CN109644554A - Circuit board and supercomputer equipment - Google Patents
Circuit board and supercomputer equipment Download PDFInfo
- Publication number
- CN109644554A CN109644554A CN201880002429.0A CN201880002429A CN109644554A CN 109644554 A CN109644554 A CN 109644554A CN 201880002429 A CN201880002429 A CN 201880002429A CN 109644554 A CN109644554 A CN 109644554A
- Authority
- CN
- China
- Prior art keywords
- card
- circuit board
- clamping portion
- cooling fin
- clamping
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/06—Thermal details
- H05K2201/066—Heatsink mounted on the surface of the PCB
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10598—Means for fastening a component, a casing or a heat sink whereby a pressure is exerted on the component towards the PCB
Abstract
This application provides a kind of circuit board and supercomputer equipment, wherein the circuit board includes circuit board body and at least one cooling fin；It is provided with the first clamping portion in circuit board body, the second clamping portion is provided on each of at least one cooling fin cooling fin；First clamping portion and the second clamping portion are clamped, at least one cooling fin is arranged in circuit board body.Cooling fin can be connected in circuit board body；By above-mentioned snap fit, easily cooling fin can be fixed on circuit board or disassemble cooling fin from circuit board；The efficiency of installation and removal cooling fin is improved, the convenience of installation and removal cooling fin is improved.
Description
Technical field
This application involves circuit board technology field more particularly to a kind of circuit board and supercomputer equipment.
Background technique
Printed circuit board (Printed Circuit Board, abbreviation PCB) is applied in all kinds of electronic devices, printing electricity
Road plate is important electronic component, and various components can be arranged on a printed circuit board.Wherein, printed circuit board can be referred to as
For circuit board.Circuit board can generate heat in the process of work, and the temperature of circuit board can be made higher, and higher temperature can be broken
Component in the structure and circuit board of bad circuit board leads to the component cisco unity malfunction on circuit board and circuit board, from
And it needs to carry out radiating treatment to circuit board.Cooling fin can be set on circuit boards, circuit board is carried out by cooling fin scattered
Heat.
In the prior art, when cooling fin is set on circuit boards, tin cream can be coated on circuit boards, and dissipating
The bottom of backing coats tin cream, so that cooling fin be fixedly installed on circuit boards by tin cream；Alternatively, will be radiated by screw
Piece is screwed on circuit board.
But the inventors of the present application found that above by tin cream or screw by cooling fin fixed to the side on circuit board
Formula, it is more troublesome when cooling fin is fixed on circuit board or dismantles cooling fin from circuit board, and then make
Mount and dismount on circuit boards cooling fin efficiency is lower, convenience is poor.
Summary of the invention
The application provides a kind of circuit board and supercomputer equipment, to solve to mount and dismount on circuit boards in the prior art
The problem that the efficiency of cooling fin is lower, convenience is poor.
In a first aspect, the application provides a kind of circuit board, comprising:
Circuit board body and at least one cooling fin；
The first clamping portion is provided in the circuit board body, on each of at least one described cooling fin cooling fin
It is provided with the second clamping portion；First clamping portion and second clamping portion are clamped, at least one described cooling fin is set
It sets in the circuit board body.
Further, the number of first clamping portion is multiple, and the number of first clamping portion is more than or equal to described
The number of cooling fin；
First clamping portion corresponding to the second clamping portion and each described cooling fin on each described cooling fin into
Row clamping.
Further, at least one first card and portion are provided on each described first clamping portion, each described the
Be provided on second clamping portion corresponding to one clamping portion with it is described at least one first card and portion it is matched at least one second
Card and portion.
Further, first card and portion are recess, and second card and portion are convex；
Alternatively, first card and portion are convex, second card and portion are recess.
Further, it is additionally provided with the first groove on each described first clamping portion, each described second clamping portion
On be provided with the first groove on the first clamping portion corresponding to the second clamping portion described in each match first protrusion
Portion.
Further, at least one described first card on each described first clamping portion and portion are arranged described first
The edge of groove；
At least one described second card and portion on each described second clamping portion are arranged on first lug boss.
Further, at least one described first card on each described first clamping portion and portion and first groove
Bottom surface be located at same level, on each described described second clamping portion it is described at least one second card and portion with it is described
The top of first lug boss is located at same level.
Further, it is additionally provided with the second lug boss on each described first clamping portion, each described second clamping
Second to match with the second lug boss on the first clamping portion corresponding to the second clamping portion described in each is provided in portion
Groove.
Further, at least one described first card on each described first clamping portion and portion are arranged described second
The bottom margin of lug boss；
The side of second groove is arranged at least one described second card and portion on each described second clamping portion
On edge.
Further, at least one described first card on each described first clamping portion and portion and second protrusion
The bottom surface in portion is located at same level, at least one described second card and portion and institute on each described described second clamping portion
The top for stating the second groove is located at same level.
Further, first card and portion and second card and portion correspond.
Further, first card and portion are the first card and the portion of elasticity；
If first card and portion are recess and second card and portion are convex, first card and portion
Diameter is less than the diameter of the second card and portion corresponding to first card and portion；
If first card and portion are convex and second card and portion are recess, first card and portion
Diameter is greater than the diameter of the second card and portion corresponding to first card and portion.
Further, the surface of first clamping portion is provided with adhesive layer, first clamping portion surface and described the
The surface of two clamping portions is bonded by the adhesive layer.
Further, be provided at least one chip in the circuit board body, first wedging position in it is described extremely
On a few chip.
Further, the number of first clamping portion is one；
It is provided at least one third card and portion on first clamping portion, is provided on each described second clamping portion
Matched 4th card of at least one and the third card and portion and portion.
Further, the third card and portion are recess, and the 4th card and portion are convex；
Alternatively, the third card and portion are convex, the 4th card and portion are recess.
Further, first clamping portion includes third groove, at least one described third card and portion are arranged described
On the edge of third groove, at least one described third card and portion and the third groove are located at same level；
4th card and portion are located at the bottom margin of the cooling fin.
Further, the third card and portion and the 4th card and portion correspond.
Further, at least one radiating fin, at least one described heat dissipation are additionally provided on each described cooling fin
Fin is connect with the second clamping portion on each described cooling fin.
Further, interconnecting piece is also set up on each described cooling fin, interconnecting piece includes the first plate and the second plate, described
It is in predetermined angle between first plate and second plate；
At least one described radiating fin is fixed at the upper surface of the interconnecting piece, and the second clamping portion fixation is set
It sets in the lower surface of the interconnecting piece.
Further, the height of radiating fin adjacent at least one described radiating fin is identical or different.
Second aspect, the application provide a kind of supercomputer equipment, including at least one is as described in claim any one of 1-21
Circuit board.
Further, parallel with one another between each circuit board in the supercomputer equipment.
Further, be provided with sliding slot on the cabinet of the supercomputer equipment, the sliding slot be used for in the supercomputer equipment
Each circuit board be slidably connected.
In above various aspects, by the way that one or more cooling fins are arranged in circuit board body；In circuit board body
The first clamping portion of upper setting, is arranged the second clamping portion on each cooling fin；First clamping portion and the second clamping portion are clamped, into
And cooling fin is arranged in circuit board body.Since the first clamping portion being arranged in circuit board body, in each cooling fin
The second clamping portion of upper setting, so that cooling fin can be connected in circuit board body；It, can be convenient and fast by above-mentioned snap fit
Cooling fin is fixed on circuit board or disassembles cooling fin from circuit board；Improve installation and removal cooling fin
Efficiency improves the convenience of installation and removal cooling fin.
Detailed description of the invention
In order to illustrate the technical solutions in the embodiments of the present application or in the prior art more clearly, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of application for those skilled in the art without any creative labor, can be with root
Other attached drawings are obtained according to these attached drawings.
Fig. 1 is a kind of structural schematic diagram of circuit board provided by the embodiments of the present application；
Fig. 2 is the structural schematic diagram one of circuit board body provided by the embodiments of the present application；
Fig. 3 is the structural schematic diagram one of cooling fin provided by the embodiments of the present application；
Fig. 4 is the structural schematic diagram two of cooling fin provided by the embodiments of the present application；
Fig. 5 is the structural schematic diagram three of cooling fin provided by the embodiments of the present application；
Fig. 6 is the structural schematic diagram four of cooling fin provided by the embodiments of the present application；
Fig. 7 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application；
Fig. 8 is the structural schematic diagram two of another circuit board provided by the embodiments of the present application；
Fig. 9 is the structural schematic diagram five of cooling fin provided by the embodiments of the present application；
Figure 10 is the structural schematic diagram of another circuit board provided by the embodiments of the present application；
Figure 11 is the structural schematic diagram six of cooling fin provided by the embodiments of the present application；
Figure 12 is the structural schematic diagram of another circuit board provided by the embodiments of the present application；
Figure 13 is other a kind of structural schematic diagrams of circuit board provided by the embodiments of the present application；
Figure 14 is the structural schematic diagram of supercomputer equipment provided by the embodiments of the present application.
Appended drawing reference:
| 1- circuit board body | 2- cooling fin | The first clamping portion 3- |
| The second clamping portion 4- | 5- egative film | 6- radiating fin |
| 7- interconnecting piece | The card of 8- first and portion | The card of 9- second and portion |
| The first groove of 10- | The first lug boss of 11- | The second lug boss of 12- |
| 13- third card and portion | 141- circuit board |
Specific embodiment
The embodiment of the present application is applied in circuit board.It should be noted that the scheme when the embodiment of the present application is applied to now
Circuit board or the future may appear circuit board when, the title of each structure may change, but this has no effect on this Shen
Please example scheme implementation.
It should be pointed out that noun involved in the embodiment of the present application or term can be referred to mutually, repeat no more.
In the prior art, when cooling fin is set on circuit boards, tin cream can be coated on circuit boards, and dissipating
The bottom of backing coats tin cream, so that cooling fin be fixedly installed on circuit boards by tin cream；Alternatively, will be radiated by screw
Piece is screwed on circuit board.But cooling fin will radiated fixed to the mode on circuit board above by tin cream or screw
It is more troublesome when piece is fixed on circuit board or dismantles cooling fin from circuit board.
Circuit board and supercomputer equipment provided by the present application, it is intended to solve the technical problem as above of the prior art.
How the technical solution of the application and the technical solution of the application are solved with specifically embodiment below above-mentioned
Technical problem is described in detail.These specific embodiments can be combined with each other below, for the same or similar concept
Or process may repeat no more in certain embodiments.Below in conjunction with attached drawing, embodiments herein is described.
Fig. 1 is a kind of structural schematic diagram of circuit board provided by the embodiments of the present application, as shown in Figure 1, the circuit board includes:
Circuit board body 1 and at least one cooling fin 2.Fig. 2 is the structural schematic diagram one of circuit board body provided by the embodiments of the present application,
Fig. 3 is that the structural schematic diagram one of cooling fin provided by the embodiments of the present application is arranged in circuit board body 1 as shown in Figures 2 and 3
There is the first clamping portion 3, the second clamping portion 4 is provided on each of at least one cooling fin 2 cooling fin 2；First clamping portion 3
It is clamped with the second clamping portion 4, at least one cooling fin 2 is arranged in circuit board body 1.
Optionally, the surface of the first clamping portion 3 is provided with adhesive layer, the table on 3 surface of the first clamping portion and the second clamping portion 4
Face is bonded by adhesive layer.
Optionally, at least one chip is provided in circuit board body 1, the first clamping portion 3 is located at least one chip.
Optionally, it is additionally provided at least one radiating fin 6 on each cooling fin 2, at least one radiating fin 6 and every
The second clamping portion 4 connection on one cooling fin 2.
Optionally, interconnecting piece 7 is also set up on each cooling fin 2, interconnecting piece 7 includes the first plate and the second plate, the first plate
It is in predetermined angle between the second plate；At least one radiating fin 6 is fixed at the upper surface of interconnecting piece 7, the second clamping portion 4
It is fixed at the lower surface of interconnecting piece 7.
Optionally, the height of radiating fin 6 adjacent at least one radiating fin 6 is identical or different.
Illustratively, circuit board is made of a circuit board body 1, and one or more can be arranged in circuit board body 1
A cooling fin 2.
The shape of circuit board body 1 can be rectangle or be square or be it is trapezoidal or be other rule
Shape or be other irregular shapes；For the shape of circuit board body 1, the application is with no restrictions.
For the material of circuit board body 1, the application is with no restrictions.
Circuit board body 1 can be single sided board or dual platen or multi-layer board, and the application is with no restrictions.
First clamping portion 3 is set in circuit board body 1, also, the second clamping portion 4 is set on each cooling fin 2；
First clamping portion 3 and the second clamping portion 4 are clamped, and then cooling fin 2 is arranged in circuit board body 1.
For example, multiple first clamping portions 3 can be set in circuit board body 1, be arranged on each cooling fin 2
One the second clamping portion 4, corresponding first clamping portion 3 in the second clamping portion 4；By the second clamping portion 4 of each cooling fin 2 with
Its corresponding first clamping portion 3 is clamped, and then each cooling fin 2 is fixed in circuit board body 1.
Again for example, first clamping portion 3 can be set in circuit board body 1, set on each cooling fin 2
Set second clamping portion 4；Second clamping portion 4 of each cooling fin 2 is snapped fit on the first clamping portion 3, and then will be each
A cooling fin 2 is fixed in circuit board body 1.
For position of first clamping portion 3 in circuit board body 1, the application is with no restrictions.Exist for the first clamping portion 3
Arrangement mode in circuit board body 1, the application is with no restrictions.For the number of the first clamping portion 3, the application is with no restrictions.
For the shapes and sizes of the first clamping portion 3, the application is with no restrictions.
In the present embodiment, it is glued it is possible to further be coated on the surface of the first clamping portion 3, and then in the first clamping
One layer of adhesive layer is arranged in the surface in portion 3；To which the surface of 3 surface of the first clamping portion and the second clamping portion 4 can pass through adhesive layer
It is bonded, further makes cooling fin 2 and the connection of circuit board body 1 more secured.
For position of the cooling fin 2 in circuit board body 1, the application is with no restrictions.For cooling fin 2 in circuit board sheet
Arrangement mode on body 1, the application is with no restrictions.For the number of cooling fin 2, the application is with no restrictions.For cooling fin 2
Shapes and sizes, the application is with no restrictions.
In the present embodiment, circuit board body 1 has upper and lower surfaces；It can be in the upper surface of circuit board body 1
The upper above-mentioned cooling fin 2 of setting.Further, on one or more chips are provided on the lower surface of circuit board body 1, each
Chip is fixedly connected with circuit board body 1；For the ease of the heat dissipation of chip, above-mentioned can be arranged on each chip
One clamping portion 3, and then chip is clamped with above-mentioned cooling fin 2.
For the connection type of chip and circuit board body 1, the application is with no restrictions.For chip in circuit board body 1
On position, the application is with no restrictions.For arrangement mode of the chip in circuit board body 1, the application is with no restrictions.For
The number of chip, the application is with no restrictions.For the shapes and sizes of chip, the application is with no restrictions.
Into one, as shown in figure 3, each cooling fin 2 is made of egative film 5 and at least one radiating fin 6, each is dissipated
Hot fin 6 is fixedly connected with egative film 5, and the second clamping portion 4 is located on egative film 5, and then each radiating fin 6 of each cooling fin 2
Also it is fixedly connected with the second clamping portion 4；Each cooling fin 2 passes through the second clamping portion 4 of each cooling fin 2 and circuit board sheet
First clamping portion 3 of body 1 is clamped.
Also, the height of adjacent radiating fin 6 is identical or different in each radiating fin 6 in same cooling fin 2.Example
Such as, the height of each radiating fin 6 in same cooling fin 2 is all identical；Alternatively, each radiating fin 6 in same cooling fin 2
Height be all different；Alternatively, the height of the part radiating fin 6 in same cooling fin 2 is identical, remaining part dissipates
The height of hot fin 6 is different；Alternatively, for same cooling fin 2, from the radiating fin 6 of the centre of cooling fin 2 towards both sides
Radiating fin 6 direction, the height of radiating fin 6 is successively raised and lowered.For example, as shown in figure 3, each in cooling fin 2
The height of radiating fin 6 is all identical；For example, Fig. 4 is the structural schematic diagram two of cooling fin provided by the embodiments of the present application, such as
Shown in Fig. 4, from the radiating fin 6 of the centre of cooling fin 2 towards the direction of the radiating fin 6 on both sides, the height of radiating fin 6 according to
Secondary raising.
And it is possible to which a handle is arranged at the top of cooling fin 2, a radiating fin 6 of the handle and cooling fin 2 is solid
Fixed connection can also will be radiated so as to be snapped fit onto cooling fin 2 in circuit board body 1 by the handle by the handle
Piece 2 is taken off from circuit board body 1.
In the present embodiment, an interconnecting piece 7 can be provided on cooling fin 2, interconnecting piece 7 is by including the first plate and second
Plate is constituted, and is in predetermined angle between the first plate and the second plate, which can be in the range of 180 degree be to 90 degree；
Also, each radiating fin 6 is fixed at the upper surface of interconnecting piece 7, and egative film 5 is fixed at the lower surface of interconnecting piece 7；Due to
Second clamping portion 4 is located on egative film 5, and then the second clamping portion 4 is located at the lower surface of interconnecting piece 7.For example, Fig. 5 is that the application is real
The structural schematic diagram three of the cooling fin of example offer is provided, as shown in figure 5, being provided with an interconnecting piece 7 on cooling fin 2, also, is radiated
The height of each radiating fin 6 in piece 2 is all identical；Fig. 6 is the structural schematic diagram of cooling fin provided by the embodiments of the present application
Four, as shown in fig. 6, be provided with an interconnecting piece 7 on cooling fin 2, and from the radiating fin of the centre of cooling fin 26 towards two
The direction of the radiating fin 6 on side, the height of radiating fin 6 successively increase.
The present embodiment, by the way that one or more cooling fins 2 are arranged in circuit board body 1；It is arranged in circuit board body 1
The second clamping portion 4 is arranged in first clamping portion 3 on each cooling fin 2；First clamping portion 3 and the second clamping portion 4 are clamped, into
And cooling fin 2 is arranged in circuit board body 1.It is scattered at each since the first clamping portion 3 being arranged in circuit board body 1
Second clamping portion 4 is set on backing 2, so that cooling fin 2 can be connected in circuit board body 1；It, can by above-mentioned snap fit
Easily cooling fin 2 to be fixed on circuit board or disassembles cooling fin 2 from circuit board；Improve peace installation and dismantling
The efficiency of cooling fin 2 is unloaded, the convenience of installation and removal cooling fin 2 is improved.
Fig. 7 is the structural schematic diagram one of another circuit board provided by the embodiments of the present application, the base of embodiment shown in Fig. 1
On plinth, as shown in fig. 7, the number of the first clamping portion 3 be it is multiple, the number of the first clamping portion 3 is more than or equal to of cooling fin 2
Number；First clamping portion 3 corresponding to the second clamping portion 4 and each cooling fin 2 on each cooling fin 2 is clamped.
At least one first card and portion 8 are provided on each first clamping portion 3, corresponding to each first clamping portion 3
The second clamping portion 4 on be provided with and at least one first card and portion 8 it is matched at least one second block and portion 9.
First card and portion 8 are recess, and the second card and portion 9 are convex；Alternatively, first card and portion 8 be convex, second
Card and portion 9 are recess.
Optionally, the first card and portion 8 and the second card and portion 9 correspond.
Optionally, the first card and portion 8 are the first card and the portion 8 of elasticity；
If the first card and portion 8 be recess and the second card and portion 9 are convex, the diameter in the first card and portion 8 is less than the
The diameter of second card and portion 9 corresponding to one card and portion 8；If the first card and portion 8 are convex and the second card and portion 9 are recess
Shape, then the first card and the diameter in portion 8 are greater than the diameter of the second card and portion 9 corresponding to the first card and portion 8.
Illustratively, multiple first clamping portions 3 can be set in circuit board body 1.When the number of cooling fin 2 is equal to the
When the number of one clamping portion 3, cooling fin 2 is one-to-one with the first clamping portion 3；When the number of cooling fin 2 is less than
When the number of one clamping portion 3, cooling fin 2 has corresponding first clamping portion 3, is increasing new cooling fin
When 2, new cooling fin 2 and extra the first clamping portion 3 out can be clamped.
The shape of first clamping portion 3, can be stamp shape or is jagged or is mushroom or is
Star-like, etc..
It is possible to further be provided with the first card of one or more and portion 8 on each first clamping portion 3；Due to every
Corresponding one or more second clamping portions 4 in one the first clamping portion 3, can be corresponding to each first clamping portion 3
Setting and matched one or more second cards of the first card and portion 8 and portion 9 on second clamping portion 4.
First card and portion 8 can be recess or convex, then the second card and 9, portion needs cooperate with it.Specifically
For, first card and portion 8 be recess, second card and portion 9 be convex, then second card and portion 9 can block and to first card and
In portion 8；Alternatively, the first card and portion 8 are convex, the second card and portion 9 are recess, then the first card and portion 8 can block and to the
In two cards and portion 9.
For example, the first card and portion 8 are the convex of stamp as shown in fig. 7, the shape of the first clamping portion 3 can be stamp shape
Part is played, then the first card and portion 8 are convex.In another example Fig. 8 is the structure of another circuit board provided by the embodiments of the present application
Schematic diagram two, as shown in figure 8, the shape of the first clamping portion 3 can be it is star-like, first card and portion 8 be star-like convex portion,
Then the first card and portion 8 are convex.
For example, as seen in figures 3-6, the second card and portion 9 are convex；Fig. 9 is cooling fin provided by the embodiments of the present application
Structural schematic diagram five, as shown in figure 9, the second card and portion 9 are recess.
For the number of the first card and portion 8 on each first clamping portion 3, the application is with no restrictions.For each
The first card and position of the portion 8 on the first clamping portion 3 on first clamping portion 3, the application is with no restrictions.For each first
The shape of the first card and portion 8 on clamping portion 3, the application is with no restrictions.
In the present embodiment, when having multiple first clamping portions 3 in circuit board body 1, have one on each cooling fin 2
When a second clamping portion 4, cooling fin 2 has corresponding first clamping portion 3, i.e. each second clamping portion 4
With corresponding first clamping portion 3；Further, the first card and portion 8 and the second card and portion 9 correspond.For example,
For first clamping portion 3, N number of first card and portion 8 are provided on first clamping portion 3；First clamping portion 3 has corresponded to one
The second clamping portion 4 on a cooling fin 2 is provided with N number of second card and portion 9, the first card and portion 8 and second on second clamping portion 4
Card and portion 9 correspond.
In order to enable cooling fin 2 and the clamping of circuit board body 1 are more secured, can be set positioned at circuit board body 1
On first clamping portion 3 first card and portion 8 be it is elastic, and then can by second card and portion 9 it is relatively firm with first block and
Portion 8 is clamped.
Further, in order to enable the second card and portion 9 and first block and the clamping in portion 8 it is more secured in, adjustable the
The diameter in one card and portion 8 and the second card and portion 9.For example, if the first card and portion 8 are recess, and the second card and portion 9 are
Convex, then needing the first card and the diameter in portion 8 less than the diameter of the second card and portion 9 corresponding to the first card and portion 8, in turn
Second card and portion 9 more can firmly snap fit onto the first card and portion 8.Again for example, if the first card and portion 8 are protrusion
Shape, and the second card and portion 9 are recess, then the first card and the diameter in portion 8 is needed to be greater than corresponding to the first card and portion 8 the
The diameter of two cards and portion 9, and then the first card and portion 8 more can firmly snap fit onto the second card and portion 9.
The present embodiment, by the way that at least one first card and portion 8 are arranged on each first clamping portion 3, each first
Be provided on second clamping portion 4 corresponding to clamping portion 3 at least one first card and portion 8 it is matched at least one second block and
Portion 9.Wherein, the first card and portion 8 are recess, and the second card and portion 9 are convex；Alternatively, the first card and portion 8 are convex, the
Two cards and portion 9 are recess.To the first card and portion 8 and the second card and portion 9, cooling fin 2 and circuit board body 1 are blocked
It connects；Present embodiments provide a variety of snap fits；By above-mentioned snap fit, convenient, firmly cooling fin 2 can be fixed to
It is disassembled from circuit board on circuit board or by cooling fin 2；The efficiency of installation and removal cooling fin 2 is improved, installation is improved
With the convenience of disassembly cooling fin 2.
Figure 10 is the structural schematic diagram of another circuit board provided by the embodiments of the present application, in Fig. 1 and embodiment illustrated in fig. 7
On the basis of, as shown in Figure 10, it is additionally provided with the first groove 10 on each first clamping portion 3, on each second clamping portion 4
It is provided with the first lug boss to match with the first groove 10 on the first clamping portion 3 corresponding to each the second clamping portion 4
11。
Optionally, the side of the first groove 10 is arranged at least one first card on each first clamping portion 3 and portion 8
Edge；At least one second card and portion 9 on each second clamping portion 4 are arranged on the first lug boss 11.
Optionally, at least one first card on each first clamping portion 3 and portion 8 and the bottom surface of the first groove 10 are located at
Same level, at least one second card and portion 9 and the top of the first lug boss 11 on each second clamping portion 4 are positioned at together
One horizontal plane.
Illustratively, in order to enable the clamping of the first clamping portion 3 and the second clamping portion 4 is more secured, in addition at each
The first card of one or more and portion 8 are set on first clamping portion 3, one the can also be arranged on each first clamping portion 3
One groove 10.Preferably, the first card and portion 8 on each first clamping portion 3 can be arranged in the edge of the first groove 10.
It in turn, can also be each in addition to the second card of one or more and portion 9 are arranged on each second clamping portion 4
One the first lug boss 11 is set on a second clamping portion 4, and each first lug boss 11 is and each the second clamping
What the first groove 10 on the first clamping portion 3 corresponding to portion 4 matched.First lug boss 11 can be the egative film of cooling fin 2
5；Alternatively, the structural schematic diagram six that Figure 11 is cooling fin provided by the embodiments of the present application as shown in figure 11 can be on egative film 5
One the first lug boss 11 is set.
For the shapes and sizes of the first groove 10, the application is with no restrictions.
Also, the shape of the first different grooves 10 can be identical or different；The size of the first different grooves 10 can be with
It is identical or different.
The first card and portion 8 and the first groove 10 on same first clamping portion 3 can not be located at same level, can also
To be located at same level；And the second card and portion 9 on same second clamping portion 4 can not be located at the first lug boss 11
Same level can also be located at same level.Only need the first groove 10 match with the first lug boss 11, first card with
Portion 8 and the second card and portion 9 match.
In this implementation, as shown in Figure 10, a kind of mode is provided, first on same first clamping portion 3 is allowed to block and portion 8
It is located at same level with the bottom surface of the first groove 10, i.e., the first card and portion 8 are extend horizontally away from the bottom surface of the first groove 10
It goes；Correspondingly, the second card allowed on same second clamping portion 4 and portion 9 and the top of the first lug boss 11 are located at same water
Plane, i.e., the second card and portion 9 are extended out from the top horizontal of the first lug boss 11.
Aforesaid way provided in this embodiment is adapted to the first card and portion 8 is recess or convex, both of these case.
The present embodiment, by being additionally provided with the first groove 10, and each second card on each first clamping portion 3
First to match with the first groove 10 on the first clamping portion 3 corresponding to each the second clamping portion 4 is provided in socket part 4
Lug boss 11.By the mutual cooperation of the first groove 10 and the first lug boss 11, so that the first clamping portion 3 and the second clamping portion 4
Clamping it is more secured so that cooling fin 2 can be firmly connected in circuit board body 1.
Figure 12 is the structural schematic diagram of another circuit board provided by the embodiments of the present application, in Fig. 1 and embodiment illustrated in fig. 7
On the basis of, as shown in figure 12, it is additionally provided with the second lug boss 12 on each first clamping portion 3, each second clamping portion 4
On be provided with match with the second lug boss 12 on the first clamping portion 3 corresponding to each the second clamping portion 4 it is second recessed
Slot.
Optionally, the bottom of the second lug boss 12 is arranged at least one first card on each first clamping portion 3 and portion 8
Portion edge；
At least one second card and portion 9 on each second clamping portion 4 are arranged on the edge of the second groove.
Optionally, at least one first card on each first clamping portion 3 and portion 8 and the bottom surface of the second lug boss 12 position
In the top of at least one second card and portion 9 and the second groove in same level, each second clamping portion 4 positioned at same
Horizontal plane.
Illustratively, in order to enable the clamping of the first clamping portion 3 and the second clamping portion 4 is more secured, in addition at each
The first card of one or more and portion 8 are set on first clamping portion 3, one the can also be arranged on each first clamping portion 3
Two lug bosses 12.Preferably, the first card and portion 8 on each first clamping portion 3 can be arranged in the bottom of the second lug boss 12
The edge in portion.
It in turn, can also be each in addition to the second card of one or more and portion 9 are arranged on each second clamping portion 4
On a second clamping portion 4 be arranged second groove, and each second groove be with corresponding to each second clamping portion 4
The first clamping portion 3 on second lug boss 12 match.The second groove can be dug on the egative film 5 of cooling fin 2.
For the shapes and sizes of the second lug boss 12, the application is with no restrictions.
Also, the shape of the second different lug bosses 12 can be identical or different；The size of the second different lug bosses 12
It can be identical or different.
The first card and portion 8 and the second lug boss 12 on same first clamping portion 3 can not be located at same level,
Same level can be located at；And the second card and portion 9 and the second groove on same second clamping portion 4 can not be located at same
One horizontal plane can also be located at same level.Only the second lug boss 12 is needed to match with the second groove, the first card and portion 8
Match with the second card and portion 9.
In this implementation, as shown in figure 12, a kind of mode is provided, first on same first clamping portion 3 is allowed to block and portion 8
It is located at same level with the bottom surface of the second lug boss 12, i.e., the first card and portion 8 are prolonged from the bottom surface level of the second lug boss 12
What stretching was gone；Correspondingly, the second card allowed on same second clamping portion 4 and portion 9 and the top of the second groove are located at same water
Plane, i.e., the second card and portion 9 are extended out from the top horizontal of the second groove.
Aforesaid way provided in this embodiment is adapted to the case where the first card and portion 8 are recess.
The present embodiment, by being additionally provided with the second lug boss 12 on each first clamping portion 3, in each the second card
To match with the second lug boss 12 on the first clamping portion 3 corresponding to each the second clamping portion 4 is provided in socket part 4
Two grooves.By the mutual cooperation of the second lug boss 12 and the second groove, so that the card of the first clamping portion 3 and the second clamping portion 4
Connect it is more secured so that cooling fin 2 can be firmly connected in circuit board body 1.
Figure 13 is other a kind of structural schematic diagrams of circuit board provided by the embodiments of the present application, embodiment shown in Fig. 1
On the basis of, as shown in figure 13, the number of the first clamping portion 3 is one；Be provided on first clamping portion 3 at least one third card and
Portion 13 is provided at least one and third card and the card of portion 13 the matched 4th and portion on each second clamping portion 4.
Optionally, third card and portion 13 are recess, and the 4th card and portion are convex；Alternatively, third card and portion 13 are convex
Shape is played, the 4th card and portion are recess.
Optionally, the first clamping portion 3 includes third groove, and the side of third groove is arranged at least one third card and portion 13
On edge, at least one third card and portion 13 and third groove are located at same level；4th card and portion are located at the bottom of cooling fin 2
Edge.
Optionally, third card and portion 13 and the 4th card and portion correspond.
Illustratively, first clamping portion 3 can be set in circuit board body 1, and then will be on each cooling fin 2
The second clamping portion 4 be all clamped respectively with the first clamping portion 3, so that each cooling fin 2 is snapped fit onto circuit board body 1
On.Cooling fin 2 can use cooling fin 2 provided by the above embodiment.
Specifically, one or more third cards and portion 13 are set on the first clamping portion 3；It is set on each cooling fin 2
It is equipped with second clamping portion 4；On the second clamping portion 4 of each radiator setting the 4th card and portion, the 4th card and portion and
Third card and portion 13 are mutually matched.For example, M third card and portion 13, radiator will be provided on the first clamping portion 3
Number be Q, second clamping portion 4 is provided on each radiator, have on the second clamping portion 4 P the 4th card and
Portion.Third card and portion 13 and the 4th card and portion are one-to-one, and then P the 4th card and portion on each second clamping portion 4
It is snapped fit onto P third card and portion 13 respectively, so that radiator is snapped fit onto circuit board body 1.Alternatively, third card and
Portion 13 is corresponding with two the 4th cards and portion, and then the P on each second clamping portion 4 the 4th card and portion snap fit onto respectively
In P/2 third card and portion 13, so that radiator is snapped fit onto circuit board body 1.Alternatively, two third cards and portion 13 and one
A 4th card and portion are one-to-one, and then P the 4th card on each second clamping portion 4 snaps fit onto 2*P with portion respectively
In third card and portion 13, so that radiator is snapped fit onto circuit board body 1.
Further, third card and portion 13 can be recess or convex, then the 4th card and portion only need to cooperate with it
?.Specifically, third card and portion 13 are recess, and the 4th card and portion are convex, then the 4th card and portion can block and arrive
In third card and portion 13；Alternatively, third card and portion 13 are convex, the 4th card and portion are recess, then third card and portion 13 can
With card and into the 4th card and portion.
For the ease of the clamping of the first clamping portion 3 and the second clamping portion 4, in addition to being arranged on each first clamping portion 3
The first card of one or more and portion 8, can also be arranged a third groove on each first clamping portion 3.It preferably, can be with
Third card and portion 13 on each first clamping portion 3 are arranged in the edge of third groove.It can be by multiple cooling fins 2 all with
The edge of one clamping portion 3 is clamped, so that each cooling fin 2 be snapped fit onto circuit board body 1.
For the shapes and sizes of third groove, the application is with no restrictions.
In order to enable cooling fin 2 and the clamping of circuit board body 1 are more secured, can be set positioned at circuit board body 1
Third card and portion 13 on first clamping portion 3 are elastic, so can by the 4th card and portion it is relatively firm with third card and
Portion 13 is clamped.
Further, in order to enable during the clamping in third card and portion 13 and the 4th card and portion is more secured, adjustable the
The diameter in three cards and portion 13 and the 4th card and portion.For example, if third card and portion 13 are recess, and the 4th card and portion are
Convex, then third card and the diameter in portion 13 is needed to block the diameter with portion less than the corresponding to third card and portion 13 the 4th, into
And the 4th card and portion more can firmly snap fit onto third card and portion 13.Again for example, if third card and portion 13 are convex
Shape is played, and the 4th card and portion are recess, then third card and the diameter in portion 13 is needed to be greater than corresponding to third card and portion 13
The 4th card and portion diameter, and then third card and portion 13 more can firmly snap fit onto the 4th card and portion in.
Each third card and portion 13 and third groove can not be located at same level, can also be located at same level.This
In implementation, as shown in figure 11, a kind of mode is provided, the bottom surface of each third card and portion 13 and third groove is allowed to be located at same level
Face, i.e. third card and portion 13 are gone out from the bottom surface horizontal extension of third groove；At this time it is required that the 4th card and portion are located at
The bottom margin of cooling fin 2, i.e., the 4th card and portion are extended out from the bottom level of cooling fin 2.
Multiple cooling fins 2 can be clamped by the present embodiment by the way that first clamping portion 3 is arranged in circuit board body 1
It is arranged in circuit board body 1 onto the first clamping portion 3, and then by cooling fin 2.It, can be convenient and fast by above-mentioned snap fit
Cooling fin 2 is fixed on circuit board or disassembles cooling fin 2 from circuit board；Improve installation and removal cooling fin 2
Efficiency, improve installation and removal cooling fin 2 convenience.
Embodiments herein additionally provides a kind of supercomputer equipment, as shown in figure 14, to provide in the embodiment of the present application
Supercomputer equipment structural schematic diagram.Specifically, as shown in Figure 14, in the supercomputer equipment include above-described embodiment in provide to
A few circuit board 141.
Optionally, parallel with one another between each circuit board 141 in supercomputer equipment.
Optionally, it may be provided with sliding slot on the cabinet of supercomputer equipment, sliding slot is used for and each circuit board 141 in supercomputer equipment
It is slidably connected.
Optionally, the cabinet two sides of supercomputer equipment are also provided with fan, the heat dissipation wind channel of fan can on circuit board 141
The heat dissipation cavity of radiator be consistent, so that quickly the heat that cabinet interior circuit board 141 generates is dispersed into outside cabinet, into
And provide the performance of supercomputer equipment.
Illustratively, one or more circuit boards 141 are set in supercomputer equipment, which uses above-mentioned implementation
The circuit board that example provides.The structure and function of circuit board 141 may refer to the introduction of above-described embodiment, repeat no more.
In the present embodiment, multiple circuit boards 141 can be subjected to parallel connection, then by the setting of circuit board 141 in parallel super
It calculates in equipment.In one embodiment, supercomputer equipment can be supercomputer server.
Circuit board 141 can choose the mode for being fixedly connected or being slidably connected with the connection type of supercomputer equipment.It is exemplary
Ground can be provided with one or more sliding slots on the cabinet of supercomputer equipment, and then circuit board 141 is arranged in sliding slot, is made
Obtaining circuit board 141 can slide on the chute.
Wherein, when multiple circuit board 141 are set in supercomputer equipment, each of multiple circuit boards 141 circuit
The structure of plate 141 can be identical or different.For example, S circuit board 141 is set in supercomputer equipment, and S is more than or equal to 2
Positive integer is provided with 4 the first clamping portions, remaining circuit board body in the circuit board body of the part in S circuit board 141
On be provided with 6 the first clamping portions.
The present embodiment provides one or more circuit boards 141 by the way that above-described embodiment is arranged in supercomputer equipment.Pass through
One or more cooling fins are set in circuit board body；First clamping portion is set in circuit board body, in each heat dissipation
The second clamping portion is arranged on piece；First clamping portion and the second clamping portion are clamped, and then cooling fin is arranged in circuit board body.
Since the first clamping portion being arranged in circuit board body, the second clamping portion is set on each cooling fin, so that cooling fin can
To be connected in circuit board body；By above-mentioned snap fit, easily cooling fin can be fixed on circuit board 141 or
Person disassembles cooling fin from circuit board 141；The efficiency of installation and removal cooling fin is improved, installation and removal heat dissipation is improved
The convenience of piece.
When in the application, although term " first ", " second " etc. may be used in this application to describe respectively
Element, but these elements should not be limited by these terms.These terms are only used to by an element and another element region
It does not open.For example, in the case where not changing the meaning of description, first element can be called second element, and same, second
Element can be called first element, as long as " second yuan that " first element " occurred is unanimously renamed and occurred
Part " unanimously renames.First element and second element are all elements, but can not be identical element.
Word used herein is only used for description embodiment and is not used in limitation claim.Such as embodiment with
And used in the description of claim, unless context clearly illustrates, otherwise "one" (a) of singular, "one"
(an) and " described " (the) is intended to include equally plural form.Similarly, term "and/or" as used in this specification
Refer to comprising one or more associated any and all possible combinations listed.In addition, when being used for the application
When middle, term " includes " (comprise) and its modification " comprising " (comprises) and/or refer to including (comprising) etc. old
The presence of feature, entirety, step, operation, element and/or the component stated, but be not excluded for one or more other features,
Entirety, step, operation, element, component and/or these grouping presence or addition.
Above-mentioned technical description can refer to attached drawing, these attached drawings form a part of the application, and by description attached
The embodiment according to described embodiment is shown in figure.Although the description of these embodiments is enough in detail so that this field
Technical staff can be realized these embodiments, but these embodiments are non-limiting；Other implementations thus can be used
Example, and variation can also be made in the case where not departing from the range of described embodiment.For example, described in flow chart
Operation order be non-limiting, therefore in flow charts illustrate and according to flow chart description two or more behaviour
The sequence of work can be changed according to several embodiments.As another example, in several embodiments, it explains in flow charts
It releases and is optional or deletable according to one or more operations that flow chart describes.In addition, certain steps or
Function can be added in the disclosed embodiments or more than two sequence of steps are replaced.All these variations are considered
Included in the disclosed embodiments and claim.
In addition, using term to provide the thorough understanding of described embodiment in above-mentioned technical description.However, and being not required to
Will excessively detailed details to realize described embodiment.Therefore, the foregoing description of embodiment be in order to illustrate and describe and
It presents.The embodiment and example disclosed according to these embodiments presented in foregoing description is provided separately, with
Addition context simultaneously helps to understand described embodiment.Description above, which is not used in, accomplishes exhaustive or by described reality
Apply the precise forms that example is restricted to the application.According to the above instruction, it is several modification, selection be applicable in and variation be feasible.?
In some cases, processing step well known is not described in avoid described embodiment is unnecessarily influenced.
Specific embodiment is applied in the application, and the principle and implementation of this application are described, above embodiments
Explanation be merely used to help understand the present processes and its core concept；At the same time, for those skilled in the art,
According to the thought of the application, there will be changes in the specific implementation manner and application range, in conclusion in this specification
Hold the limitation that should not be construed as to the application.
The above, the only specific embodiment of the application, but the protection scope of the application is not limited thereto, it is any
Those familiar with the art within the technical scope of the present application, can easily think of the change or the replacement, and should all contain
Lid is within the scope of protection of this application.Therefore, the protection scope of the application should be based on the protection scope of the described claims.
Claims (24)
1. a kind of circuit board characterized by comprising
Circuit board body and at least one cooling fin；
It is provided with the first clamping portion in the circuit board body, is arranged on each of at least one described cooling fin cooling fin
There is the second clamping portion；First clamping portion and second clamping portion are clamped, at least one cooling fin setting is existed
In the circuit board body.
2. circuit board according to claim 1, which is characterized in that the number of first clamping portion be it is multiple, described the
The number of one clamping portion is more than or equal to the number of the cooling fin；
Blocked first clamping portion corresponding to the second clamping portion and each described cooling fin on each described cooling fin
It connects.
3. circuit board according to claim 2, which is characterized in that be provided at least one on each described first clamping portion
A first card and portion, be provided on the second clamping portion corresponding to each described first clamping portion with it is described at least one first
At least one matched second card of card and portion and portion.
4. circuit board according to claim 3, which is characterized in that first card and portion are recess, second card
It is convex with portion；
Alternatively, first card and portion are convex, second card and portion are recess.
5. circuit board according to claim 3 or 4, which is characterized in that be additionally provided on each described first clamping portion
First groove is provided with and the first clamping portion corresponding to the second clamping portion described in each on each described second clamping portion
On the first lug boss for matching of the first groove.
6. circuit board according to claim 5, which is characterized in that described at least one on each described first clamping portion
The edge of first groove is arranged in a first card and portion；
At least one described second card and portion on each described second clamping portion are arranged on first lug boss.
7. circuit board according to claim 6, which is characterized in that described at least one on each described first clamping portion
A first card and portion and the bottom surface of first groove are located at same level, the institute on each described described second clamping portion
It states at least one second card and portion and the top of first lug boss is located at same level.
8. circuit board according to claim 3, which is characterized in that be additionally provided with second on each described first clamping portion
Lug boss, be provided on each described second clamping portion on the first clamping portion corresponding to the second clamping portion described in each
The second groove for matching of the second lug boss.
9. circuit board according to claim 8, which is characterized in that described at least one on each described first clamping portion
The bottom margin of second lug boss is arranged in a first card and portion；
At least one described second card and portion on each described second clamping portion are arranged on the edge of second groove.
10. circuit board according to claim 9, which is characterized in that on each described first clamping portion it is described at least
The bottom surface of one first card and portion and second lug boss is located at same level, on each described described second clamping portion
At least one described second card and the top of portion and second groove be located at same level.
11. according to the described in any item circuit boards of claim 3-10, which is characterized in that first card and portion and described second
Card and portion correspond.
12. circuit board according to claim 11, which is characterized in that it is described first card and portion be elasticity first card and
Portion；
If first card and portion are recess and second card and portion are convex, the diameter of first card and portion
Less than the diameter of the second card and portion corresponding to first card and portion；
If first card and portion are convex and second card and portion are recess, the diameter of first card and portion
Greater than the diameter of the second card and portion corresponding to first card and portion.
13. -12 described in any item circuit boards according to claim 1, which is characterized in that the surface of first clamping portion is arranged
There is adhesive layer, first clamping portion surface and the surface of second clamping portion are bonded by the adhesive layer.
14. -13 described in any item circuit boards according to claim 1, which is characterized in that be provided in the circuit board body to
A few chip, first wedging position is at least one described chip.
15. circuit board according to claim 1, which is characterized in that the number of first clamping portion is one；
It is provided at least one third card and portion on first clamping portion, is provided at least on each described second clamping portion
One with the third card and portion it is matched 4th card and portion.
16. circuit board according to claim 15, which is characterized in that the third card and portion are recess, the described 4th
Card and portion are convex；
Alternatively, the third card and portion are convex, the 4th card and portion are recess.
17. circuit board according to claim 16, which is characterized in that first clamping portion includes third groove, described
At least one third card and portion are arranged on the edge of the third groove, at least one described third card and portion and the third
Groove is located at same level；
4th card and portion are located at the bottom margin of the cooling fin.
18. circuit board according to claim 17, which is characterized in that the third card and portion and the 4th card and portion one
One is corresponding.
19. -18 described in any item circuit boards according to claim 1, which is characterized in that also set up on each described cooling fin
There is at least one radiating fin, at least one described radiating fin is connect with the second clamping portion on each described cooling fin.
20. circuit board according to claim 19, which is characterized in that interconnecting piece is also set up on each described cooling fin,
Interconnecting piece includes the first plate and the second plate, is in predetermined angle between first plate and second plate；
At least one described radiating fin is fixed at the upper surface of the interconnecting piece, and second clamping portion is fixed at
The lower surface of the interconnecting piece.
21. circuit board described in 9 or 20 according to claim 1, which is characterized in that adjacent at least one described radiating fin
The height of radiating fin is identical or different.
22. a kind of supercomputer equipment, which is characterized in that including at least one such as the described in any item circuit boards of claim 1-21.
23. supercomputer equipment according to claim 22, which is characterized in that each circuit board in the supercomputer equipment it
Between it is parallel with one another.
24. the supercomputer equipment according to claim 22 or 23, which is characterized in that be provided on the cabinet of the supercomputer equipment
Sliding slot, the sliding slot with each circuit board in the supercomputer equipment for being slidably connected.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/113200 WO2020087410A1 (en) | 2018-10-31 | 2018-10-31 | Circuit board and supercomputing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109644554A true CN109644554A (en) | 2019-04-16 |
Family
ID=66060109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880002429.0A Pending CN109644554A (en) | 2018-10-31 | 2018-10-31 | Circuit board and supercomputer equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN109644554A (en) |
| WO (1) | WO2020087410A1 (en) |
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| US5735340A (en) * | 1996-05-15 | 1998-04-07 | Silicon Graphics, Inc. | Heat sink with integral attachment mechanism |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2020087410A1 (en) | 2020-05-07 |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190416 |
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| RJ01 | Rejection of invention patent application after publication |