CN209861265U

CN209861265U - High-heat-conductivity single-side aluminum-based PCB

Info

Publication number: CN209861265U
Application number: CN201920515440.9U
Authority: CN
Inventors: 胡立存
Original assignee: Shenzhen Lihua New Circuit Board Co Ltd
Current assignee: Shenzhen Lihua New Circuit Board Co Ltd
Priority date: 2019-04-16
Filing date: 2019-04-16
Publication date: 2019-12-27
Anticipated expiration: 2029-04-16

Abstract

The utility model discloses an aluminium base circuit board of high heat conduction PCB single face, including aluminium base board and copper foil board, aluminium base board correspondence sets up the downside at the copper foil board, the rectangle mounting groove that corresponds with aluminium base board is seted up to the lower extreme of copper foil board, set up the snakelike heat conduction hole of controlling the intercommunication on the lateral wall of aluminium base board, the upper end of aluminium base board is provided with the heat-conducting layer with snakelike heat conduction hole intercommunication, a plurality of mounting holes with rectangle mounting groove intercommunication are seted up to the upper end of copper foil board, top-down comprises copper foil layer, heat insulating layer and circuit layer in proper order between copper foil board and the rectangle mounting groove, bond by the resin glue between copper foil layer, heat insulating layer and the circuit layer respectively, the utility model provides high fire resistance and the heat conductivility on circuit layer to have good heat trafficability, do benefit to the long-term use of circuit.

Description

High-heat-conductivity single-side aluminum-based PCB

Technical Field

The utility model relates to a circuit board technical field especially relates to an aluminium base circuit board of high heat conduction PCB single face.

Background

The circuit board is a provider of electrical connection of electronic components, and the circuit board has the main advantages of integrating various electronic components and functional modules, greatly reducing errors of manual wiring and assembly and improving the automation level and production efficiency of electronic product assembly. The circuit board is cut into a certain size by taking an insulating board as a base material, and a plurality of conductive patterns are attached to the insulating board and are provided with conducting holes, so that the electronic components are connected with each other.

In the prior art, due to the miniaturization of electronic products, the arrangement density of devices is gradually increased, and the heat dissipation is more and more serious, so that the service life of the electronic products is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the defects existing in the prior art and providing a high heat conduction PCB single-side aluminum-based circuit board.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a high heat conduction PCB single face aluminium base circuit board, includes aluminium base board and copper foil board, aluminium base board corresponds the downside that sets up at the copper foil board, the rectangle mounting groove that corresponds with aluminium base board is seted up to the lower extreme of copper foil board, set up the snakelike heat conduction hole of controlling the intercommunication on the lateral wall of aluminium base board, the upper end of aluminium base board is provided with the heat-conducting layer with snakelike heat conduction hole intercommunication, a plurality of mounting holes with rectangle mounting groove intercommunication are seted up to the upper end of copper foil board, top-down comprises copper foil layer, heat-conducting insulation layer and circuit layer in proper order between copper foil board and the rectangle mounting groove, bond by the resin between copper foil layer, heat-conducting insulation layer and the.

Preferably, the heat-conducting layer comprises the polyimide layer, and the polyimide layer is equipped with a plurality of heat conduction holes that run through its upper and lower surface, the heat conduction hole is cylindrical, and the heat conduction hole inside is filled with high heat conduction epoxy of high tenacity.

Preferably, the heat-conducting insulating layer is epoxy resin, and the upper surface layer and the lower surface layer of the epoxy resin are coated with 5-10 microns of boron nitride heat-conducting film and 1-2 microns of rosin resin.

Preferably, a heat dissipation base plate is provided at a lower end of the aluminum substrate, and the heat dissipation base plate is a metal base plate, a resin base plate, or a ceramic base plate.

Preferably, the rectangular mounting grooves of the aluminum substrate and the copper foil plate are bonded by resin glue.

Preferably, the thicknesses of the copper foil layer, the heat conduction insulating layer and the circuit layer are all in the range of 50-300 mu m.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through being provided with snakelike heat conduction hole in aluminium base board, can effectively release PCB board center department and gather too much heat to ensure the performance of PCB board, can effectively prolong the life of PCB board simultaneously, and be provided with the heat-conducting layer at the upside of snakelike heat conduction hole, the fire resistance on circuit layer has further been improved in the existence on polyimide layer, and has good heat trafficability characteristic.

2. The copper foil layer, the heat conduction insulating layer and the circuit layer are sequentially arranged between the copper foil plate and the rectangular mounting groove from top to bottom, so that the heat conduction performance of the circuit layer can be further improved, and the long-term use of the circuit board is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a high thermal conductivity PCB single-sided aluminum-based circuit board provided by the present invention;

FIG. 2 is an enlarged view of a portion of FIG. 1 at A;

fig. 3 is the utility model provides a snakelike heat conduction hole overlooking cross-sectional view of aluminium base circuit board of high heat conduction PCB single face.

In the figure: the heat dissipation substrate comprises an aluminum substrate 1, a copper foil plate 2, a snakelike heat conduction hole 3, a heat conduction layer 4, a mounting hole 5, a copper foil layer 6, a heat conduction insulation layer 7, a circuit layer 8 and a heat dissipation substrate plate 9.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Referring to fig. 1-3, the high thermal conductivity single-sided aluminum-based PCB comprises an aluminum substrate 1 and a copper foil plate 2, wherein the aluminum substrate 1 is correspondingly arranged at the lower side of the copper foil plate 2, a rectangular mounting groove corresponding to the aluminum substrate 1 is formed at the lower end of the copper foil plate 2, and the aluminum substrate 1 is bonded with the rectangular mounting groove of the copper foil plate 2 through resin glue.

Wherein, the side wall of the aluminum substrate 1 is provided with a snakelike heat conducting hole 3 which is communicated with the left and the right, the upper end of the aluminum substrate 1 is provided with a heat conducting layer 4 which is communicated with the snakelike heat conducting hole 3, concretely, the heat conducting layer 4 is composed of a polyimide layer, the polyimide layer is provided with a plurality of heat conduction holes penetrating through the upper surface and the lower surface, the heat conduction holes are cylindrical, high-toughness high-heat-conduction epoxy glue is filled in the heat conduction holes, the polyimide is a self flame-retardant polymer, the flame retardance of the circuit layer 8 is further improved due to the existence of the polyimide layer, and has good heat passing performance, more specifically, the lower end of the aluminum substrate 1 is provided with a heat dissipation base plate 9, and the heat dissipation base plate 9 adopts a ceramic base plate, has good heat conductivity, the serpentine heat conduction hole 3 can effectively release excessive heat accumulated at the center of the PCB, thereby ensuring the performance of the PCB and effectively prolonging the service life of the PCB.

Wherein, a plurality of mounting holes 5 with the rectangle mounting groove intercommunication are seted up to the upper end of copper foil board 2, top-down is by copper foil layer 6 in proper order between copper foil board 2 and the rectangle mounting groove, heat conduction insulation layer 7 and circuit layer 8 are constituteed, copper foil layer 6, bond by the resin glue between heat conduction insulation layer 7 and the circuit layer 8 respectively, it is specific, copper foil layer 6, heat conduction insulation layer 7 and circuit layer 8's thickness is 300 mu m, heat conduction insulation layer 7 is epoxy, and epoxy's upper and lower top layer all scribbles 5 microns's boron nitride heat conduction membrane and 2 microns's rosin resin, can ensure circuit layer 8's heat conductivility.

The utility model discloses in, through be provided with snakelike heat conduction hole 3 in aluminium base board 1, can effectively release PCB board center department and gather too much heat, thereby ensure the performance of PCB board, can effectively prolong the life of PCB board simultaneously, and be provided with heat-conducting layer 4 at the upside of snakelike heat conduction hole 3, the fire resistance on circuit layer has further been improved in the existence on polyimide layer, and good heat trafficability characteristic has, in addition, copper foil layer 6 has been set gradually through top-down between copper foil plate 2 and rectangle mounting groove, heat-conducting insulation layer 7 and circuit layer 8, can further improve the heat conductivility on circuit layer 8, do benefit to the long-term use of circuit board.

The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims

1. A high heat conduction PCB single-side aluminum base circuit board comprises an aluminum base board (1) and a copper foil board (2), it is characterized in that the aluminum substrate (1) is correspondingly arranged at the lower side of the copper foil plate (2), the lower end of the copper foil plate (2) is provided with a rectangular mounting groove corresponding to the aluminum substrate (1), the side wall of the aluminum substrate (1) is provided with a snake-shaped heat conducting hole (3) which is communicated with the left and the right, the upper end of the aluminum substrate (1) is provided with a heat conduction layer (4) communicated with the snakelike heat conduction hole (3), the upper end of the copper foil plate (2) is provided with a plurality of mounting holes (5) communicated with the rectangular mounting groove, the copper foil plate (2) and the rectangular mounting groove are sequentially composed of a copper foil layer (6), a heat conduction insulating layer (7) and a circuit layer (8) from top to bottom, and the copper foil layer (6), the heat conduction insulating layer (7) and the circuit layer (8) are respectively bonded by resin glue.

2. The PCB single-sided aluminum-based circuit board with high thermal conductivity as claimed in claim 1, wherein the thermal conductive layer (4) is composed of a polyimide layer, and the polyimide layer is provided with a plurality of thermal conductive holes penetrating through the upper and lower surfaces thereof, the thermal conductive holes are cylindrical, and the thermal conductive holes are filled with high-toughness high-thermal conductive epoxy glue.

3. The PCB single-sided aluminum-based circuit board with high thermal conductivity as claimed in claim 1, wherein the thermal insulation layer (7) is epoxy resin, and the upper and lower surface layers of the epoxy resin are coated with 5-10 micron boron nitride thermal conductive films and 1-2 micron rosin resin.

4. The PCB single-sided aluminum-based circuit board with high thermal conductivity according to claim 1, wherein the lower end of the aluminum substrate (1) is provided with a heat dissipation base plate (9), and the heat dissipation base plate (9) is a metal base plate, a resin base plate or a ceramic base plate.

5. The PCB single-sided aluminum-based circuit board as claimed in claim 1, wherein the rectangular mounting grooves of the aluminum substrate (1) and the copper foil (2) are bonded by resin glue.

6. The PCB single-sided aluminum-based circuit board with high thermal conductivity as claimed in claim 1, wherein the thicknesses of the copper foil layer (6), the thermal insulation layer (7) and the circuit layer (8) are all in the range of 50-300 μm.