CN215073130U - Multilayer circuit board capable of fast radiating - Google Patents
Multilayer circuit board capable of fast radiating Download PDFInfo
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- CN215073130U CN215073130U CN202121337568.4U CN202121337568U CN215073130U CN 215073130 U CN215073130 U CN 215073130U CN 202121337568 U CN202121337568 U CN 202121337568U CN 215073130 U CN215073130 U CN 215073130U
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Abstract
The utility model provides a multilayer circuit board capable of fast heat dissipation, which comprises an upper layer board, a first heat conduction insulating layer positioned at the lower end of the upper layer board, a first double-sided board, a second heat conduction insulating layer and a lower layer board, a cold water pipe is arranged between the first heat-conducting insulating layer and the second heat-conducting insulating layer, the cold water pipe comprises a first joint, a first pipe body, a second pipe body, a third pipe body, a fourth pipe body, a fifth pipe body and a second joint, a third heat-conducting insulating layer is arranged on one side of the first double-face plate, the first pipe body is positioned on the inner side of the third heat-conducting insulating layer, a fourth heat-conducting insulating layer is arranged between the first double-face plate and the second double-face plate, the third tube body is positioned at the inner side of the third heat-conducting insulating layer, and a fifth heat conduction insulating layer is arranged on one side of the second double-sided board, and the fifth pipe body is positioned on the inner side of the third heat conduction insulating layer. The utility model discloses a multilayer circuit board, the radiating efficiency is high.
Description
Technical Field
The utility model relates to a circuit board technical field, concretely relates to quick radiating multilayer circuit board.
Background
Circuit boards are providers of electrical connections for electronic components, and a major advantage of circuit boards is that wiring and assembly errors are greatly reduced. In the prior art, a circuit board usually utilizes a small fan to dissipate heat, and the heat dissipation mode of the small fan easily causes great noise and has low heat dissipation efficiency.
SUMMERY OF THE UTILITY MODEL
To above problem, the utility model provides a quick radiating multilayer circuit board, the radiating efficiency is high.
In order to achieve the above object, the present invention provides the following technical solutions:
a multi-layer circuit board capable of fast heat dissipation comprises an upper plate, a first heat-conducting insulating layer positioned at the lower end of the upper plate, a first double-face plate positioned at the lower end of the first heat-conducting insulating layer, a second double-face plate, a second heat-conducting insulating layer positioned at the lower ends of the first double-face plate and the second double-face plate, and a lower plate positioned at the lower end of the second heat-conducting insulating layer, wherein a cold water pipe is arranged between the first heat-conducting insulating layer and the second heat-conducting insulating layer and comprises a first joint, a first pipe body, a second pipe body, a third pipe body, a fourth pipe body, a fifth pipe body and a second joint, a third heat-conducting insulating layer is arranged on one side of the first double-face plate, the first pipe body is positioned on the inner side of the third heat-conducting insulating layer, a fourth heat-conducting insulating layer is arranged between the first double-face plate and the second double-face plate, and the third pipe body is positioned on the inner side of the third heat-conducting insulating layer, and a fifth heat conduction insulating layer is arranged on one side of the second double-sided board, and the fifth pipe body is positioned on the inner side of the third heat conduction insulating layer.
Specifically, the upper end of the upper plate is provided with a first circuit layer, the upper end and the lower end of the first double-face plate are respectively provided with a second circuit layer and a third circuit layer, the upper end and the lower end of the second double-face plate are respectively provided with a fourth circuit layer and a fifth circuit layer, and the lower end of the upper plate is provided with a sixth circuit layer.
Specifically, first circuit layer with be connected with first electrically conductive hole between the second circuit layer, first circuit layer with be connected with the second electrically conductive hole between the fourth circuit layer, the second circuit layer with be connected with the third electrically conductive hole between the third circuit layer, the fourth circuit layer with be connected with the fourth electrically conductive hole between the fifth circuit layer, the third circuit layer with be connected with the fifth electrically conductive hole between the sixth circuit layer, the fifth circuit layer with be connected with the sixth electrically conductive hole between the sixth circuit layer.
Specifically, the first double-sided board is also coated with a first waterproof membrane layer.
Specifically, the second double-sided board is also coated with a second waterproof film layer.
The utility model has the advantages that:
the utility model discloses a multilayer circuit board has increased a cold water pipe between first heat-conducting insulation layer and second heat-conducting insulation layer, and the cold water pipe is through between first double sided board and the second double sided board, and after the cold water pipe let in cold water, take away the inboard heat of multilayer circuit board through cold water, improved the radiating efficiency of circuit board.
Drawings
Fig. 1 is a schematic structural view of a multilayer circuit board for rapid heat dissipation of the present invention.
Fig. 2 is a schematic structural view of the intercooling water pipe of the present invention.
The reference signs are: the heat-conducting and heat-insulating composite pipe comprises an upper plate 1, a first heat-conducting and heat-insulating layer 2, a first double panel 3, a second double panel 4, a second heat-conducting and heat-insulating layer 5, a lower plate 6, a cold water pipe 7, a first joint 71, a first pipe body 72, a second pipe body 73, a third pipe body 74, a fourth pipe body 75, a fifth pipe body 76, a second joint 77, a third heat-conducting and heat-insulating layer 8, a fourth heat-conducting and heat-insulating layer 9, a fifth heat-conducting and heat-insulating layer 10, a first circuit layer 11, a second circuit layer 12, a third circuit layer 13, a fourth circuit layer 14, a fifth circuit layer 15, a sixth circuit layer 16, a first conductive hole 17, a second conductive hole 18, a third conductive hole 19, a fourth conductive hole 20, a fifth conductive hole 21, a sixth conductive hole 22, a first waterproof film layer 23 and a second waterproof film layer 24.
Detailed Description
The present invention will be described in further detail with reference to the following examples and drawings, but the present invention is not limited thereto.
As shown in fig. 1-2:
a multi-layer circuit board capable of fast heat dissipation comprises an upper plate 1, a first heat-conducting insulating layer 2 positioned at the lower end of the upper plate 1, a first double-face plate 3 positioned at the lower end of the first heat-conducting insulating layer 2, a second double-face plate 4, a second heat-conducting insulating layer 5 positioned at the lower end of the first double-face plate 3 and the second double-face plate 4, and a lower plate 6 positioned at the lower end of the second heat-conducting insulating layer 5, wherein a cold water pipe 7 is arranged between the first heat-conducting insulating layer 2 and the second heat-conducting insulating layer 5, the cold water pipe 7 comprises a first connector 71, a first pipe body 72, a second pipe body 73, a third pipe body 74, a fourth pipe body 75, a fifth pipe body 76 and a second connector 77, a third heat-conducting insulating layer 8 is arranged at one side of the first double-face plate 3, the first pipe body 72 is positioned at the inner side of the third heat-conducting insulating layer 8, a fourth heat-conducting insulating layer 9 is arranged between the first double-face plate 3 and the second double-face plate 4, and the third pipe body 74 is positioned at the inner side of the third heat-conducting insulating layer 8, the second double-sided board 4 one side is equipped with fifth heat conduction insulation layer 10, fifth body 76 is located 8 inboards of third heat conduction insulation layer, first joint 71 and water piping connection, second joint 77 and drain pipe connection, the inlet tube lets in cold water toward first joint 71, cold water process is in proper order through first body 72, second body 73, third body 74, fourth body 75, fifth body 76, discharge to the drain pipe from second joint 77, the cold water flow in-process, derive the inboard heat of multilayer circuit board, thereby multilayer circuit board's radiating efficiency has been promoted.
Preferably, the upper end of the upper plate 1 is provided with a first circuit layer 11, the upper and lower ends of the first double-panel 3 are respectively provided with a second circuit layer 12 and a third circuit layer 13, the upper and lower ends of the second double-panel 4 are respectively provided with a fourth circuit layer 14 and a fifth circuit layer 15, and the lower end of the upper plate 1 is provided with a sixth circuit layer 16.
Preferably, a first conductive hole 17 is connected between the first circuit layer 11 and the second circuit layer 12, a second conductive hole 18 is connected between the first circuit layer 11 and the fourth circuit layer 14, a third conductive hole 19 is connected between the second circuit layer 12 and the third circuit layer 13, a fourth conductive hole 20 is connected between the fourth circuit layer 14 and the fifth circuit layer 15, a fifth conductive hole 21 is connected between the third circuit layer 13 and the sixth circuit layer 16, and a sixth conductive hole 22 is connected between the fifth circuit layer 15 and the sixth circuit layer 16.
Preferably, the first double panel 3 is also coated at its edges with a first waterproofing membrane 23.
Preferably, the second double panel 4 is also coated at its edges with a second waterproofing membrane layer 24.
The above examples only represent 1 embodiment of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A multilayer circuit board capable of quickly dissipating heat is characterized by comprising an upper plate (1), a first heat-conducting insulating layer (2) positioned at the lower end of the upper plate (1), a first double-face plate (3) positioned at the lower end of the first heat-conducting insulating layer (2), a second double-face plate (4), a second heat-conducting insulating layer (5) positioned at the lower ends of the first double-face plate (3) and the second double-face plate (4), and a lower plate (6) positioned at the lower end of the second heat-conducting insulating layer (5), wherein a cold water pipe (7) is arranged between the first heat-conducting insulating layer (2) and the second heat-conducting insulating layer (5), the cold water pipe (7) comprises a first joint (71), a first pipe body (72), a second pipe body (73), a third pipe body (74), a fourth pipe body (75), a fifth pipe body (76) and a second joint (77), a third heat-conducting insulating layer (8) is arranged on one side of the first double-face plate (3), the first pipe body (72) is located on the inner side of the third heat-conducting insulating layer (8), a fourth heat-conducting insulating layer (9) is arranged between the first double-face plate (3) and the second double-face plate (4), the third pipe body (74) is located on the inner side of the third heat-conducting insulating layer (8), a fifth heat-conducting insulating layer (10) is arranged on one side of the second double-face plate (4), and the fifth pipe body (76) is located on the inner side of the third heat-conducting insulating layer (8).
2. The multilayer circuit board for rapid heat dissipation according to claim 1, wherein a first circuit layer (11) is disposed at an upper end of the upper board (1), a second circuit layer (12) and a third circuit layer (13) are disposed at upper and lower ends of the first double-sided board (3), a fourth circuit layer (14) and a fifth circuit layer (15) are disposed at upper and lower ends of the second double-sided board (4), and a sixth circuit layer (16) is disposed at a lower end of the upper board (1).
3. The multilayer circuit board for rapid heat dissipation according to claim 2, wherein a first conductive hole (17) is connected between the first circuit layer (11) and the second circuit layer (12), a second conductive hole (18) is connected between the first circuit layer (11) and the fourth circuit layer (14), a third conductive hole (19) is connected between the second circuit layer (12) and the third circuit layer (13), a fourth conductive hole (20) is connected between the fourth circuit layer (14) and the fifth circuit layer (15), a fifth conductive hole (21) is connected between the third circuit layer (13) and the sixth circuit layer (16), and a sixth conductive hole (22) is connected between the fifth circuit layer (15) and the sixth circuit layer (16).
4. A rapid heat dissipation multilayer circuit board according to claim 1, characterized in that the first double-sided board (3) is also coated with a first waterproof film layer (23) at its edges.
5. A rapid thermal dissipation multilayer circuit board according to claim 1, characterized in that the second double panel (4) is also coated on its edges with a second waterproof film layer (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121337568.4U CN215073130U (en) | 2021-06-16 | 2021-06-16 | Multilayer circuit board capable of fast radiating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121337568.4U CN215073130U (en) | 2021-06-16 | 2021-06-16 | Multilayer circuit board capable of fast radiating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215073130U true CN215073130U (en) | 2021-12-07 |
Family
ID=79203266
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121337568.4U Active CN215073130U (en) | 2021-06-16 | 2021-06-16 | Multilayer circuit board capable of fast radiating |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN215073130U (en) |
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2021
- 2021-06-16 CN CN202121337568.4U patent/CN215073130U/en active Active
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