CN210629969U - Heat dissipation type circuit board for set top box - Google Patents
Heat dissipation type circuit board for set top box Download PDFInfo
- Publication number
- CN210629969U CN210629969U CN201921667044.4U CN201921667044U CN210629969U CN 210629969 U CN210629969 U CN 210629969U CN 201921667044 U CN201921667044 U CN 201921667044U CN 210629969 U CN210629969 U CN 210629969U
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- heat dissipation
- layer
- chip
- insulating substrate
- solder mask
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Abstract
The utility model provides a heat dissipation type circuit board for a set top box, which comprises an insulating substrate, wherein one side of the insulating substrate is provided with a conductive circuit layer and a solder mask layer, and the other side of the insulating substrate is provided with a heat dissipation base; a heat dissipation block is fixed on one side, away from the insulating substrate, of the solder mask layer, the heat dissipation block is located between the chip and the solder mask layer, a first patch notch is formed in the solder mask layer, a chip pin is connected to the outside of the chip, and the chip pin is welded in the first patch notch through a first soldering tin layer; be equipped with the jack in the solder mask, one side of insulating substrate is equipped with the constant head tank, and the electron plug-in components outer joint has the plug-in components pin that is L shape, and the plug-in components pin is arranged in jack and constant head tank, and the jack intussuseption is filled with the second soldering tin layer, still fills in jack and the constant head tank and has the insulating cement piece. The utility model discloses can effectively improve the holistic heat dispersion of circuit board, the electronic components of plug-in components formula fixes a position through the mode of buckling, and overall structure is stable compact.
Description
Technical Field
The utility model relates to a STB circuit board specifically discloses a heat dissipation type circuit board for STB.
Background
A set-top box circuit board refers to a circuit board used in a set-top box. The circuit board is also called a printed circuit board, is an important electronic component, and is a support body of an electronic component and a carrier for electrical connection of the electronic component.
The electronic components are arranged on the circuit board, the electronic components can generate heat in the working process, the heat can be accumulated between the electronic components and the circuit board due to the fact that the bottoms of the electronic components are attached to the circuit board, most of the electronic components are sensitive to the temperature, and when the temperature exceeds a certain critical value, the performance of the electronic components is sharply reduced, and therefore the performance of the whole electronic product is affected. In the prior art, the set-top box is usually provided with a cooling fan outside the circuit board for cooling, and has large occupied space and high energy consumption.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a heat dissipation type circuit board for a set top box, which has good heat dissipation performance and a stable and compact overall structure.
In order to solve the prior art problem, the utility model discloses a heat dissipation type circuit board for a set top box, which comprises an insulating substrate, wherein one side of the insulating substrate is sequentially provided with a conductive circuit layer and a solder mask layer, the other side of the insulating substrate is provided with a heat dissipation base, and one side of the solder mask layer, which is far away from the insulating substrate, is provided with a chip and an electronic plug-in;
a heat dissipation block is fixed on one side, away from the insulating substrate, of the solder mask layer, the heat dissipation block is located between the chip and the solder mask layer, a first patch notch is formed in the solder mask layer and located around the heat dissipation block, a chip pin is connected to the outside of the chip, the chip pin is welded in the first patch notch through a first soldering tin layer, and the first soldering tin layer is located on the conducting circuit layer;
be equipped with the jack in the solder mask, the jack runs through conducting wire layer and insulating substrate, one side that the conducting wire layer was kept away from to insulating substrate is equipped with the constant head tank, the constant head tank is connected in one side of jack, the electronic plug-in components outer joint has the plug-in components pin that is L shape, the plug-in components pin is arranged in jack and constant head tank, the jack intussuseption is filled with the second soldering tin layer, the second soldering tin layer is connected with the conducting wire layer, still pack in jack and the constant head tank and have the insulating cement piece, the second soldering tin layer is.
Furthermore, a heat dissipation through hole is further formed in the solder mask layer and is located on one side, far away from the chip, of the heat dissipation block.
Furthermore, the heat dissipation base is a ceramic base or an aluminum base.
Furthermore, the heat dissipation block is a ceramic block.
Furthermore, one side of the solder mask layer far away from the insulating substrate is further provided with a patch element, a patch pin is connected to the outside of the patch element, a second patch notch is further arranged in the solder mask layer, the patch pin is welded in the second patch notch through a third soldering tin layer, and the third soldering tin layer is located on the conducting circuit layer.
The utility model has the advantages that: the utility model discloses a heat dissipation type circuit board for STB, be provided with heat dissipation base structure at the back, can effectively improve the holistic heat dispersion of circuit board, electronic components pertinence to the temperature sensitivity is provided with the radiating block structure, can locally promote the radiating efficiency, the electronic components of plug-in components formula is fixed a position through the mode of buckling, can effectively avoid plug-in components pin protrusion and insulating substrate and influence the use, overall structure is stable compact, and completely cut off between heat dissipation base and the plug-in components pin has the insulating cement piece, the selectivity of heat dissipation base kind is high.
Drawings
Fig. 1 is a schematic top view of the present invention.
3 fig. 32 3 is 3 a 3 schematic 3 cross 3- 3 sectional 3 view 3 along 3 a 3- 3 a 3' 3 in 3 fig. 31 3. 3
Fig. 3 is a schematic view of the split structure of the present invention.
The reference signs are: the electronic component comprises an insulating substrate 10, a conductive circuit layer 11, a solder mask layer 12, a heat dissipation through hole 121, a heat dissipation base 13, a chip 21, a chip pin 211, an electronic package 22, a package pin 221, a chip component 23, a chip pin 231, a heat dissipation block 30, a first chip notch 31, a first solder layer 32, a jack 40, a positioning slot 41, a second solder layer 42, an insulating glue block 43, a second chip notch 50 and a third solder layer 51.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
Refer to fig. 1 to 3.
The embodiment of the utility model discloses a heat dissipation type circuit board for STB, including the insulating substrate 10 that thickness is D, preferably, insulating substrate 10 is the epoxy base plate, and one side of insulating substrate 10 is equipped with conducting wire layer 11 and solder mask layer 12 in proper order, and the opposite side of insulating substrate 10 is equipped with heat dissipation base 13, and preferably, be connected with the glue layer between heat dissipation base 13 and the insulating substrate 10, heat dissipation base 13's heat dispersion is good, can effectively improve the holistic heat dispersion of circuit board, and one side that the solder mask layer 12 kept away from insulating substrate 10 is equipped with chip 21 and electronic plug-in 22;
one side of the solder mask layer 12, which is far away from the insulating substrate 10, is fixed with a heat dissipation block 30 through glue, the heat dissipation block 30 is positioned between the chip 21 and the solder mask layer 12, so that the heat dissipation efficiency of the chip 21 can be effectively improved, a plurality of first chip notches 31 are arranged in the solder mask layer 12, the first chip notches 31 are positioned around the heat dissipation block 30, a plurality of chip pins 211 are connected outside the chip 21, the number of the chip pins 211 connected around the chip 21 is equal to the number of the first chip notches 31 around the heat dissipation block 30, the chip pins 211 are welded in the first chip notches 31 through a first soldering tin layer 32, and the first soldering layer 32 is positioned on the conductive circuit layer 11, so that the chip pins 211 are conducted with the conductive circuit layer 11;
the solder mask layer 12 is provided with a plurality of jacks 40, the jacks 40 penetrate through the conductive circuit layer 11 and the insulating substrate 10, one side of the insulating substrate 10, which is far away from the conductive circuit layer 11, is provided with positioning grooves 41 with the thickness D, D < D, the positioning grooves 41 are connected to one side of the jacks 40, the electronic plug-in 22 is externally connected with at least two L-shaped plug-in pins 221, the plug-in pins 221 are positioned in the jacks 40 and the positioning grooves 41, the jacks 40 are filled with second solder layers 42, the second solder layers 42 are connected with the conductive circuit layer 11, the plug-in pins 221 are in conductive connection with the conductive circuit layer 11 through the second solder layers 42, the jacks 40 and the positioning grooves 41 are further filled with insulating glue blocks 43, the insulating glue blocks 43 are positioned on the surface of the heat dissipation base 13, the plug-in pins 221 and the heat dissipation base 13 are separated by the insulating glue blocks 43, so that the selectivity of the heat dissipation base 13, the insulating glue block 43 is located below the conductive circuit layer 11, the insulating glue block 43 can be ensured not to influence conduction between the plug-in pins 221 and the conductive circuit layer 11, the plug-in pins 221 are located in the second soldering tin layer 42 and the insulating glue block 43, the plug-in pins 221 are bent into L-shaped pins to be inserted into the insertion holes 40 and the positioning grooves 41, welding and positioning are carried out through solder paste and glue, the stability of the connection structure of the electronic plug-in 22 on the circuit board can be effectively improved, and the plug-in pins 221 can not protrude out of the back of the circuit board and increase the limiting conditions for setting the circuit board.
The laminated insulating substrate 10, the conductive circuit layer 11 and the solder mask layer 12 are obtained by laminating and printing, the chip 21 and the electronic package 22 are mounted on the circuit board, and finally the heat dissipation base 13 is fixedly connected to the back surface of the insulating substrate 10 by glue.
The utility model discloses be provided with heat dissipation base 13 structure at the back, can effectively improve the holistic heat dispersion of circuit board, electronic components pertinence to the temperature sensitivity is provided with radiating block 30 structure, can locally promote the radiating efficiency, the electronic components of plug-in components formula is fixed a position through the mode of buckling, can effectively avoid plug-in components pin 221 protrusion and insulating substrate 10 and influence the use, overall structure is stable compact, and completely cut off between heat dissipation base 13 and the plug-in components pin 221 has insulating cement piece 43, the selectivity of heat dissipation base 13 kind is high.
In this embodiment, the solder mask layer 12 is further provided with a plurality of heat dissipation through holes 121, the heat dissipation through holes 121 are located on a side of the heat dissipation block 30 away from the chip 21, and the heat dissipation performance of the whole circuit board can be further improved through the heat dissipation through holes 121.
In this embodiment, the heat dissipation base 13 is a ceramic base or an aluminum base, which can further improve the heat dissipation performance of the entire circuit board.
In the embodiment, the heat dissipation block 30 is a ceramic block, and the ceramic has good heat dissipation performance and insulation performance, so that the heat dissipation efficiency of the chip 21 can be effectively improved, and meanwhile, the short circuit of each chip pin 211 can be avoided.
In this embodiment, a patch element 23 is further disposed on one side of the solder mask layer 12 away from the insulating substrate 10, a patch pin 231 is connected to the outside of the patch element 23, a plurality of second patch notches 50 are further disposed in the solder mask layer 12, the patch pin 231 is welded in the second patch notch 50 through a third solder layer 51, and the third solder layer 51 is located on the conductive circuit layer 11, so as to achieve conduction between the patch pin 231 and the conductive circuit layer 11.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. The heat dissipation type circuit board for the set top box is characterized by comprising an insulating substrate (10), wherein a conducting circuit layer (11) and a solder mask layer (12) are sequentially arranged on one side of the insulating substrate (10), a heat dissipation base (13) is arranged on the other side of the insulating substrate (10), and a chip (21) and an electronic plug-in unit (22) are arranged on one side, far away from the insulating substrate (10), of the solder mask layer (12);
a heat dissipation block (30) is fixed on one side, away from the insulating substrate (10), of the solder mask layer (12), the heat dissipation block (30) is located between the chip (21) and the solder mask layer (12), a first chip notch (31) is arranged in the solder mask layer (12), the first chip notch (31) is located on the periphery of the heat dissipation block (30), a chip pin (211) is connected to the outside of the chip (21), the chip pin (211) is welded in the first chip notch (31) through a first soldering tin layer (32), and the first soldering tin layer (32) is located on the conductive circuit layer (11);
the solder mask layer (12) is provided with a jack (40), the jack (40) penetrates through the conductive circuit layer (11) and the insulating substrate (10), a positioning groove (41) is arranged on one side of the insulating substrate (10) far away from the conducting circuit layer (11), the positioning groove (41) is connected to one side of the jack (40), the electronic plug-in (22) is externally connected with an L-shaped plug-in pin (221), the insert pins (221) are located in the receptacle (40) and the positioning slot (41), the jack (40) is filled with a second soldering tin layer (42), the second soldering tin layer (42) is connected with the conducting circuit layer (11), the jack (40) and the positioning groove (41) are also filled with an insulating rubber block (43), the second soldering tin layer (42) is positioned on one side, far away from the heat dissipation base (13), of the insulating glue block (43).
2. The heat dissipation type circuit board for a set top box according to claim 1, wherein a heat dissipation through hole (121) is further formed in the solder mask layer (12), and the heat dissipation through hole (121) is located on a side of the heat dissipation block (30) far away from the chip (21).
3. A heat-dissipating circuit board for a set-top box according to claim 1, wherein the heat-dissipating base (13) is a ceramic base or an aluminum base.
4. The heat dissipating circuit board for a set top box of claim 1, wherein the heat dissipating slug (30) is a ceramic slug.
5. The heat dissipation type circuit board for the set top box according to claim 1, wherein a patch element (23) is further disposed on a side of the solder mask layer (12) away from the insulating substrate (10), a patch pin (231) is connected to an outside of the patch element (23), a second patch notch (50) is further disposed in the solder mask layer (12), the patch pin (231) is soldered in the second patch notch (50) through a third solder layer (51), and the third solder layer (51) is located on the conductive circuit layer (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667044.4U CN210629969U (en) | 2019-09-30 | 2019-09-30 | Heat dissipation type circuit board for set top box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921667044.4U CN210629969U (en) | 2019-09-30 | 2019-09-30 | Heat dissipation type circuit board for set top box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210629969U true CN210629969U (en) | 2020-05-26 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921667044.4U Expired - Fee Related CN210629969U (en) | 2019-09-30 | 2019-09-30 | Heat dissipation type circuit board for set top box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210629969U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112235935A (en) * | 2020-10-28 | 2021-01-15 | 江苏贺鸿智能科技有限公司 | PCB component and manufacturing method thereof |
| CN113873751A (en) * | 2020-06-30 | 2021-12-31 | 广东美的厨房电器制造有限公司 | Circuit board structure and household appliance |
-
2019
- 2019-09-30 CN CN201921667044.4U patent/CN210629969U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113873751A (en) * | 2020-06-30 | 2021-12-31 | 广东美的厨房电器制造有限公司 | Circuit board structure and household appliance |
| CN112235935A (en) * | 2020-10-28 | 2021-01-15 | 江苏贺鸿智能科技有限公司 | PCB component and manufacturing method thereof |
| CN112235935B (en) * | 2020-10-28 | 2023-07-21 | 江苏贺鸿智能科技有限公司 | PCB component and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200526 Termination date: 20210930 |