and arranging serial numbers beside the connecting pads (8) to sequence the connecting pads (8) on the unit PCB.
6. The unit PCB board of claim 1, wherein: and the unit PCB is provided with identification characters for explaining the packaging form of the surface mounting type electronic component to which the unit PCB can be applied.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570808.1A CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570808.1A CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108551722A CN108551722A (en) | 2018-09-18 |
| CN108551722B true CN108551722B (en) | 2020-09-08 |
Family
ID=63493615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810570808.1A Active CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108551722B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN204104223U (en) * | 2014-07-14 | 2015-01-14 | 台表科技（苏州）电子有限公司 | A kind of pasting board instrument for pcb board surface mounting technology |
| CN106233461A (en) * | 2014-04-24 | 2016-12-14 | 瑞萨电子株式会社 | Semiconductor device and manufacture method thereof |
| CN106409776A (en) * | 2015-08-03 | 2017-02-15 | 三星电子株式会社 | Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB |
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| JPH0766543A (en) * | 1993-08-31 | 1995-03-10 | Aiwa Co Ltd | Printed board |
| CN102056405B (en) * | 2009-10-30 | 2012-07-04 | 富葵精密组件(深圳)有限公司 | Surface mount structure and circuit board with same |
| JP2012146573A (en) * | 2011-01-13 | 2012-08-02 | Hitachi Cable Ltd | Flat cable and connection structure between flat cable and printed wiring board |
| CN202839596U (en) * | 2012-09-14 | 2013-03-27 | 杰群电子科技（东莞）有限公司 | Semiconductor element |
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| JP2015153915A (en) * | 2014-02-15 | 2015-08-24 | 新山 摩梨花 | Board for electronic circuit trial manufacture |
| CN204305454U (en) * | 2014-12-09 | 2015-04-29 | 潘晓勇 | Attachment auxiliary printed substrate, multilayer printed circuit board |
| CN204578898U (en) * | 2015-05-06 | 2015-08-19 | 深圳市奔强电路有限公司 | Printed circuit board (PCB) |
| CN105096711B (en) * | 2015-09-07 | 2017-07-14 | 西安工程大学 | One kind exempts from Multifunctional lead PCB experiment plate |
| CN205726677U (en) * | 2016-04-25 | 2016-11-23 | 深圳市中虹天意实业有限公司 | A kind of Combined circuit board, combined circuit external member and element connection members |
| CN207397560U (en) * | 2017-07-26 | 2018-05-22 | 陈竹 | With circuit diagram corresponding circuit experiment board in situ |
| CN206948733U (en) * | 2017-07-31 | 2018-01-30 | 湘能华磊光电股份有限公司 | A kind of surface mount device for being used to produce LED flexible PCBs |
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2018
- 2018-06-05 CN CN201810570808.1A patent/CN108551722B/en active Active
Patent Citations (4)
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|---|---|---|---|---|
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN106233461A (en) * | 2014-04-24 | 2016-12-14 | 瑞萨电子株式会社 | Semiconductor device and manufacture method thereof |
| CN204104223U (en) * | 2014-07-14 | 2015-01-14 | 台表科技（苏州）电子有限公司 | A kind of pasting board instrument for pcb board surface mounting technology |
| CN106409776A (en) * | 2015-08-03 | 2017-02-15 | 三星电子株式会社 | Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108551722A (en) | 2018-09-18 |
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Effective date of registration: 20220314 Address after: 102200 4th floor, block B, building 1, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing Patentee after: Beijing Fushixiangsheng Technology Co.,Ltd. Address before: 264500 503 unit 2, building 18-3, Xinping street, Rushan, Weihai, Shandong. Patentee before: Xiao GuoXuan |
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Effective date of registration: 20231108 Address after: 1224, 12th Floor, Building 1, Yard 21, Zhongxing Road, Changping District, Beijing, 102299 Patentee after: Beijing Fuxiang Times Technology Co.,Ltd. Address before: 102200 4th floor, block B, building 1, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing Patentee before: Beijing Fushixiangsheng Technology Co.,Ltd. |
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