CN108551722A - Unit pcb board - Google Patents
Unit pcb board Download PDFInfo
- Publication number
- CN108551722A CN108551722A CN201810570808.1A CN201810570808A CN108551722A CN 108551722 A CN108551722 A CN 108551722A CN 201810570808 A CN201810570808 A CN 201810570808A CN 108551722 A CN108551722 A CN 108551722A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- unit pcb
- substrate
- electronic component
- connection pad
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 238000009434 installation Methods 0.000 claims abstract description 20
- 238000002372 labelling Methods 0.000 claims abstract description 12
- 238000001035 drying Methods 0.000 claims abstract description 10
- 239000003292 glue Substances 0.000 claims abstract description 10
- 238000003466 welding Methods 0.000 claims description 27
- 230000017525 heat dissipation Effects 0.000 claims description 17
- 238000005538 encapsulation Methods 0.000 claims description 16
- 238000009413 insulation Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 238000002955 isolation Methods 0.000 claims description 4
- 238000004321 preservation Methods 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims description 3
- 238000000034 method Methods 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 8
- 239000000853 adhesive Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 230000000694 effects Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 239000004819 Drying adhesive Substances 0.000 description 1
- 241001191009 Gymnomyza Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The present invention relates to a kind of unit pcb boards, in upper surface of base plate, several copper-clad regions and corresponding words identification are set, its pad disclosure satisfy that the surface patch installation requirement of at least one surface labeling type electronic component, in the lower surface of substrate, non-drying glue layer is set, the unit pcb board, which is pasted onto on base stock, preserves or is taken from base stock unit pcb board, and installation unit pcb board in the method for paste is adopted, it is easy to use and flexible, at low cost.
Description
Technical field
The present invention relates to a kind of unit pcb boards, belong to the technical field of pcb board.
Background technology
Universal plate is that one kind being covered with pad according to standard IC spacing, can insert electronic component and line by the wish of oneself
Circuit board, its general pad spacing is 2.54mm, and the through-hole diameter of pad is 1mm, compared to the pcb board of profession, universal plate
Low using threshold, of low cost, easy to use, extension is flexible, thus is liked deeply by vast electronics DIY fans, even if
Also often there is use in laboratory.
Universal plate is highly suitable for the installation of direct plugging-in electronic component, but is not suitable for surface labeling type electronic component
Installation, solve the problems, such as this, the way according to the prior art be use following two points：
1, using conversion seat, surface labeling type electronic component is mounted on conversion seat, then conversion seat is mounted on universal plate
On, but compared to the patch integrated circuit of only several maos, the price of conversion seat is very expensive.
2, using change-over panel, surface labeling type electronic component is mounted on PCB change-over panels, then change-over panel is mounted on
On universal plate, several connection pads for carrying through-hole are wherein set, the centre-to-centre spacing between these connection pads is on change-over panel
The integral multiple of 2.54mm or 2.54mm, so that the through-hole center of these pads can be directed at the welding plate hole center on universal plate,
After the welding plate hole both passed through with conducting wire, then the conducting wire respectively together with the pad solder on change-over panel and universal plate,
To achieve the purpose that installation surface pasting type electronic component, but the volume of change-over panel is big, higher price, because being to pass through through-hole
Conducting wire is welded to connect with the pad of universal plate to be connected, thus it is comparatively laborious, and efficiency is low, dismounting trouble, is also unfavorable for circuit
Change.
3, it does it yourself to make change-over panel, it is evident that this is a kind of method having no idea, very troublesome, of high cost, and
And it is difficult to ensure that quality.
It cannot low cost and efficiently installation surface pasting type electronic component by the prior art.
Invention content
According to the above-mentioned deficiencies of the prior art, the technical problem to be solved by the present invention is to：It is inexpensive and high to provide a kind of energy
The unit pcb board of effect ground installation surface pasting type electronic component.
To achieve the above object, the technical solution adopted by the present invention to solve the technical problems is：
Copper-clad is arranged in the upper surface of the substrate in a kind of unit pcb board, including one piece of substrate, and the copper-clad is divided
To be no less than 2 regions, each region includes encapsulation welding tray, line and connection pad, the encapsulation welding tray with connect pad it
Between be connected to form electric path by line；Each encapsulation welding tray is for welding installation surface pasting type electronic component
Electrode pin, the size of each encapsulation welding tray and placement position disclosure satisfy that at least one surface labeling type electronic component
Surface patch installation requirement；The connection pad is for welding lead to be connected to other circuits；It does not set on the substrate
It sets heat dissipation hole or setting is no less than 1 penetrating heat dissipation hole；In the lower surface of the substrate, non-drying glue layer, the list are set
First pcb board is pasted onto by non-drying glue layer on base stock, in favor of the preservation of unit pcb board, the base stock can easily with not
Drying adhesive layer separates, and the unit pcb board is enable to paste other body surfaces, and the use to meet unit pcb board is wanted
It asks.
The distance between the edge of the connection pad and the edge of the substrate are not less than 0.2mm, to improve edge
Insulation effect.
The substrate is flexiplast isolation material or hard insulation.
The thickness of the substrate is 0.1mm~1.5mm.
Serial number is set on the side of the connection pad, the connection pad on the unit pcb board is ranked up.
The setting mark word on the unit pcb board, the surface attaching type electricity that can be applicable in for illustrating unit pcb board
The packing forms of sub- component.
It is had the beneficial effect that possessed by unit pcb board of the present invention：Pad is set on the unit pcb board and is dissipated
Hot hole hole meets the installation and job requirement of surface adhered with electronic component, and installation surface is welded on each encapsulation welding tray
The electrode pin of pasting type electronic component, the size of each encapsulation welding tray and placement position disclosure satisfy that at least one surface
The surface patch installation requirement of pasting type electronic component, it is adaptable；The unit pcb board is pasted onto base stock by adhesive sticker
On, several module unit pcb boards can be pasted on a base stock, be conducive to the preservation of unit pcb board；The base stock can very easily
Ground is detached with adhesive sticker, and the unit pcb board is enable to paste other body surfaces, so the installation of the unit pcb board
It is very easy to, is installed because being pasted using adhesive sticker, and to the lead of external circuit also by the way of surface soldered, so comparing
It is also very easy to install it in the welding of the prior art and remove, and is conducive to the change of circuit；The unit pcb board is very thin,
Small, easy to use, completely compatible prior art, production and application cost is low；Corresponding words identification is set, electricity is improved
The readability of road plate.
Compared to the prior art, unit pcb board of the present invention has substantive distinguishing features outstanding and significant progress.
Description of the drawings
Fig. 1 show the cross-sectional configuration schematic diagram of unit pcb board of the present invention.
Fig. 2 show the general structure schematic diagram of unit pcb board of the present invention.
Fig. 3 show the schematic diagram after unit pcb board of the present invention is installed and used.
Fig. 4 show the close-up schematic view of Fig. 3.
Wherein, 1, substrate 2, non-drying glue layer 3, base stock 4, copper-clad 5, heat dissipation hole 6, encapsulation welding tray 7, line
8, pad 9, universal plate 91, the pad 92 of universal plate, the welding plate hole 10 of universal plate, unit pcb board 11, surface are connected
Pasting type integrated circuit.
It because non-drying glue layer 2 is very thin, can not show, can only be understood in conjunction with attached drawing 1 in fig 2.
Surface labeling type electronic component is illustrated by taking surface attaching type integrated circuit as an example in figs. 3 and 4 described
The installation situation of unit pcb board, in figure 3 only 1 heat dissipation hole 5 as it can be seen that other heat dissipation hole by two integrated circuits
It covers.
Specific implementation mode
Illustrated embodiment does further specifically the technical solution of unit pcb board of the present invention below in conjunction with the accompanying drawings
It is bright.
As shown in Figure 1 and Figure 2, a kind of unit pcb board, including one piece of substrate 1, set in the upper surface of the substrate 1
Copper-clad 4 is set, the copper-clad 4 is divided into no less than 2 regions, and each region includes encapsulation welding tray 6, line 7 and connection
Pad 8 is connected to form electric path between the encapsulation welding tray 6 and connection pad 8 by line 7；Each encapsulation welding tray 6
Electrode pin for welding installation surface pasting type electronic component, the size and placement position energy of each encapsulation welding tray 6
Enough meet the surface patch installation requirement of at least one surface labeling type electronic component；The connection pad 8 is led for welding
Line is to be connected to other circuits；It is not provided with heat dissipation hole 5 on the substrate 1 or setting is no less than 1 penetrating heat emission hole
Hole 5, the surface labeling type electronic component that setting thermal vias 5 is used to installation improves heat dissipation effect, as the unit PCB
When the electronic component that plate is applicable in is not necessarily to thermal vias, then it is not necessarily to that thermal vias 5 is arranged；In the substrate（1）Lower surface
Non-drying glue layer 2 is set, the unit pcb board is pasted onto by non-drying glue layer 2 on base stock 3, in favor of the preservation of unit pcb board,
The base stock 3 can be separated with non-drying glue layer 2 easily, and the unit pcb board is enable to paste other body surfaces,
To meet the requirement of unit pcb board.
As shown in Fig. 2, the unit pcb board can be pasted onto on base stock 3 as adhesive label or be taken from base stock 3
With unit pcb board, thus preserve and very easy to use.
In addition, according to the prior art, the main material for making base stock 3 can be paper or plastics etc..
When in use, unit pcb board 10 is taken off from base stock 3, then the unit pcb board 10 can be pasted
Other body surfaces, as be in attached drawing 3 and attached embodiment illustrated in fig. 4 unit pcb board 10 paste be mounted on universal plate 9 on, and
And welding is mounted with 2 surface attaching type integrated circuits 11 on unit pcb board 10, unit PCB in this embodiment certainly
The integrated circuit for installing other type patch encapsulation, thus easy to use and flexible can also be welded on plate 10, it is adaptable, scheming
There is 1 heat dissipation hole 5 in 3 as it can be seen that being covered in conjunction with Fig. 2 it is found that there is several heat dissipation holes to be integrated circuit 11 in figure 3
, these heat dissipation holes contribute to integrated circuit 11 radiate.
Sometimes heat dissipation hole 5 can be blocked by beneath universal plate 9, can be in the integrated electricity of installation in order to improve heat dissipation effect
Before road 11, universal plate 9 is implemented to drill in heat dissipation hole 5 with drill bit, makes heat dissipation hole 5 through universal plate 9 full through favorably
In raising heat dissipation effect.
When the electronic component that the unit pcb board is applicable in is not necessarily to thermal vias, then it is not necessarily to that thermal vias 5 is arranged.
The distance between edge of edge and the substrate 1 of the connection pad 8 is not less than 0.2mm, such as attached drawing 3 and attached
Shown in Fig. 4, because unit pcb board is relatively thin, when the edge of unit pcb board 10 is mounted on the pad 91 of universal plate 9, if connection weldering
Disk 8 is placed directly onto the edge of unit pcb board, then connects pad 8 possibly through the pad 91 of universal plate 9 in unit pcb board
Edge electrical breakdown occurs, or when being welded to connect conducting wire on connecting pad 8, it is possible to by the short circuit of pad 91 of universal plate 9
Each conducting wire, so gap is arranged between the edge and the edge of the substrate 1 of connection pad 8, it is possible to prevente effectively from the situation
Generation.
Certainly, for extremely thin unit pcb board, in order to ensure that the insulating properties of circuit board, especially voltage value are higher
Circuit can remove individual pads 91 of the universal plate 9 below unit pcb board 10 of the present invention, to prevent installing or welding
Influence of the unfavorable factors to circuit board, certain these such as the damage of accidental minor insulation or humidity, dust in journey are all easy to
Accomplish.
The substrate 1 is flexiplast isolation material or hard insulation, so that unit pcb board meets different want
It asks.Especially when substrate 1 is using flexiplast isolation material, then it is very thin with adhesive sticker to be equivalent to one side for unit pcb board
Flexible PCB, unit pcb board can be taken on base stock 3 as adhesive label, it is small, preserve and using very
It is convenient and of low cost.
The thickness of the substrate 1 be 0.1mm~1.5mm so that unit pcb board meet mechanical strength, proper alignment it is high temperatures,
The requirement of the factors such as insulating properties, cost.
Serial number is set on the side of the connection pad 8, the connection pad 8 on the unit pcb board is ranked up,
Setting mark word on the unit pcb board, for illustrating surface labeling type electronic component that unit pcb board can be applicable in
Packing forms keep the use of unit pcb board very visual in image, improve the readability of circuit board.
Such serial number or mark word are not shown in the accompanying drawings, but are had no effect in this way to scheme of the present invention
Understanding.
There are many form of surface labeling type electronic component, based on technical solution of the present invention, can also have very
More others embodiments, can not possibly enumerate out herein.
Certainly, in the case where not departing from the frame of the present invention, there can also be other select and development and our energy
It is enough it is envisioned that equivalent device.
Claims (6)
1. a kind of unit pcb board, including one piece of substrate（1）, in the substrate（1）Upper surface be arranged copper-clad（4）, feature
It is：The copper-clad（4）It includes encapsulation welding tray to be divided into no less than 2 regions, each region（6）, line（7）And connection
Pad（8）, the encapsulation welding tray（6）With connect pad（8）Between pass through line（7）It is connected to form electric path；It is described each
Encapsulation welding tray（6）Electrode pin for welding installation surface pasting type electronic component, each encapsulation welding tray（6）Size
It disclosure satisfy that the surface patch installation requirement of at least one surface labeling type electronic component with placement position；The connection pad
（8）For welding lead to be connected to other circuits；In the substrate（1）On be not provided with heat dissipation hole（5）Or setting is many
In 1 penetrating heat dissipation hole（5）；In the substrate（1）Lower surface be arranged non-drying glue layer（2）, the unit pcb board passes through
Non-drying glue layer（2）It is pasted onto base stock（3）On, in favor of the preservation of unit pcb board, the base stock（3）Can easily with do not do
Glue-line（2）It separates, the unit pcb board is enable to paste other body surfaces, the use to meet unit pcb board is wanted
It asks.
2. unit pcb board according to claim 1, it is characterised in that：The connection pad（8）Edge and the substrate
（1）The distance between edge be not less than 0.2mm.
3. unit pcb board according to claim 1, it is characterised in that：The substrate（1）For flexiplast isolation material or
Hard insulation.
4. unit pcb board according to claim 1, it is characterised in that：The substrate（1）Thickness be 0.1mm~
1.5mm。
5. unit pcb board according to claim 1, it is characterised in that：In the connection pad（8）Side be arranged sequence
Number, to the connection pad on the unit pcb board（8）It is ranked up.
6. unit pcb board according to claim 1, it is characterised in that：The setting mark word on the unit pcb board,
Packing forms for illustrating surface labeling type electronic component that unit pcb board can be applicable in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570808.1A CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810570808.1A CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108551722A true CN108551722A (en) | 2018-09-18 |
| CN108551722B CN108551722B (en) | 2020-09-08 |
Family
ID=63493615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810570808.1A Active CN108551722B (en) | 2018-06-05 | 2018-06-05 | Unit PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108551722B (en) |
Citations (17)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766543A (en) * | 1993-08-31 | 1995-03-10 | Aiwa Co Ltd | Printed board |
| CN102056405A (en) * | 2009-10-30 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Surface mount structure and circuit board with same |
| US20120184130A1 (en) * | 2011-01-13 | 2012-07-19 | Hitachi Cable, Ltd. | Flat cable and connection structure between flat cable and printed wiring board |
| CN202839596U (en) * | 2012-09-14 | 2013-03-27 | 杰群电子科技（东莞）有限公司 | Semiconductor element |
| CN202857140U (en) * | 2012-09-17 | 2013-04-03 | 上海广电北陆微电子有限公司 | Universal pad structure for printed circuit board |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN204104223U (en) * | 2014-07-14 | 2015-01-14 | 台表科技（苏州）电子有限公司 | A kind of pasting board instrument for pcb board surface mounting technology |
| CN204305454U (en) * | 2014-12-09 | 2015-04-29 | 潘晓勇 | Attachment auxiliary printed substrate, multilayer printed circuit board |
| CN204578898U (en) * | 2015-05-06 | 2015-08-19 | 深圳市奔强电路有限公司 | Printed circuit board (PCB) |
| JP2015153915A (en) * | 2014-02-15 | 2015-08-24 | 新山 摩梨花 | Board for electronic circuit trial manufacture |
| CN105096711A (en) * | 2015-09-07 | 2015-11-25 | 西安工程大学 | Lead-free multifunctional PCB experiment board |
| CN205726677U (en) * | 2016-04-25 | 2016-11-23 | 深圳市中虹天意实业有限公司 | A kind of Combined circuit board, combined circuit external member and element connection members |
| CN106233461A (en) * | 2014-04-24 | 2016-12-14 | 瑞萨电子株式会社 | Semiconductor device and manufacture method thereof |
| CN106409776A (en) * | 2015-08-03 | 2017-02-15 | 三星电子株式会社 | Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB |
| CN107564923A (en) * | 2017-10-13 | 2018-01-09 | 京东方科技集团股份有限公司 | A kind of array base palte and preparation method thereof, flexible display apparatus |
| CN206948733U (en) * | 2017-07-31 | 2018-01-30 | 湘能华磊光电股份有限公司 | A kind of surface mount device for being used to produce LED flexible PCBs |
| CN207397560U (en) * | 2017-07-26 | 2018-05-22 | 陈竹 | With circuit diagram corresponding circuit experiment board in situ |
-
2018
- 2018-06-05 CN CN201810570808.1A patent/CN108551722B/en active Active
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766543A (en) * | 1993-08-31 | 1995-03-10 | Aiwa Co Ltd | Printed board |
| CN102056405A (en) * | 2009-10-30 | 2011-05-11 | 富葵精密组件(深圳)有限公司 | Surface mount structure and circuit board with same |
| US20120184130A1 (en) * | 2011-01-13 | 2012-07-19 | Hitachi Cable, Ltd. | Flat cable and connection structure between flat cable and printed wiring board |
| CN103096618A (en) * | 2011-10-31 | 2013-05-08 | 联发科技（新加坡）私人有限公司 | Printed circuit board and electronic apparatus thereof |
| CN202839596U (en) * | 2012-09-14 | 2013-03-27 | 杰群电子科技（东莞）有限公司 | Semiconductor element |
| CN202857140U (en) * | 2012-09-17 | 2013-04-03 | 上海广电北陆微电子有限公司 | Universal pad structure for printed circuit board |
| JP2015153915A (en) * | 2014-02-15 | 2015-08-24 | 新山 摩梨花 | Board for electronic circuit trial manufacture |
| CN106233461A (en) * | 2014-04-24 | 2016-12-14 | 瑞萨电子株式会社 | Semiconductor device and manufacture method thereof |
| CN204104223U (en) * | 2014-07-14 | 2015-01-14 | 台表科技（苏州）电子有限公司 | A kind of pasting board instrument for pcb board surface mounting technology |
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| CN106409776A (en) * | 2015-08-03 | 2017-02-15 | 三星电子株式会社 | Printed circuit board (PCB), method of manufacturing the PCB, and method of manufacturing semiconductor package using the PCB |
| CN105096711A (en) * | 2015-09-07 | 2015-11-25 | 西安工程大学 | Lead-free multifunctional PCB experiment board |
| CN205726677U (en) * | 2016-04-25 | 2016-11-23 | 深圳市中虹天意实业有限公司 | A kind of Combined circuit board, combined circuit external member and element connection members |
| CN207397560U (en) * | 2017-07-26 | 2018-05-22 | 陈竹 | With circuit diagram corresponding circuit experiment board in situ |
| CN206948733U (en) * | 2017-07-31 | 2018-01-30 | 湘能华磊光电股份有限公司 | A kind of surface mount device for being used to produce LED flexible PCBs |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN108551722B (en) | 2020-09-08 |
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Effective date of registration: 20220314 Address after: 102200 4th floor, block B, building 1, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing Patentee after: Beijing Fushixiangsheng Technology Co.,Ltd. Address before: 264500 503 unit 2, building 18-3, Xinping street, Rushan, Weihai, Shandong. Patentee before: Xiao GuoXuan |
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Effective date of registration: 20231108 Address after: 1224, 12th Floor, Building 1, Yard 21, Zhongxing Road, Changping District, Beijing, 102299 Patentee after: Beijing Fuxiang Times Technology Co.,Ltd. Address before: 102200 4th floor, block B, building 1, No. 27, Chuangxin Road, science and Technology Park, Changping District, Beijing Patentee before: Beijing Fushixiangsheng Technology Co.,Ltd. |
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