CN217849766U - Circuit soft board with good heat dissipation performance - Google Patents
Circuit soft board with good heat dissipation performance Download PDFInfo
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- CN217849766U CN217849766U CN202221504773.XU CN202221504773U CN217849766U CN 217849766 U CN217849766 U CN 217849766U CN 202221504773 U CN202221504773 U CN 202221504773U CN 217849766 U CN217849766 U CN 217849766U
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- circuit board
- board main
- main part
- heat dissipation
- heat
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Abstract
The utility model discloses a good heat dissipation's circuit soft board, including circuit board main part and base plate, circuit board main part's one end is provided with the connector, one side fixed mounting of circuit board main part has the district of bending, circuit board main part's opposite side is provided with the covering film, be provided with coupling assembling between circuit board main part and the base plate, be provided with the through-hole on the base plate, the last louvre that is provided with of circuit board main part, through heat conduction silica gel and the cooling tube that sets up, can be with the outer wall of heat conduction cooling tube with many heats conduction through heat conduction silica gel, outside and in the heat of going through the cooling tube effluvium again, improve thermal conductivity, prolong its life, through the filter layer that sets up, when the device uses, because the filter layer is located circuit board main part's one end is in external direct contact, can prevent that the inside that the dust from getting into circuit board main part through the export of cooling tube from influencing its normal use.
Description
Technical Field
The utility model relates to a flexible circuit board field specifically is a good heat dissipation's circuit soft board.
Background
The flexible circuit board is also called as a flexible board and is a printed circuit made of flexible insulating base materials; the flexible circuit provides excellent electrical performance, can meet the design requirements of smaller and higher density mounting, and also contributes to reducing assembly processes and enhancing reliability; the flexible circuit board is the only solution to meet the requirements of miniaturization and movement of electronic products; the flexible printed circuit board can be freely bent, wound and folded, can bear millions of dynamic bending without damaging the lead, can be randomly arranged according to the space layout requirement, and can be freely moved and stretched in a three-dimensional space, so that the integration of component assembly and lead connection is realized; the flexible circuit board can greatly reduce the volume and the weight of the electronic product, and is suitable for the development of the electronic product towards high density, miniaturization and high reliability. The existing flexible printed circuit board has a plurality of types, but when the existing flexible printed circuit board is used, a large amount of heat can be emitted, but the heat radiation performance of the existing flexible printed circuit board is not very good, which can affect the service life of the flexible printed circuit board, so that the current situation is changed by a flexible printed circuit board with a good heat radiation effect.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a good heat dissipation's circuit soft board, can improve the high temperature resistance and the bending nature of circuit board through setting up the base plate, through heat conduction silica gel and the cooling tube that sets up, can be with the outer wall of heat conduction to the cooling tube with many heat conduction through heat conduction silica gel, outside in again with the heat through the cooling tube dispel away, when making equipment use, improve heat conductivility, prolong its life, through the filter layer that sets up, when the device uses, because the one end that the filter layer is located the circuit board main part is in external direct contact, can prevent that the inside that the export of dust through the cooling tube from getting into the circuit board main part from influencing its normal use, when making equipment use, prevent that the dust from getting into inside, guarantee circuit board normal use.
In order to achieve the above object, the utility model provides a following technical scheme: the circuit soft board with good heat dissipation performance comprises a circuit board main body and a substrate, wherein a connector is arranged at one end of the circuit board main body, a bending area is fixedly arranged on one side of the circuit board main body, a covering film is arranged on the other side of the circuit board main body, a connecting assembly is arranged between the circuit board main body and the substrate, a through hole is formed in the substrate, heat dissipation holes are formed in the circuit board main body, and heat dissipation assemblies are arranged on the circuit board main body and the substrate.
Preferably, the connecting assembly comprises a Pi heat-conducting double-sided copper foil and heat-conducting glue, the heat-conducting glue is adhered between the Pi heat-conducting double-sided copper foil and the circuit board main body, and the Pi heat-conducting double-sided copper foil is fixed on the lower side of the circuit board main body.
Preferably, the two ends of the circuit board main body are provided with filter layers, and the two filter layers are symmetrically arranged.
Preferably, the through hole is provided with a plurality of groups and penetrates through the substrate, and the heat dissipation hole is also provided with a plurality of groups and penetrates through the circuit board main body.
Preferably, the through holes and the heat dissipation holes are partially overlapped, and heat dissipation silica gel is arranged in the heat dissipation holes.
Preferably, the substrate is an aluminum substrate, and the through holes are arranged in a square shape.
Preferably, the radiating assembly comprises heat-conducting silica gel and a radiating pipe, and the radiating pipe is provided with a plurality of groups and is uniformly distributed between the heat-conducting silica gel and the substrate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses mainly can be with the outer wall of heat conduction to the cooling tube with many through heat conduction silica gel, outside again in to dispel the heat through the cooling tube for when the equipment uses, improve heat conductivility, prolong its life.
2. The utility model discloses a set up high temperature resistance and the bending nature that the base plate can improve the circuit board, through heat conduction silica gel and the cooling tube that sets up.
3. The utility model discloses a filter layer that sets up, when the device uses, because the one end that the filter layer is located the circuit board is in external direct contact, can prevent that the dust from getting into its normal use of inside influence of circuit board main part through the export of cooling tube for during the use of equipment, prevent that the dust from getting into inside, guarantee circuit board main part normal use.
Drawings
FIG. 1 is a schematic view of the three-dimensional structure of the present invention;
FIG. 2 is a schematic view of the connection between the heat conductive silica gel and the substrate;
FIG. 3 is a schematic view of the connection between the Pi heat-conducting double-sided copper foil and the circuit board main body of the present invention;
fig. 4 is the structure diagram of the through hole and the heat dissipation tube of the present invention.
In the figure: 1. a circuit board main body; 2. a bending area; 3. covering the film; 4. a substrate; 5. a connection port; 6. heat dissipation holes; 7. a through hole; 9. heat conducting glue; 10. pi heat-conducting double-sided copper foil; 12. heat conducting silica gel; 14. a heat radiation pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides a technical solution: a circuit soft board with good heat dissipation performance comprises a circuit board main body 1 and a substrate 4, wherein one end of the circuit board main body 1 is provided with a connecting port 5, one side of the circuit board main body 1 is fixedly provided with a bending area 2, the other side of the circuit board main body 1 is provided with a covering film 3, a connecting assembly is arranged between the circuit board main body 1 and the substrate 4, a through hole 7 is formed in the substrate 4, heat dissipation holes 6 are formed in the circuit board main body 1 and the substrate 4, the high temperature resistance and the bending performance of a circuit board can be improved by arranging the substrate 4, through the arranged heat conduction silica gel 12 and the heat dissipation tubes 14, much heat can be conducted to the outer walls of the heat dissipation tubes 14 through the heat conduction silica gel 12, the heat can be dissipated through the heat dissipation tubes 14 from outside to inside, when equipment is used, the heat conduction performance is improved, the service life of the circuit board soft board is prolonged, when the device is used, because one end, located at the circuit board main body, is in direct contact with the outside, dust can be prevented from entering the inside of the circuit board main body 1 through an outlet of the heat dissipation tubes 14, and normal use of the circuit board is prevented, and the normal use of the circuit board soft board is ensured.
The connecting assembly comprises a Pi heat-conducting double-sided copper foil 10 and heat-conducting glue 9, the heat-conducting glue 9 is bonded between the Pi heat-conducting double-sided copper foil 10 and the circuit board main body 1, and the Pi heat-conducting double-sided copper foil 10 is fixed on the lower side of the circuit board main body 1, so that the heat-conducting performance is improved, and the service life of the connecting assembly is prolonged.
Both ends of circuit board main part 1 all are provided with the filter layer, and two sets of filter layers are the symmetry setting, through the filter layer that sets up, when the device uses, because the one end that the filter layer is located the circuit board main part is in external direct contact, can prevent that the dust from getting into circuit board main part 1's inside through the export of cooling tube 14 and influencing its normal use for during the use of equipment, prevent that the dust from getting into inside, guarantee circuit board main part 1 normal use.
The through hole 7 is provided with the multiunit and runs through the base plate 4, and the louvre 6 also is provided with the multiunit and runs through in circuit board main part 1, through the through hole 7 with the heat through the cooling tube 14 effluvium in to for when the equipment uses, improve heat conductivility, prolong its life.
Through- hole 7 and 6 partial coincidences of louvre, and be provided with heat dissipation silica gel in the louvre 6, through heat conduction silica gel 12 and the cooling tube 14 that sets up, can be with the outer wall of heat conduction to cooling tube 14 with many heat conduction through heat conduction silica gel 12, outside again in with the heat through the cooling tube 14 dispel away for when equipment uses, improve heat conductivility, prolong its life.
The base plate 4 is an aluminum base plate 4, the through holes 7 are arranged in a square mode, the high temperature resistance and the bending performance of the circuit board can be improved through the base plate 4, heat is dissipated through the radiating pipes 14 from the inside of the through holes 7, the heat conducting performance is improved when the heat dissipation device is used, and the service life of the heat dissipation device is prolonged.
The radiating component comprises heat-conducting silica gel 12 and a radiating pipe 14, the radiating pipe 14 is provided with a plurality of groups and is evenly distributed between the heat-conducting silica gel 12 and a substrate 4, through the heat-conducting silica gel 12 and the radiating pipe 14 which are arranged, the heat can be conducted to the outer wall of the radiating pipe 14 through the heat-conducting silica gel 12, and the heat is radiated out through the radiating pipe 14 in the outside to the inside, so that the heat-conducting performance is improved and the service life of the radiating pipe is prolonged when the equipment is used.
During the specific use, will connect connector 5 to required position and use, then adjust required degree of curvature through bending district 2, can improve the high temperature resistance and the bending property of circuit board through setting up base plate 4, through heat conduction silica gel 12 and the cooling tube 14 that sets up, can be with the outer wall of heat conduction cooling tube 14 with many heats conduction through heat conduction silica gel 12, outside in again with heat through cooling tube 14 effluvium, when making equipment use, improve heat conductivility, prolong its life, through the filter layer that sets up, when the device uses, because the one end that the filter layer is located the circuit board main part is in external direct contact, can prevent that the inside of dust through cooling tube 14's export entering circuit board main part 1 from influencing its normal use, when making equipment use, prevent that the dust from getting into inside, guarantee circuit board main part 1 normal use.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. A circuit flexible board with good heat dissipation performance comprises a circuit board main body (1) and a substrate (4), and is characterized in that: the one end of circuit board main part (1) is provided with connector (5), one side fixed mounting of circuit board main part (1) has bending area (2), the opposite side of circuit board main part (1) is provided with hiding membrane (3), be provided with coupling assembling between circuit board main part (1) and base plate (4), be provided with through-hole (7) on base plate (4), be provided with louvre (6) on circuit board main part (1), be provided with radiator unit on circuit board main part (1) and base plate (4).
2. The flexible printed circuit board with good heat dissipation performance of claim 1, wherein: the connecting assembly comprises a Pi heat-conducting double-sided copper foil (10) and heat-conducting glue (9), the heat-conducting glue (9) is bonded between the Pi heat-conducting double-sided copper foil (10) and the circuit board main body (1), and the Pi heat-conducting double-sided copper foil (10) is fixed on the lower side of the circuit board main body (1).
3. The flexible printed circuit board with good heat dissipation performance as claimed in claim 1, wherein: the two ends of the circuit board main body (1) are provided with filter layers, and the two filter layers are symmetrically arranged.
4. The flexible printed circuit board with good heat dissipation performance as claimed in claim 1, wherein: the through holes (7) are provided with a plurality of groups and penetrate through the substrate (4), and the heat dissipation holes (6) are also provided with a plurality of groups and penetrate through the circuit board main body (1).
5. The flexible printed circuit board with good heat dissipation performance as set forth in claim 4, wherein: the through holes (7) are partially overlapped with the heat dissipation holes (6), and heat dissipation silica gel is arranged in the heat dissipation holes (6).
6. The flexible printed circuit board with good heat dissipation performance as claimed in claim 1, wherein: the substrate (4) is an aluminum substrate (4), and the through holes (7) are arranged in a square shape.
7. The flexible printed circuit board with good heat dissipation performance as claimed in claim 1, wherein: the radiating assembly comprises heat-conducting silica gel (12) and a radiating pipe (14), wherein the radiating pipe (14) is provided with a plurality of groups and is uniformly distributed between the heat-conducting silica gel (12) and the substrate (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221504773.XU CN217849766U (en) | 2022-06-15 | 2022-06-15 | Circuit soft board with good heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202221504773.XU CN217849766U (en) | 2022-06-15 | 2022-06-15 | Circuit soft board with good heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217849766U true CN217849766U (en) | 2022-11-18 |
Family
ID=84024194
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202221504773.XU Active CN217849766U (en) | 2022-06-15 | 2022-06-15 | Circuit soft board with good heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217849766U (en) |
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2022
- 2022-06-15 CN CN202221504773.XU patent/CN217849766U/en active Active
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