CN219893733U - Portable box with radiating function and component overhang layout - Google Patents
Portable box with radiating function and component overhang layout Download PDFInfo
- Publication number
- CN219893733U CN219893733U CN202321530001.8U CN202321530001U CN219893733U CN 219893733 U CN219893733 U CN 219893733U CN 202321530001 U CN202321530001 U CN 202321530001U CN 219893733 U CN219893733 U CN 219893733U
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- Prior art keywords
- heat dissipation
- pcb
- components
- top cover
- heat
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 46
- 239000003292 glue Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims description 7
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 16
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 5
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000012545 processing Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model provides a portable box body with a hanging layout of components and parts and with a heat dissipation function, which comprises: the PCB comprises a top cover positioned above the box body, a bottom plate positioned below the box body and a PCB positioned between the top cover and the bottom plate, and is characterized in that heat conducting glue is coated on the upper surface of the PCB, the upper surface of the PCB is connected with the top cover through the heat conducting glue, components facing the bottom plate in the vertical direction are arranged below the PCB, and air flows between the components and the bottom plate.
Description
Technical Field
The utility model relates to the technical field related to component heat dissipation, in particular to a portable box body with a component overhang layout and a heat dissipation function.
Background
In the prior art, for portable emergency communication equipment, certain heat is generated by internal components during operation, and the internal temperature of the equipment is easy to rise rapidly in an external environment with high temperature or high temperature. If the heat is not timely emitted, the equipment is continuously heated, components and parts can be invalid due to overheat, and the equipment reliability is reduced. Therefore, it is important to efficiently perform heat dissipation processing on the circuit board in the device.
The traditional component layout mode is that a PCB is arranged on a bottom plate of a box body, components on the PCB face to a top cover of the box body, and then the components on the PCB are radiated by radiating equipment arranged in the box body.
Disclosure of Invention
The utility model aims to provide a portable box body with a hanging layout of components and parts, which has a heat dissipation function, adopts the technical means of carrying out the hanging layout of the components and parts, improves the heat dissipation efficiency through natural convection of air, and can improve the heat dissipation efficiency in the box body without adding excessive heat dissipation equipment.
In order to solve the technical problems, the utility model adopts the following scheme:
a box for a component overhang layout with heat dissipation, comprising: the PCB comprises a top cover positioned above the box body, a bottom plate positioned below the box body and a PCB positioned between the top cover and the bottom plate, and is characterized in that heat conducting glue is coated on the upper surface of the PCB, the upper surface of the PCB is connected with the top cover through the heat conducting glue, components facing the bottom plate in the vertical direction are arranged below the PCB, and air flows between the components and the bottom plate.
Further, the upper surface of the PCB is partially coated with heat conducting glue, and the heat conducting glue is used for conducting heat between the top cover and the PCB.
Further, the heat-conducting glue is anisotropic heat-conducting glue, and the anisotropic heat-conducting glue is used for conducting heat between the top cover and the PCB in a specific direction.
Further, the top cover is made of metal.
Further, the PCB is an MCPCB metal base core circuit board.
Further, the components on the PCB are arranged in a staggered manner in the horizontal direction.
Further, the top cover is also provided with a plurality of heat dissipation holes, and the heat dissipation holes penetrate through the upper end face and the lower end face of the top cover.
Further, a heat radiation grille is further arranged on the top cover.
Further, the bottom plate is also provided with a radiating fin.
The utility model has the beneficial effects that:
the utility model provides a box body with a hanging layout of components and parts, which adopts the technical means of hanging layout of the components and parts, improves the heat dissipation efficiency through natural convection of air, and can improve the heat dissipation efficiency in the box body without adding excessive heat dissipation equipment.
In addition, the box body with the component overhang layout with the heat dissipation function adopts the technical means of carrying out overhang layout on the components, so that the box body can be miniaturized.
Drawings
Fig. 1 is a schematic structural diagram of a connection between a top cover and a PCB board in embodiment 1 of the present utility model;
fig. 2 is a schematic diagram of a connection between a PCB board and a top cover through a heat conductive adhesive in embodiment 1 of the present utility model;
fig. 3 is a schematic structural diagram of a box with a hanging layout of components with heat dissipation function in embodiment 1 of the present utility model;
reference numerals illustrate: 1-top cover, 11-heat dissipation holes, 12-heat dissipation grids, 2-PCB board, 3-components and 4-heat conduction layers.
Detailed Description
In order that those skilled in the art will better understand the technical scheme of the present utility model, the following further details the present utility model with reference to the accompanying drawings and detailed description, but the embodiments of the present utility model are not limited thereto.
In the description of the present utility model, it should be noted that, directions or positional relationships indicated by terms such as "center", "upper", "lower", "left", "right", "vertical", "longitudinal", "lateral", "horizontal", "inner", "outer", "front", "rear", "top", "bottom", etc., are directions or positional relationships based on those shown in the drawings, or are directions or positional relationships conventionally put in use of the inventive product, are merely for convenience of describing the present utility model and for simplifying the description, and are not indicative or implying that the apparatus or element to be referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be construed as limiting the present utility model.
In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "configured," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
The utility model is described in detail below by reference to the attached drawings and in connection with the embodiments:
in the prior art, for portable emergency communication equipment, when in operation, the internal components 3 generate certain heat, and the internal temperature of the equipment is easy to rise rapidly in an external environment with high temperature or high temperature. If the heat is not timely emitted, the equipment continuously heats up, the components 3 can fail due to overheating, and the equipment reliability is reduced. Therefore, it is important to efficiently perform heat dissipation processing on the circuit board in the device.
The traditional component 3 layout mode is that the PCB 2 is arranged on the bottom plate of the box body, the component 3 on the PCB 2 faces to the top cover 1 of the box body, and then the component 3 on the PCB 2 is radiated by arranging radiating equipment in the box body.
The utility model provides a box body with a hanging layout of components 3 with a heat dissipation function, and the problems can be solved by adopting a technical means of carrying out the hanging layout of the components 3.
As shown in fig. 1, 2 and 3, the box body with the hanging layout of the components 3 with the heat dissipation function provided by the utility model comprises: the top cover 1 positioned above the box body, the bottom plate positioned below the box body and the PCB 2 positioned between the top cover 1 and the bottom plate are characterized in that heat conducting glue is coated on the PCB 2, the upper surface of the PCB 2 is connected with the top cover 1 through the heat conducting glue, a component 3 oriented to the bottom plate in the vertical direction is arranged below the PCB 2, and air flows between the component 3 and the bottom plate.
Specifically, the component 3 faces the bottom plate, but the component 3 is not connected with the heat dissipation bottom plate, air flows between the component 3 and the heat dissipation bottom plate, and heat dissipation efficiency is improved by utilizing air convection.
Preferably, the PCB 2 in the box body with the overhanging layout of the components 3 with the heat dissipation function selects the MCPCB metal-based core circuit board, and the MCPCB metal-based core circuit board is characterized in that metal is used as a circuit board substrate, so that the heat dissipation performance of the PCB 2 can be greatly improved.
Preferably, the upper surface of the PCB board 2 is partially coated with a heat-conducting glue, so that the upper surface of the PCB board is connected with the lower surface of the top cover 1 through the heat-conducting glue, and the heat-conducting glue is used for conducting heat between the top cover 1 and the PCB board 2.
Specifically, the local coating is adopted because the local coating can form a good heat conduction channel between the PCB 2 and the top cover 1, and the whole coating can reduce the heat dissipation efficiency of the PCB 2. When the local coating position is selected, the hot area can be selected for coating, so that the hot area coincides with the contact point, the heat conduction efficiency can be improved, and the heat can be more quickly transferred from the PCB 2 to the top cover 1 and emitted.
Preferably, the heat conducting glue adopts anisotropic heat conducting glue. The anisotropic heat-conducting adhesive has insulating property and can be used for fixing the PCB 2 below the top cover 1. And the anisotropic heat conduction adhesive has special heat conduction performance, can conduct heat energy in one mode, but conduct heat in the other mode rarely, and can play a role in efficiently leading out heat generated in the box body and simultaneously blocking external environment heat from entering.
Preferably, the components 3 on the PCB 2 are staggered in the horizontal direction.
Specifically, in the horizontal direction, the high-power components 3 are arranged as close to the edge of the PCB 2 as possible and along the edge of the PCB 2 so as to shorten the heat transfer path; in the vertical direction, the high-power components 3 are arranged as close to the PCB board 2 as possible in order to reduce the influence of these components 3 on the temperature of the other components 3 when they are in operation.
Therefore, according to the box body with the overhang layout of the components 3 with the heat dissipation function, not only is the overhang layout adopted for the components 3 in the box body, but also the staggered layout mode is adopted for the components 3 in the box body in the horizontal direction and the vertical direction, so that the heat dissipation efficiency in the box body is increased, and more dense component 3 layout can be realized.
Preferably, the top cover 1 is further provided with a plurality of heat dissipation holes 11 and heat dissipation grids 12, and the heat dissipation holes 11 penetrate through the upper end face and the lower end face of the top cover 1.
Preferably, the bottom plate is further provided with a heat sink.
In summary, the utility model mainly adopts the technical means that the components 3 are arranged in a hanging mode and staggered mode, and utilizes air convection to improve the heat dissipation efficiency, and without adding excessive heat dissipation equipment, the dense arrangement of the components 3 can be realized under the condition of keeping a better heat dissipation function, so that the box body becomes miniaturized, and the carrying of operators is convenient.
It is to be understood that the above embodiments are merely illustrative of the application of the principles of the present utility model, but not in limitation thereof. Various modifications and improvements may be made by those skilled in the art without departing from the spirit and substance of the utility model, and are also considered to be within the scope of the utility model.
Claims (9)
1. A portable case with a hanging layout of components (3) having a heat dissipation function, comprising: the novel solar cell module comprises a top cover (1) positioned above a box body, a bottom plate positioned below the box body and a PCB (2) positioned between the top cover (1) and the bottom plate, and is characterized in that heat conducting glue is coated on the upper surface of the PCB (2), the upper surface of the PCB (2) is connected with the top cover (1) through the heat conducting glue, a component (3) oriented to the bottom plate in the vertical direction is arranged below the PCB (2), and air flows between the component (3) and the bottom plate.
2. Portable case with overhanging layout of components (3) with heat dissipation function according to claim 1, characterized in that the upper part of the PCB board (2) is locally coated with a heat conducting glue for conducting heat between the top cover (1) and the PCB board (2).
3. The portable box with the hanging layout of the components (3) with the heat dissipation function according to claim 2, wherein the heat conducting glue is anisotropic heat conducting glue, and the anisotropic heat conducting glue is used for conducting heat between the top cover (1) and the PCB (2) towards a specific direction.
4. The portable box body with the hanging layout of the components (3) with the heat dissipation function according to claim 1, wherein the top cover (1) is a top cover (1) made of metal.
5. The portable case with a hanging layout of components (3) with heat dissipation function according to claim 1, wherein the PCB (2) is an MCPCB metal-based core circuit board.
6. The portable case with a hanging layout of components (3) with heat dissipation function according to claim 1, wherein the components (3) on the PCB board (2) are staggered in a horizontal direction.
7. The portable box body with the hanging layout of the components (3) with the heat dissipation function according to claim 1, wherein the top cover (1) is further provided with a plurality of heat dissipation holes (11), and the heat dissipation holes (11) penetrate through the upper end face and the lower end face of the top cover (1).
8. The portable box body with the hanging layout of the components (3) with the heat dissipation function according to claim 1, wherein the top cover (1) is further provided with a heat dissipation grid (12).
9. The portable case with a hanging layout of components (3) with heat dissipation function according to claim 1, wherein the bottom plate is further provided with heat dissipation fins.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321530001.8U CN219893733U (en) | 2023-06-15 | 2023-06-15 | Portable box with radiating function and component overhang layout |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202321530001.8U CN219893733U (en) | 2023-06-15 | 2023-06-15 | Portable box with radiating function and component overhang layout |
Publications (1)
Publication Number | Publication Date |
---|---|
CN219893733U true CN219893733U (en) | 2023-10-24 |
Family
ID=88397290
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202321530001.8U Active CN219893733U (en) | 2023-06-15 | 2023-06-15 | Portable box with radiating function and component overhang layout |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN219893733U (en) |
-
2023
- 2023-06-15 CN CN202321530001.8U patent/CN219893733U/en active Active
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