CN216902900U - Circuit board and control device - Google Patents

Abstract

The embodiment of the utility model discloses a circuit board and a control device, the circuit board comprises a substrate, a heat conduction layer, a chip and a radiator, the substrate comprises a first side and a second side which are oppositely arranged, the heat conduction layer is arranged on the substrate and is exposed from the first side to respectively form a heat conduction part and a connection part, the chip is arranged on the first side and is abutted against the heat conduction part, a radiator cover is arranged on the outer side of the chip, the radiator is fixed on the connection part and is covered on the outer side of the chip to enhance the heat radiation performance of the outer part of the chip through the radiator and accelerate the heat radiation of the chip, because the chip is abutted against the heat conduction part, the heat at the bottom of the chip can be led out through the heat conduction part, the radiator is fixed on the connection part, and the heat conduction part and the connection part are parts of the heat conduction layer, the heat of the chip can be transmitted to the connection part through the heat conduction part of the heat conduction layer and then is transmitted to the radiator through the connection part, the heat dissipation effect of the heat radiator on the chip is further enhanced, and the stable operation of the chip on the circuit board is guaranteed.

Description

Circuit board and control device

Technical Field

The utility model relates to the technical field of circuit boards, in particular to a circuit board and a control device.

Background

The circuit board is an important electronic component, is a support body of the electronic component, and is a carrier for electrical connection of the electronic component. Under the general condition, the circuit board is provided with high-power devices which are mainly chips, the chips can generate more heat during working, the heat dissipation performance of the circuit board is insufficient, and the chips are easy to burn out due to overhigh temperature because the heat dissipation performance of the chips is poor.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit board and a control device, and aims to solve the technical problems that the existing circuit board is insufficient in heat dissipation performance, and a chip is easy to burn out due to overhigh temperature because the heat dissipation of the chip is not good.

The present invention provides a circuit board, comprising: the heat-conducting layer is arranged on the substrate and exposed from the first side to form a heat-conducting part and a connecting part respectively, the chip is arranged on the first side and abutted against the heat-conducting part, the radiator cover is arranged on the outer side of the chip, and the radiator is fixed on the connecting part.

The heat conductive layer can also be exposed from the second side to form a heat sink.

In one embodiment, the heat sink includes a top wall and a side wall extending from the edge of the top wall to the substrate, and the top wall and the side wall enclose a receiving space for receiving the chip.

In one embodiment, the heat sink further comprises fins extending from the top wall in a direction away from the top wall; and/or

The circuit board further comprises heat dissipation paste, and the heat dissipation paste is filled in a gap between the top wall and the chip and a gap between the side wall and the chip.

In one of them embodiment, the chip includes a plurality of pins, the radiator is equipped with dodges the mouth, dodge the mouth be used for certainly lateral wall and/or the roof exposes the pin, the base plate is equipped with a plurality of pads, the pin weld in the pad, the pin with the pad one-to-one sets up.

In one embodiment, the plurality of chips are arranged on the substrate at intervals, and the radiator cover is arranged on the outer sides of the plurality of chips; and/or

The chip is attached to the substrate.

In one embodiment, the connecting portion is provided with a welding hole penetrating through the first side and the second side, and the heat sink is further provided with a plug pin inserted into a hole wall of the welding hole.

In one embodiment, the plurality of welding holes are arranged at intervals around at least part of the edge of the chip, and the plurality of inserting pins are arranged in one-to-one correspondence with the welding holes.

In one embodiment, the heat sink is a structural member made of metal, and the heat conduction layer is a metal layer; and/or

The outer side of the circuit board is sealed with sealant to form a rubber shell, and the radiator is exposed out of the outer wall of the rubber shell and is in contact with the outside air.

In a second aspect, the utility model further provides a control device, which includes the circuit board of any of the above embodiments.

The embodiment of the utility model has the following beneficial effects:

by adopting the circuit board, the radiator cover is arranged at the outer side of the chip so as to enhance the heat radiation performance of the outer side part of the chip through the radiator and accelerate the heat radiation of the chip, the heat at the bottom of the chip can be led out through the heat conducting part because the chip is abutted against the heat conducting part, and the radiator is fixed on the connecting part, and the heat conducting part and the connecting part are parts of the heat conducting layer, so that the heat of the chip can be transmitted to the connecting part through the heat conducting part of the heat conducting layer and further transmitted to the radiator through the connecting part, thereby further enhancing the heat radiation effect of the radiator on the chip and ensuring the stable operation of the chip on the circuit board.

The circuit board is applied to the control device, and the radiator arranged on the circuit board can provide good radiating performance for the chip, so that the stable operation of the chip on the circuit board can be ensured, the control stability of the control device is improved, and the service life of the control device is prolonged.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.

Wherein:

FIG. 1 is a schematic diagram of a circuit board in one embodiment.

Fig. 2 is an enlarged view of a portion a of fig. 1.

Fig. 3 is a front view of the heat sink on the circuit board of fig. 1.

Fig. 4 is a side view of the heat sink shown in fig. 1.

Fig. 5 is a bottom view of the heat sink shown in fig. 1.

FIG. 6 is a diagram illustrating solder mask of a top layer of a circuit board in one embodiment.

FIG. 7 is a diagram illustrating solder mask of a top layer of a circuit board in one embodiment.

FIG. 8 is a circuit diagram of a circuit board according to one embodiment.

Figure 9 is a technical parameter diagram of a booster pump in one embodiment.

Reference numerals: 100. a substrate; 110. a first side; 120. a second side; 130. a pad;

200. a heat conductive layer; 210. a heat conducting portion; 220. a connecting portion; 230. a heat dissipating section; 240. welding the hole;

300. a chip; 310. a pin;

400. a heat sink; 410. a top wall; 420. a side wall; 430. a heat sink; 440. avoiding the mouth; 450. a pin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

The embodiment of the utility model provides a circuit board, which can control specific work of equipment such as a booster water pump and the like, for example, the water yield of the booster water pump can be adjusted through the control of the circuit board, wherein a chip 300 is a main heating device on the circuit board. Referring to fig. 1 to 7, a circuit board according to an embodiment includes a substrate 100, a heat conductive layer 200, a chip 300 and a heat sink 400, wherein the substrate 100 includes a first side 110 and a second side 120 opposite to each other, the heat conductive layer 200 is disposed on the substrate 100 and exposed from the first side 110 to form a heat conductive portion 210 and a connecting portion 220, respectively, the chip 300 is disposed on the first side 110 and abuts against the heat conductive portion 210, the heat sink 400 is disposed outside the chip 300, and the heat sink 400 is fixed to the connecting portion 220.

It can be understood that the heat sink 400 is covered outside the chip 300 to increase the contact area with air through the heat sink 400, and enhance the heat dissipation performance of the outside portion of the chip 300, so as to accelerate the heat dissipation of the chip 300, because the chip 300 abuts against the heat conduction portion 210, the heat at the bottom of the chip 300 can be conducted out through the heat conduction portion 210, because the heat sink 400 is fixed to the connection portion 220, and the heat conduction portion 210 and the connection portion 220 are both part of the heat conduction layer 200, the heat of the chip 300 can be transferred to the connection portion 220 through the heat conduction portion 210 of the heat conduction layer 200, and then transferred to the heat sink 400 through the connection portion 220, so as to further enhance the heat dissipation effect of the heat sink 400 on the chip 300, and through the arrangement of the contact type heat sink, the stable operation of the chip 300 on the circuit board is ensured.

In this embodiment, the heat sink 400 is a structural member made of metal, and the heat conducting layer 200 is a metal layer, which is beneficial to heat transfer and dissipation. Further, the heat sink 400 is a structural member made of copper metal, and the heat conductive layer 200 is a copper foil. Specifically, this radiator 400 can be the structure that red copper made, and has plated the tin layer at radiator 400 surface, and tin layer thickness is greater than 3um, has stronger antirust property, soldering tin nature. Preferably, the wall thickness of the heat sink 400 is 0.7mm to 0.9 mm.

In an embodiment, with reference to fig. 2, 6 and 7, the heat conductive layer 200 can also be exposed from the second side 120 to form a heat dissipation portion 230, and the heat dissipation portion 230 is disposed to enhance the heat dissipation performance of the chip 300 and accelerate the heat dissipation of the chip 300. Specifically, since the chip 300 abuts against the heat conduction portion 210, the heat at the bottom of the chip 300 can be conducted out through the heat conduction portion 210, and since the heat conduction portion 210 and the heat dissipation portion 230 are both part of the heat conduction layer 200, the heat of the chip 300 can be transmitted to the heat dissipation portion 230 through the heat conduction portion 210 of the heat conduction layer 200, and then dissipated to the air through the heat dissipation portion 230, so as to further enhance the heat dissipation performance of the chip 300 and avoid the chip 300 from being too hot. Further, the heat conducting portion 210 and the heat dissipating portion 230 are disposed on two sides of the heat conducting layer 200 opposite to each other, that is, two side end surfaces of the heat conducting layer 200.

In an embodiment, with reference to fig. 2 to 5, the heat sink 400 includes a top wall 410 and a side wall 420 extending from an edge of the top wall 410 to the substrate 100, and the top wall 410 and the side wall 420 surround to form an accommodating space for accommodating the chip 300, so that the top wall 410 and the side wall 420 can be disposed around the outside of the chip 300 to increase a contact area between the heat sink 400 and the outside of the chip 300, thereby enhancing a heat dissipation effect of the heat sink 400 and improving a heat dissipation performance of the chip 300. Specifically, the circuit board further includes a thermal paste, the thermal paste fills a gap between the top wall 410 and the chip 300 and a gap between the side wall 420 and the chip 300, and the thermal paste enables the heat sink 400 to be in closer contact with the chip 300, so as to improve the efficiency of the chip 300 in transferring heat to the heat sink 400. Optionally, the plurality of side walls 420 are provided, an included angle is formed between adjacent side walls 420, when three side walls 420 are provided, an orthographic projection of the three side walls 420 on the substrate 100 is U-shaped, and of course, the side walls 420 may also be arc-shaped walls, and the specific arrangement position and shape of the side walls 420 may be adapted to the position and shape of the chip 300.

Further, the heat sink 400 further includes heat dissipation fins 430, the heat dissipation fins 430 extend from the top wall 410 to a direction away from the top wall 410, and the contact area between the heat sink 400 and the air can be further increased by the heat dissipation fins 430, so as to further enhance the heat dissipation effect of the heat sink 400. Alternatively, the heat sink 430 is provided in plurality. Of course, in other embodiments, the heat sink 430 may also be disposed on the sidewall 420, and the specific disposition position and disposition shape of the heat sink 430 may be selected according to the design requirement of the circuit board.

Further, in this embodiment, referring to fig. 2, the chip 300 includes a plurality of pins 310, the heat sink 400 is provided with an avoiding opening 440, the avoiding opening 440 is used to expose the pins 310 from the side wall 420 and/or the top wall 410, the substrate 100 is provided with a plurality of pads 130, the pins 310 are soldered to the pads 130, the pins 310 and the pads 130 are arranged in a one-to-one correspondence, so as to implement transmission of electrical signals through the pins 310, and by arranging the avoiding opening 440, it is more beneficial to mount the pins 310 on the substrate 100, it can be understood that, since the pins 310 need to be electrically connected to the pads 130 on the substrate 100, so as to implement transmission of electrical signals through the pins 310, it is noted that the pins 310 cannot contact with the heat sink 400, and the coating film of the thermal paste needs to avoid the pins 310.

In one embodiment, the circuit board is sealed with a sealant to form a plastic case, and the heat sink 400 is exposed from the outer wall of the plastic case and contacts with the outside air. Through the setting of gluing the shell, can improve the waterproof performance of circuit board, in order to avoid leaking water in long-time use, take place the short circuit, simultaneously, because fin 430 can stretch out the gluey shell outside, can guarantee the radiating effect of radiator 400, and then guarantee the heat dispersion of chip 300, in order to avoid chip 300 high temperature to burn out, optionally, roof 410 and/or lateral wall 420 upper end of radiator 400 also can expose and locate gluey shell outside, guarantee the radiating effect of radiator 400, reduce the temperature of chip 300.

In an embodiment, referring to fig. 2, a plurality of chips 300 are disposed on the substrate 100 at intervals, and the heat spreader 400 covers the outer sides of the plurality of chips 300; the heat dissipation performance of the plurality of chips 300 can be enhanced by one heat sink 400, specifically, at least one of the plurality of chips 300 can be selected as a switching power supply chip, and further, the chip 300 is attached to the substrate 100.

In an embodiment, with reference to fig. 3 to 5 and 7, the connecting portion 220 is provided with a welding hole 240 penetrating through the first side 110 and the second side 120, and the heat sink 400 is further provided with a plug pin 450, and the plug pin 450 is inserted into a hole wall of the welding hole 240. The heat spreader 400 is inserted on the substrate 100 through an insertion process so that the heat spreader 400 can be covered on the outer side of the chip 300 and can contact the chip 300 to accelerate the heat dissipation of the chip 300.

Further, a plurality of welding holes 240 are provided and are arranged at intervals around at least a part of the edge of the chip 300, and a plurality of pins 450 are provided and are arranged in one-to-one correspondence with the welding holes 240, so that the stability and reliability of inserting the heat sink 400 on the substrate 100 can be enhanced.

Referring to fig. 1 to 7, a control device according to an embodiment includes a circuit board according to any of the embodiments. When the circuit board is applied to the control device, the heat sink 400 disposed on the circuit board can provide good heat dissipation performance for the chip 300, so that the chip 300 can be ensured to stably operate on the circuit board, and the control stability and the service life of the control device are improved.

When being applied to booster pump with this controlling means and realizing adjusting the water yield, the outside of circuit board is sealed to have sealed glue in order to form and glues the shell, because the setting of gluing the shell, can improve the waterproof performance of circuit board to avoid the face to leak water in long-time use, take place the short circuit, simultaneously, because the fin 430 can stretch out glues the shell outside, can guarantee the radiating effect of radiator 400, and then guarantee the heat dispersion of chip 300.

Specifically, as shown in fig. 8, the circuit board includes a switch circuit, the switch circuit is a circuit composed of a patch switch power supply chip and a patch schottky diode, the model of the patch switch power supply chip is XL4015E1, and the model of the patch schottky diode is MBRB20100 CT. According to technical specifications, when 24V is input, 5V is output, and the output current can reach 0.1A-5A. As shown in fig. 9, according to the technical parameters of the used booster pump, the actual working current of the load is 2A, and the application adaptability is good. Fig. 9 is a schematic diagram of the efficiency and the output current of the booster pump, where the abscissa is the load current (a) and the ordinate is the efficiency, where the curve a1 represents VIN equal to 8V, VOUT equal to 5V, IOUT equal to 0.1A to 5A, the curve a2 represents VIN equal to 12V, VOUT equal to 5V, IOUT equal to 0.1A to 5A, the curve A3 represents VIN equal to 24V, VOUT equal to 5V, IOUT equal to 01A to 5A, the curve a4 represents VIN equal to 36V, VOUT equal to 5V, and IOUT equal to 01A to 5A. In this embodiment, all the related components on the circuit board are mounted on the substrate 100 in a chip form, the switching power supply is packaged in a TO26-5L chip form, and the schottky diode is packaged in a SOT-23 chip form.

The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention, and it is therefore to be understood that the utility model is not limited by the scope of the appended claims.

Claims (10)

1. A circuit board, comprising: the heat-conducting layer is arranged on the substrate and exposed from the first side to form a heat-conducting part and a connecting part respectively, the chip is arranged on the first side and abutted against the heat-conducting part, the radiator cover is arranged on the outer side of the chip, and the radiator is fixed on the connecting part.

2. The circuit board of claim 1, wherein the thermally conductive layer is further exposed from the second side to form a heat sink.

3. The circuit board of claim 1, wherein the heat sink includes a top wall and a side wall extending from an edge of the top wall toward the substrate, and the top wall and the side wall enclose a receiving space for receiving the chip.

4. The circuit board of claim 3, wherein the heat sink further comprises a heat sink fin extending from the top wall in a direction away from the top wall; and/or

The circuit board further comprises a heat dissipation paste, and the heat dissipation paste is filled in a gap between the top wall and the chip and a gap between the side wall and the chip.

5. The circuit board of claim 3, wherein the chip comprises a plurality of pins, the heat sink is provided with an avoiding opening for exposing the pins from the side wall and/or the top wall, the substrate is provided with a plurality of pads, the pins are soldered to the pads, and the pins and the pads are arranged in a one-to-one correspondence.

6. The circuit board of claim 1, wherein the plurality of chips are disposed on the substrate at intervals, and the heat spreader lid is disposed on an outer side of the plurality of chips; and/or

The chip is attached to the substrate.

7. The circuit board of claim 1, wherein the connecting portion has a welding hole penetrating through the first side and the second side, and the heat sink further has a plug pin inserted into a hole wall of the welding hole.

8. The circuit board of claim 7, wherein the plurality of solder holes are spaced around at least a portion of the edge of the chip, and the plurality of pins are in one-to-one correspondence with the plurality of solder holes.

9. The circuit board of claim 1, wherein the heat sink is a structural member made of metal, and the heat conductive layer is a metal layer; and/or

The outer side of the circuit board is sealed with sealant to form a rubber shell, and the radiator is exposed out of the outer wall of the rubber shell and is in contact with the outside air.

10. A control device comprising a circuit board according to any one of claims 1 to 9.

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