CN210272335U

CN210272335U - Chip heat radiation structure

Info

Publication number: CN210272335U
Application number: CN201921218602.9U
Authority: CN
Inventors: 李武德
Original assignee: Jiangmen Chuanqi Co ltd
Current assignee: Jiangmen Chuanqi Co ltd
Priority date: 2019-07-30
Filing date: 2019-07-30
Publication date: 2020-04-07
Anticipated expiration: 2029-07-30

Abstract

The utility model discloses a chip heat radiation structure, which comprises a first PCB, a heat radiation block and a second PCB, wherein the heat radiation block is welded on the second PCB by arranging the second PCB, and the second PCB is fixed on the first PCB by utilizing a pin header, so that the fixing of the heat radiation block is not limited by components on the first PCB, and meanwhile, the heat radiation block is favorably and stably fixed, and the heat radiation block is not easy to drop; in addition, first PCB and second PCB are fixed through the pin header, are favorable to saving first PCB's space under the condition of guaranteeing firm degree.

Description

Chip heat radiation structure

Technical Field

The utility model belongs to the technical field of the electronic circuit and specifically relates to a chip heat radiation structure.

Background

Along with the trend of miniaturization of electronic circuits, the application of chips is becoming more and more extensive on PCBs, but the problem of generating heat also becomes obvious, and the chip can all produce great heat when generally working, if do not take the heat dissipation means, burns out the chip easily for PCB can't normally work. The existing heat dissipation means is to use a heat dissipation block to contact with a chip, and absorb heat dissipated by the chip to realize heat dissipation, however, because components on a PCB are more and the space is limited, the heat dissipation block is difficult to fix.

SUMMERY OF THE UTILITY MODEL

In order to solve the above problems, an object of the present invention is to provide a chip heat dissipation structure, which can simply and conveniently fix a heat dissipation block.

The utility model provides a technical scheme that its problem adopted is:

the embodiment of the utility model provides a chip heat radiation structure, include:

the chip-on-chip PCB comprises a first PCB, wherein a chip is mounted on the first PCB, and a pin header is arranged on the first PCB;

the heat dissipation block is used for dissipating heat of the chip;

the second PCB is used for fixing the heat dissipation block, an exposed first copper layer is arranged on the upper surface of the second PCB, and an exposed second copper layer is arranged on the lower surface of the second PCB; the PCB is characterized in that a plurality of heat dissipation holes communicated with the first copper layer and the second copper layer are formed in the second PCB, the first copper layer and the second copper layer are in heat conduction connection through the heat dissipation holes, the heat dissipation blocks are welded on the first copper layer, through holes matched with the pins are formed in the second PCB, the first PCB and the second PCB are fixed with each other through the pins and the through holes, and the second copper layer is in heat conduction connection with a chip.

Furthermore, soldering tin is filled in the heat dissipation holes, and the first copper layer and the second copper layer are in heat conduction connection through the soldering tin.

Further, the side wall of the heat dissipation hole is provided with a third copper layer, and the first copper layer, the second copper layer and the third copper layer are in heat conduction connection.

Further, the heat dissipation block is a copper block.

Furthermore, a plurality of bulges are arranged on the radiating block.

Furthermore, the bulges are arranged in an array which is uniformly distributed.

Further, the pin headers are arranged on two sides of the chip in parallel.

Further, the second copper layer is coated with heat dissipation silicone grease.

Further, the first copper layer and the second copper layer are obtained by removing the insulating layer on the surface of the second PCB.

Furthermore, the heat dissipation holes are uniformly distributed in an array arrangement.

The embodiment of the utility model provides an in one or more technical scheme, following beneficial effect has at least: the embodiment of the utility model provides a chip heat radiation structure, through setting up the second PCB, weld the radiating block on the second PCB, and utilize the pin header to fix the second PCB on the first PCB, make the fixing of radiating block not restricted by the components and parts on the first PCB, help to fix the radiating block steadily at the same time, make the radiating block difficult to drop; in addition, first PCB and second PCB are fixed through the pin header, are favorable to saving first PCB's space under the condition of guaranteeing firm degree.

Drawings

The invention is further described with reference to the following figures and examples.

Fig. 1 is a schematic cross-sectional view of a first embodiment of the present invention;

fig. 2 is a schematic front or back view of a second PCB in a first embodiment of the invention;

FIG. 3 is a schematic view of the structure of the heat dissipation holes in the first embodiment of the present invention;

FIG. 4 is a schematic view of a second embodiment of the heat dissipation holes of the present invention;

fig. 5 is a plan view of the heat dissipating block according to the first embodiment of the present invention.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, a plurality of means are one or more, a plurality of means are two or more, and the terms greater than, less than, exceeding, etc. are understood as not including the number, and the terms greater than, less than, within, etc. are understood as including the number. If the first and second are described for the purpose of distinguishing technical features, they are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

The embodiments of the present invention will be further explained with reference to the drawings.

Referring to fig. 1-2, a first embodiment of the present invention provides a chip heat dissipation structure, including a first PCB100, a heat dissipation block 200 for dissipating heat from a chip 110, and a second PCB300 for fixing the heat dissipation block 200, wherein the chip 110 is mounted on the first PCB100, and the first PCB100 is provided with a pin header 120; an exposed first copper layer 310 is disposed on the upper surface of the second PCB300, and an exposed second copper layer 320 is disposed on the lower surface of the second PCB 300; the second PCB300 is provided with a plurality of heat dissipation holes 330 communicated with the first copper layer 310 and the second copper layer 320, the first copper layer 310 and the second copper layer 320 are in heat conduction connection through the heat dissipation holes 330, the heat dissipation block 200 is welded on the first copper layer 310, the second PCB300 is provided with through holes matched with the pin headers 120, the first PCB100 and the second PCB300 are mutually fixed through the pin headers 120 and the through holes, and the second copper layer 320 is in heat conduction connection with the chip 110. Specifically, the pin header 120 and the through hole may be welded together to achieve fixation.

Preferably, the heat dissipation block 200 is a copper block, and the copper has good heat conductivity, which is beneficial to improving the heat dissipation capability of the heat dissipation block 200. In addition, an aluminum block may be used as the heat dissipation block 200, but the heat dissipation effect is not as good as that of a copper block.

Further, the plurality of protrusions 210 are disposed on the heat dissipation block 200, which is beneficial to increasing the heat dissipation area of the heat dissipation block 200 and improving the heat dissipation performance of the heat dissipation block 200. In addition, the protrusions 210 are arranged in an evenly distributed array, so that the surface space of the heat dissipation block 200 is reasonably utilized, the number of the protrusions 210 is maximized, and heat can be uniformly dissipated.

Referring to fig. 3, a general PCB is formed by covering copper layers with insulating layers, and the upper and lower surfaces of the double-sided PCB are both provided with copper layers, in this embodiment, the structural characteristics of the double-sided PCB are utilized, and the insulating layers on the upper and lower surfaces of the second PCB300 are respectively removed to obtain the first copper layer 310 and the second copper layer 320, so that the structure of the second PCB300 is effectively utilized, and the manufacturing cost and the manufacturing difficulty are reduced. Since the first copper layer 310 and the second copper layer 320 are insulating layers, in order to realize heat conduction, a plurality of heat dissipation holes 330 communicating the first copper layer 310 and the second copper layer 320 are formed in the second PCB300, specifically, solder 331 is filled in the heat dissipation holes 330, the first copper layer 310 and the second copper layer 320 are in heat conduction connection through the solder 331, and heat of the chip 110 sequentially passes through the second copper layer 320, the solder 331, the first copper layer 310 and the heat dissipation block 200 and is finally dissipated through the heat dissipation block 200. As one preferable mode, the heat dissipation block 200 covers the heat dissipation holes 330, and heat can be timely transferred to the heat dissipation block 200 after passing through the heat dissipation holes 330, which is beneficial to increasing the heat dissipation speed.

Referring to fig. 5, the heat dissipation holes 330 are uniformly distributed in an array, which is beneficial to ensure that heat is uniformly transferred. In order to improve the heat conduction between the chip 110 and the second copper layer 320, the second copper layer 320 is coated with a heat-dissipating silicone grease, and the second copper layer 320 may also be in direct contact with the chip 110, but the heat dissipation effect is slightly reduced.

In the present embodiment, the pin headers 120 are disposed in parallel at two sides of the chip 110, so as to position the second PCB 300; if the first PCB100 has a smaller specification, the pins 120 may also be disposed in parallel at two side edges of the first PCB100, and the specification of the second PCB300 is set to be the same as that of the first PCB100, which is beneficial to improving the uniformity of the overall circuit structure.

The utility model has the advantages that the second PCB300 is arranged, the radiating block 200 is welded on the second PCB300, and the second PCB300 is fixed on the first PCB100 by the pin header 120, so that the fixing of the radiating block 200 is not limited by the components on the first PCB100, and meanwhile, the radiating block 200 is favorably and stably fixed, and the radiating block 200 is not easy to fall off; in addition, the first PCB100 and the second PCB300 are fixed by the pin header 120, which is advantageous to save the space of the first PCB100 while ensuring the degree of stability.

Referring to fig. 4, a second embodiment of the present invention provides a chip heat dissipation structure, which is different from the first embodiment in that a third copper layer 332 is disposed on a sidewall of a heat dissipation hole 330, and the first copper layer 310, the second copper layer 320 and the third copper layer 332 are connected in a heat conducting manner, and in this embodiment, the third copper layer 332 is disposed on the sidewall of the heat dissipation hole 330 instead of filling solder 331 into the heat dissipation hole 330 and conducting heat through the solder 331, and the third copper layer 332 is used as a heat conducting medium for the first copper layer 310 and the second copper layer 320. The third copper layer 332 is disposed on the sidewall of the thermal via 330 by electroplating, and the first copper layer 310 and the second copper layer 320 are connected by soldering at the connection point with the third copper layer 332. In addition, other principles of the present embodiment are the same as those of the first embodiment, and are not described herein again.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention defined by the appended claims.

Claims

1. A chip heat dissipation structure, comprising:

the heat dissipation block is used for dissipating heat of the chip;

the second PCB is used for fixing the heat dissipation block, an exposed first copper layer is arranged on the upper surface of the second PCB, and an exposed second copper layer is arranged on the lower surface of the second PCB;

the PCB is characterized in that a plurality of heat dissipation holes communicated with the first copper layer and the second copper layer are formed in the second PCB, the first copper layer and the second copper layer are in heat conduction connection through the heat dissipation holes, the heat dissipation blocks are welded on the first copper layer, through holes matched with the pins are formed in the second PCB, the first PCB and the second PCB are fixed with each other through the pins and the through holes, and the second copper layer is in heat conduction connection with a chip.

2. A chip heat dissipation structure as recited in claim 1, wherein: soldering tin is filled in the heat dissipation holes, and the first copper layer and the second copper layer are in heat conduction connection through the soldering tin.

3. A chip heat dissipation structure as recited in claim 1 or 2, wherein: the side wall of the heat dissipation hole is provided with a third copper layer, and the first copper layer, the second copper layer and the third copper layer are in heat conduction connection.

4. A chip heat dissipation structure as recited in claim 1, wherein: the heat dissipation block is a copper block.

5. A chip heat dissipation structure as recited in claim 1, wherein: the radiating block is provided with a plurality of bulges.

6. A chip heat dissipation structure as recited in claim 5, wherein: the bulges are arranged in an array which is uniformly distributed.

7. A chip heat dissipation structure as recited in claim 1, wherein: the pin headers are arranged on two sides of the chip in parallel.

8. A chip heat dissipation structure as recited in claim 1, wherein: and the second copper layer is coated with heat dissipation silicone grease.

9. A chip heat dissipation structure as recited in claim 1, wherein: the first copper layer and the second copper layer are obtained by removing the insulating layer on the surface of the second PCB.

10. A chip heat dissipation structure as recited in claim 1, wherein: the heat dissipation holes are uniformly distributed in an array arrangement.