CN214014630U - High heat dissipation PCB board - Google Patents
High heat dissipation PCB board Download PDFInfo
- Publication number
- CN214014630U CN214014630U CN202022871032.2U CN202022871032U CN214014630U CN 214014630 U CN214014630 U CN 214014630U CN 202022871032 U CN202022871032 U CN 202022871032U CN 214014630 U CN214014630 U CN 214014630U
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- CN
- China
- Prior art keywords
- heat
- pcb
- aluminum plate
- plate
- heat conduction
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 31
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims abstract description 85
- 229910052782 aluminium Inorganic materials 0.000 claims abstract description 85
- 238000009413 insulation Methods 0.000 claims abstract description 13
- 238000000926 separation method Methods 0.000 claims abstract description 4
- 238000001816 cooling Methods 0.000 claims description 12
- 239000002826 coolant Substances 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 9
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 9
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 8
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 8
- 239000000110 cooling liquid Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 239000002355 dual-layer Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high heat dissipation PCB board, which comprises a first PCB board and a second PCB board, wherein a heat dissipation component is arranged in front of the first PCB board and the second PCB board, the heat dissipation component comprises a first heat conduction aluminum plate, a heat insulation board and a second heat conduction aluminum plate, one surface of the first heat conduction aluminum plate is connected with the first PCB board, the other surface of the first heat conduction aluminum plate is connected with one surface of the heat insulation board, one surface of the second heat conduction aluminum plate is connected with the second PCB board, the other surface of the second heat conduction aluminum plate is connected with the other surface of the heat insulation board, the lower ends of the first heat-conducting aluminum plate and the second heat-conducting aluminum plate are both connected with a step-shaped step heat-conducting plate, the two step heat-conducting plates are respectively positioned at the two sides of the heat-insulating plate, the step surface of the step heat-conducting plate is matched with the lower end surfaces of the corresponding first PCB and the second PCB, and a separation plate is arranged between the corresponding stepped heat-conducting plate and the lower end faces of the first PCB and the second PCB. The utility model provides the high radiating effect.
Description
Technical Field
The utility model relates to a PCB's technical field, in particular to high heat dissipation PCB board.
Background
The circuit board is named as a circuit board, a PCB board, an aluminum substrate, a high-frequency board, a thick copper board, an impedance board, a PCB, an ultra-thin circuit board, a printed (copper etching technology) circuit board and the like. The circuit board enables the circuit to be miniaturized and visualized, plays an important role in the batch production of fixed circuits and the optimization of the layout of electrical appliances, and is a PCB (printed Circuit Board) which is also called as a printed circuit board and is a provider for electrical connection of electronic components; many PCB boards need to be mounted in many devices.
However, most of the existing PCB boards are combined in a dual-layer manner, but after the PCB boards are combined and mounted, most of the PCB boards are combined back to back, which causes poor heat dissipation effect, and thus improvement is needed.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat dissipation PCB board to solve the poor problem of radiating effect who proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: a high heat dissipation PCB board comprises a first PCB board and a second PCB board, wherein a heat dissipation component mutually adhered with the first PCB board and the second PCB board is arranged in front of the first PCB board and the second PCB board, the heat dissipation assembly comprises a first heat conduction aluminum plate, a heat insulation plate and a second heat conduction aluminum plate, one surface of the first heat conduction aluminum plate is connected with the first PCB, the other side of the first heat-conducting aluminum plate is connected with one side of the heat insulation plate, one side of the second heat-conducting aluminum plate is connected with the second PCB plate, the other side of the second heat-conducting aluminum plate is connected with the other side of the heat insulation plate, the lower ends of the first heat-conducting aluminum plate and the second heat-conducting aluminum plate are both connected with a step-shaped step heat-conducting plate, the two step heat-conducting plates are respectively positioned at the two sides of the heat-insulating plate, the step surface of the step heat-conducting plate is matched with the lower end surfaces of the corresponding first PCB and the second PCB, and a separation plate is arranged between the corresponding stepped heat-conducting plate and the lower end faces of the first PCB and the second PCB.
As preferred, all be equipped with a third heat conduction aluminum plate between first heat conduction aluminum plate and the second heat conduction aluminum plate and the heat insulating board that corresponds, the ladder heat-conducting plate three ladder faces have, the first ladder face of ladder heat-conducting plate and the third heat conduction aluminum plate lower extreme face contact that corresponds, the third ladder face of ladder heat-conducting plate and the lower extreme face and the back contact of the first PCB board or the second PCB board that correspond, the second ladder face of ladder heat-conducting plate and the lower extreme face and the back contact of the first heat conduction aluminum plate or the second heat conduction aluminum plate that correspond.
Preferably, the lengths of the first heat-conducting aluminum plate and the second heat-conducting aluminum plate are shorter than those of the first PCB and the second PCB, the upper end of the heat-insulating plate is lower than those of the first heat-conducting aluminum plate and the second heat-conducting aluminum plate, the lower end of the heat-insulating plate is longer than those of the first heat-conducting aluminum plate and the second heat-conducting aluminum plate, a T-shaped cooling chamber is arranged between the first heat-conducting aluminum plate and the second heat-conducting aluminum plate, the lower end of the T-shaped cooling chamber is abutted to the upper end face of the heat-insulating plate, and cooling liquid is arranged in the T-shaped cooling chamber.
Preferably, the lower portion of the stepped heat conductive plate extends out of the corresponding first and second PCB boards.
Preferably, the lower end faces of the first and second PCBs are arranged at the lower part of the stepped heat conducting plate.
The utility model provides a high heat dissipation PCB board, set up a heat insulating board between two first PCB boards and second PCB board, then set up in heat insulating board both sides with the first heat conduction aluminum plate of first PCB board complex, with second PCB board complex second heat conduction aluminum plate, utilize heat conduction aluminum plate to carry out heat conduction heat dissipation to the PCB board of both sides, then utilize the further heat conduction of ladder heat-conducting plate to discharge the heat, can not influence other PCB boards simultaneously when the heat extraction, influence each other between two PCB boards, finally improve the radiating effect.
Drawings
Fig. 1 is a schematic structural diagram of a high heat dissipation PCB board in this embodiment 1;
fig. 2 is a schematic structural diagram of a high heat dissipation PCB board in this embodiment 2;
fig. 3 is a schematic structural diagram of a high heat dissipation PCB board in this embodiment 3.
In the figure: the heat-conducting aluminum plate comprises a first PCB (printed Circuit Board) 1, a second PCB 2, a first heat-conducting aluminum plate 3, a heat-insulating plate 4, a second heat-conducting aluminum plate 5, a stepped heat-conducting plate 6, an isolating plate 7, a third heat-conducting aluminum plate 8, a first stepped surface 6-1, a third stepped surface 6-3, a second stepped surface 6-2 and a T-shaped cooling chamber 9.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1, the embodiment provides a high heat dissipation PCB, which includes a first PCB 1 and a second PCB 2, a heat dissipation assembly adhered to the first PCB 1 and the second PCB 2 is disposed in front of the first PCB 1 and the second PCB 2, the heat dissipation assembly includes a first heat conductive aluminum plate 3, a heat insulation plate 4 and a second heat conductive aluminum plate 5, one surface of the first heat conductive aluminum plate 3 is connected to the first PCB 1, the other surface of the first heat conductive aluminum plate 3 is connected to one surface of the heat insulation plate 4, one surface of the second heat conductive aluminum plate 5 is connected to the second PCB 2, the other surface of the second heat conductive aluminum plate 5 is connected to the other surface of the heat insulation plate 4, a stepped heat conduction plate 6 is connected to the lower ends of the first heat conductive aluminum plate 3 and the second heat conductive aluminum plate 5, the two stepped heat conduction plates 6 are respectively located at two sides of the heat conduction plate 4, and the stepped surfaces of the stepped heat conduction plates 6 are matched with the lower end surfaces of the first PCB 1 and the second PCB 2, and a separation plate 7 is arranged between the corresponding stepped heat conduction plate 6 and the lower end faces of the first PCB board 1 and the second PCB board 2.
Preferably, a third heat-conducting aluminum plate 8 is arranged between each of the first heat-conducting aluminum plate 3 and the second heat-conducting aluminum plate 5 and the corresponding heat-insulating plate 4, the step heat-conducting plate 6 is provided with three step surfaces, the first step surface 6-1 of the step heat-conducting plate 6 is in end-to-end contact with the corresponding third heat-conducting aluminum plate 8, the third step surface 6-3 of the step heat-conducting plate 6 is in end-to-end contact with the corresponding first PCB plate 1 or the second PCB plate 2, and the second step surface 6-2 of the step heat-conducting plate 6 is in end-to-end contact with the corresponding first heat-conducting aluminum plate 3 or the second heat-conducting aluminum plate 5.
Preferably, the lower portion of the stepped heat conducting plate 6 protrudes from the corresponding first and second PCB boards 1 and 2.
Through the structure setting, set up a heat insulating board 4 between two first PCB boards 1 and second PCB board 2, then set up in 4 both sides of heat insulating board with the first heat conduction aluminum plate 3 of 1 complex of first PCB board, with second PCB board 2 complex second heat conduction aluminum plate 5, utilize heat conduction aluminum plate to carry out the heat conduction heat dissipation to the PCB board of both sides, then utilize ladder heat-conducting plate 6 further heat conduction to discharge the heat, can not influence other PCB boards simultaneously when the heat extraction, influence each other between two PCB boards, finally improve the radiating effect.
Example 2:
referring to fig. 2, in the present embodiment, the lengths of the first heat conductive aluminum plate 3 and the second heat conductive aluminum plate 5 are both shorter than the lengths of the first PCB 1 and the second PCB 2, the upper end of the heat insulating plate 4 is lower than the upper ends of the first heat conductive aluminum plate 3 and the second heat conductive aluminum plate 5, the lower end of the heat insulating plate 4 is longer than the lower ends of the first heat conductive aluminum plate 3 and the second heat conductive aluminum plate 5, a T-shaped cooling chamber 9 is disposed between the first heat conductive aluminum plate 3 and the second heat conductive aluminum plate 5, the lower end of the T-shaped cooling chamber 9 abuts against the upper end surface of the heat insulating plate 4, a cooling liquid is disposed in the T-shaped cooling chamber 9, the T-shaped cooling chamber 9 is disposed between the two first PCB 1 and the second PCB 2, and the cooling liquid is disposed in the T-shaped cooling chamber 9 to further improve a heat dissipation effect.
Example 3:
referring to fig. 3, in the present embodiment, a high heat dissipation PCB is provided, preferably, the lower end surfaces of the first PCB 1 and the second PCB 2 are covered by the lower portion of the stepped heat conduction plate 6, and the lower portion of the stepped heat conduction plate 6 is provided with an edge covering structure, so that the heat dissipation effect is further improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. A high heat dissipation PCB board, includes first PCB board (1) and second PCB board (2), its characterized in that: the heat dissipation structure is characterized in that a heat dissipation assembly which is mutually pasted with the first PCB (1) and the second PCB (2) is arranged in front of the first PCB (1) and the second PCB (2), the heat dissipation assembly comprises a first heat conduction aluminum plate (3), a heat insulation plate (4) and a second heat conduction aluminum plate (5), one surface of the first heat conduction aluminum plate (3) is connected with the first PCB (1), the other surface of the first heat conduction aluminum plate (3) is connected with one surface of the heat insulation plate (4), one surface of the second heat conduction aluminum plate (5) is connected with the second PCB (2), the other surface of the second heat conduction aluminum plate (5) is connected with the other surface of the heat insulation plate (4), stepped ladder heat conduction plates (6) are connected to the lower ends of the first heat conduction aluminum plate (3) and the second heat conduction aluminum plate (5), and the two ladder heat conduction plates (6) are respectively positioned on two sides of the heat insulation plate (4), and the step surface of the step heat-conducting plate (6) is matched with the lower end surfaces of the corresponding first PCB (1) and the second PCB (2), and a separation plate (7) is arranged between the corresponding step heat-conducting plate (6) and the lower end surfaces of the first PCB (1) and the second PCB (2).
2. The PCB board with high heat dissipation as recited in claim 1, wherein: all be equipped with a third heat conduction aluminum plate (8) between first heat conduction aluminum plate (3) and second heat conduction aluminum plate (5) and heat insulating board (4) that correspond, ladder heat-conducting plate (6) three ladder face has, terminal surface contact under first ladder face (6-1) of ladder heat-conducting plate (6) and the third heat conduction aluminum plate (8) that corresponds, the lower terminal surface and the back contact of third ladder face (6-3) and the first PCB board (1) or second PCB board (2) that correspond of ladder heat-conducting plate (6), the lower terminal surface and the back contact of second ladder face (6-2) and the first heat conduction aluminum plate (3) or second heat conduction aluminum plate (5) that correspond of ladder heat-conducting plate (6).
3. The PCB board with high heat dissipation as recited in claim 2, wherein: the length of first heat conduction aluminum plate (3) and second heat conduction aluminum plate (5) all is less than first PCB board (1) and second PCB board (2), the upper end of heat insulating board (4) is less than the upper end of first heat conduction aluminum plate (3) and second heat conduction aluminum plate (5), the lower extreme of heat insulating board (4) is longer than the lower extreme of first heat conduction aluminum plate (3) and second heat conduction aluminum plate (5), and is equipped with T type cooling chamber (9) between first heat conduction aluminum plate (3) and second heat conduction aluminum plate (5), the lower extreme of T type cooling chamber (9) offsets with the up end of heat insulating board (4), sets up the coolant liquid in T type cooling chamber (9).
4. The PCB board with high heat dissipation as recited in claim 1, wherein: the lower part of the ladder heat-conducting plate (6) extends out of the corresponding first PCB (1) and second PCB (2).
5. The PCB board with high heat dissipation as recited in claim 2, wherein: the lower end faces of the first PCB (1) and the second PCB (2) which correspond to each other are covered by the lower portion of the stepped heat conducting plate (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022871032.2U CN214014630U (en) | 2020-12-04 | 2020-12-04 | High heat dissipation PCB board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202022871032.2U CN214014630U (en) | 2020-12-04 | 2020-12-04 | High heat dissipation PCB board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN214014630U true CN214014630U (en) | 2021-08-20 |
Family
ID=77310586
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202022871032.2U Expired - Fee Related CN214014630U (en) | 2020-12-04 | 2020-12-04 | High heat dissipation PCB board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN214014630U (en) |
-
2020
- 2020-12-04 CN CN202022871032.2U patent/CN214014630U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20210820 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |