CN209914183U - Novel circuit board heat radiation structure and brushless electric tool - Google Patents
Novel circuit board heat radiation structure and brushless electric tool Download PDFInfo
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- CN209914183U CN209914183U CN201920697890.4U CN201920697890U CN209914183U CN 209914183 U CN209914183 U CN 209914183U CN 201920697890 U CN201920697890 U CN 201920697890U CN 209914183 U CN209914183 U CN 209914183U
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- heat dissipation
- circuit board
- pcb
- copper foil
- silica gel
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Abstract
A novel circuit board heat dissipation structure and a brushless electric tool belong to the technical field of circuit board heat dissipation. The novel circuit board heat dissipation structure comprises an aluminum heat dissipation shell, wherein a heat dissipation boss is arranged inside the aluminum heat dissipation shell, a silica gel pad and a PCB are arranged on the heat dissipation boss in a stacking mode, and a patch type MOS (metal oxide semiconductor) tube is fixed on the PCB; the PCB board laminating is in one side is equipped with the large tracts of land copper foil on the silica gel pad, the copper foil with the silica gel pad laminating, SMD MOS pipe pass through the via hole on the PCB board to the copper foil heat conduction. The utility model discloses can increase paster MOS pipe radiating effect, reduce MOS pipe temperature rise, guarantee the reliability of MOS pipe work.
Description
Technical Field
The utility model relates to a technique in circuit board heat dissipation field specifically is a novel circuit board heat radiation structure and brushless electric tool.
Background
The brushless electric tool has large working current and serious heating, and a heat dissipation structure needs to be designed. Particularly in hot summer, the temperature of the MOS tube is increased, and the requirement on heat dissipation is higher. As shown in fig. 4, the conventional high-power MOS transistor 4 is disposed on one side of the PCB 3 facing the bottom surface of the aluminum heat dissipation case 1, and the silicone pad 3 is disposed on the plastic package on the surface of the MOS transistor, so that the silicone pad 3 contacts the aluminum heat dissipation case 1 for heat dissipation. However, the plastic package thermal resistance is large, the effect of conducting heat to the aluminum radiating fin is poor, so that the temperature difference between the MOS tube and the aluminum shell is large, and good heat radiation is not obtained.
SUMMERY OF THE UTILITY MODEL
The utility model discloses it is not enough to the above-mentioned that prior art exists, provide a novel circuit board heat radiation structure and brushless electric tool, can increase paster MOS pipe radiating effect, reduce MOS pipe temperature rise, guarantee the reliability of MOS pipe work.
The utility model discloses a realize through following technical scheme:
the utility model relates to a novel circuit board heat radiation structure, which comprises an aluminum heat radiation shell, wherein a heat radiation boss is arranged inside the aluminum heat radiation shell, a silica gel pad and a PCB are arranged on the heat radiation boss in a stacking way, and a patch type MOS tube is fixed on one side of the PCB, which is far away from the bottom surface of the aluminum heat radiation shell;
one side of the PCB attached to the silica gel pad is provided with a large-area copper foil, the copper foil is attached to the silica gel pad, and the surface-mounted MOS tube conducts heat to the copper foil through a through hole in the PCB.
The utility model relates to a brushless electric tool, including above-mentioned novel circuit board heat radiation structure.
Technical effects
Compared with the prior art, the utility model discloses be fixed with high-power SMD MOS pipe at PCB board front side, the MOS pipe is through the heat conduction of a plurality of punchholes to the large tracts of land copper foil of PCB board bottom surface, and the copper foil thermal resistance is little, through silica gel pad and the contact of aluminium heat dissipation shell, has guaranteed the abundant heat dissipation of MOS pipe.
Drawings
FIG. 1 is a schematic view of the entire structure of embodiment 1;
FIG. 2 is a schematic diagram of an exploded structure of example 1;
FIG. 3 is a schematic cross-sectional view showing the structure of example 1;
FIG. 4 is a schematic diagram of a prior art heat dissipation structure;
in the figure: an aluminum heat dissipation shell 1 and a heat dissipation boss 11; a silica gel pad 2; a PCB board 3; and a patch type MOS tube 4.
Detailed Description
The present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Example 1
The embodiment relates to a brushless electric hammer, which is provided with a novel circuit board heat dissipation structure.
As shown in fig. 1, 2 and 3, the novel circuit board heat dissipation structure includes an aluminum heat dissipation shell 1, heat dissipation bosses 11 are arranged inside the aluminum heat dissipation shell 1, silicone pads 2 and a PCB 3 are stacked on the heat dissipation bosses 11, patch-type MOS tubes 4 are fixed on the PCB 3, the number of the patch-type MOS tubes 4 is 12, the patch-type MOS tubes are roughly arranged in two rows, two heat dissipation bosses 11 are arranged according to the arrangement of the patch-type MOS tubes, and the silicone pads 2 are erected on the two heat dissipation bosses 11;
one side of the PCB 3 is provided with a large-area copper foil on the silica gel pad 2, the copper foil is partially attached to the silica gel pad 2 at least, the surface-mounted MOS tube 4 conducts heat to the copper foil through a through hole on the PCB 3, the copper foil is contacted with the silica gel pad 2 and the aluminum radiating shell 1 for radiating, and the radiating effect is good.
Comparing the heat dissipation effects of the embodiment and the traditional heat dissipation structure under the same conditions (the contact areas of the heat dissipation bosses are equal, the currents are all 40A), after the power-on aging is carried out for 3 minutes, the temperature of the aluminum heat dissipation shell is scanned through a thermal imager, the temperature of the aluminum heat dissipation shell in the traditional heat dissipation structure is 50 ℃, and the temperature of the aluminum shell in the embodiment is 65 ℃, so that the heat generated by the MOS tube in the embodiment is more conducted to the aluminum heat dissipation shell, and the heat dissipation effect is better.
It is to be emphasized that: the above embodiments are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form, and any simple modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (4)
1. A novel circuit board heat dissipation structure is characterized by comprising an aluminum heat dissipation shell, wherein a heat dissipation boss is arranged inside the aluminum heat dissipation shell, a silica gel pad and a PCB are arranged on the heat dissipation boss in a stacking mode, and a patch type MOS (metal oxide semiconductor) tube is fixed on one side, far away from the bottom surface of the aluminum heat dissipation shell, of the PCB;
the PCB board laminating is in one side is equipped with the large tracts of land copper foil on the silica gel pad, the copper foil with the silica gel pad laminating, SMD MOS pipe pass through the via hole on the PCB board to the copper foil heat conduction.
2. The novel circuit board heat dissipation structure of claim 1, wherein the number of the heat dissipation bosses is two, the heat dissipation bosses are arranged in parallel, and the silicone pad is mounted on the two heat dissipation bosses.
3. The novel circuit board heat dissipation structure of claim 1, wherein the copper foil is at least partially attached to a silicone pad.
4. A brushless power tool comprising the novel circuit board heat dissipation structure of any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920697890.4U CN209914183U (en) | 2019-05-16 | 2019-05-16 | Novel circuit board heat radiation structure and brushless electric tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920697890.4U CN209914183U (en) | 2019-05-16 | 2019-05-16 | Novel circuit board heat radiation structure and brushless electric tool |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209914183U true CN209914183U (en) | 2020-01-07 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920697890.4U Active CN209914183U (en) | 2019-05-16 | 2019-05-16 | Novel circuit board heat radiation structure and brushless electric tool |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209914183U (en) |
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2019
- 2019-05-16 CN CN201920697890.4U patent/CN209914183U/en active Active
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