CN206728381U - Surface Mount power module - Google Patents
Surface Mount power module Download PDFInfo
- Publication number
- CN206728381U CN206728381U CN201720412360.1U CN201720412360U CN206728381U CN 206728381 U CN206728381 U CN 206728381U CN 201720412360 U CN201720412360 U CN 201720412360U CN 206728381 U CN206728381 U CN 206728381U
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- circuit board
- power module
- mount power
- surface mount
- pad
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Abstract
The utility model discloses a kind of Surface Mount power module, include first circuit board, first circuit board is included to install the top surface of electronic component and bottom surface, first circuit board also includes multiple side end faces, each side end face connection top surface and bottom surface, multiple side end faces are at least provided with an at least pad on a side end face, an at least pad is connected to a second circuit board.Because pad is designed in the side end face of first circuit board, first circuit board top surface and the area of bottom surface are not take up, so that the characteristic that side end face is not provided with electronic component is utilized, improves first circuit board utilization rate, first circuit board area has been saved, has reduced whole Surface Mount power module size.Pin need not be assembled, so as to reduce material cost and save man-hour, and integrally reduces Surface Mount power module cost.
Description
Technical field
A kind of Surface Mount power module is the utility model is related to, specifically, more particularly to a kind of try one's best takes circuit board less
The Surface Mount power module of area.
Background technology
Surface Mount power module is less because having the area occupied when being connected with circuit board, and need not open inserting in circuit board
Hole, the advantages that improving circuit board trace density, and widely used by client.
Surface Mount power module is divided into horizontal Surface Mount power module and vertical surface-mount power module.Horizontal Surface Mount power module leads to
Multiple pads are opened usually through the circuit board bottom surface of more pins or Surface Mount power module to carry out with the pad on another circuit board
Welding, and vertical surface-mount power module is then generally welded by more pins with the pad on another circuit board.
Fig. 1 is refer to, Fig. 1 is the structural representation of a horizontal Surface Mount power module of prior art.It is as shown in figure 1, existing
There is horizontal Surface Mount power module to include first circuit board 11 and electronic component 12；Pin 111 is welded on first circuit board 11, electricity
Subcomponent 12 is installed on first circuit board 11, is provided with the pad 131 corresponding to pin 111 on second circuit board 13, and first
Circuit board 11 is welded to be assembled on second circuit board 13 by pin 111 and pad 131.
Fig. 2 is refer to, Fig. 2 is the structural representation of another horizontal Surface Mount power module of prior art.It is illustrated in fig. 2
The difference of horizontal Surface Mount power module and horizontal Surface Mount power module illustrated in fig. 1 is, horizontal table illustrated in fig. 2
The pad 211 of the first circuit board 21 of power module is pasted to replace the pin 111 in Fig. 1, first circuit board 21 passes through pad 211
Welded with the pad (not shown) on second circuit board 23 to be assembled on second circuit board 23.
Fig. 3 is refer to, Fig. 3 is the structural representation of the vertical surface-mount power module of prior art.It is as shown in figure 3, existing
Vertical surface-mount power module includes first circuit board 31 and electronic component 32；Pin 311 and electronic component 32 are installed in the first electricity
On road plate 31, be provided with the pad 331 corresponding to pin 311 on second circuit board 33, first circuit board 31 by pin 311 with
Pad 331 is welded to be assembled on second circuit board 33.
From Fig. 1-3, either vertical surface-mount power module or horizontal Surface Mount power module, such as carried out using pin
Welding, it is all higher to pin surface planarity requirements, if flatness is unsatisfactory for demand, module missing solder, failure welding can be caused
The problems such as；And pin needs the certain area of the first circuit board for occupying Surface Mount power module.Especially horizontal Surface Mount power supply
Module, so that bottom surface can not place any other electronic component, causes as set pad using in first circuit board bottom surface
The area that the circuit board of horizontal Surface Mount power module needs can be bigger, causes the increase of cost.
Therefore it is badly in need of developing a kind of Surface Mount power module for overcoming drawbacks described above.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of Surface Mount power module, comprising first circuit board,
The first circuit board is included to install the top surface of electronic component and bottom surface, wherein, the first circuit board is also comprising multiple
Side end face, each side end face connect the top surface and the bottom surface, at least one side end face of the multiple side end face
On be provided with an at least pad, an at least pad is connected to a second circuit board.
Above-mentioned Surface Mount power module, wherein, an at least pad is spaced apart on the side end face.
Above-mentioned Surface Mount power module, wherein, an at least pad from the side end face extend to the top surface and/or
In at least part of bottom surface.
Above-mentioned Surface Mount power module, wherein, also it is installed in the first circuit board comprising pin, one end of the pin
On, the other end of the pin is connected to the second circuit board.
Above-mentioned Surface Mount power module, wherein, the pin is F types pin or L-type pin.
Above-mentioned Surface Mount power module, wherein, an at least fin is also included, is installed in the top surface and/or the bottom
On face.
Above-mentioned Surface Mount power module, wherein, it is described that locating dowel, institute are at least equiped with least one of fin
The positioning hole that the corresponding locating dowel is further opened with second circuit board is stated, the locating dowel is connected to the positioning hole.
Above-mentioned Surface Mount power module, wherein, the first circuit board is vertically connected at the second circuit board.
Above-mentioned Surface Mount power module, wherein, an at least pad, at least one weldering are provided with the second circuit board
Disk is connected to an at least pad correspondingly.
Above-mentioned Surface Mount power module, wherein, an at least pad is formed for electroplating technology.
The effect of prior art this practicality is new is directed to be：
1. because pad is designed in the side end face of first circuit board, first circuit board top surface and the area of bottom surface are not take up,
So that the characteristic that side end face is not provided with electronic component is utilized, first circuit board utilization rate is improved, has saved first
Board area, reduce whole Surface Mount power module size；
2. pin need not be assembled, so as to reduce material cost and save man-hour, and Surface Mount power supply mould is integrally reduced
Block cost.
Brief description of the drawings
Fig. 1 is the structural representation of a horizontal Surface Mount power module of prior art；
Fig. 2 is the structural representation of another horizontal Surface Mount power module of prior art；
Fig. 3 is the structural representation of the vertical surface-mount power module of prior art；
Fig. 4-5 is the structural representation of the utility model Surface Mount power module first embodiment；
Fig. 6 is the structural representation of the utility model Surface Mount power module second embodiment；
Fig. 7 is the structural representation of the utility model Surface Mount power module 3rd embodiment.
Wherein, reference is：
11、21、31、41、51：First circuit board
T：Top surface
B：Bottom surface
C：Side end face
111、311、54：Pin
211、411、511、131、231、331、431：Pad
12、22、32、52：Electronic component
13、23、33、43、53：Second circuit board
432：Positioning hole
44：Fin
441：Locating dowel
442：Locating dowel solder pad
Embodiment
Hereby illustrate about detailed content of the present utility model and technology, be now described further with a preferred embodiment,
But it is not necessarily to be construed as the limitation of the utility model implementation.Wherein pad is formed for electroplating technology, but the utility model not with
This is limited.
Fig. 4-5 is refer to, Fig. 4-5 is the structural representation of the utility model Surface Mount power module first embodiment.Such as figure
Shown in 4-5, the utility model Surface Mount power module includes first circuit board 41 and electronic component (not shown), first circuit board 41
Multiple side end face C comprising top surface T, bottom surface B and connection top surface T and bottom surface B, electronic component are installed in top surface T and/or bottom surface B
On, an at least pad 411 that being at least provided with a side end face C in multiple side end face C is spaced apart, on second circuit board 43
An at least pad 431 is provided with, the electricity of an at least pad 431 first is connected to by an at least pad 411 correspondingly
Road plate 41 is assembled on second circuit board 43, wherein in the present embodiment, first circuit board 41 perpendicular to second circuit board 43, but
The utility model is not limited thereto.
Further, pad 411 is extended in top surface T and/or bottom surface B at least part from side end face C, consequently facilitating after
The welding of continuous technique.
Yet further, Surface Mount power module also includes at least one fin 44, is installed in the top of first circuit board 41
On face T or bottom surface B, locating dowel 441 is equiped with fin 44, corresponding locating dowel 441 is further opened with second circuit board 43
Positioning hole 432, locating dowel 441 are connected to positioning hole 432 correspondingly, can not only play the work of support Surface Mount power module
With can also prevent Surface Mount power module from tilting, and increase the intensity of Surface Mount power module.Wherein, in the present embodiment, position
The outside of post 441 is coated with locating dowel solder pad 442, so that locating dowel 441 is firm to be connected to positioning hole 432.
It is worth noting that, although locating dowel and positioning hole are diagonal setting in the present embodiment, this practicality is new
Type is not limited thereto, at the same the utility model also not the quantity to fin, locating dowel and positioning hole and locating dowel with it is fixed
The connected mode in position hole is limited.
Fig. 6 is refer to, Fig. 6 is the structural representation of the utility model Surface Mount power module second embodiment.Such as Fig. 6 institutes
Show, the utility model Surface Mount power module includes first circuit board 51 and electronic component 52, first circuit board 51 include top surface T,
Bottom surface B and connection top surface T and bottom surface B multiple side end face C, electronic component 52 are installed on top surface T and/or bottom surface B, multiple sides
At least pad 511 that being at least provided with a side end face C in the C of end face is spaced apart, the wherein structure of second circuit board with
The structure of second circuit board shown in Fig. 4-5 is roughly the same, therefore same section does not just repeat herein.Wherein, Surface Mount power supply
Module also includes pin 54, and one end of pin 54 is installed on first circuit board 51, and 54 other ends of pin are connected to the second electricity
Road plate (not shown), in the present embodiment, pin 54 are F type pins.
Fig. 7 is refer to, Fig. 7 is the structural representation of the utility model Surface Mount power module 3rd embodiment.Shown by Fig. 7
Surface Mount power module structure it is roughly the same with the structure of Surface Mount power module illustrated in fig. 6, therefore same section is just not
Repeat, be now described as follows difference herein：Pin 54 is L-type pin in the present embodiment.
In the embodiment of the utility model one, when locating dowel 441, F types pin or L-type pin are connected with second circuit board,
It can not only play a part of supporting Surface Mount power module, can also further have the function that electrical connection.
In summary, the utility model by pad design by the side end face of first circuit board, being not take up the first circuit
Plate top surface and the area of bottom surface, so that the characteristic that side end face is not provided with electronic component is utilized, improve the first circuit
Plate utilization rate, first circuit board area is saved, reduced whole Surface Mount power module size；Pin need not be assembled, so as to
Reduce material cost and saved man-hour, and integrally reduce Surface Mount power module cost.
Preferred embodiment of the present utility model is above are only, is not used for limiting the scope of the utility model implementation,
In the case of without departing substantially from the utility model spirit and its essence, those skilled in the art work as can be according to the utility model
Various corresponding changes and deformation are made, but the right that these corresponding changes and deformation should all belong to appended by the utility model is wanted
The protection domain asked.
Claims (10)
1. a kind of Surface Mount power module, comprising first circuit board, the first circuit board is included to install the top of electronic component
Face and bottom surface, it is characterised in that the first circuit board also includes multiple side end faces, and each side end face connects the top surface
And the bottom surface, an at least pad, an at least pad are provided with least one side end face of the multiple side end face
It is connected to a second circuit board.
2. Surface Mount power module as claimed in claim 1, it is characterised in that an at least pad is spaced apart in the side
On end face.
3. Surface Mount power module as claimed in claim 1, it is characterised in that an at least pad extends from the side end face
On at least part of the top surface and/or bottom surface.
4. Surface Mount power module as claimed in claim 1, it is characterised in that also installed comprising pin, one end of the pin
In on the first circuit board, the other end of the pin is connected to the second circuit board.
5. Surface Mount power module as claimed in claim 4, it is characterised in that the pin is F types pin or L-type pin.
6. Surface Mount power module as claimed in claim 1, it is characterised in that also include an at least fin, be installed in described
On top surface and/or the bottom surface.
7. Surface Mount power module as claimed in claim 6, it is characterised in that described at least at least one of fin
Locating dowel is equiped with, the positioning hole of the corresponding locating dowel is further opened with the second circuit board, the locating dowel is connected to
The positioning hole.
8. Surface Mount power module as claimed in claim 1, it is characterised in that the first circuit board is vertically connected at described
Two circuit boards.
9. Surface Mount power module as claimed in claim 1, it is characterised in that at least one weldering is provided with the second circuit board
Disk, an at least pad are connected at least pad on the first circuit board correspondingly.
10. Surface Mount power module as claimed in claim 1, it is characterised in that an at least pad is formed for electroplating technology.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720412360.1U CN206728381U (en) | 2017-04-19 | 2017-04-19 | Surface Mount power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720412360.1U CN206728381U (en) | 2017-04-19 | 2017-04-19 | Surface Mount power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206728381U true CN206728381U (en) | 2017-12-08 |
Family
ID=60505181
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720412360.1U Active CN206728381U (en) | 2017-04-19 | 2017-04-19 | Surface Mount power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206728381U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980504A (en) * | 2022-07-27 | 2022-08-30 | 之江实验室 | High-density power supply device for wafer-level processor |
-
2017
- 2017-04-19 CN CN201720412360.1U patent/CN206728381U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114980504A (en) * | 2022-07-27 | 2022-08-30 | 之江实验室 | High-density power supply device for wafer-level processor |
| CN114980504B (en) * | 2022-07-27 | 2022-11-08 | 之江实验室 | High-density power supply device for wafer-level processor |
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