CN107889338A - Heat sink assembly for Surface mounted devices - Google Patents
Heat sink assembly for Surface mounted devices Download PDFInfo
- Publication number
- CN107889338A CN107889338A CN201710561550.4A CN201710561550A CN107889338A CN 107889338 A CN107889338 A CN 107889338A CN 201710561550 A CN201710561550 A CN 201710561550A CN 107889338 A CN107889338 A CN 107889338A
- Authority
- CN
- China
- Prior art keywords
- pcb
- circuit board
- printed circuit
- radiator
- mounted devices
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/205—Heat-dissipating body thermally connected to heat generating element via thermal paths through printed circuit board [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Materials Engineering (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The present invention relates to the heat sink assembly for Surface mounted devices.According to certain aspects of the invention, heat sink assembly is disclosed.Illustrative radiator component includes the printed circuit board (PCB) with the first side and the second side.The printed circuit board (PCB) limits the opening that the second side is extended to from the first side.The heat sink assembly also includes the radiator for being connected to the first side of printed circuit board (PCB).The radiator includes the protuberance for extending through the through hole of printed circuit board (PCB).The heat sink assembly also includes the Surface mounted devices for being connected to the second side of printed circuit board (PCB).The Surface mounted devices are thermally contacted with the protuberance of radiator so that heat is delivered into radiator from Surface mounted devices.Also disclose the illustrative methods of manufacture heat sink assembly.
Description
Technical field
The present invention relates to the heat sink assembly for Surface mounted devices.
Background technology
This part provides background information related to the present invention, and the background information, which differs, is set to prior art.
Surface mounted devices are typically coupled to printed circuit board (PCB).These equipment often produce heat during operation, the heat
Amount needs be dissipated and away from Surface mounted devices to suppress apparatus overheat.Generally, Surface mounted devices include being directly installed on
Radiating terminal on printed circuit board (PCB).
The content of the invention
This part provides the generalized summaries of the present invention, and is not the four corner of the present invention or all features of the present invention
Comprehensive disclosure.
According to an aspect of the present invention, a kind of heat sink assembly includes printed circuit board (PCB), and the printed circuit board (PCB) has the
Side and second side relative with first side.The printed circuit board (PCB) limits from the first side of printed circuit board (PCB) and extends to printing electricity
The opening of second side of road plate.The component also includes the radiator for being connected to the first side of printed circuit board (PCB).The radiator includes
Protuberance, the protuberance extend through the opening limited in printed circuit board (PCB).The component also includes being connected to printed circuit board (PCB)
The Surface mounted devices of second side.The Surface mounted devices are thermally contacted with the protuberance of radiator to promote from Surface mounted devices
To the heat transfer of radiator.
According to another aspect of the present invention, a kind of method for manufacturing heat sink assembly is disclosed.This method includes will radiating
Device is connected to the first side of printed circuit board (PCB).The printed circuit board (PCB) has opening, and protruding parts are in the opening.The opening
It is limited between the first side of printed circuit board (PCB) and second side relative with the first side of printed circuit board (PCB).This method also includes
The second side and/or the protuberance that Surface mounted devices are connected to printed circuit board (PCB) are scattered so that heat to be delivered to from Surface mounted devices
Hot device.
Concept 1, a kind of heat sink assembly, including：
Printed circuit board (PCB), the printed circuit board (PCB) have the first side and second side relative with first side, the print
Printed circuit board restriction extends to opening for second side of the printed circuit board (PCB) from first side of the printed circuit board (PCB)
Mouthful；
Radiator, the radiator are connected to first side of the printed circuit board (PCB), and the radiator includes protruding
Portion, the protuberance of the radiator extend through the opening limited in the printed circuit board (PCB)；And
Surface mounted devices, the Surface mounted devices are connected to second side and/or the institute of the printed circuit board (PCB)
Protuberance is stated, the Surface mounted devices are thermally contacted with the protuberance of the radiator so that installation is set from the surface by heat
It is standby to be delivered to the radiator.
Concept 2, the component as described in concept 1, wherein, the opening limited in the printed circuit board (PCB) is coated with heat conduction material
Material.
Concept 3, the component as described in concept 1 or 2, wherein, the radiator is connected to the printed circuit board (PCB) using glue
First side.
Concept 4, the component as described in concept 3, wherein, the radiator is connected to the printing electricity by multiple glued portions
First side of road plate.
Concept 5, the component as any one of concept 1 to 4, wherein, the height of the protuberance of the radiator
It is substantially the same with the thickness of the printed circuit board (PCB).
Concept 6, the component as any one of concept 1 to 5, wherein, the height of the protuberance of the radiator
More than the thickness of the printed circuit board (PCB).
Concept 7, the component as any one of concept 1 to 6, wherein, the Surface mounted devices are pacified on the surface
Heat is produced during installing standby operation.
Concept 8, the component as any one of concept 1 to 7, wherein, the top surface of the protuberance of the radiator
It is substantially flat.
Concept 9, the component as described in concept 8, wherein, the top surface and the print of the protuberance of the radiator
Second side of printed circuit board is substantially coplanar.
Concept 10, the component as any one of concept 1 to 9, in addition to be placed in the Surface mounted devices with it is described
Solder between the protuberance of radiator.
Concept 11, the component as any one of concept 1 to 10, wherein, the radiator includes copper.
Concept 12, the component as any one of concept 1 to 11, wherein, the radiator includes aluminium.
Concept 13, the component as any one of concept 1 to 12, wherein, the radiator is included away from the printing
First side of circuit board and the multiple fins extended.
Concept 14, the component as any one of concept 1 to 13, wherein, the radiator is the first radiator, described
It is open and equipment is installed for first surface for the first opening, the Surface mounted devices, and the printed circuit board (PCB) is limited from institute
State printed circuit board (PCB) first side extend to the printed circuit board (PCB) second side second opening, the component is also
Including：
Second radiator, second radiator are connected to first side of the printed circuit board (PCB), and described second dissipates
Hot device includes protuberance, and the protuberance of second radiator extends through second opening；And
Second surface installs equipment, and the second surface installation equipment is connected to second side of the printed circuit board (PCB)
And/or the protuberance of second radiator, the second surface installation equipment and the protuberance of second radiator
Thermo-contact is delivered to second radiator so that heat is installed into equipment from the second surface.
Concept 15, the component as any one of concept 1 to 14, in addition to it is placed in described the of the printed circuit board (PCB)
Circuit on two sides, wherein, the Surface mounted devices include at least one terminal for being electrically coupled to the circuit.
Concept 16, the component as any one of concept 1 to 15, wherein, what is limited in the printed circuit board (PCB) is described
Space-consuming of the opening more than the Surface mounted devices.
Concept 17, the component as any one of concept 1 to 16, wherein, the surface area of the top surface of the protuberance
More than the space-consuming of the Surface mounted devices.
Concept 18, a kind of method for manufacturing heat sink assembly, methods described include：
Radiator with protuberance is connected to the first side of printed circuit board (PCB), the printed circuit board (PCB) has opening,
For the protruding parts in the opening, the opening is limited at first side of the printed circuit board (PCB) and the printing
Between second side relative with first side of circuit board；And
By Surface mounted devices be connected to the printed circuit board (PCB) second side and/or the protuberance with by heat from
The Surface mounted devices are delivered to the radiator.
Concept 19, the method as described in concept 18, wherein, couple the radiator including one or more glue points are neighbouring
The opening and be coated onto first side of the printed circuit board (PCB), and the radiator is contacted one or more of glue
Point.
Concept 20, the method as described in concept 18 or 19, wherein, coupling the radiator is included the printed circuit board (PCB)
Second side placed against flat surfaces, and the radiator is inserted through to the institute limited in the printed circuit board (PCB)
State opening, until the radiator the protuberance contact the flat surfaces so that the radiator the protuberance with
Second side aligned coplanar of the printed circuit board (PCB).
Concept 21, the method as described in concept 20, in addition to apply heat to the printed circuit board (PCB) and the radiator
To set one or more of glue points and the radiator be fixed into the printed circuit board (PCB).
Concept 22, the method as any one of concept 18 to 21, wherein, the Surface mounted devices are connected to institute
Stating printed circuit board (PCB) and/or the protuberance includes solder being coated onto described in the printed circuit board (PCB) and/or the radiator
Protuberance and the Surface mounted devices are made to contact the solder.
From description provided herein, other side and application field will be apparent.It should be appreciated that the present invention's is each
Aspect and feature can individually be realized or realized with one or more of the other aspect or combinations of features.It is also understood that herein
In description and specific example be intended to being merely to illustrate property purpose and be not intended to limit the scope of the invention.
Brief description of the drawings
Accompanying drawing described herein is only used for the illustrative purpose of selected embodiment, rather than all possible realization side
Formula, and be not intended to limit the scope of the invention.
Fig. 1 is the top view according to the heat sink assembly of an exemplary embodiment of the present invention.
Fig. 2 is the sectional side view of Fig. 1 heat sink assembly.
Fig. 3 is the bottom perspective view of Fig. 2 heat sink assembly.
Fig. 4 is the sectional side view according to the heat sink assembly of another illustrative embodiments of the present invention.
Fig. 5 be another exemplary heat sink assembly sectional side view, the heat sink assembly have extend beyond radiator and
The printed circuit board (PCB) of Surface mounted devices.
Multiple views in accompanying drawing, feature corresponding to corresponding reference instruction.
Embodiment
Illustrative embodiments are described more fully with now with reference to accompanying drawing.
There is provided illustrative embodiments so that the present invention will be thorough and will be passed on comprehensively to those skilled in the art
Scope.It is proposed multiple details, the example of such as specific part, equipment and method, to provide to embodiments of the present invention
Thorough understanding.It is obvious to those skilled in the art that detail, exemplary implementation need not be used
Mode can embody in many different forms, and be understood not to both detail and illustrative embodiments
Limit the scope of the present invention.In some illustrative embodiments, known process, known equipment knot are not described in detail
Structure and known technology.
Term used herein is merely for the purpose for describing specific exemplary embodiments and is not intended to be limited.
As used herein, singulative " one " and "the" can be intended to also include plural form, clearly refer to unless the context otherwise
Show.Term " comprising ", "comprising" and " having " are inclusive and therefore refer to stated feature, integer, step, operation, member
The presence of part, and/or part, but be not excluded for one or more of the other feature, integer, step, operation, element, part and/or
Its presence combined is additional.Method and step, process and operation described herein are understood not to necessarily require them
With discussion or shown certain order perform, be identified as execution order except non-specific.Also it will be understood that, can use attached
Add or alternative step.
Although term " first ", " second ", " the 3rd " etc. can be used to describing herein various elements, part, region,
Layer and/or section, but these elements, part, region, layer and/or section should not be limited by these terms.These terms can
To be only used for distinguishing an element, part, region, layer or section and another region, layer or section.Such as " first ", " the
Two " term and other numerical terms do not imply that order or sequence as used herein, unless context clearly dictates otherwise.Cause
This, the first element, first component, first area, first layer or the first section being discussed below can be referred to as the second element,
Two parts, second area, the second layer or the second section, without departing from the teaching of illustrative embodiments.
For the ease of description, space relative terms can be used herein, such as " inside ", " outside ", " following ",
" lower section ", " bottom ", " top ", " top " etc., come describe an element as illustrated in the drawing or feature with other one or
The relation of multiple element or feature.In addition to the orientation shown in figure, space relative terms, which can be intended to cover equipment, to be made
With or operation in different orientation.For example, if the equipment in figure is reversed, be described as other elements or feature " under
The element of side " or " following " will be oriented as " top " in other elements or feature.Thus, exemplary term " lower section " can
With two kinds of orientations above and below covering.The equipment can be additionally orientated and (be rotated by 90 ° or rotated with other orientations) and this
Space relative descriptors used in text are correspondingly understood.
The heat sink assembly according to an exemplary embodiment of the present invention is shown into Fig. 3 in Fig. 1, the radiator
Component is totally indicated with reference 100.As shown in Figure 1 to Figure 3, heat sink assembly 100 includes having top side 104 and bottom side
106 printed circuit board (PCB) (Printed Circuit Board, PCB) 102.The restriction of printed circuit board (PCB) 102 opening 108 (such as it is logical
Hole etc.), the opening 108 extends to bottom side 106 from top side 104.
Radiator 110 is connected to the bottom side 106 of printed circuit board (PCB) 102.Radiator 110 includes protuberance 112.Work as radiator
110 when being connected to printed circuit board (PCB) 102, and protuberance 112 extends through the opening 108 limited in printed circuit board (PCB) 102.
Surface mounted devices 114 are connected to the top side 104 of printed circuit board (PCB).For example, Surface mounted devices 114 can be joined
It is connected into and is almost flushed with the top side of printed circuit board (PCB) 102 104 (for example, the space-consuming (footprint) of Surface mounted devices can
With substantially coplanar, etc. with the top side 104 of printed circuit board (PCB) 102).When Surface mounted devices are connected to printed circuit board (PCB) 102
When, Surface mounted devices 114 thermally contact with the protuberance 112 of radiator 110.This promotes from Surface mounted devices 114 to radiating
The heat transfer of device 110.Surface mounted devices 114 are also coupled to the protuberance 112 of radiator 110.In some embodiments, table
Face installation equipment 114 can only be connected to protuberance 112 and can be not coupled to the top side 104 of printed circuit board (PCB) 102.
Therefore, radiator 110 can be thermally contacted with Surface mounted devices 114 (for example, by physical contact, by being placed in
Heat conducting film between radiator 110 and Surface mounted devices 114, by being placed between radiator 110 and Surface mounted devices 114
Heat-conducting cream, etc.).Radiator 110 can by the opening 108 that is limited in printed circuit board (PCB) 102 and with Surface mounted devices
114 thermo-contacts, while also allow one or more terminals 115 of Surface mounted devices 114 to be connected to the electricity of printed circuit board (PCB) 102
Road (not shown).
As shown in figure 1, Surface mounted devices 114 include the multiple terminals for being connected to the top side 104 of printed circuit board (PCB) 102
115.When Surface mounted devices 114, which are installed into, to be flushed with the top side of printed circuit board (PCB) 102 104, terminal 115 can electrically connect
To one or more circuit (not shown) of printed circuit board (PCB) 102.Although fig 1 illustrate that it is only located at Surface mounted devices 114
Terminal 115 on bottom side, but in other embodiments, Surface mounted devices can be included positioned at the Surface mounted devices
Terminal on top side, terminal on the top side and bottom side of the Surface mounted devices, etc. can be included.
Terminal 115 can include any suitable lead, engagement pad etc..Terminal 115 can be in Surface mounted devices 114
Under bottom surface (for example, therefore terminal 115 flushes with the bottom surface of Surface mounted devices 114), terminal 115 can be installed from surface and set
Side extension of standby 114 bottom surface, etc..
Terminal 115 can provide Surface mounted devices 114 and protuberance 112, Surface mounted devices 114 and printed circuit board (PCB)
Electrically connecting between 102 circuit etc. and/or it is thermally coupled.One or more of terminal 115 terminal can be that surface installation is set
The radiating terminal of standby 114 protuberance 112 for being connected to radiator.This can be provided from Surface mounted devices 114 to radiator
110 effective heat transfer, so as to reduce (or elimination) using the demand of the plated through-holes in high heat conductor PCB substrate, PCB etc..
It will be apparent, however, that heat conduction PCB, plated through-holes etc. can also be used in heat sink assembly, without departing from the model of the present invention
Enclose.
Opening 108 can be suitably sized to allow the protuberance 112 of radiator 110 to extend through the (example of opening 108
Such as, 108 size of being open can correspond to the circumference of protuberance 112).In some embodiments, protuberance 112 can have
The surface area substantially the same with the size of opening 108, therefore protuberance 112 takes the substantially all space of opening 108
(for example, protuberance can be considered as being embedded in printed circuit board (PCB) 102).
Opening 108 can be less than the circumference of radiator 110.For example, the bottom side 106 of printed circuit board (PCB) 102 can radiate
Extend on one or more parts in addition to protuberance 112 of device 110, can so as to one or more parts of radiator 110
The bottom side 106 of printed circuit board (PCB) 102 is connected to adjacent openings 108.
In some embodiments, opening 108 can be less than the space-consuming of Surface mounted devices 114 (for example, surface is pacified
The bottom perimeter of installing standby 114, surface area of bottom surface of Surface mounted devices etc.), so as to allow Surface mounted devices neighbouring
Opening 108 and be connected to the top side 104 of printed circuit board (PCB) 102.
In other embodiments, opening 108 can be more than the space-consuming of Surface mounted devices 114, so as to allow to make
With the Different Package size of Surface mounted devices 114.If for example, opening 108 at least with the Surface mounted devices to be used
Maximum package size is equally big, then opening 108 can accommodate the Package size of gamut.This can allow in the scope
Each Package size there is increase contact area with the protuberance 112 of radiator 110, while in Surface mounted devices 114
There is (or zero) contact area reduced between printed circuit board (PCB) 102.
As shown in figure 1, some of opening 108 extends beyond the space-consuming of Surface mounted devices 114.In the situation
Under, some of protuberance 112 extends beyond the space-consuming of Surface mounted devices 114.It should be clear that other embodiment
Opening size corresponding with the space-consuming of Surface mounted devices 114, the space-consuming than Surface mounted devices 114 can be included
Small opening size etc..
In some embodiments, opening 108 can be plated through-holes.For example, opening 108 can include surrounding opening
The thermal conductive material layer that 108 one or more wall cloths are put is to increase by opening 108 and from Surface mounted devices 114 to radiator
110 heat transfer, to protect printed circuit board (PCB) 102 from the hot influence by the grade transmission of opening 108.Exemplary coating material
Including but not limited to copper, aluminium etc..Heat Conduction Material can also be conductive.
Protuberance 112 can have substantially flat top surface.Therefore, when radiator 110 is connected to printed circuit board (PCB) 102
When, the top surface of protuberance 112 can be substantially coplanar with the top side 104 of printed circuit board (PCB) 102.This can provide smooth, flat
Etc. surface, for Surface mounted devices 114 to be applied to the top side of printed circuit board (PCB) 102 and/or the top of protuberance 112
Face.
The height (i.e. thickness) of protuberance 112 can correspond to the thickness of printed circuit board (PCB) 102.In some embodiments
In, the height of protuberance 112 may be largely analogous to the thickness of printed circuit board (PCB) 102.If for example, printed circuit board (PCB) 102
Thickness be about 1 millimeter, then the height of protuberance 112 can also be about 1 millimeter.In this case, when radiator 110
When some of neighbouring protuberance 112 is positioned to contact with the bottom side of printed circuit board (PCB) 102 106, the top surface of protuberance 112 can
Alignd with the top side 104 with printed circuit board (PCB) 102.
In some embodiments, the height of the protuberance 112 of radiator can be more than the thickness of printed circuit board (PCB) 102.
This can allow the slight change (such as tolerance) of protuberance thickness and printed circuit plate thickness during manufacture etc..For example, such as
Fruit protuberance thickness is slightly larger than printed circuit plate thickness, then protuberance 112 can be inserted through opening 108, until protrusion
The top surface in portion 112 aligns with the top side 104 of printed circuit board (PCB) 102.This can be in the bottom side 106 of printed circuit board (PCB) 102 and radiating
Gap is reserved between some of the neighbouring protuberance 112 of device 110.The gap can be filled suitable link material.
Radiator 110 can use any suitable link material and be connected to the bottom side 106 of printed circuit board (PCB) 102, should
Suitable link material includes but is not limited to solder, glue, other adhesives etc..As shown in Fig. 2 multiple glue points 116 are placed in printing
Between some of the bottom side 106 of circuit board 102 and the neighbouring protuberance 112 of radiator 110, so as to by radiator 110
It is connected to printed circuit board (PCB) 102.It should be clear that other embodiment can use between printed circuit board (PCB) 102 and radiator 110
Other suitable link materials.
Surface mounted devices 114 can be can be connected to printed circuit board (PCB) 102 and/or protuberance 112 any suitable
Electronic equipment.For example, Surface mounted devices 114 can include microprocessor, microcontroller, IC chip etc..Surface
Installation equipment 114 can produce heat during the operation of Surface mounted devices 114.
Surface mounted devices 114 can be with the substantially planar of the flat surfaces for allowing to be connected to printed circuit board (PCB) 102
Bottom surface (such as space-consuming).Surface mounted devices 114 can be installed into the top side of printed circuit board (PCB) 102 104 and/or
Protuberance 112 flushes.
Surface mounted devices 114 can use any suitable link material and be connected to printed circuit board (PCB), and this is suitable
Link material includes welding material, sizing material, other jointing materials etc..Set as shown in Fig. 2 welding material 120 is placed in surface installation
For between 114 and printed circuit board (PCB) 102 and between the top surface of Surface mounted devices 114 and protuberance 112.
Radiator 110 can use any suitable radiator for being suitable for transferring heat away from Surface mounted devices 114
Structure.As shown in Figure 1 to Figure 3, radiator 110 includes the multiple fins 118 extended away from printed circuit board (PCB) 102.Multiple fins
118 can transfer heat away from Surface mounted devices 114, and can have the radiating strengthened, wherein bypassing air through multiple wings
Piece (such as by fan etc.).Radiator 110 can include be suitable for radiating any Heat Conduction Material, including but not limited to copper,
Aluminium etc..
In Fig. 1 and Fig. 3 example, printed circuit board (PCB) 102 limits multiple openings 108.Component 100 includes multiple radiators
110 and multiple Surface mounted devices 114.Each radiator 110 has one opening of correspondence extended through in multiple openings 108
Protuberance 112, and each radiator corresponding with multiple radiator protuberances 112 of Surface mounted devices 114 dashes forward
Go out portion's thermo-contact.As it should be clear that other heat sink assemblies can include more or less openings 108, the and of radiator 110
Surface mounted devices 114, other arrangements of opening 108 in printed circuit board (PCB) etc..
Although describing Fig. 1 to Fig. 3 herein by the top side 104 with reference to printed circuit board (PCB) 102 and bottom side 106,
It should be clear that top and bottom is merely for illustrative purpose, and the relative side of printed circuit board (PCB) 102 can be oriented at different directions
On.For example, according to the orientation of printed circuit board (PCB), radiator 110 can be connected to top side, right side, left side, front side, rear side etc..Class
As, Surface mounted devices 114 can be connected to the respective side of printed circuit board (PCB) 102 with any proper orientation.
Fig. 4 shows the heat sink assembly 200 of another illustrative embodiments according to the present invention.Similar to Fig. 1 to Fig. 3
Heat sink assembly 100, heat sink assembly 200 includes radiator 210, and the radiator 210, which has, extends through printed circuit board (PCB)
The protuberance 212 of the opening 208 limited in 202.
Surface mounted devices 214 are connected to the top side of printed circuit board (PCB) 202 by solder 220.Surface mounted devices 214 with
The protuberance 212 of radiator 210 is thermally contacted so that heat is dissipated into radiator 210 from Surface mounted devices 214.
As shown in figure 4, protuberance 212 has the height of the thickness 222 corresponding to printed circuit board (PCB).If for example, printing
The thickness 222 of circuit board is about 1 millimeter, then the height of protuberance 212 is also about 1 millimeter.As described above, other embodiment party
Formula can include the protuberance 212 of the height of the thickness with more than printed circuit board (PCB).In addition, in other embodiments, print
The thickness 222 of printed circuit board can be more than or less than 1 millimeter.
Protuberance 212 can improve the heat transfer from Surface mounted devices 214 to radiator 210.For example, compared to printing
Heat through-hole in circuit board material or printed circuit board (PCB) etc., protuberance 212 can more effectively transmit heat, provide bigger heat conduction
Rate.
In one example, if the power consumption in Surface mounted devices 214 is about 6 watts, the temperature rise at radiator
Can be that environment temperature adds about 29.39 degrees Celsius.If environment temperature is about 55 degrees Celsius, at radiator 210
The temperature of formation can be about 84.39 degrees Celsius.
In this example, the thermal resistance at the junction surface of Surface mounted devices 214 and printed circuit board (PCB) 202 can be about
0.9K/W.Thermal resistance between Surface mounted devices 214 and radiator 210 can be about when radiator 210 includes copper
1.1711K/W, and when radiator 210 includes aluminium be about 3.02K/W.It is scattered with protuberance 212 compared to not including
The embodiment of hot device 210, radiating can be improved about 57% by copper radiator 210, and aluminium radiator 210 can propose radiating
Height about 24%.Above-mentioned example value is provided merely for illustrative purpose.It should be clear that other embodiment can have it is different
Thermal resistance, different temperature, different radiator materials, different raising percentage factors etc..
Fig. 5 shows the heat sink assembly 300 of another illustrative embodiments according to the present invention.Similar to dissipating for Fig. 4
Hot device assembly 200, heat sink assembly 300 include radiator 210, and the radiator 210, which has, to be extended through in printed circuit board (PCB) 302
The protuberance 212 of the opening 308 of restriction.
Surface mounted devices 214 are connected to the top side of printed circuit board (PCB) 302 by welding material 220.Surface mounted devices
214 thermally contact with the protuberance 212 of radiator 210 so that heat is dissipated into radiator 210 from Surface mounted devices 214.Protuberance
212 have the height of the thickness 222 corresponding to printed circuit board (PCB).
As shown in figure 5, printed circuit board (PCB) 302 extends beyond Surface mounted devices 214 and radiator 210.Printed circuit board (PCB)
302 have top surface and bottom surface, and the top surface has the surface area of the space-consuming more than Surface mounted devices 214, bottom surface tool
There is the surface area more than radiator 210.Therefore, printed circuit board (PCB) 302 can accommodate Different Package size surface installation set
Standby 214, various sizes of radiator 210 etc..
Radiator 210 is illustrated as with the space-consuming identical surface area chi with Surface mounted devices 214 by Fig. 5
It is very little, and the surface area dimensions of space-consuming of the protuberance 212 with less than Surface mounted devices 214 of radiator 210.Should
When clear, in other embodiments, radiator 210 and/or protuberance 212 can have more than Surface mounted devices 214
The surface area of space-consuming.This can allow the Surface mounted devices 214 of Different Package size to be connected to the protrusion of radiator
Portion 212.
For example, the protuberance 212 of radiator can have the table more than maximum package size on the top surface of protuberance 212
The surface area of the space-consuming of face installation equipment 214.This Surface mounted devices 214 for a series of Package size
Say, the contact area between Surface mounted devices 214 and protuberance 212 can be increased, while reduce (or elimination) surface installation
Contact area between equipment 214 and printed circuit board (PCB) 302.
In another embodiment, a kind of method for manufacturing heat sink assembly is disclosed.Illustrative methods include having
The radiator of protuberance is connected to the first side of printed circuit board (PCB).The printed circuit board (PCB) has opening, and protruding parts in this
In opening.The opening be limited at printed circuit board (PCB) the first side and printed circuit board (PCB) second side relative with the first side it
Between.This method also include by Surface mounted devices be connected to the second side and/or the protuberance of printed circuit board (PCB) with by heat from surface
Installation equipment is delivered to radiator.
Connection radiator can include one or more glue points being coated onto the first side of printed circuit board (PCB) adjacent to the opening,
And radiator is set to contact one or more glue points.For example, during manufacture, can be with the first side of attachment printed circuit board (PCB)
On other Surface mounted devices essentially simultaneously distribute glue point.Soldering paste can be printed on the first of printed circuit board (PCB) with mould
Equipment is installed to contact surface on side, but radiator can not need soldering paste.Then can be (such as adjacent to printed circuit
The opening limited in plate) glue point is distributed at radiator coupled position.Then the first all side surfaces can be pacified with machine
Standby and radiator is installed to put on a printed circuit.
Coupling radiator can include placing the second side of printed circuit board (PCB) against flat surfaces, and radiator is inserted
The opening limited in entering through printed circuit board (PCB), it is prominent so as to radiator until the protuberance of radiator contacts the flat surfaces
The second side for going out portion and printed circuit board (PCB) is coplanar.For example, printed circuit board (PCB) can be supported by lifts plate, so as to printed circuit board (PCB)
Both protuberances of top side and radiator are rested on same support surface.
This method can include applying heat to printed circuit board (PCB) and radiator to set one or more glue points and will dissipate
Hot device is fixed to printed circuit board (PCB).For example, once printed circuit board (PCB) and protuberance are rested on same support surface, then can make
Whole component is by reflow soldering to set glue and be secured in position radiator.
Surface mounted devices are connected to the protuberance that printed circuit board (PCB) can include for solder being coated onto radiator, and made
Surface mounted devices contact solder.For example, can normally processing printed circuit board top side because radiator has turned into printing
The integration section of circuit board.Soldering paste can be printed on the pad of printed circuit board (PCB) with mould as normal and is also printed on
On the protuberance of radiator.Then Surface mounted devices can be placed on printed circuit board (PCB) and/or protuberance and by soldering paste
To couple.
Any one of illustrative embodiments, aspect and/or feature disclosed herein can with institute herein
The form of any appropriate combination of disclosed any other illustrative embodiments, aspect and/or feature uses, without departing from
The scope of the present invention.For example, heat sink assembly described herein can be linked together using other methods, herein
Described coupling method can be realized using other radiators, Surface mounted devices etc., without departing from the scope of the present invention.
Illustrative radiator component described herein can be used in any suitable applications, including but not limited to handed over
(AC) is flowed to direct current (DC) power supply, DC-DC power source, the hot gratifying power supply changeover device removed from Surface mounted devices
Deng.For example, some heat sink assemblies can be used in high density, high watts power supply.
The illustrative embodiments and aspect of the present invention can provide any one of following advantage：Improve and installed from surface
Equipment is allowed to the thermal conductivity (for example, through hole etc.) compared to printed circuit board (PCB) of radiator, due to more efficient thermally conductive pathways
Smaller heat sink size and reduce radiator cost, the sink-efficiency improved in high density power converter design, will
Radiator is used as the high current capacity busbar that is directly connected with equipment to reduce conduction loss (for example, compared to printed circuit
The through hole of plate, compared to circuit of printed circuit board (PCB) etc.).
The as described above of embodiment is had been provided for for the purpose of illustration and description.It is not intended to be detailed or limitation
The present invention.The each element or feature of particular implementation are typically not limited to the particular implementation, but in feelings applicatory
It is interchangeable under condition and can be used in selected embodiment, even if is not shown or described in detail.Specific reality
The each element or feature for applying mode can also be varied in many ways.These changes are not to be regarded as a departure from the present invention, and
And all such modifications are intended to be included in the scope of the present invention.
Claims (10)
1. a kind of heat sink assembly, including：
Printed circuit board (PCB), the printed circuit board (PCB) have the first side and second side relative with first side, the printing electricity
Road plate limits the opening for second side that the printed circuit board (PCB) is extended to from first side of the printed circuit board (PCB)；
Radiator, the radiator are connected to first side of the printed circuit board (PCB), and the radiator includes protuberance, institute
The protuberance for stating radiator extends through the opening limited in the printed circuit board (PCB)；And
Surface mounted devices, the Surface mounted devices are connected to second side of the printed circuit board (PCB) and/or described prominent
Go out portion, the Surface mounted devices are thermally contacted with the protuberance of the radiator so that heat to be passed from the Surface mounted devices
It is delivered to the radiator.
2. component as claimed in claim 1, wherein, the opening limited in the printed circuit board (PCB) is coated with Heat Conduction Material.
3. component as claimed in claim 1 or 2, wherein, the radiator is connected to the institute of the printed circuit board (PCB) using glue
State the first side.
4. component as claimed in claim 3, wherein, the radiator is connected to the printed circuit board (PCB) by multiple glued portions
First side.
5. the component as any one of Claims 1-4, wherein, the height of the protuberance of the radiator and institute
The thickness for stating printed circuit board (PCB) is substantially the same.
6. the component as any one of claim 1 to 5, wherein, the height of the protuberance of the radiator is more than
The thickness of the printed circuit board (PCB).
7. the component as any one of claim 1 to 6, wherein, on the surface, installation is set the Surface mounted devices
Heat is produced during standby operation.
8. the component as any one of claim 1 to 7, wherein, the top surface of the protuberance of the radiator is base
It is flat in sheet.
9. component as claimed in claim 8, wherein, the top surface of the protuberance of the radiator and the printing electricity
Second side of road plate is substantially coplanar.
10. component as claimed in any one of claims 1-9 wherein, in addition to it is placed in the Surface mounted devices and the radiating
Solder between the protuberance of device.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US15/282,540 | 2016-09-30 | ||
| US15/282,540 US10504813B2 (en) | 2016-09-30 | 2016-09-30 | Heat sink assemblies for surface mounted devices |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107889338A true CN107889338A (en) | 2018-04-06 |
Family
ID=61759220
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710561550.4A Pending CN107889338A (en) | 2016-09-30 | 2017-07-11 | Heat sink assembly for Surface mounted devices |
| CN201720834206.3U Active CN207854260U (en) | 2016-09-30 | 2017-07-11 | Heat sink assembly for Surface mounted devices |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720834206.3U Active CN207854260U (en) | 2016-09-30 | 2017-07-11 | Heat sink assembly for Surface mounted devices |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US10504813B2 (en) |
| CN (2) | CN107889338A (en) |
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| CN109644554A (en) * | 2018-10-31 | 2019-04-16 | 北京比特大陆科技有限公司 | Circuit board and supercomputer equipment |
| CN114245562A (en) * | 2021-11-03 | 2022-03-25 | 马瑞利汽车零部件(芜湖)有限公司 | Heat dissipation device for electronic component |
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| CN110798961B (en) * | 2018-08-01 | 2022-10-21 | 苏州旭创科技有限公司 | Circuit board and optical module with same |
| JP7447785B2 (en) * | 2020-12-25 | 2024-03-12 | 株式会社デンソー | electronic equipment |
| US11910518B2 (en) * | 2021-05-26 | 2024-02-20 | Huawei Technologies Canada Co., Ltd. | Method and apparatus for heat sink mounting |
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Also Published As
| Publication number | Publication date |
|---|---|
| US10504813B2 (en) | 2019-12-10 |
| US20180098414A1 (en) | 2018-04-05 |
| CN207854260U (en) | 2018-09-11 |
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