CN216531929U

CN216531929U - 6 layers of PCB circuit boards of high-accuracy multilayer hard substrate

Info

Publication number: CN216531929U
Application number: CN202123150781.7U
Authority: CN
Inventors: 刘小锋
Original assignee: Shenzhen High Precision Technology Co ltd
Current assignee: Shenzhen High Precision Technology Co ltd
Priority date: 2021-12-15
Filing date: 2021-12-15
Publication date: 2022-05-13
Anticipated expiration: 2031-12-15

Abstract

The utility model provides a high-precision multilayer hard substrate layer PCB circuit board, which comprises a circuit board body, wherein the circuit board body comprises a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate and side plates, the second substrate is arranged at the bottom end of the first substrate, the third substrate is arranged at the bottom end of the second substrate, the fourth substrate is arranged at the bottom end of the third substrate, the fifth substrate is arranged at the bottom end of the fourth substrate, a first notch is formed in one side of the first substrate, a second notch is formed in one side of the second substrate, a third notch is formed in one side of the third substrate, a fourth notch is formed in one side of the fourth substrate, an insulating plate is arranged at the top end of the first substrate, the side plates are arranged at the side edges of the fifth substrate, clamping grooves are formed in the surfaces of the side plates, the production process of the high-precision multilayer hard substrate 6-layer PCB circuit board is simplified, the processing procedure is shortened, and the cost is reduced, the heat dissipation is better, has high-efficient dustproof function.

Description

6 layers of PCB circuit boards of high-accuracy multilayer hard substrate

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a high-precision 6-layer PCB circuit board with a multi-layer hard substrate.

Background

The circuit board is mainly made up by using insulating plate as base material, cutting it into a certain size, on which at least one conductive pattern is attached, and distributed with holes, and can be used for replacing chassis of electronic components of existent equipment and realizing interconnection of electronic components. Wherein, the plasticity of multilayer PCB circuit board is stronger, and the volume is littleer, can use in more accurate equipment.

But current multilayer PCB circuit board need set up a plurality of vacancies for intercommunication each other between the different layer circuit, consequently increased a large amount of drilling processes, the processing degree of difficulty has been improved, and be difficult to directly connect the wire on the two-layer base plate that is not adjacent, the manufacturing cost of processing has been improved, on the other hand, current multilayer PCB circuit board radiating effect only relies on the top heat dissipation, and the heat dissipation can't be accurate to on the concrete heating element, to the big circuit board of calorific capacity, can only rely on more heat radiation structure, the heat dissipation cost is improved.

SUMMERY OF THE UTILITY MODEL

Aiming at the defects in the prior art, the utility model aims to provide a high-precision multilayer hard substrate 6-layer PCB circuit board to solve the problems in the background technology, simplifies the production process, shortens the processing procedure, reduces the cost, has better heat dissipation performance and has a high-efficiency dustproof function.

In order to achieve the purpose, the utility model is realized by the following technical scheme: a high-precision multilayer hard substrate layer PCB circuit board comprises a circuit board body, wherein the circuit board body comprises a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate and side plates, the second substrate is installed at the bottom end of the first substrate, the third substrate is installed at the bottom end of the second substrate, the fourth substrate is installed at the bottom end of the third substrate, the fifth substrate is installed at the bottom end of the fourth substrate, a first notch is formed in one side of the first substrate, a second notch is formed in one side of the second substrate, a third notch is formed in one side of the third substrate, a fourth notch is formed in one side of the fourth substrate, an insulating plate is installed at the top end of the first substrate, the side plates are installed at the side edges of the fifth substrate, clamping grooves are formed in the surfaces of the side plates, two fixing holes are formed in four corners of the side plates, a first fixing hole is formed in the periphery of the fifth substrate, and grooves are formed in the inner sides of the insulating plate, and heat dissipation plates are arranged in the insulating plate and at two ends of the insulating plate.

As a preferred embodiment of the present invention, the bottom end of the insulating plate is attached to a surface of the first substrate, the surface of the first substrate is etched with a copper wire and welded with a desired electrical component, and the groove is formed in a corresponding area on the surface of the first substrate where the heat of the heating component and the heat of the wire are concentrated.

In a preferred embodiment of the present invention, the heat dissipation plate penetrates through the inside of the groove, and the inner wall of the groove and the heat dissipation plate area inside are coated with heat dissipation silicone grease.

In a preferred embodiment of the present invention, the widths of the first notch, the second notch, the third notch and the fourth notch become gradually shorter from top to bottom.

As a preferred embodiment of the present invention, the same sides of the first substrate, the second substrate, the third substrate, the fourth substrate and the fifth substrate are clamped inside the clamping groove together, and are completely filled to form a stepped structure.

In a preferred embodiment of the present invention, the length of the base plate five is greater than the lengths of the other base plates at the top, and the widths of both sides of the base plate five are the same as the length of the side plate.

The utility model has the beneficial effects that: the utility model discloses a high-precision multilayer hard substrate layer PCB circuit board which comprises a circuit board body, wherein the circuit board body comprises a first substrate, a second substrate, a third substrate, a fourth substrate, a fifth substrate, side plates, an insulating plate, a heat dissipation plate, a first fixing hole, a second fixing hole, a first notch, a second notch, a third notch, a fourth notch, a clamping groove and a groove.

1. This 6 layers of PCB circuit boards of high-accuracy multilayer hard base plate have five layers of base plates altogether, can be connected the wire of every layer of base plate both sides directly in the both sides of curb plate surface and arbitrary one deck base plate, compare in conventional trompil formula connected mode, the procedure of processing has been simplified to this structure, and the wire can directly link to arbitrary base plate on, and processing is more high-efficient, has reduced manufacturing cost.

2. The 6 layers of PCB circuit boards of this high-accuracy multilayer hard base plate can horizontal installation in the side or the bottom of equipment, utilizes the selection of fixed orifices one and fixed orifices two can expand the optional mounted position of circuit board, and the mounting means is more nimble.

3. This 6 layers of PCB circuit boards of high-accuracy multilayer hard substrate can directly dispel the heat with heating element or the regional of heat concentration to the ization to through the inside heating panel with both ends of insulation board with the heat effluvium, this structure radiating effect is better, and can play protection and dirt-proof effect to top and both sides.

Drawings

FIG. 1 is a schematic structural diagram of the appearance of a high-precision multilayer hard substrate 6-layer PCB circuit board of the present invention;

FIG. 2 is an exploded view of a high-precision multilayer hard substrate 6-layer PCB circuit board according to the present invention;

FIG. 3 is a schematic bottom structure diagram of an insulating board of a high-precision multilayer hard substrate 6-layer PCB circuit board of the present invention;

in the figure: 1. a first substrate; 2. a second substrate; 3. a third substrate; 4. a fourth substrate; 5. a fifth substrate; 6. a side plate; 7. an insulating plate; 8. a heat dissipation plate; 9. a first fixing hole; 10. a second fixing hole; 11. a first gap is formed; 12. a second gap; 13. a third gap; 14. a fourth gap; 15. a card slot; 16. and (4) a groove.

Detailed Description

In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the utility model easy to understand, the utility model is further described with the specific embodiments.

Referring to fig. 1 to 3, the present invention provides a technical solution: a high-precision multilayer hard substrate 6-layer PCB circuit board comprises a circuit board body, wherein the circuit board body comprises a first substrate 1, a second substrate 2, a third substrate 3, a fourth substrate 4, a fifth substrate 5 and side plates 6, the second substrate 2 is installed at the bottom end of the first substrate 1, the third substrate 3 is installed at the bottom end of the second substrate 2, the fourth substrate 4 is installed at the bottom end of the third substrate 3, the fifth substrate 5 is installed at the bottom end of the fourth substrate 4, a first notch 11 is formed in one side of the first substrate 1, a second notch 12 is formed in one side of the second substrate 2, a third notch 13 is formed in one side of the third substrate 3, a fourth notch 14 is formed in one side of the fourth substrate 4, an insulating plate 7 is installed at the top end of the first substrate 1, the side plate 6 is installed at the side edge of the fifth substrate 5, a clamping groove 15 is formed in the surface of each side plate 6, and two fixing holes 10 are formed in four corners of each side plate 6, the periphery of the five base plates 5 is provided with first fixing holes 9, the inner side of the insulating plate 7 is provided with a groove 16, and the inside and two ends of the insulating plate 7 are provided with heat dissipation plates 8.

As a preferred embodiment of the present invention, the bottom end of the insulating plate 7 is attached to the surface of the first substrate 1, the surface of the first substrate 1 is etched with copper wires and welded with required electrical components, the groove 16 is formed in a corresponding heating element and a region where heat of the wires is concentrated on the surface of the first substrate 1, and silicone grease in the groove 16 can perform independent heat dissipation on the heat dissipation region, thereby improving heat dissipation efficiency.

In a preferred embodiment of the present invention, the heat dissipation plate 8 passes through the inside of the groove 16, and the inner wall of the groove 16 and the area of the heat dissipation plate 8 inside are coated with heat dissipation silicone grease until the silicone grease is in contact with the heating element to realize heat conduction.

In a preferred embodiment of the present invention, the widths of the first notch 11, the second notch 12, the third notch 13 and the fourth notch 14 are gradually shortened from top to bottom, so that a partial area of each substrate is directly exposed to the outside and is connected to the side plate 6.

As a preferred embodiment of the present invention, the same sides of the first substrate 1, the second substrate 2, the third substrate 3, the fourth substrate 4 and the fifth substrate 5 are clamped inside the clamping slot 15 together, and are completely filled to form a stepped structure, so that any one layer of substrate can be directly connected to any other substrate by using the stepped structure without passing through adjacent substrates.

As a preferred embodiment of the present invention, the length of the base plate five 5 is greater than the lengths of the other base plates at the top, and the widths of both sides of the base plate five 5 are the same as the length of the side plate 6, so that the base plate five 5 can be directly attached to the bottommost part of the slot 15 to contact with the side plate 6.

The working principle is as follows: the high-precision multilayer hard substrate 6-layer PCB circuit board comprises a first substrate 1, a second substrate 2, a third substrate 3, a fourth substrate 4, a fifth substrate 5 and side plates 6, wherein the circuit board comprises five layers of substrates, a first layer and a second layer of circuit layers are arranged on two sides of the first substrate 1, a third layer of circuit layer is arranged between the second substrate 2 and the third substrate 3, a fourth layer of circuit layer is arranged between the third substrate 3 and the fourth substrate 4, a fifth layer and a sixth layer of circuit layer are arranged on two sides of the fifth substrate 5, one side of each substrate is embedded on the surface of the side plates 6, the five layers of substrates are connected into a whole through the side plates 6, and wires of circuits on the surfaces of the substrates are connected and communicated, one end of the top four layers of substrates is provided with a notch, the length of the notch is gradually lengthened from bottom to top, therefore, a step structure can be formed when the PCB circuit board is clamped in a clamping groove 15, the structure can be used for directly connecting the wires on two sides of each layer of the substrate with two sides of any layer of the side plates on the surface of the side plates 6, compared with the conventional open-hole type connection mode, the structure simplifies the processing procedure, the lead can be directly connected to any substrate, the processing is more efficient, the production cost is reduced, the surface of the substrate five 5 is provided with the plurality of first fixing holes 9, the size of the substrate five 5 is larger than that of other four layers of substrates, so that the lead can be directly installed on the surface of equipment by penetrating the first fixing holes 9 through screws, the surface of the side plate 6 is also provided with the plurality of second fixing holes 10, the circuit board can be horizontally installed on the side plate 6 of the equipment, the installation position of the circuit board can be enlarged by utilizing the structure, the installation mode is more flexible, the top of the substrate 1 of the circuit board is covered with the insulating plate 7, the inner side of the insulating plate 7 is provided with a plurality of grooves 16, the inner parts of the grooves 16 are coated with heat-conducting silicone grease, the grooves 16 correspond to the etched circuit on the surface of the substrate 1 or are embedded with heating elements, and with its cover inside, consequently can be directly with the regional heat dissipation to the ization of heating element or heat concentration to through the inside heating panel 8 with both ends of insulation board 7 with the heat effluvium, this structure radiating effect is better, and can play protection and dirt-proof effect to top and both sides.

While there have been shown and described what are at present considered the fundamental principles and essential features of the utility model and its advantages, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but is capable of other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

Claims

1. The utility model provides a 6 layers of PCB circuit boards of high-accuracy multilayer hard base plate, includes the circuit board body, its characterized in that: the circuit board body comprises a first substrate (1), a second substrate (2), a third substrate (3), a fourth substrate (4), a fifth substrate (5) and a side plate (6), wherein the second substrate (2) is installed at the bottom end of the first substrate (1), the third substrate (3) is installed at the bottom end of the second substrate (2), the fourth substrate (4) is installed at the bottom end of the third substrate (3), the fifth substrate (5) is installed at the bottom end of the fourth substrate (4), a notch I (11) is formed in one side of the first substrate (1), a notch II (12) is formed in one side of the second substrate (2), a notch III (13) is formed in one side of the third substrate (3), a notch IV (14) is formed in one side of the fourth substrate (4), an insulating plate (7) is installed at the top end of the first substrate (1), and the side plate (6) is installed at the side edge of the fifth substrate (5), the heat-insulating plate is characterized in that a clamping groove (15) is formed in the surface of the side plate (6), two fixing holes (10) are formed in four corners of the side plate (6), one fixing hole (9) is formed in the periphery of the five base plate (5), a groove (16) is formed in the inner side of the insulating plate (7), and the heat-insulating plate (8) is arranged in the inner portion and at two ends of the insulating plate (7).

2. A high precision multilayer hard substrate 6 layer PCB circuit board according to claim 1, characterized in that: the bottom of insulation board (7) is laminated with the surface of base plate (1) mutually, the surface etching of base plate (1) has the copper wire and the welding has required electrical components, recess (16) are seted up in the corresponding heating element in base plate (1) surface and the region that the wire heat is concentrated.

3. A high precision multilayer hard substrate 6 layer PCB circuit board according to claim 1, characterized in that: the heat dissipation plate (8) penetrates through the groove (16), and heat dissipation silicone grease is smeared on the inner wall of the groove (16) and the area of the heat dissipation plate (8) inside.

4. A high precision multilayer hard substrate 6 layer PCB circuit board according to claim 1, characterized in that: the widths of the first notch (11), the second notch (12), the third notch (13) and the fourth notch (14) are gradually shortened from top to bottom.

5. A high precision multilayer hard substrate 6 layer PCB circuit board according to claim 1, characterized in that: the same sides of the first substrate (1), the second substrate (2), the third substrate (3), the fourth substrate (4) and the fifth substrate (5) are clamped in the clamping groove (15) together, and the stepped structure is formed by completely filling.

6. A high precision multilayer hard substrate 6 layer PCB circuit board according to claim 1, characterized in that: the length of the base plate five (5) is larger than that of other base plates at the top, and the width of the two sides of the base plate five (5) is the same as that of the side plate (6).