CN211128383U - Anti-interference heat dissipation type circuit board - Google Patents
Anti-interference heat dissipation type circuit board Download PDFInfo
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- CN211128383U CN211128383U CN201922104927.0U CN201922104927U CN211128383U CN 211128383 U CN211128383 U CN 211128383U CN 201922104927 U CN201922104927 U CN 201922104927U CN 211128383 U CN211128383 U CN 211128383U
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Abstract
The utility model discloses an anti-interference heat dissipation type circuit board, which comprises a substrate, a first metal layer, a second metal layer and a heat dissipation body, wherein the first metal layer and the second metal layer are respectively arranged on the upper surface and the lower surface of the substrate, and a first conductive pattern layer and a second conductive pattern layer are respectively formed on the surfaces of the first metal layer and the second metal layer; the heat dissipation body is arranged in the middle of the substrate and penetrates through the first metal layer and the second metal layer of the substrate, the heat dissipation body comprises a metal body, a first heat conduction insulation layer, a first heat dissipation layer, a second heat conduction insulation layer and a second heat dissipation layer, the first heat conduction insulation layer is arranged on the upper surface of the metal body, and the first heat dissipation layer is arranged on the first heat conduction insulation layer; the second heat conducting insulating layer is arranged on the lower surface of the metal body, and a second heat dissipation layer is arranged on the second heat conducting insulating layer. The utility model discloses processing is convenient, makes the radiating circuit board have good heat stability moreover, also has good interference immunity simultaneously.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is an anti-interference heat dissipation type circuit board.
Background
Printed Circuit Boards (PCBs) are one of the important components of the electronics industry. The PCB can provide mechanical support for fixing and assembling the electronic components, and can realize electrical connection among the electronic components. In addition, the PCB is printed with the component numbers and some figures, which provides convenience for component insertion, inspection and maintenance. Almost every electronic device, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, requires the use of printed circuit boards for electrical interconnection between electronic components, such as integrated circuits
With the continuous development of the electronic technology field, the demand for various circuit boards is increasing, and for the circuit board processing industry, a circuit board processing method with higher efficiency and higher precision must be provided. The existing circuit board is generally formed by stacking a copper foil circuit layer, an insulating medium layer and a metal base layer one on another, the heat dissipation is slow, the temperature rise of the whole PCB is easy to be rapid, and the PCB is further damaged.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an anti-interference heat dissipation type circuit board and processing method to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: an anti-interference heat dissipation type circuit board comprises a substrate, a first metal layer, a second metal layer and a heat dissipation body, wherein the first metal layer and the second metal layer are respectively arranged on the upper surface and the lower surface of the substrate, and a first conductive pattern layer and a second conductive pattern layer are respectively formed on the surfaces of the first metal layer and the second metal layer; the heat dissipation body is arranged in the middle of the substrate and penetrates through the first metal layer and the second metal layer of the substrate, the heat dissipation body comprises a metal body, a first heat conduction insulation layer, a first heat dissipation layer, a second heat conduction insulation layer and a second heat dissipation layer, the first heat conduction insulation layer is arranged on the upper surface of the metal body, and the first heat dissipation layer is arranged on the first heat conduction insulation layer; the second heat conducting insulating layer is arranged on the lower surface of the metal body, and a second heat dissipation layer is arranged on the second heat conducting insulating layer.
Preferably, the substrate is provided with a mounting hole and comprises a first base layer, a second base layer, a first heat-conducting insulating medium layer and a second heat-conducting insulating medium layer, the upper end face of the first base layer is provided with a first inner groove, and the lower end face of the second base layer is provided with a second inner groove.
Preferably, the first inner groove and the second inner groove are communicated with external air flow, one end of the base layer is bonded with the first heat-conducting insulating medium layer through heat-radiating glue, and the second base layer is bonded with the second heat-conducting insulating medium layer through heat-radiating glue.
Preferably, the first heat-conducting insulating medium layer and the second heat-conducting insulating medium layer are filled with heat-conducting filler particles with high heat conductivity.
Preferably, the first heat dissipation layer and the second heat dissipation layer are consistent in structure and both are honeycomb-shaped nonmetal heat dissipation layers, and each honeycomb-shaped nonmetal heat dissipation layer is formed by arranging a plurality of heat dissipation grids.
Preferably, the metal body is made of an aluminum material, and the first heat conduction insulating layer and the second heat conduction insulating layer are formed by aluminum anodic oxidation.
The utility model also provides a processing method of above-mentioned circuit board, including following step:
the method comprises the following steps: manufacturing a substrate, wherein an inner groove I and an inner groove II are arranged on a base layer I and a base layer II, and a heat conduction insulating medium layer I and a heat conduction insulating medium layer II are bonded at the two end parts of the base layer I and the base layer II through heat dissipation glue;
step two: firstly, manufacturing a heat radiator, and then installing the heat radiator in the mounting hole of the substrate;
step three: a first metal layer and a second metal layer are arranged on the substrate, and a first conductive pattern layer and a second conductive pattern layer are formed on the first metal layer and the second metal layer.
Preferably, the manufacturing of the heat sink in the second step includes: step a: taking a metal body, and connecting a first heat conduction insulating layer and a second heat conduction insulating layer on the upper surface and the lower surface of the metal body; step b: and the first heat dissipation layer and the second heat dissipation layer are connected on the first heat conduction insulation layer and the second heat conduction insulation layer.
Preferably, the method for forming the first conductive pattern layer and the second metal layer in the third step includes: step a: sticking dry film protective layers on the first metal layer and the second metal layer; step b: and respectively manufacturing the first conductive pattern layer and the second conductive pattern layer by the first metal layer and the second metal layer through exposure, development, electroplating and etching processes.
Compared with the prior art, the beneficial effects of the utility model are that:
the utility model discloses the processing is convenient, and has good withstand voltage, heat dispersion, and the heat that the circuit board produced at the during operation is derived, is dispersed the heat by the cooperation of inner groovy one, inner groovy two and radiator for the radiating circuit board has good thermal stability, also has good interference immunity simultaneously.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a processing flow chart of the present invention.
In the figure: 1. a substrate; 11. a first base layer; 111. a first inner groove; 12. a second base layer; 121. a second inner groove; 13. a first heat-conducting insulating medium layer; 14. a first heat-conducting insulating medium layer; 2. a first metal layer; 3. a second metal layer; 4. a heat sink; 401. a metal body; 402. a first heat conduction insulating layer; 403. a first heat dissipation layer; 404. a second heat conduction insulating layer; 405. and a second heat dissipation layer.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-2, the present invention provides a technical solution: an anti-interference heat dissipation type circuit board comprises a substrate 1, a first metal layer 2, a second metal layer 3 and a heat dissipation body 4, wherein the first metal layer 2 and the second metal layer 3 are respectively arranged on the upper surface and the lower surface of the substrate 1, and a first conductive pattern layer and a second conductive pattern layer are respectively formed on the surfaces of the first metal layer 2 and the second metal layer 3; the heat radiator 4 is arranged in the middle of the substrate 1 and penetrates through the first substrate metal layer 2 and the second substrate metal layer 3, the heat radiator 4 comprises a metal body 401, a first heat conduction insulating layer 402, a first heat dissipation layer 403, a second heat conduction insulating layer 404 and a second heat dissipation layer 405, the first heat conduction insulating layer 402 is arranged on the upper surface of the metal body 401, and the first heat dissipation layer 403 is arranged on the first heat conduction insulating layer 402; the second heat conducting insulating layer 404 is disposed on the lower surface of the metal body 401, and a second heat dissipation layer 405 is disposed on the second heat conducting insulating layer 404.
In this embodiment, the first heat dissipation layer 403 and the second heat dissipation layer 405 have the same structure and are both honeycomb-shaped non-metal heat dissipation layers, and each honeycomb-shaped non-metal heat dissipation layer is formed by arranging a plurality of heat dissipation grids.
In the embodiment, the metal body 401 is made of an aluminum material, and the first thermal insulation layer 402 and the second thermal insulation layer 404 are formed by aluminum anodization.
In this embodiment, the first metal layer 2 and the second metal layer 3 are provided with anti-interference layers.
Example 2: the utility model discloses a base plate 1 has the mounting hole, and base plate 1 includes that one 11 of basic unit, two 12 of basic unit, heat conduction insulating medium layer 13 and heat conduction insulating medium layer two 14, and one 11 up ends of basic unit are provided with inner groovy one 111, and the terminal surface is provided with inner groovy two 121 under two 12 of basic unit.
In this embodiment, the first inner groove 111 and the second inner groove 121 are both communicated with external air flow, the first heat conducting insulating medium layer 13 is bonded to the end portion of the first base layer 11 through a heat dissipation glue, and the second heat conducting insulating medium layer 14 is bonded to the second base layer 12 through a heat dissipation glue.
In this embodiment, the first heat-conducting insulating medium layer 13 and the second heat-conducting insulating medium layer 14 are filled with heat-conducting filler particles with high thermal conductivity.
The utility model also provides an above-mentioned anti-interference heat dissipation type circuit board's processing method, including following step:
the method comprises the following steps: manufacturing a substrate 1, arranging a first inner groove 111 and a second inner groove 112 on a first base layer 11 and a second base layer 12, and bonding a first heat-conducting insulating medium layer 13 and a second heat-conducting insulating medium layer 14 on the end parts of the first base layer 11 and the second base layer 12 through heat-radiating glue;
step two: firstly, manufacturing a heat radiation body 4, and then installing the heat radiation body 4 in an installation hole of the substrate 1 after manufacturing the heat radiation body 4;
step three: a first metal layer 2 and a second metal layer 3 are arranged on a substrate 1, and a first conductive pattern layer and a second conductive pattern layer are formed on the first metal layer 2 and the second metal layer 3.
In this embodiment, the manufacturing of the heat sink 4 in the second step includes: step a: taking a metal body 401, and connecting a first heat conduction insulating layer 402 and a second heat conduction insulating layer 403 on the upper surface and the lower surface of the metal body 401; step b: the first heat dissipation layer 404 and the second heat dissipation layer 405 are connected to the first heat conduction insulation layer 402 and the second heat conduction insulation layer 403.
In this embodiment, the method for forming the first conductive pattern layer and the second metal layer in the third step includes: step a: pasting dry film protective layers on the first metal layer 2 and the second metal layer 3; step b: and respectively manufacturing the first conductive pattern layer and the second conductive pattern layer by the first metal layer 2 and the second metal layer 3 through exposure, development, electroplating and etching processes.
The utility model discloses the processing is convenient, and has good withstand voltage, heat dispersion, and the heat that the circuit board produced at the during operation is derived, is dispersed the heat by the cooperation of inner groovy one, inner groovy two and radiator for the radiating circuit board has good thermal stability, also has good interference immunity simultaneously.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. An anti-interference heat dissipation type circuit board is characterized by comprising a substrate (1), a first metal layer (2), a second metal layer (3) and a heat dissipation body (4), wherein the first metal layer (2) and the second metal layer (3) are respectively arranged on the upper surface and the lower surface of the substrate (1), and a first conductive pattern layer and a second conductive pattern layer are respectively formed on the surfaces of the first metal layer (2) and the second metal layer (3); the heat radiator (4) is arranged in the middle of the substrate (1) and penetrates through the first metal layer (2) and the second metal layer (3) of the substrate, the heat radiator (4) comprises a metal body (401), a first heat conduction insulating layer (402), a first heat dissipation layer (403), a second heat conduction insulating layer (404) and a second heat dissipation layer (405), the first heat conduction insulating layer (402) is arranged on the upper surface of the metal body (401), and the first heat dissipation layer (403) is arranged on the first heat conduction insulating layer (402); the second heat conduction insulating layer (404) is arranged on the lower surface of the metal body (401), and a second heat dissipation layer (405) is arranged on the second heat conduction insulating layer (404).
2. The anti-interference heat dissipation type circuit board according to claim 1, wherein the substrate (1) has a mounting hole, the substrate (1) comprises a first base layer (11), a second base layer (12), a first heat conduction and insulation medium layer (13) and a second heat conduction and insulation medium layer (14), an upper end face of the first base layer (11) is provided with a first inner groove (111), and a lower end face of the second base layer (12) is provided with a second inner groove (121).
3. The anti-interference heat dissipation type circuit board according to claim 2, wherein the first inner groove (111) and the second inner groove (121) are both in air flow communication with the outside, the first heat conduction insulating medium layer (13) is bonded to the end portion of the first base layer (11) through a heat dissipation glue, and the second heat conduction insulating medium layer (14) is bonded to the second base layer (12) through the heat dissipation glue.
4. The anti-interference heat dissipation type circuit board according to claim 3, wherein the first heat conduction and insulation medium layer (13) and the second heat conduction and insulation medium layer (14) are filled with heat conduction filler particles with high heat conductivity.
5. The anti-interference heat dissipation type circuit board according to claim 1, wherein the first heat dissipation layer (403) and the second heat dissipation layer (405) have the same structure and are both honeycomb-shaped non-metal heat dissipation layers, and each honeycomb-shaped non-metal heat dissipation layer is formed by arranging a plurality of heat dissipation grids.
6. The anti-interference heat dissipation type circuit board according to claim 1, wherein the metal body (401) is made of aluminum material, and the first heat conduction insulation layer (402) and the second heat conduction insulation layer (404) are formed by aluminum anodic oxidation.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922104927.0U CN211128383U (en) | 2019-11-29 | 2019-11-29 | Anti-interference heat dissipation type circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922104927.0U CN211128383U (en) | 2019-11-29 | 2019-11-29 | Anti-interference heat dissipation type circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211128383U true CN211128383U (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922104927.0U Active CN211128383U (en) | 2019-11-29 | 2019-11-29 | Anti-interference heat dissipation type circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211128383U (en) |
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2019
- 2019-11-29 CN CN201922104927.0U patent/CN211128383U/en active Active
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