CN220823352U - Heat dissipation circuit and motor driving circuit - Google Patents

Heat dissipation circuit and motor driving circuit Download PDF

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Publication number
CN220823352U
CN220823352U CN202322482253.4U CN202322482253U CN220823352U CN 220823352 U CN220823352 U CN 220823352U CN 202322482253 U CN202322482253 U CN 202322482253U CN 220823352 U CN220823352 U CN 220823352U
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China
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heat
circuit
power device
conductive
heat dissipation
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CN202322482253.4U
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Chinese (zh)
Inventor
徐振
黄桂连
方统孝
张奕基
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Shenzhen Taikong Technology Co ltd
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Shenzhen Taikong Technology Co ltd
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Abstract

A heat dissipation circuit belongs to the technical field of motor drive, and comprises: the printed circuit board comprises a first surface, a second surface opposite to the first surface and a preset number of conductive through holes which are arranged on the bonding pads of the printed circuit board at intervals, wherein the conductive through holes penetrate through the first surface and the second surface; the power device is attached to the first surface; the control device is welded on the first surface, is connected with the power device and the connecting circuit printed on the first surface, is used for welding soldering tin of the control device, and is filled with the conductive through holes to form a heat conduction through hole network. Compared with the traditional power device heat dissipation mode, the heat dissipation path based on the heat conduction through hole network is introduced into the back of the power device, so that heat can be effectively transferred from the power device to the back of the printed circuit board, retention in the power device is reduced, heat efficiency is improved, and heat loss is reduced.

Description

Heat dissipation circuit and motor driving circuit
Technical Field
The utility model belongs to the technical field of motor driving, and particularly relates to a heat dissipation circuit and a motor driving circuit.
Background
In motor driving, heat gradually accumulates with the operation of the power device, which can lead to the reduction of the secondary current capability, in particular to the reduction of the performance and the shortening of the service life of the motor driving circuit with the reduction of the secondary current capability in the motor driving circuit with high power.
At present, in order to solve the heat dissipation problem of the high-power motor driving circuit, an integrated intelligent power module (INTELLIGENT POWER MODULE, IPM) is generally adopted to add heat conduction silicone grease and a heat dissipation fin, or a single power tube package is adopted to add heat conduction silicone grease and a heat dissipation fin to conduct heat dissipation. However, the cost of the integrated IPM is high, which increases the manufacturing cost of the motor driving circuit, and is not beneficial to general use; the surface of a single power tube is generally uneven, so that effective heat dissipation is difficult to ensure, and the packaging surface is covered with thicker epoxy resin, so that the thermal resistance is increased, and the heat dissipation is not facilitated.
Disclosure of utility model
In view of the above, the embodiment of the utility model provides a heat dissipation circuit and a motor driving circuit, which aim to solve the above technical problems in the heat dissipation of the current power device.
In order to solve the technical problems, an embodiment of the application provides a heat dissipation circuit which is applied to a motor driving circuit, wherein the motor driving circuit comprises a power device, a control device and a connecting circuit; the heat dissipation circuit includes:
The printed circuit board comprises a first surface, a second surface opposite to the first surface and a preset number of conductive through holes which are arranged on the bonding pads of the printed circuit board at intervals, wherein the conductive through holes penetrate through the first surface and the second surface; the power device is attached to the first surface; the control device is welded on the first surface, is connected with the power device and the connecting circuit printed on the first surface, is used for welding soldering tin of the control device, and is filled with the conductive through holes to form a heat conduction through hole network.
In one embodiment, the second surface of the printed circuit board further comprises: and the heat dissipation device covers the second surface.
In one embodiment, a heat dissipating device includes: a heat conducting silica gel and a heat radiating fin; the heat conduction silica gel covers the second surface, and the radiating fin is attached to the heat conduction silica gel.
In one embodiment, the thermally conductive silicone is used to transfer heat from the power device to the second surface of the printed circuit board and the heat sink is used to disperse the heat to the surrounding space.
In one embodiment, the back surface of the power device is attached to the first surface.
In one embodiment, the conductive via is a copper plated via.
In one embodiment, solder for soldering the control device fills the conductive vias, forming a network of thermally conductive copper-tin vias.
A second aspect of an embodiment of the present application provides a motor driving circuit including the heat dissipating circuit of the first aspect above.
The embodiment of the application has the beneficial effects that: the heat dissipation circuit is applied to a motor driving circuit, wherein the motor driving circuit comprises a power device, a control device and a connecting circuit; the heat dissipation circuit includes: the printed circuit board comprises a first surface, a second surface opposite to the first surface and a preset number of conductive through holes which are arranged on the bonding pads of the printed circuit board at intervals, wherein the conductive through holes penetrate through the first surface and the second surface; the power device is attached to the first surface; the control device is welded on the first surface, is connected with the power device and the connecting circuit printed on the first surface, is used for welding soldering tin of the control device, and is filled with the conductive through holes to form a heat conduction through hole network. Compared with the traditional power device heat dissipation mode, the heat dissipation path based on the heat conduction through hole network is introduced into the back of the power device, so that heat can be effectively transferred from the power device to the back of the printed circuit board, retention in the power device is reduced, heat efficiency is improved, heat loss is reduced, and the heat dissipation device is arranged on the back of the printed circuit board, so that the radiator is not limited by the structure.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic side view of a printed circuit board according to an embodiment of the present application;
fig. 2 is a schematic view of a first surface structure of a printed circuit board according to an embodiment of the present application;
Fig. 3 is a schematic diagram of a second surface structure of a printed circuit board according to an embodiment of the present application.
Detailed Description
Embodiments of the technical scheme of the present application will be described in detail below with reference to the accompanying drawings. The following examples are only for more clearly illustrating the technical aspects of the present application, and thus are merely examples, and are not intended to limit the scope of the present application.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having" and any variations thereof in the description of the application and the claims and the description of the drawings above are intended to cover a non-exclusive inclusion.
In the description of embodiments of the present application, the technical terms "first," "second," and the like are used merely to distinguish between different objects and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated, a particular order or a primary or secondary relationship. In the description of the embodiments of the present application, the meaning of "plurality" is two or more unless explicitly defined otherwise.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1, fig. 1 is a schematic side view of a printed circuit board according to an embodiment of the application. The motor driving circuit includes a power device, a control device, a connection circuit, and a heat dissipation circuit. The heat dissipation circuit comprises a printed circuit board, and the power device, the control device and the connection circuit are respectively distributed on the printed circuit board.
As shown in fig. 1, the printed circuit board 101 includes a first surface 1011, a second surface 1012 disposed opposite the first surface. It should be noted that, in the embodiment of the present application, a predetermined number of conductive vias 1013 (not shown in fig. 1, please refer to fig. 2 or fig. 3) are arranged on the pads of the printed circuit board 101 at intervals, so as to implement heat conduction through the conductive vias 1013, and the conductive vias 1013 penetrate the first surface 1011 and the second surface 1012. Heat conduction can be performed, heat is effectively transferred from the first surface to the second surface comprising the power device, and retention of heat inside the power device is reduced.
As shown in fig. 2, the power device 102, the control device 103, and a connection circuit (wherein the connection circuit is a circuit provided on the printed circuit board for conducting each part of the motor driving circuit, and specifically the connection circuit is shown in the drawing) are provided on the first surface 1011 of the printed circuit board 101. Specifically, the power device 102 is attached to the first surface 1011; the control device 103 is soldered to the first surface 1011, and is connected to the power device 102 and a connection circuit printed on the first surface 1011, for soldering the solder of the control device 102, filling the conductive via 1013, forming a network of heat conductive vias. The conductive through holes on the printed circuit board are used as efficient heat conduction channels, so that the heat conduction path is optimized, and heat can be effectively transferred from the power device to the back of the printed circuit board, thereby reducing the working temperature of the device.
Wherein the printed circuit board 101 is a PCB board. The conductive via 1013 is a copper plated via. The solder used to solder the control device 102 covers and fills the conductive vias during the process of soldering the control device, forming a network of thermally conductive copper-tin vias. Heat is conducted through a large number of copper-tin through holes, heat is effectively transferred from the power device to the back of the printed circuit board, retention of the heat in the power device is reduced, and heat dissipation efficiency is improved.
The power device 102 typically includes a power switch, such as a transistor (MOSFET, IGBT), a power diode, or the like. These power devices are used to control the current flow and voltage of the motor, and thus the speed and direction of the motor. The power switch plays a critical switching role in the motor drive, allowing or preventing current flow through the motor coils.
The control device 103 comprises control logic and a Microcontroller (MCU) for executing a control algorithm for generating PWM (pulse width modulation) signals for controlling the motor from input signals such as speed, position, current feedback. These signals control the operation of the motor by changing the state of the power devices.
Referring to fig. 3, fig. 3 is a schematic diagram of a second surface structure of a printed circuit board according to an embodiment of the application.
As can be seen in fig. 3, the second surface 1012 of the printed circuit board 101 further comprises a heat sink 1014. The heat sink 1014 covers the second surface 1012 and forms a heat sink circuit with the printed circuit board. By disposing the heat sink 1014 on a surface (which may also be referred to as a back surface) of the printed circuit board 101 having no other circuit layout, the heat sink 1014 can be mounted without being limited by the structure of the circuit diagram on the motor driving circuit, and the layout and design of the heat sink can be optimized, improving heat dissipation performance. For example, the heat sink 1014 includes a high thermal conductivity material and a heat sink. Wherein, high thermal conductivity material such as heat conduction silica gel can improve heat conduction efficiency, with heat conduction to the fin. In addition, the heat dissipation effect can be improved by reasonably increasing the areas of the heat conduction silica gel and the heat dissipation fins.
Specifically, heat conduction silica gel covers at the second surface, and the fin laminating is on heat conduction silica gel. The heat conducting silica gel is used for transferring heat from the power device to the second surface of the printed circuit board, and the radiating fin is used for dispersing the heat to the surrounding space. The combination mode not only provides double heat conduction paths, but also reduces the whole working temperature of the whole driving circuit, and is beneficial to improving the reliability and the service life of the driving circuit.
Specifically, the area of the heat conducting silica gel and the area of the radiating fins can be flexibly designed according to actual radiating requirements, and the heat conducting silica gel and the radiating fins are not limited herein.
In the embodiment of the present application, the back surface of the power device 102 is attached to the first surface 1011 of the printed circuit board 101. Compared with the traditional technology of radiating through the front of the power device, the back of the power device 102 is attached to the first surface 1011 of the printed circuit board 101, and heat is conducted through a large number of conductive through holes, so that the heat can be more effectively transferred from the back of the power device to the back of the printed circuit board without a circuit, the retention of the heat in the power device is reduced, the radiating efficiency is improved, the design complexity of the radiating device is reduced, and the design and installation of the radiating device are simpler. The second surface of the printed circuit board is flat relative to the first surface, so that the heat dissipation plate is tightly adhered and uniformly disperses heat, and the heat dissipation plate plays a vital role in ensuring the performance of the high-power motor driver.
Because the heat dissipation circuit has a good heat dissipation effect, and a motor driver with higher power can be accommodated in the same space, the heat dissipation circuit provided by the embodiment of the application can be used for motor driving with any power, especially for motor driving with high power such as 140w/220v or more, and can better solve the heat dissipation problem. Providing a more reliable solution for high power applications.
The embodiment of the application has the beneficial effects that: the heat dissipation circuit is applied to a motor driving circuit, wherein the motor driving circuit comprises a power device, a control device and a connecting circuit; the heat dissipation circuit includes: the printed circuit board comprises a first surface, a second surface opposite to the first surface and a preset number of conductive through holes which are arranged on the bonding pads of the printed circuit board at intervals, wherein the conductive through holes penetrate through the first surface and the second surface; the power device is attached to the first surface; the control device is welded on the first surface, is connected with the power device and the connecting circuit printed on the first surface, is used for welding soldering tin of the control device, and is filled with the conductive through holes to form a heat conduction through hole network. Compared with the traditional power device heat dissipation mode, the heat dissipation path based on the heat conduction through hole network is introduced into the back of the power device, so that heat can be effectively transferred from the power device to the back of the printed circuit board, retention in the power device is reduced, heat efficiency is improved, heat loss is reduced, and the heat dissipation device is arranged on the back of the printed circuit board, so that the radiator is not limited by the structure.
The above embodiments are only for illustrating the technical solution of the present application, and are not limiting; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.

Claims (8)

1. The heat dissipation circuit is applied to a motor driving circuit, and the motor driving circuit comprises a power device, a control device and a connecting circuit; the heat dissipation circuit is characterized by comprising:
The printed circuit board comprises a first surface, a second surface opposite to the first surface and a preset number of conductive through holes which are arranged on the printed circuit board bonding pads at intervals, wherein the conductive through holes penetrate through the first surface and the second surface;
the power device is attached to the first surface;
The control device is welded on the first surface, is connected with the power device and the connecting circuit printed on the first surface, is used for welding soldering tin of the control device, fills the conductive through holes, and forms a heat conduction through hole network.
2. The heat dissipation circuit of claim 1, wherein the second surface of the printed circuit board further comprises:
And the heat dissipation device covers the second surface.
3. The heat dissipating circuit of claim 2, wherein said heat dissipating device comprises: a heat conducting silica gel and a heat radiating fin; the heat conduction silica gel covers the second surface, and the radiating fin is attached to the heat conduction silica gel.
4. The heat dissipating circuit of claim 3, wherein said thermally conductive silicone is for transferring heat from said power device to a second surface of a printed circuit board, and wherein said heat sink is for dissipating said heat to a surrounding space.
5. The heat dissipating circuit of any of claims 1-4, wherein a back side of said power device is bonded to said first surface.
6. The heat dissipating circuit of claim 5, wherein said conductive via is a copper plated via.
7. The heat dissipating circuit of claim 5, wherein said solder for soldering said control device fills said conductive vias forming a network of thermally conductive copper-tin vias.
8. A motor drive circuit comprising a heat dissipating circuit as claimed in any one of claims 1 to 7.
CN202322482253.4U 2023-09-12 2023-09-12 Heat dissipation circuit and motor driving circuit Active CN220823352U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202322482253.4U CN220823352U (en) 2023-09-12 2023-09-12 Heat dissipation circuit and motor driving circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202322482253.4U CN220823352U (en) 2023-09-12 2023-09-12 Heat dissipation circuit and motor driving circuit

Publications (1)

Publication Number Publication Date
CN220823352U true CN220823352U (en) 2024-04-19

Family

ID=90677349

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202322482253.4U Active CN220823352U (en) 2023-09-12 2023-09-12 Heat dissipation circuit and motor driving circuit

Country Status (1)

Country Link
CN (1) CN220823352U (en)

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