CN209785918U - SMD triode - Google Patents
SMD triode Download PDFInfo
- Publication number
- CN209785918U CN209785918U CN201920877001.2U CN201920877001U CN209785918U CN 209785918 U CN209785918 U CN 209785918U CN 201920877001 U CN201920877001 U CN 201920877001U CN 209785918 U CN209785918 U CN 209785918U
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- Prior art keywords
- heat dissipation
- pin
- contact
- heating panel
- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 61
- 238000004806 packaging method and process Methods 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 18
- 239000006071 cream Substances 0.000 claims abstract description 12
- 239000004519 grease Substances 0.000 claims description 15
- 229920001296 polysiloxane Polymers 0.000 claims description 15
- 230000000694 effects Effects 0.000 abstract description 10
- 239000003570 air Substances 0.000 description 7
- 239000012080 ambient air Substances 0.000 description 3
- 230000002035 prolonged effect Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model discloses a SMD triode, including packaging body, first pin, second pin and third pin, still include the heating panel, the top surface of heating panel with the bottom surface face and the face contact of packaging body, the top surface area of heating panel is greater than the bottom surface area of packaging body, the bottom surface of heating panel and the top surface face and the face contact of circuit board, the heating panel is equipped with one deck electrically insulating's heat dissipation cream layer, heat dissipation cream layer with first pin contact, heat dissipation cream layer with the second pin contact, heat dissipation cream layer with the third pin contact, the heating panel is equipped with the fin. Compared with the prior art, the utility model, improve the radiating effect, increase of service life.
Description
Technical Field
The utility model relates to a triode technical field, concretely relates to powerful SMD triode.
Background
As shown in fig. 1, a conventional high-power patch type triode includes a package, a first pin, a second pin, and a third pin. The heat in the triode is transferred to the shell of the packaging body, and when the heat is dissipated, the shell of the packaging body is in contact with the ambient air, and one part of the heat is transferred to the ambient air, and the other part of the heat is in contact with the circuit board, so that the heat is transferred to the circuit board, and the heat dissipation is realized.
The disadvantages are as follows: the contact area between the shell of the packaging body and the circuit board is determined by the bottom area of the shell of the packaging body, and the bottom area of the shell of the packaging body is generally fixed and cannot be randomly increased. In addition, the circuit board has a low heat transfer coefficient, resulting in poor heat dissipation.
SUMMERY OF THE UTILITY MODEL
To the defect among the prior art, the utility model provides a SMD triode to improve the radiating effect, increase of service life.
the utility model provides a SMD triode, includes packaging body, first pin, second pin and third pin, still includes the heating panel, the top surface of heating panel with the bottom surface face and the face contact of packaging body, the top surface area of heating panel is greater than the bottom surface area of packaging body, the bottom surface of heating panel and the top surface face and the face contact of circuit board, the heating panel is equipped with one deck electrically insulating's heat dissipation cream layer, heat dissipation cream layer with first pin contact, heat dissipation cream layer with the second pin contact, heat dissipation cream layer with the third pin contact, the heating panel is equipped with the fin.
Preferably, the number of the heat sinks is three, and the top surfaces of the heat sinks and the top surface of the package body are on the same horizontal plane.
Preferably, the package further comprises a heat conducting silicone grease, and the top surface of the heat dissipation plate is in surface-to-surface contact with the bottom surface of the package through the heat conducting silicone grease.
Preferably, the bottom surface of the heat dissipation plate is in surface-to-surface contact with the top surface of the circuit board through the heat conductive silicone grease.
Preferably, the material of the heat dissipation paste layer is heat conduction silicone grease.
The beneficial effects of the utility model are embodied in: the heat transfer coefficient of the heat dissipation plate is high, so that the heat of the shell of the packaging body is quickly transferred to the heat dissipation plate, the heat dissipation plate is in contact with the surrounding air and can transfer the heat to the air, and in addition, the contact area of the heat dissipation plate and the surrounding air is increased through the heat dissipation plate, and the heat dissipation effect is improved; the area of the top surface of the heat dissipation plate is larger than that of the bottom surface of the packaging body, and the bottom surface of the heat dissipation plate is in surface contact with the top surface of the circuit board, so that the contact area of the packaging body and the circuit board is indirectly increased, and the heat dissipation effect is improved; a part of heat of the heat dissipation plate is transferred to the first pin, the second pin and the third pin through the heat dissipation paste layer which is electrically insulated, and the heat of the first pin, the second pin and the third pin is transferred to the surrounding air, so that the heat dissipation effect is improved. Compared with the prior art, the radiating effect of the triode is improved, and the service life is prolonged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the technical solutions in the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.
FIG. 1 is a high power SMD triode of the prior art;
Fig. 2 is a top view of the present invention;
Fig. 3 is a front view of the package, the third pin, the heat dissipating plate and the heat dissipating paste layer of the present invention.
Detailed Description
Embodiments of the present invention will be described in detail below with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and therefore are only examples, and the protection scope of the present invention is not limited thereby.
It is to be noted that unless otherwise specified, technical or scientific terms used herein shall have the ordinary meaning as understood by those skilled in the art to which the present invention belongs.
As shown in fig. 2 to 3, a chip transistor includes a package 1, a first lead 2, a second lead 3, and a third lead 4, and further includes a heat sink 5, the top surface of the heat dissipation plate 5 is in surface contact with the bottom surface of the packaging body 1, the area of the top surface of the heat dissipation plate 5 is larger than that of the bottom surface of the packaging body 1, the bottom surface of the heat dissipation plate 5 is in surface contact with the top surface of the circuit board, the heat dissipation plate 5 is provided with an electrically insulating heat dissipation paste layer 51, the heat dissipation paste layer 51 is in contact connection with the first pins 2, the heat dissipation paste layer 51 is in contact connection with the second pins 3, the heat dissipation paste layer 51 is in contact connection with the third pins 4, the heat dissipation plate 5 is provided with heat dissipation fins 52, the heat dissipation plate 5 and the heat dissipation fins 52 are made of copper, the number of the heat dissipation fins 52 is three, and the top surfaces of the heat dissipation fins 52 and the top surface of the package body 1 are on the same horizontal plane.
The utility model discloses a theory of operation is:
Because the heat transfer coefficient of the heat dissipation plate 5 is high, the heat of the shell of the packaging body 1 is quickly transferred to the heat dissipation plate 5, the heat dissipation plate 5 is in contact with the surrounding air, the heat can be transferred to the air, in addition, the contact area with the surrounding air is increased through the heat dissipation fins 52, and the heat dissipation effect is improved; the area of the top surface of the heat dissipation plate 5 is larger than that of the bottom surface of the packaging body 1, and the bottom surface of the heat dissipation plate 5 is in surface contact with the top surface of the circuit board, so that the contact area of the packaging body 1 and the circuit board is indirectly increased, and the heat dissipation effect is improved; a part of heat of the heat dissipating plate 5 is transferred to the first pins 2, the second pins 3, and the third pins 4 through the heat dissipating paste layer 51, which is electrically insulated, and the heat of the first pins 2, the second pins 3, and the third pins 4 is transferred to the ambient air, thereby improving the heat dissipating effect. Compared with the prior art, the heat dissipation effect of the triode is improved, and the service life is prolonged
And a heat conductive silicone grease (not shown) is further included, and the top surface of the heat dissipation plate 5 is in surface-to-surface contact with the bottom surface of the package body 1 through the heat conductive silicone grease. Through the heat conduction silicone grease, the micro gap between the heat dissipation plate and the packaging body is filled, surface-to-surface contact is achieved, and heat conductivity is guaranteed.
The bottom surface of the heat dissipation plate 5 is in surface contact with the top surface of the circuit board through heat-conducting silicone grease. Through the heat conduction silicone grease, the micro gap between the heat dissipation plate and the circuit board is filled, surface-to-surface contact is achieved, and heat conductivity is guaranteed.
The heat dissipation paste layer is made of heat conduction silicone grease. The heat-conducting silicone grease has good heat conductivity and electrical insulation.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the scope of the embodiments of the present invention, and are intended to be covered by the claims and the specification.
Claims (5)
1. the utility model provides a SMD triode, includes packaging body, first pin, second pin and third pin, its characterized in that: still include the heating panel, the top surface of heating panel with the bottom surface face and the face contact of packaging body, the top surface area of heating panel is greater than the bottom surface area of packaging body, the top surface face and the face contact of the bottom surface of heating panel and circuit board, the heating panel is equipped with one deck electrically insulating's heat dissipation cream layer, heat dissipation cream layer with first pin contact, heat dissipation cream layer with the second pin contact, heat dissipation cream layer with the third pin contact, the heating panel is equipped with the fin.
2. The patch type triode of claim 1, wherein: the number of the radiating fins is three, and the top surfaces of the radiating fins and the top surface of the packaging body are on the same horizontal plane.
3. The patch type triode of claim 1, wherein: the heat dissipation plate is characterized by further comprising heat conduction silicone grease, and the top surface of the heat dissipation plate is in surface contact with the bottom surface of the packaging body through the heat conduction silicone grease.
4. The patch type triode of claim 3, wherein: the bottom surface of the heat dissipation plate is in surface contact with the top surface of the circuit board through the heat conduction silicone grease.
5. The patch type triode of claim 1, wherein: the heat dissipation paste layer is made of heat conduction silicone grease.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877001.2U CN209785918U (en) | 2019-06-12 | 2019-06-12 | SMD triode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920877001.2U CN209785918U (en) | 2019-06-12 | 2019-06-12 | SMD triode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209785918U true CN209785918U (en) | 2019-12-13 |
Family
ID=68788767
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920877001.2U Active CN209785918U (en) | 2019-06-12 | 2019-06-12 | SMD triode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209785918U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200408600A1 (en) * | 2018-01-11 | 2020-12-31 | Toyota Jidosha Kabushiki Kaisha | Inspection method, inspection apparatus, production method, and production system for heatsink |
-
2019
- 2019-06-12 CN CN201920877001.2U patent/CN209785918U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20200408600A1 (en) * | 2018-01-11 | 2020-12-31 | Toyota Jidosha Kabushiki Kaisha | Inspection method, inspection apparatus, production method, and production system for heatsink |
| US11802797B2 (en) * | 2018-01-11 | 2023-10-31 | Toyota Jidosha Kabushiki Kaisha | Inspection method, inspection apparatus, production method, and production system for heatsink |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A kind of transistor patch Effective date of registration: 20201016 Granted publication date: 20191213 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. Registration number: Y2020980006863 |
|
| CP02 | Change in the address of a patent holder | ||
| CP02 | Change in the address of a patent holder |
Address after: No.3, 3rd Street, aichayuan Road, Dalingshan Town, Dongguan City, Guangdong Province, 523000 Patentee after: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. Address before: 523000 3rd floor, building B, No.3 Industrial Zone, Dalingshan Town, Dongguan City, Guangdong Province Patentee before: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20191213 Pledgee: China Co. truction Bank Corp Dongguan branch Pledgor: DONGGUAN TONGKE ELECTRONIC Co.,Ltd. Registration number: Y2020980006863 |