CN217037538U - Circuit board and electronic equipment - Google Patents
Circuit board and electronic equipment Download PDFInfo
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- CN217037538U CN217037538U CN202220041232.1U CN202220041232U CN217037538U CN 217037538 U CN217037538 U CN 217037538U CN 202220041232 U CN202220041232 U CN 202220041232U CN 217037538 U CN217037538 U CN 217037538U
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- circuit board
- hole
- board body
- circuit
- heat dissipation
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Abstract
The embodiment of the utility model relates to the technical field of printed circuit boards, and particularly discloses a circuit board and electronic equipment, wherein the circuit board comprises: the circuit board body is provided with a first through hole; the insulating layer is arranged on one surface of the circuit board body and is provided with a second through hole; the heat dissipation substrate is arranged on one surface of the insulating layer, which is far away from the circuit board body, and is provided with a third through hole; an electronic component provided with a pin; the third through hole, the second through hole and the first through hole are arranged corresponding to pins of the electronic element, when the pins pass through the third through hole, the second through hole and the first through hole respectively, the pins of the electronic element are connected with one surface of the circuit board body, which is far away from the heat dissipation substrate, and gaps are formed between the wall surfaces of the second through hole and the third through hole and the pins of the electronic element. Through the mode, the circuit board and the electronic element are respectively positioned on two sides of the heat dissipation substrate in the embodiment of the utility model, so that the heat dissipation performance can be improved.
Description
Technical Field
The embodiment of the utility model relates to the technical field of printed circuit boards, in particular to a circuit board and electronic equipment.
Background
Printed Circuit Boards (PCBs) are used to provide electrical connections between electronic components.
In the process of implementing the embodiment of the present invention, the inventors found that: at present, in order to meet the heat dissipation requirement of electronic components, a heat dissipation substrate is generally required to be additionally arranged on a printed circuit board. The conventional connection method for the printed circuit board, the heat dissipation substrate and the electronic component generally includes respectively disposing the heat dissipation substrate and the electronic component on two sides of the printed circuit board, wherein the heat dissipation substrate is disposed on one surface of the printed circuit board by using a surface mount technology, and the electronic component is disposed on the other surface of the printed circuit board after bending the pins. Set up like this and probably damage electronic components pin on the one hand, on the other hand radiating basal plate and electronic components are located printed circuit board both sides respectively, and the heat that electronic components gived off can not be absorbed well by radiating basal plate, and the radiating effect is not good.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the embodiments of the present invention is to provide a circuit board and an electronic device, which can improve heat dissipation performance.
In order to solve the technical problems, the utility model adopts a technical scheme that: provided are a circuit board and an electronic device, the circuit board including: electronic component, circuit board body, insulating layer and radiating basal plate. The circuit board body is provided with a first through hole. The insulating layer is arranged on one surface of the circuit board body and provided with a second through hole. The heat dissipation substrate is arranged on the surface, far away from the circuit board body, of the insulating layer and is provided with a third through hole. An electronic component provided with a pin. The third through hole, the second through hole and the first through hole are arranged corresponding to the pins of the electronic element, when the pins respectively pass through the third through hole, the second through hole and the first through hole, the pins of the electronic element are connected with one surface of the circuit board body, which is far away from the heat dissipation substrate, and gaps are formed between the wall surfaces of the second through hole and the third through hole and the pins of the electronic element.
Optionally, the circuit board body includes a first circuit and a second circuit, and the first circuit and the second circuit are respectively disposed on two opposite surfaces of the circuit board body. The circuit board body comprises a connecting piece, the circuit board body is provided with a fourth through hole, the fourth through hole penetrates through the first circuit and the second circuit, the connecting piece is arranged in the fourth through hole, and the connecting piece is respectively connected with the first circuit and the second circuit.
Optionally, the circuit board further includes a first pad, the first pad is disposed on a surface of the circuit board body away from the heat dissipation substrate, and the first pad is used to connect the circuit board body and the pins of the electronic component.
Optionally, the circuit board further includes a second pad, the second pad is disposed between the circuit board body and the insulating layer, and the second pad is connected to the circuit board body and the insulating layer, respectively.
Optionally, the circuit board further includes an insulating ring, the insulating ring is disposed in the third through hole, and the insulating ring is sleeved on the pin of the electronic component.
Optionally, the insulating ring is made of a plastic material.
Optionally, conducting layers are arranged on two side walls of the circuit board body, and the conducting layers are used for realizing side tin climbing when the circuit board body is welded.
Optionally, the heat dissipation substrate is made of an aluminum material.
According to an aspect of an embodiment of the present invention, there is provided an electronic device, wherein the air conditioner includes the circuit board described in any one of the above.
The embodiment of the utility model has the beneficial effects that: unlike the prior art, an embodiment of the present invention provides a circuit board including: the circuit board comprises a circuit board body, an insulating layer, a heat dissipation substrate and an electronic element. The heat dissipation substrate is arranged between the circuit board body and the electronic element and used for achieving heat dissipation of the circuit board body and the electronic element. The insulating layer is arranged between the circuit board body and the radiating substrate, so that short circuit is avoided. The circuit board body, the insulating layer and the radiating substrate are respectively provided with a first through hole, a second through hole and a third through hole facing to the pins of the electronic element. When the pins of the electronic element pass through the third through hole, the second through hole and the first through hole respectively, the pins of the electronic element are connected with the surface of the circuit board body, which is far away from the heat dissipation substrate, and gaps are formed between the wall surfaces of the second through hole and the third through hole and the pins of the electronic element. Through the mode, the heat dissipation substrates in the embodiment of the utility model are respectively positioned between the circuit board body and the electronic element, so that the heat of the circuit board body and the electronic element can be better absorbed, and the heat dissipation performance can be further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
Fig. 1 is a perspective view of a circuit board according to an embodiment of the utility model;
fig. 2 is a schematic connection diagram of a circuit board body, an insulating layer, a heat dissipation substrate, an electronic component, a first pad and a second pad in the circuit board according to an embodiment of the utility model.
The reference numerals in the detailed description are as follows:
| 100 | |
21 | Second through |
| 10 | |
30 | |
| 11 | |
31 | Third through |
| 12 | |
40 | |
| 13 | Fourth through |
41 | |
| 14 | |
50 | |
| 15 | First through |
60 | Second bonding pad |
| 20 | Insulating layer |
Detailed Description
In order to facilitate an understanding of the utility model, the utility model is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and fig. 2, a circuit board 100 according to an embodiment of the present invention includes: the circuit board comprises a circuit board body 10, an insulating layer 20, a heat dissipation substrate 30, an electronic element 40, a first bonding pad 50 and a second bonding pad 60. The circuit board body 10, the insulating layer 20, the heat dissipation substrate 30 and the electronic component 40 are sequentially disposed, the first pad 50 is disposed on a surface of the circuit board body 10 away from the heat dissipation substrate 30, and the second pad 60 is disposed between the circuit board body 10 and the insulating layer 20. The circuit board body 10 is a printed circuit board, and can realize connection between electronic components. The insulating layer 20 is disposed between the circuit board body 10 and the heat dissipating substrate 30 for preventing short circuit. The circuit board body 10 and the electronic component 40 are respectively located at two sides of the heat dissipation substrate 30, and the heat dissipation substrate 30 can dissipate heat for the circuit board body 10 and the electronic component 40 at the same time, so that the heat dissipation performance is improved. The first pads 50 are used to connect the circuit board body 10 and the leads 41 of the electronic component 40. The second pads 60 are used to connect the circuit board body 10 and the insulating layer 20.
Referring to fig. 2, in some embodiments, the circuit board body 10 includes a first circuit 11, a second circuit 12 and a connecting element (not shown), and the first circuit 11 and the second circuit 12 are respectively disposed on two opposite surfaces of the circuit board body 10. The circuit board body 10 is provided with a fourth through hole 13, the fourth through hole 13 penetrates through the first circuit 11 and the second circuit 12, and the connecting member is arranged in the fourth through hole 13 and is respectively connected with the first circuit 11 and the second circuit 12.
It is understood that the connecting member is made of copper material, and is used for realizing the circuit conduction between the first circuit 11 and the second circuit 12. Of course, the material of the connector is not limited thereto, and for example, other metal materials may be used as long as the circuit conduction between the first circuit 11 and the second circuit 12 can be achieved.
In some embodiments, the two side walls of the circuit board body 10 are provided with conductive layers 14, and the conductive layers 14 are used for realizing side tin-climbing during soldering of the circuit board body 10.
Referring to fig. 2, in some embodiments, the insulating layer 20 is disposed on the second surface of the circuit board body 10 by using surface mount technology.
Referring to fig. 2, in some embodiments, the heat dissipating substrate 30 is disposed on the surface of the insulating layer 20 away from the circuit board body 10 by surface mount technology.
In some embodiments, the heat-dissipating substrate 30 is made of an aluminum material. The aluminum material has good heat dissipation performance and can well realize heat dissipation. It is understood that the heat dissipation substrate 30 can also be made of other heat dissipation materials, such as heat conductive silicone, copper material, etc.
As for the above-described electronic component 40, the electronic component 40 is provided with pins 41 for realizing electrical connection. The heat dissipating substrate 30 is provided with a third through hole 31, the insulating layer 20 is provided with a second through hole 21, and the circuit board body 10 is provided with a first through hole 15. The third through hole 31, the second through hole 21 and the first through hole 15 are disposed corresponding to the pin 41 of the electronic component 40, and after the pin 41 passes through the third through hole 31, the second through hole 21 and the first through hole 15, the pin 41 of the electronic component 40 is connected to a surface of the circuit board body 10 away from the heat dissipation substrate 30, that is, the first surface of the circuit board body 10.
It should be noted that, in some embodiments, there is a gap between the wall surfaces of the second through hole 21 and the third through hole 31 and the pin 41 of the electronic component 40. The length of the gap satisfies the insulation distance, that is, the insulation distance between the insulating layer 20 and the heat dissipation substrate 30 is required to satisfy the insulation distance between the pins 41, so as to prevent the electronic component 40 from short-circuiting.
It is understood that in some embodiments, the connection between the pins 41 of the electronic component 40 and the surface of the circuit board body 10 away from the heat dissipation substrate 30 is soldering, for example, wave soldering, etc., so as to avoid bending the pins 41 and damage to the pins 41.
In some embodiments, the circuit board further includes an insulating ring (not shown) disposed in the third through hole 31, and the insulating ring is sleeved on the pin 41 of the electronic component 40 for positioning the pin 41 and insulating the pin 41 to prevent the electronic component 40 from being short-circuited.
It will be appreciated that in some embodiments, the insulator ring is made of a plastic material. Of course, the material of the insulating ring is not limited thereto, and the insulating ring may be made of other insulating materials, such as rubber.
An embodiment of the present invention provides a circuit board 100 including: the circuit board comprises a circuit board body 10, an insulating layer 20, a heat dissipation substrate 30 and an electronic element 40. The heat dissipation substrate 30 is disposed between the circuit board body 10 and the electronic component 40, and is used for dissipating heat between the circuit board body 10 and the electronic component 40. The insulating layer 20 is disposed between the circuit board body 10 and the heat dissipation substrate 30 to prevent short circuit. The circuit board body 10, the insulating layer 20 and the heat dissipating substrate 30 are respectively provided with a first through hole 15, a second through hole 21 and a third through hole 31 facing the pins 41 of the electronic component 40. After the pins 41 of the electronic component 40 pass through the third through holes 31, the second through holes 21 and the first through holes 15, the pins 41 of the electronic component 40 are connected with a surface of the circuit board body 10 away from the heat dissipation substrate 30, and gaps are formed between wall surfaces of the second through holes 21 and the third through holes 31 and the pins 41 of the electronic component 40. In this way, the heat dissipation substrate 30 in the embodiment of the present invention is respectively located between the circuit board body 10 and the electronic component 40, so that heat of the circuit board body 10 and the electronic component 40 can be better absorbed, and further, the heat dissipation performance can be improved.
An embodiment of the present invention further provides an electronic device, where the electronic device includes the circuit board 100, and the circuit board 100 is used for implementing electrical connection. For the structure of the circuit board 100, reference may be made to the above embodiments, and details are not repeated here.
It should be noted that the preferred embodiments of the present invention are shown in the description and the drawings, but the present invention may be embodied in many different forms and is not limited to the embodiments described in the description, which are not intended as additional limitations to the present disclosure, which is provided for the purpose of providing a more thorough understanding of the present disclosure. Moreover, the above technical features are combined with each other to form various embodiments which are not listed above, and all the embodiments are regarded as the scope of the present invention described in the specification; further, modifications and variations will occur to those skilled in the art in light of the foregoing description, and it is intended to cover all such modifications and variations as fall within the scope of the appended claims.
Claims (9)
1. A circuit board, comprising:
the circuit board comprises a circuit board body, a first connecting piece and a second connecting piece, wherein the circuit board body is provided with a first through hole;
the insulating layer is arranged on one surface of the circuit board body and provided with a second through hole;
the heat dissipation substrate is arranged on one surface, far away from the circuit board body, of the insulating layer and provided with a third through hole;
an electronic component provided with a pin;
the third through hole, the second through hole and the first through hole are arranged corresponding to the pins of the electronic element, when the pins respectively pass through the third through hole, the second through hole and the first through hole, the pins of the electronic element are connected with one surface of the circuit board body, which is far away from the heat dissipation substrate, and gaps are formed between the wall surfaces of the second through hole and the third through hole and the pins of the electronic element.
2. The circuit board of claim 1,
the circuit board body comprises a first circuit and a second circuit, and the first circuit and the second circuit are respectively arranged on two opposite surfaces of the circuit board body;
the circuit board body comprises a connecting piece, the circuit board body is provided with a fourth through hole, the fourth through hole penetrates through the first circuit and the second circuit, the connecting piece is arranged in the fourth through hole, and the connecting piece is respectively connected with the first circuit and the second circuit.
3. The circuit board of claim 1, further comprising a first pad disposed on a surface of the circuit board body away from the heat dissipation substrate, the first pad being used for connecting the circuit board body and the pin of the electronic component.
4. The circuit board of claim 1, further comprising a second pad disposed between the circuit board body and the insulating layer, the second pad connecting the circuit board body and the insulating layer, respectively.
5. The circuit board of claim 1, further comprising an insulating ring disposed in the third through hole, wherein the insulating ring is sleeved on the pins of the electronic component.
6. The circuit board of claim 5, wherein the insulating ring is made of a plastic material.
7. The circuit board of claim 1, wherein two side walls of the circuit board body are provided with conductive layers, and the conductive layers are used for realizing side tin climbing during soldering of the circuit board body.
8. The circuit board according to claim 1, wherein the heat-dissipating substrate is made of an aluminum material.
9. An electronic device comprising a circuit board according to any one of claims 1-8.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220041232.1U CN217037538U (en) | 2022-01-07 | 2022-01-07 | Circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220041232.1U CN217037538U (en) | 2022-01-07 | 2022-01-07 | Circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN217037538U true CN217037538U (en) | 2022-07-22 |
Family
ID=82445236
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220041232.1U Active CN217037538U (en) | 2022-01-07 | 2022-01-07 | Circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN217037538U (en) |
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2022
- 2022-01-07 CN CN202220041232.1U patent/CN217037538U/en active Active
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