CN212305749U

CN212305749U - LED double-layer circuit board module

Info

Publication number: CN212305749U
Application number: CN201922153582.8U
Authority: CN
Inventors: 颜晓钟
Original assignee: Triple E Power Saving & Application Co ltd
Current assignee: Triple E Power Saving & Application Co ltd
Priority date: 2019-12-05
Filing date: 2019-12-05
Publication date: 2021-01-05
Anticipated expiration: 2029-12-05

Abstract

The utility model discloses a, LED double-deck circuit board module, including the upper element layer, upper element layer lower extreme fixed connection goes up the solder mask, goes up solder mask fixed connection insulating connection layer one end, and solder mask one end fixed connection solder mask down is kept away from to the insulating connection layer, and lower solder mask lower extreme fixed connection component layer down goes up component layer upper end fixed connection LED banks, and LED banks both ends are equipped with the connecting piece, and upper element layer upper end is close to LED banks one end and is equipped with a pair of intercommunication mouth, the utility model discloses the beneficial effect who reaches is: the insulating connection in-situ heat conduction casting glue that sets up can carry out fine heat dissipation to upper element layer, last solder mask, solder mask and lower component layer to the heat pipe that sets up and the heat-conducting oil can be fine conduct heat to the heat conduction casting glue, set up that the connecting pipe can be fine fix the circuit component connecting wire, the connection of the circuit component of being convenient for.

Description

LED double-layer circuit board module

Technical Field

The utility model relates to a LED circuit board technical field specifically is a double-deck circuit board module of LED.

Background

Double-layer circuit boards, which are double-sided copper and metallized via, i.e., with copper on both sides and also within the via, are particularly important for both sides of the circuit board because, at the earliest, it was most difficult to have copper in the via (how to have copper on the wall of the via without copper), which is the most important basis for distinguishing between double-sided and single-sided boards. Double layer circuit boards have wiring on both sides of the board, but use wires on both sides, necessitating appropriate circuit connections between the two sides. The paster module is characterized in that a paster type LED lamp bead is pasted on a PCB and then components formed by electric wires are welded.

The screw that current double-deck circuit board module of LED adopted in the aspect of the structure usually carries out two-layer connection for the installation is loaded down with trivial details, and it dispels the heat to be equipped with the heating panel between both sides and makes the radiating effect not very good, and partial component can't obtain the heat dissipation, and the LED lamp generates heat and can't effectually get rid of and lead to the long-time high temperature of local.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a double-deck circuit board module of LED to the screw of the adoption of proposing carries out two-layer connection in solving above-mentioned background art, makes the installation loaded down with trivial details, and it dispels the heat to be equipped with the heating panel between both sides and makes the radiating effect not fine, and partial component can't obtain the heat dissipation, and the LED lamp generates heat can't effectually get rid of and lead to the local long-time high temperature problem.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a double-deck circuit board module of LED, includes the upper element layer, solder mask is connected to upper element layer lower extreme fixed connection, go up solder mask fixed connection insulating connection layer one end, solder mask one end fixed connection solder mask down is kept away from to the insulating connection layer, solder mask lower extreme fixed connection lower element layer down, upper element layer upper end fixed connection LED banks, LED banks both ends are equipped with the connecting piece, upper element layer upper end is close to LED banks one end and is equipped with a pair of intercommunication mouth of going up.

Preferably, the lower element layer and the upper element layer are both provided with a connecting piece, an LED lamp group and a circuit element group in the same structure, and the lower end of the lower element layer is provided with a lower communicating port.

Preferably, the upper communication port and the lower communication port are connected through a communication pipe.

Preferably, the insulating connecting layer is internally composed of heat conduction pouring sealant, and the middle part of the insulating connecting layer is provided with a heat conduction pipe.

Preferably, the heat conduction oil is filled in the heat conduction pipe.

Compared with the prior art, the utility model has simple and practical structure,

1. the heat conduction pouring sealant in the arranged insulation connection layer can well dissipate heat of the upper element layer, the upper solder mask layer, the lower solder mask layer and the lower element layer, and the arranged heat conduction pipe and the heat conduction oil can well conduct heat to the heat conduction pouring sealant.

2. The connecting pipe is arranged, so that the connecting line of the circuit element can be well fixed, and the circuit element can be conveniently connected.

Drawings

Fig. 1 is a top view of the structure of the present invention;

FIG. 2 is a sectional view of the structure of the present invention;

fig. 3 is a side sectional view of the structure of the present invention.

In the figure: 1. an upper element layer; 2. an upper solder mask layer; 3. an insulating connection layer; 31. heat conducting pouring sealant; 4. a lower solder resist layer; 5. a lower element layer; 6. an upper communication port; 61. a lower communication port; 62. a connecting pipe; 11. a circuit element group; 12. a connecting member; 13. an LED lamp group; 14. a heat conducting pipe.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Please refer to fig. 1-3, the utility model provides a double-deck circuit board module of LED, including upper element layer 1, upper element layer 1 lower extreme fixed connection goes up solder mask 2, go up solder mask 2 fixed connection insulating connection layer 3 one end, solder mask 4 under the insulating connection layer 3 keeps away from the 2 one end fixed connection of solder mask, lower solder mask 4 lower extreme fixed connection is component layer 5 down, upper element layer 1 upper end fixed connection LED banks 13, LED banks 13 both ends are equipped with connecting piece 12, upper element layer 1 upper end is close to LED banks 13 one end and is equipped with a pair of intercommunication mouth 6, the upper element layer 1 that sets up, go up solder mask 2, solder mask 4 down, insulating connection layer 3 and lower component layer 5 make the double-deck circuit board of LED can closely link to each other and be convenient for the heat dissipation under insulating connection layer 3's connection.

The upper communicating port 6 is connected with the lower communicating port 61 through the communicating pipe 62, the communicating pipe 62 is convenient for fixedly mounting a circuit element wire, thereby facilitating the connection between circuit elements, heat conduction oil is filled in the heat conduction pipe 14, the heat conduction oil has good heat conduction and heat dissipation effects, and is convenient for dissipating heat emitted by an electronic element between the upper solder mask layer 2 and the lower solder mask layer 4, the lower element layer 5 and the upper element layer 1 are both provided with a connecting piece 12, an LED lamp group 13 and a circuit element group 11 in the same structure, the lower end of the lower element layer 5 is provided with the lower communicating port 61, the insulating connecting layer 3 is internally composed of heat conduction pouring sealant 31, the heat conduction pouring sealant 31 has excellent electrical insulation performance, can resist environmental pollution, avoids the damage to the product caused by environmental factors such as stress, vibration, humidity and the like, is particularly suitable for products requiring good heat dissipation of the pouring sealant, the heat conduction pouring sealant 31 has excellent physical and, and the middle part of the insulating connecting layer 3 is provided with a heat conduction pipe 14, and heat conduction oil is filled in the heat conduction pipe 14 so as to dissipate heat.

When the LED double-layer circuit board is used, the lower end of the upper element layer 1 is fixedly connected with the upper solder mask layer 2, the upper solder mask layer 2 is fixedly connected with the insulating connecting layer 3, the insulating connecting layer 3 is far away from one end of the upper solder mask layer 2 and is fixedly connected with the lower solder mask layer 4, the lower end of the lower solder mask layer 4 is fixedly connected with the lower element layer 5, the upper end of the upper element layer 1 is fixedly connected with the LED lamp bank 13, the two ends of the LED lamp bank 13 are provided with connecting pieces 12, one end of the upper element layer 1, which is close to the LED lamp bank 13, is provided with a pair of upper communicating ports 6, the upper element layer 1, the upper solder mask layer 2, the lower solder mask layer 4, the insulating connecting layer 3 and the lower element layer 5 enable the LED double-layer circuit board to be tightly connected and convenient to radiate heat under the connection of the insulating connecting layer 3, the connecting pipes 62 can be well used for fixing the, Lower solder mask carries out fine heat dissipation with lower component layer, and heat conduction casting glue 31 has good physics and chemical resistance ability to the heat pipe 14 that sets up and heat conduction oil can be fine carry out the heat transfer to heat conduction casting glue 31, thereby make the LED paste module can prevent the problem that the heat can't be got rid of when using.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a double-deck circuit board module of LED, includes upper element layer (1), its characterized in that, upper element layer (1) lower extreme fixed connection goes up solder mask (2), go up solder mask (2) fixed connection insulating connection layer (3) one end, solder mask (2) one end fixed connection solder mask (4) down are kept away from in insulating connection layer (3), solder mask (4) lower extreme fixed connection lower element layer (5) down, upper element layer (1) upper end fixed connection LED banks (13), LED banks (13) both ends are equipped with connecting piece (12), upper element layer (1) upper end is close to LED banks (13) one end and is equipped with a pair of intercommunication mouth (6).

2. The LED double-layer circuit board module as claimed in claim 1, wherein: the lower element layer (5) and the upper element layer (1) are the same in structure and are provided with a connecting piece (12), an LED lamp group (13) and a circuit element group (11), and a lower communicating opening (61) is formed in the lower end of the lower element layer (5).

3. The LED double-layer circuit board module as claimed in claim 1, wherein: the upper communicating port (6) is connected with the lower communicating port (61) through a communicating pipe (62).