CN221727100U - A high power density power component with integrated heat sink and plug-and-play function - Google Patents
A high power density power component with integrated heat sink and plug-and-play function Download PDFInfo
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- CN221727100U CN221727100U CN202323264158.3U CN202323264158U CN221727100U CN 221727100 U CN221727100 U CN 221727100U CN 202323264158 U CN202323264158 U CN 202323264158U CN 221727100 U CN221727100 U CN 221727100U
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Abstract
本实用新型涉及电力电子技术领域，一种集成散热器、即插即用的高功率密度功率组件，包括PCB基板；功率器件，安装在PCB基板的背面，并与所述PCB基板电性连接陶瓷覆铜基板，其为双面覆铜基板，所述陶瓷覆铜基板的第一侧延展面的铜箔与所述功率器件焊接；散热器，其第一侧延展面与所述陶瓷覆铜基板的第二侧延展面的铜箔焊接。该功率组件可解决现有功率模组安装复杂、功率密度低、热阻大的问题。
The utility model relates to the technical field of power electronics, and is a plug-and-play high power density power component with integrated heat sink, comprising a PCB substrate; a power device, which is mounted on the back of the PCB substrate and electrically connected to the PCB substrate; a ceramic copper-clad substrate, which is a double-sided copper-clad substrate, and the copper foil of the first side extension surface of the ceramic copper-clad substrate is welded to the power device; and a heat sink, whose first side extension surface is welded to the copper foil of the second side extension surface of the ceramic copper-clad substrate. The power component can solve the problems of complex installation, low power density and high thermal resistance of existing power modules.
Description
Technical Field
The utility model relates to the technical field of power electronics, in particular to an integrated radiator, namely a plug-and-play high-power-density power component.
Background
The existing power electronic power assembly in the market is that a small-current module adopts a discrete device which is similar TO TO247 package, and then the discrete device is arranged on a radiator through silicone grease and an insulating sheet; another is to use IGBT modules, which are then mounted on a heat sink by silicone grease. Both the two power components are arranged on the radiator through silicone grease, the silicone grease has the risk of drying failure, and the discrete device also needs an insulating sheet to ensure insulation; the heat conductivity coefficients of the insulating sheet and the silicone grease are low, so that the heat resistance of power devices in the assembly is high, and the size and the performance of the power assembly are affected; in addition, the two power components adopt the traditional production process, the whole production process is complex, the space utilization rate is low, the power density is low, and the miniaturization of equipment and the application of special occasions cannot be effectively realized.
Disclosure of utility model
In order to solve the problems, the utility model provides an integrated radiator, namely a plug-and-play high-power-density power component, which can solve the problems of complex installation, low power density and large thermal resistance of the traditional power module.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
An integrated heat sink, plug and play high power density power assembly, comprising
A PCB substrate;
The power device is arranged on the back surface of the PCB substrate and is electrically connected with the PCB substrate
The ceramic copper-clad substrate is a double-sided copper-clad substrate, and a copper foil of a first side extension surface of the ceramic copper-clad substrate is welded with the power device;
And the first side extension surface of the radiator is welded with the copper foil of the second side extension surface of the ceramic copper-clad substrate.
Preferably, the power device is a TO-247 packaged power device.
Preferably, the heat sink is a passive heat sink.
Preferably, a second side of the radiator facing away from the first side extension has an array of heat dissipating fins.
Preferably, the integrated heat sink, the plug and play high power density power module further comprises a functional board, the front surface of the PCB substrate is provided with an upper connector, and the PCB substrate is plugged with the functional board through the upper connector and is electrically connected with the functional board.
Preferably, the functional board is soldered with an external connector.
Preferably, the four corners of the radiator are provided with first mounting holes, the four corners of the bottom surface of the PCB substrate are provided with first mounting through holes, and the PCB substrate is connected to the radiator in a mode that mounting studs penetrate through the first mounting through holes and are screwed to the first mounting holes.
Preferably, the functional board is arranged on one side of the front surface of the PCB substrate, the four corners of the functional board are provided with welding mounting columns,
The cover is attached to the heat sink by passing mounting screws through the welded mounting posts and screwing on the mounting studs.
The beneficial effects of using the utility model are as follows:
Because the thermal resistance of the power device in the high-power density power assembly is reduced, the working frequency of the whole machine can be improved, the size of the whole machine can be effectively reduced, the connection among all parts in the power assembly is mostly welded or directly inserted, the installation of all parts is simplified, and the production efficiency is higher. The installation of the power device is realized by adopting a mode of welding the ceramic copper-clad substrate, so that the space utilization rate of the PCB printed board is increased, a design space is provided for high-power density design, and the defects of complex installation process, poor insulating strength, poor heat conductivity, poor consistency and the like caused by the traditional installation mode are effectively avoided.
The high-power density power assembly has high overall power density, high integration level, small volume and light weight, and the internal functional board can be adapted to different boards, so that the design flexibility can be effectively improved and the size of the whole machine can be reduced.
Drawings
Fig. 1 is a schematic diagram of a structure of an integrated heat sink, plug and play high power density power module according to the present utility model.
Fig. 2 is a schematic diagram of the internal structure of the integrated heat sink, plug and play high power density power module of the present utility model.
The reference numerals include:
1-heat radiator, 2-ceramic copper-clad substrate, 3-power device, 4-PCB substrate, 5-function board, 6-upper cover, 7-mounting screw, 8-mounting stud, 9-external connector;
11-first mounting holes, 41-upper connector pairs, 42-first mounting vias, 51-solder mounting posts.
Detailed Description
In order to make the objects, technical solutions and advantages of the present technical solution more apparent, the present technical solution is further described in detail below in conjunction with the specific embodiments. It should be understood that the description is only illustrative and is not intended to limit the scope of the present technical solution.
As shown in fig. 1 and 2, the present embodiment proposes an integrated heat sink, a plug-and-play high power density power assembly, comprising a PCB substrate 4; the power device 3 is arranged on the back surface of the PCB substrate 4 and is electrically connected with the PCB substrate 4; a ceramic copper-clad substrate 2, which is a double-sided copper-clad substrate, wherein a copper foil on a first side extension surface of the ceramic copper-clad substrate 2 is welded with the power device 3; the heat sink 1 has a first side extension surface welded to a copper foil of a second side extension surface of the ceramic copper-clad substrate 2.
And the power device 3 is packaged by TO-247, so that the size is small, and the space utilization rate is high. The radiator 1, the ceramic copper-clad substrate 2, the power device 3, the PCB substrate 4 and the functional board 5 basically adopt a laminated design, and each functional component adopts a modularized design, so that the space size is effectively utilized, and the volume is minimized. Meanwhile, the power device 3 is installed by adopting an installation mode of welding the ceramic copper-clad substrate 2, the connection between the power MOS tube in the power device 3 and the radiator 1 is realized through the ceramic copper-clad substrate 2, the requirements of power tube insulation and heat dissipation are met, the whole power device 3 is installed and fixed without screw fixation, the installation process is simple, the installation difficulty is reduced, and the design space of the top PCB substrate 4 can be effectively saved because the installation hole of the power device 3 is not required to be reserved.
The ceramic copper-clad substrate 2 is a double-sided ceramic copper-clad substrate 2, copper foils are arranged on two sides, and a ceramic insulating sheet is arranged in the middle. During installation, the ceramic copper-clad substrate 2 is welded on the surface of the radiator 1 by adopting high-temperature solder, the power device 3 is welded on the other copper-clad surface of the ceramic copper-clad substrate 2 by adopting low-temperature solder, and the ceramic copper-clad substrate 2 has good insulation and high heat conduction characteristics and can meet the heat conduction and insulation requirements of the power device 3; the advantage of the welding of the ceramic copper-clad substrate 2 is that the power device 3 is installed without screw fixation, the top PCB substrate 4 is not required to design screw installation holes and consider safe spacing, the design space of the PCB substrate 4 and the product can be effectively enhanced, and a space design basis is provided for high-power density design.
Specifically, the radiator 1 in the embodiment is a passive radiator, the radiator 1 may be made of metal with good heat conductivity, such as copper or aluminum, and the second side of the radiator 1 opposite to the first side extension surface has a radiating fin array. The heat conduction efficiency of the heat sink 1 can be increased by the heat radiation fin array.
The ceramic copper-clad substrate 2 is a double-sided copper-clad substrate, the double-sided copper-clad substrate replaces the traditional silicone grease type heat dissipation filling material, the double-sided copper-clad substrate is used as a direct contact structure, the power device 3 and the radiator 1 are directly conducted with heat, and the heat conduction efficiency is higher. Meanwhile, the ceramic copper-clad substrate 2 is of a structural type and directly conducts heat, so that the problems of heat conduction failure after silicone grease air drying and heat conduction efficiency reduction caused by uneven silicone grease coating are avoided.
The power device 3 is a TO-247 packaged power device 3, but the power device 3 package is not limited TO the TO-247 package, and other solderable packaged devices are possible.
The PCB substrate 4 is a circuit connection base of the power device 3, the pins of the power device 3 are directly welded on the corresponding positions of the PCB substrate 4, and because the power device 3 generates a large amount of heat during operation, the power device 3 is directly welded on the copper foil of the ceramic copper-clad substrate 2, in this embodiment, 6 power devices 3 are mounted on the back surface of the PCB substrate 4, and 6 independent welding positions made of copper foil are formed on the corresponding side, facing the power devices 3, of the ceramic copper-clad substrate 2.
In this embodiment, in order to facilitate the assembly of the PCB substrate 4 and the functional board 5, the front side of the PCB substrate 4 is welded with the upper connector 41, and after the upper connector 41 is plugged with the interface on the functional board 5, the PCB substrate 4 and the functional board 5 can be electrically conducted rapidly.
The back of the functional board 5 is further provided with an external connector 9, and the external connector 9 of the embodiment is directly welded on the functional board 5 and is connected to the PCB substrate 4 through a short wire, so that the external connector 9 is electrically connected with the functional board 5 and the PCB substrate 4 to realize corresponding functions.
The radiator 1 is provided with first mounting holes 11 at four corners, the bottom surface of the PCB substrate 4 is provided with first mounting through holes 42 at four corners, and the PCB substrate 4 is connected to the radiator 1 by passing mounting studs 8 through the first mounting through holes 42 and screwing the mounting studs to the first mounting holes 11.
The functional board 5 is mounted on one side of the front surface of the PCB substrate 4, and the four corners of the functional board 5 are provided with welding mounting posts 51, and the upper cover 6 is connected to the heat sink 1 by passing mounting screws 7 through the welding mounting posts 51 and screwing them to the mounting studs 8.
In addition, in this embodiment, the back of the heat sink 1 has a four-surrounding frame structure, one side of the frame structure has an opening, one side of the upper cover 6 is bent to form a baffle, the baffle also has an opening, the upper cover 6 can be fastened on the top of the frame structure, the ceramic copper-clad substrate, the power device, the PCB substrate and the functional board 5 are all inside, and the external connector 9 leaks from the opening.
The mounting steps of the integrated radiator, namely the plug-and-play high-power density power component are as follows:
Firstly, the ceramic copper-clad substrate 2 is welded to the radiator 1 through high-temperature solder, and after cooling, the power device 3 is welded into the ceramic copper-clad substrate 2 through low-temperature solder.
And secondly, butt-jointing and mounting the PCB substrate 4 and the power device 3, and welding the power device 3 in the PCB substrate 4.
Step three, the external connector 9 is installed at a corresponding position; the functional board 5 is mounted above the PCB substrate 4 by means of docking.
And fourthly, fixing the shell through a nut.
The foregoing is merely exemplary of the present utility model, and those skilled in the art can make many variations in the specific embodiments and application scope according to the spirit of the present utility model, as long as the variations do not depart from the spirit of the utility model.
Claims (7)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323264158.3U CN221727100U (en) | 2023-11-29 | 2023-11-29 | A high power density power component with integrated heat sink and plug-and-play function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323264158.3U CN221727100U (en) | 2023-11-29 | 2023-11-29 | A high power density power component with integrated heat sink and plug-and-play function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221727100U true CN221727100U (en) | 2024-09-17 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323264158.3U Active CN221727100U (en) | 2023-11-29 | 2023-11-29 | A high power density power component with integrated heat sink and plug-and-play function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221727100U (en) |
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2023
- 2023-11-29 CN CN202323264158.3U patent/CN221727100U/en active Active
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