CN211046740U

CN211046740U - Synchronous rectification power supply device

Info

Publication number: CN211046740U
Application number: CN201922464551.4U
Authority: CN
Inventors: 洪道绿
Original assignee: Jiangsu Kangpin Electrical Technology Co ltd
Current assignee: Jiangsu Kangpin Electrical Technology Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-07-17
Anticipated expiration: 2029-12-31

Abstract

The utility model relates to a high-power supply technical field provides a synchronous rectification power supply device, including base plate, input pole, output pole, be provided with the breach in the middle of the base plate, the input pole sets up in breach department, and the output pole sets up in the lower terminal surface of base plate, the input pole passes through MOS pipe subassembly and base plate and output pole electric connection, just have the clearance between output pole and the input pole. The utility model discloses not directly link together input pole and output pole, but make input pole and output pole connect the electricity through MOS pipe and base plate and be connected, and input pole and output pole also do not contact, leave the clearance between to can faster heat dissipation when the work generates heat.

Description

Synchronous rectification power supply device

Technical Field

The utility model relates to a high-power supply technical field, in particular to synchronous rectification power supply device.

Background

At present, with the rapid development of power electronic technology, the relationship between power electronic equipment and the work and life of people is increasingly close, and the electronic equipment cannot be powered by a reliable power supply. Compared with the traditional power frequency direct current power supply, the high-frequency switching power supply has the advantages of small volume, light weight, high efficiency and the like, and is widely applied to occasions of electrolysis, electrochemistry and the like of large current. The current of generally requiring output is thousands of ampere, and the electric current too big can lead to the temperature to rise faster, and the device of high frequency switching power supply known at present arranges the laminating compactness, if satisfy the heavy current, then be unfavorable for the heat dissipation, if satisfy the heat dissipation, then can make switching power supply's volume grow.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to improve the not enough that exists among the prior art, provide a synchronous rectification power supply device, can effectually dispel the heat.

In order to realize the purpose of the utility model, the embodiment of the utility model provides a following technical scheme:

The utility model provides a synchronous rectification power supply device, includes base plate, input pole, output pole, be provided with the breach in the middle of the base plate, the input pole sets up in breach department, and the output pole sets up in the lower terminal surface of base plate, the input pole passes through MOS pipe assembly and is connected with base plate and output pole electricity, just there is the clearance between output pole and the input pole.

The utility model discloses not directly link together input pole and output pole, but make input pole and output pole connect the electricity through MOS pipe and base plate and be connected, and input pole and output pole also do not contact, leave the clearance between to can faster heat dissipation when the work generates heat.

Furthermore, for better realization the utility model discloses, the output pole includes first output pole, second output pole, the up end of first output pole, second output pole is connected with the lower terminal surface of base plate, and has the clearance between first output pole, second output pole and the input pole.

The first output pole and the second output pole are divided into two groups in parallel and are arranged symmetrically to the input pole, so that the installation space is saved.

Furthermore, for better realization the utility model discloses, the lower terminal surface electricity of first output pole, second output pole is connected with the motherboard, just there is the clearance between motherboard and the input pole.

After the first output pole and the second output pole are connected with the motherboard, but the input pole is not contacted with the motherboard, and a gap between the input pole and the motherboard is used for filling an insulating layer, so that the input pole and the motherboard are not conductive, and the gap is reserved, so that the heat dissipation of the device can be faster when the device works.

Furthermore, for better realization the utility model discloses, the lower terminal surface of input utmost point is provided with the insulating layer, and the laminating of the lower terminal surface of insulating layer and input utmost point.

Further, for better realization the utility model discloses, the MOS pipe subassembly includes first MOS pipe subassembly, second MOS pipe subassembly, third MOS pipe subassembly, fourth MOS pipe subassembly, the input pole is connected with base plate and first output pole through first MOS pipe subassembly, third MOS pipe subassembly to the input pole is connected with base plate and second output pole through second MOS pipe subassembly, fourth MOS pipe subassembly.

Further, for better realization the utility model discloses, the input utmost point includes input, backup pad, the backup pad sets up in the breach department of base plate, and the input is protruding towards the up end of base plate.

Furthermore, in order to better realize the utility model, the input electrode is a copper block; the first output pole and the second output pole are copper blocks. The input electrode and the output electrode are both copper blocks and can support large-current work.

Compared with the prior art, the beneficial effects of the utility model are that:

The utility model does not directly connect the input electrode and the output electrode together, but connects the input electrode and the output electrode through the MOS tube and the substrate, and the input electrode and the output electrode are not contacted, and a gap is left between the input electrode and the output electrode, so that the heat can be quickly dissipated when the work generates heat; the output poles are divided into two groups in parallel and are symmetrical, so that the installation space is saved; the input electrode and the output electrode are both copper blocks and can support large-current work; after the first output pole and the second output pole are connected with the motherboard, but the input pole is not contacted with the motherboard, and a gap between the input pole and the motherboard is used for filling an insulating layer, so that the input pole and the motherboard are not conductive, and the gap is reserved, so that the heat dissipation of the device can be faster when the device works.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.

FIG. 1 is a front view of the device of the present invention;

Fig. 2 is a top view of the device of the present invention.

Description of the main elements

The semiconductor device comprises an input electrode 1, a support plate 11, an input end 12, a first output electrode 21, a second output electrode 22, a first MOS tube assembly 31, a second MOS tube assembly 32, a third MOS tube assembly 33, a fourth MOS tube assembly 34, a substrate 4, a motherboard 5 and an insulating layer 6.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. The components of embodiments of the present invention, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiment of the present invention, all other embodiments obtained by the person skilled in the art without creative work belong to the protection scope of the present invention.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Also, in the description of the present invention, the terms "first," "second," and the like are used solely for distinguishing between the descriptions and not necessarily for indicating or implying any actual such relationship or order between such entities or operations.

Example 1:

The utility model discloses a following technical scheme realizes, as shown in fig. 1, 2, a synchronous rectification power supply unit, including base plate 4, be provided with the breach in the middle of base plate 4, breach department is provided with input utmost point 1, input utmost point 1 comprises input 12 and backup pad 11 two parts, and backup pad 11 is fixed as an organic whole with input 12, and backup pad 11 sets up in base plate 4's breach department, and input 12 is protruding towards base plate 4's up end (base plate 4's up end is components and parts welded face, and the lower terminal surface then is the opposite face to the upper and lower terminal surface of base plate 4 is accurate, and input utmost point 1, output utmost point and base plate 4 up end are towards the same one side for its up end, and be its lower terminal surface with base plate 4 lower terminal surface towards the same one side.

The output pole comprises a first output pole 21 and a second output pole 22, the upper end face of the first output pole 21 and the upper end face of the second output pole 22 are respectively fixed on the lower end face of the substrate 4 and are electrically connected with the substrate 4, the first output pole 21 and the second output pole 22 are symmetrically arranged with the support plate 11, but gaps are formed between the first output pole 21 and the input pole 1 and between the second output pole 22 and the input pole 1, and the first output pole 21 and the second output pole 22 are not in direct contact.

The lower end face of the supporting plate 11 is provided with an insulating layer 6, and the insulating layer 6 is attached to the lower end face of the supporting plate 11. One or more groups of MOS tube assemblies are arranged on the support plate 11 of the input electrode 1, the input electrode 1 is electrically connected with the substrate 4 and the output electrode through the MOS tube assemblies, and the input end 12 is connected with an external power supply (not shown in the drawing).

The lower end surfaces of the first output electrode 21 and the second output electrode 22 may be electrically connected to the motherboard 5, but a gap is formed between the motherboard 5 and the lower end surface of the support plate 11, that is, the gap between the motherboard 5 and the support plate 11 is used for filling the insulating layer 6, and the insulating layer 6 may be attached to the motherboard 5 or may not be attached to the motherboard 5, so that the motherboard 5 and the support plate 11 are not directly electrically conductive, and fig. 1 shows the case where the motherboard 5 is not attached.

In the present embodiment, four sets of MOS devices are provided, as shown in fig. 2, each set of MOS devices includes four MOS devices, and the input electrode 1 is electrically connected to the substrate 4, the first output electrode 21 and the second output electrode 22 through the first MOS device 31, the second MOS device 32, the third MOS device 33 and the fourth MOS device 34, respectively. Specifically, the input electrode 1 is electrically connected to the substrate 4 and the first output electrode 21 through the first MOS tube assembly 31 and the third MOS tube assembly 33, and the input electrode 1 is electrically connected to the substrate 4 and the second output electrode 22 through the second MOS tube assembly 32 and the fourth MOS tube assembly 34. In fig. 2, the first output electrode 21 and the second output electrode 22 are provided on the lower end surface of the substrate 4, and are not directly seen in a plan view, and are indicated by broken lines.

When the device works, an external power supply is connected to the input electrode 1, the power supply entering the input electrode 1 is rectified by the MOS tube assembly, current enters the substrate 4 and the output electrode, is processed by the elements on the substrate 4, is output to the motherboard 5 from the output electrode, and is transmitted to other substrates 4 by the motherboard 5 to further work. It should be noted that the present invention does not limit and explain the connection mode and operation principle of the components (resistors, capacitors, diodes, transistors, etc.) mounted and welded on the substrate 4, nor limit and explain other substrates 4 on the motherboard 5.

The utility model does not directly connect the input electrode 1 and the output electrode together, but connects the input electrode 1 and the output electrode through the MOS tube and the substrate 4, and the input electrode 1 and the output electrode are not contacted, and a gap is left between the input electrode 1 and the output electrode, so that the heat can be quickly dissipated when the work generates heat; the output poles are divided into two groups in parallel and are symmetrical, so that the installation space is saved; the input electrode 1 and the output electrode are both copper blocks and can support large-current work; after the first output electrode 21 and the second output electrode 22 are connected with the motherboard 5, but the input electrode 1 is not in contact with the motherboard 5, the gap between the input electrode 1 and the motherboard 5 is used for filling the insulating layer 6, so that the input electrode 1 and the motherboard 5 are not conductive, and the gap is reserved, so that the heat dissipation of the device can be faster when the device works.

The above description is only for the specific embodiments of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can easily think of the changes or substitutions within the technical scope of the present invention, and all should be covered within the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A synchronous rectification power supply device comprises a substrate, and is characterized in that: including input pole, output pole, be provided with the breach in the middle of the base plate, the input pole sets up in breach department, and the output pole sets up in the lower terminal surface of base plate, the input pole passes through MOS pipe assembly and base plate and output pole electric connection, just there is the clearance between output pole and the input pole.

2. A synchronous rectification power supply unit as claimed in claim 1, wherein: the output pole comprises a first output pole and a second output pole, the upper end faces of the first output pole and the second output pole are connected with the lower end face of the substrate, and gaps are reserved among the first output pole, the second output pole and the input pole.

3. A synchronous rectification power supply unit as claimed in claim 2, wherein: the lower end faces of the first output pole and the second output pole are electrically connected with a motherboard, and a gap is formed between the motherboard and the input pole.

4. A synchronous rectification power supply unit as claimed in claim 3, wherein: the lower end face of the input pole is provided with an insulating layer, and the insulating layer is attached to the lower end face of the input pole.

5. A synchronous rectification power supply unit as claimed in claim 4, wherein: the MOS tube component comprises a first MOS tube component, a second MOS tube component, a third MOS tube component and a fourth MOS tube component, the input electrode is electrically connected with the substrate and the first output electrode through the first MOS tube component and the third MOS tube component, and the input electrode is electrically connected with the substrate and the second output electrode through the second MOS tube component and the fourth MOS tube component.

6. A synchronous rectification power supply unit as claimed in claim 5, wherein: the input pole comprises an input end and a supporting plate, the supporting plate is arranged at the notch of the base plate, and the input end protrudes towards the upper end face of the base plate.

7. A synchronous rectification power supply unit as claimed in any one of claims 1 to 6, wherein: the input electrode is a copper block.

8. A synchronous rectification power supply unit as claimed in any one of claims 2 to 6, wherein: the first output pole and the second output pole are copper blocks.