CN206948733U - A kind of surface mount device for being used to produce LED flexible PCBs - Google Patents
A kind of surface mount device for being used to produce LED flexible PCBs Download PDFInfo
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- CN206948733U CN206948733U CN201720941630.8U CN201720941630U CN206948733U CN 206948733 U CN206948733 U CN 206948733U CN 201720941630 U CN201720941630 U CN 201720941630U CN 206948733 U CN206948733 U CN 206948733U
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Abstract
Description
技术领域technical field
本实用新型涉及半导体灯具生产技术领域,具体地,涉及一种用于生产LED柔性电路板的表面贴装装置。The utility model relates to the technical field of semiconductor lamp production, in particular to a surface mounting device for producing LED flexible circuit boards.
背景技术Background technique
随着LED技术应用的快速发展,LED灯具的市场需求越来越大,由此衍生出的各类非常规灯具也越来越受到人们的欢迎,如防水灯条、大型灯带等,它不仅具有出色的光斑和光线效果,而且相比于传统灯管,用途更加广泛。这是因为灯条或灯带型的LED灯具使用了FPC(Flexible Printed Circui,柔性电路板)作为灯板,具有配线密度高、重量轻、厚度薄、弯折性好的优点,可根据室内室外的照明需求进行大胆设计。With the rapid development of LED technology applications, the market demand for LED lamps is increasing, and various unconventional lamps derived from this are becoming more and more popular, such as waterproof light strips, large light strips, etc. It not only It has excellent light spots and light effects, and is more versatile than traditional lamps. This is because the LED lamps of the light bar or light strip type use FPC (Flexible Printed Circui, flexible circuit board) as the light board, which has the advantages of high wiring density, light weight, thin thickness, and good bendability. Outdoor lighting needs to be boldly designed.
上述灯具的生产过程如下:首先在空白的FPC上涂抹锡膏,然后在涂抹了锡膏的位置上分别放置好LED灯及电容电感等元器件,接着将FPC转移至回流焊设备中,通过高温熔融锡膏并冷却固化,使得各元器件被牢牢焊接在FPC的表面上。由于FPC本身的柔软特性,使得其不能被平整地放置,因此元器件容易出现高低不平、甚至偏位脱落的现象,加之灯条或灯带上的元器件数量众多而难以被发觉,焊接后的产品不可避免地会存在贴附偏位或脱焊死灯的缺陷,影响产品质量,损害公司利益。The production process of the above-mentioned lamps is as follows: First, apply solder paste on the blank FPC, then place LED lamps, capacitors and inductors and other components on the positions where the solder paste is applied, and then transfer the FPC to the reflow soldering equipment, through high temperature The solder paste is melted and cooled to solidify, so that each component is firmly soldered on the surface of the FPC. Due to the softness of the FPC itself, it cannot be placed flat, so the components are prone to unevenness, even deviation and fall off. In addition, the number of components on the light bar or light strip is difficult to be found. The product will inevitably have the defect of sticking deviation or desoldering dead lamp, which will affect the product quality and damage the company's interests.
实用新型内容Utility model content
本实用新型的目的在于提供一种结构简单、适用于加工柔性电路板、元器件焊接效果好的贴装装置,以解决背景技术中提出的问题。The purpose of the utility model is to provide a mounting device with simple structure, suitable for processing flexible circuit boards and good welding effect of components, so as to solve the problems raised in the background technology.
一种用于生产LED柔性电路板的表面贴装装置,包括上下设置的盖板和底板、用于将FPC固定设置在所述盖板上的T型插销、设置于所述盖板上的定位孔、对位孔和多个相互平行的条形通风口、以及设置于所述底板上的定位柱和多个相互平行的条形支撑块;所述定位孔和定位柱的位置上下对应且配合连接,所述通风口和支撑块的位置上下对应且与FPC上元器件待焊接引脚的位置对应,所述对位孔和FPC限位孔的位置对应,所述T型插销由上往下穿过FPC限位孔并插入所述对位孔内。A surface mount device for producing LED flexible circuit boards, including a cover plate and a bottom plate set up and down, a T-shaped pin for fixing the FPC on the cover plate, and a positioning device set on the cover plate Holes, alignment holes and a plurality of strip-shaped ventilation openings parallel to each other, as well as positioning columns arranged on the bottom plate and a plurality of strip-shaped support blocks parallel to each other; the positions of the positioning holes and the positioning columns correspond to and cooperate with each other connection, the position of the air vent and the support block corresponds up and down and corresponds to the position of the component to be welded on the FPC, the position of the alignment hole corresponds to the position of the FPC limit hole, and the T-shaped pin is from top to bottom Pass through the FPC limit hole and insert into the alignment hole.
优选地,在所述支撑块的上表面还设置有耐高温的硅胶垫,使FPC贴合得更加平整。Preferably, a high-temperature-resistant silicone pad is also provided on the upper surface of the support block to make the FPC fit more smoothly.
优选地,所述盖板和底板均由多块基板水平拼接而成,所述基板间通过连接片固连,且除了最外侧的两块基板外,其余基板每块均至少包括一个通风口或支撑块。Preferably, both the cover plate and the bottom plate are horizontally spliced by a plurality of substrates, and the substrates are fixedly connected by connecting pieces, and except for the two outermost substrates, each of the other substrates includes at least one vent or support block.
参见图1,LED柔性电路板在生产时采用拼版工艺,即一块FPC上设计有多个灯条或灯带,因此可通过增减所述表面贴装装置的基板数量,使得通风口和支撑台的数量与实际生产需求相匹配,适用性好。Referring to Figure 1, the LED flexible circuit board adopts the imposition process during production, that is, multiple light strips or light strips are designed on one FPC. The quantity matches the actual production demand and has good applicability.
优选地,所述T型插销为镍铁材质,且在所述对位孔的内壁设置有磁铁,从而实现对FPC的固定作用。Preferably, the T-shaped pin is made of nickel-iron, and a magnet is provided on the inner wall of the alignment hole, so as to realize the fixing effect on the FPC.
本实用新型提供的技术方案具有如下有益效果:The technical solution provided by the utility model has the following beneficial effects:
所述表面贴装装置结构简单、使用方便,可满足不同尺寸规格的LED灯带或灯条的加工方案,通过设置T型插销和支撑台对FPC起到良好的支撑和固定作用,使LED及相关元器件贴附良好,解决了LED灯带或灯条在贴装制造加工过程中出现的品质不良问题,而且还通过设置通风口以确保后续的回流焊操作的顺利进行,提高了产品的质量。The surface mount device is simple in structure and easy to use, and can meet the processing schemes of LED light strips or light strips of different sizes and specifications. The T-shaped pin and the support table play a good role in supporting and fixing the FPC, so that the LED and Relevant components are well attached, which solves the problem of poor quality of LED strips or light strips during the mounting and manufacturing process, and also ensures the smooth progress of subsequent reflow soldering operations by setting vents, improving product quality .
附图说明Description of drawings
为了更清楚地说明本实用新型实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述的附图仅仅是本实用新型的一些实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其它的附图,其中:In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings that need to be used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention , for those of ordinary skill in the art, other drawings can also be obtained according to these drawings without creative work, wherein:
图1是LED柔性电路板的结构示意图;Fig. 1 is a structural schematic diagram of an LED flexible circuit board;
图2是本实用新型所述表面贴装装置的整体结构示意图;Fig. 2 is a schematic diagram of the overall structure of the surface mount device described in the utility model;
图3是图2所示表面贴装装置的盖板的结构示意图;Fig. 3 is a schematic structural view of the cover plate of the surface mount device shown in Fig. 2;
图4是图2所示表面贴装装置的底板的结构示意图;Fig. 4 is a schematic structural view of the bottom plate of the surface mount device shown in Fig. 2;
图5是图2所示表面贴装装置的竖向截面示意图。FIG. 5 is a schematic vertical cross-sectional view of the surface mount device shown in FIG. 2 .
图中:01FPC,02元器件,03FPC限位孔,1盖板,2底板,3T型插销,4定位孔,5对位孔,6通风口,7定位柱,8支撑块,9硅胶垫,10连接片。In the figure: 01FPC, 02 components, 03FPC limit hole, 1 cover plate, 2 bottom plate, 3T-shaped pin, 4 positioning hole, 5 alignment hole, 6 ventilation port, 7 positioning column, 8 support block, 9 silicone pad, 10 connecting pieces.
具体实施方式detailed description
下面将结合本实用新型实施例中的附图,对本实用新型实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅是本实用新型的一部分实施例,而不是全部的实施例。基于本实用新型中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其它实施例,都属于本实用新型保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Example. Based on the embodiments of the present utility model, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of the present utility model.
实施例1Example 1
参阅图2-图5,一种用于生产LED柔性电路板的表面贴装装置,包括上下设置的盖板1和底板2、用于将FPC固定设置在所述盖板1上的T型插销3、以及用于固定连接所述盖板1和底板2的定位柱7。Referring to Figure 2-Figure 5, a surface mount device for producing LED flexible circuit boards, including a cover plate 1 and a bottom plate 2 arranged up and down, and a T-shaped pin for fixing the FPC on the cover plate 1 3. And a positioning column 7 for fixedly connecting the cover plate 1 and the bottom plate 2 .
所述定位柱7的底端固定设置在所述底板2上,在所述盖板1的对应位置上设置有用于插入定位柱7顶端的定位孔4;在所述盖板1上还设置有对位孔5以及多个相互平行的条形通风口6,所述对位孔5与FPC上限位孔的位置对应且在所述对位孔5的内壁上设置有磁铁,所述T型插销3为镍铁材质且由上往下穿过FPC限位孔并插入所述对位孔5内。The bottom end of the positioning column 7 is fixedly arranged on the base plate 2, and a positioning hole 4 for inserting the top end of the positioning column 7 is provided on the corresponding position of the cover plate 1; Alignment holes 5 and a plurality of strip-shaped vents 6 parallel to each other, the alignment holes 5 correspond to the position of the upper hole of the FPC and magnets are arranged on the inner wall of the alignment holes 5, and the T-shaped pins 3 is made of nickel iron and passes through the FPC limiting hole from top to bottom and is inserted into the alignment hole 5 .
在所述底板2上还设置有多个相互平行的条形支撑块8,所述支撑块8与通风口6的位置上下对应且与FPC上元器件待焊接引脚的位置对应,在所述支撑块8的上表面还设置有耐高温的硅胶垫9,使FPC贴合得更加平整。Also be provided with a plurality of mutually parallel bar-shaped support blocks 8 on the said bottom plate 2, the position of said support block 8 and air vent 6 corresponds up and down and corresponds to the position of the pins to be welded of components and parts on the FPC, in said The upper surface of the support block 8 is also provided with a high-temperature-resistant silicone pad 9 to make the FPC fit more smoothly.
在本实施例中,所述盖板1和底板2均由多块基板水平拼接而成,所述基板间通过连接片10固连,且除了最外侧的两块基板外,其余基板每块均至少包括一个通风口6或支撑块8。In this embodiment, the cover plate 1 and the bottom plate 2 are formed by horizontal splicing of a plurality of substrates, and the substrates are fixedly connected by connecting pieces 10, and except for the two outermost substrates, each of the other substrates is At least one vent 6 or support block 8 is included.
所述表面贴装装置的工作过程如下:The working process of the surface mount device is as follows:
首先将盖板1和底板2上下卡合固定,此时定位柱7对应插入定位孔4中且支撑块8对应插入通风口6中,然后将空白的FPC放置在盖板1,并使得FPC上的待焊接引脚位置和限位孔03分别与通风口6和对位孔5位置对正,接着将T型插销3从上往下穿过FPC的限位孔03并插入对位孔5内,由于磁铁对T型插销3的吸附作用,FPC的位置被固定且受力铺展开来,此时FPC的下底面与支撑块8的上表面(或硅胶垫)贴合,从而对FPC起到支撑作用,接着在FPC上涂抹锡膏并放置相关元器件,最后取下底板2,将盖板1连通FPC一起转移至回流焊设备中,由于FPC上待焊接的位置下方设置有通风口6,热风可以与FPC直接接触,因此不会对后续的焊接过程造成阻碍。Firstly, the cover plate 1 and the bottom plate 2 are fixed up and down. At this time, the positioning column 7 is inserted into the positioning hole 4 and the support block 8 is inserted into the air vent 6. Then, the blank FPC is placed on the cover plate 1, and the FPC is The position of the pin to be welded and the positioning hole 03 are respectively aligned with the position of the vent 6 and the positioning hole 5, and then the T-shaped pin 3 is passed through the positioning hole 03 of the FPC from top to bottom and inserted into the positioning hole 5 , due to the adsorption effect of the magnet on the T-shaped pin 3, the position of the FPC is fixed and spread out under force. At this time, the lower surface of the FPC is attached to the upper surface of the support block 8 (or the silicone pad), thereby playing a role in the FPC. Supporting function, then apply solder paste on the FPC and place related components, and finally remove the bottom plate 2, and transfer the cover plate 1 to the reflow soldering equipment together with the FPC. Since there is a vent 6 under the position to be soldered on the FPC, The hot air can be in direct contact with the FPC, so it will not hinder the subsequent welding process.
以上所述仅为本实用新型的实施例,并非因此限制本实用新型的专利保护范围,凡是利用本实用新型说明书及附图内容所作的等效结构或等效流程变换,直接或间接运用在其它相关的技术领域,均同理包括在本实用新型的专利保护范围内。The above descriptions are only embodiments of the present utility model, and are not intended to limit the scope of patent protection of the present utility model. Any equivalent structure or equivalent process transformation made by using the specification of the utility model and the contents of the accompanying drawings can be directly or indirectly used in other applications. Related technical fields are all included in the patent protection scope of the present utility model in the same way.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720941630.8U CN206948733U (en) | 2017-07-31 | 2017-07-31 | A kind of surface mount device for being used to produce LED flexible PCBs |
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| CN201720941630.8U CN206948733U (en) | 2017-07-31 | 2017-07-31 | A kind of surface mount device for being used to produce LED flexible PCBs |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108551722A (en) * | 2018-06-05 | 2018-09-18 | 肖国选 | Unit pcb board |
| CN108566730A (en) * | 2018-05-30 | 2018-09-21 | 金庆波 | Composite circuit board |
| CN110594253A (en) * | 2019-09-17 | 2019-12-20 | 歌尔股份有限公司 | Flexible circuit board mounting equipment |
| CN116801486A (en) * | 2022-03-11 | 2023-09-22 | 刘洋 | Flexible printed substrate |
-
2017
- 2017-07-31 CN CN201720941630.8U patent/CN206948733U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108566730A (en) * | 2018-05-30 | 2018-09-21 | 金庆波 | Composite circuit board |
| CN108566730B (en) * | 2018-05-30 | 2020-09-08 | 佛山市顺德区博为电器有限公司 | Composite circuit board |
| CN108551722A (en) * | 2018-06-05 | 2018-09-18 | 肖国选 | Unit pcb board |
| CN110594253A (en) * | 2019-09-17 | 2019-12-20 | 歌尔股份有限公司 | Flexible circuit board mounting equipment |
| CN116801486A (en) * | 2022-03-11 | 2023-09-22 | 刘洋 | Flexible printed substrate |
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