CN222442096U

CN222442096U - Module components and parts heat radiation structure

Info

Publication number: CN222442096U
Application number: CN202420731399.XU
Authority: CN
Inventors: 邱泽银; 王德维
Original assignee: Truly Opto Electronics Ltd
Current assignee: Truly Opto Electronics Ltd
Priority date: 2024-04-09
Filing date: 2024-04-09
Publication date: 2025-02-07
Anticipated expiration: 2034-04-09

Abstract

A module component radiating structure comprises an FPC and components, wherein the FPC comprises FPCIC and a copper layer, the copper layer is arranged in FPCIC, the components are arranged at the central position of the left side of the FPC, the components comprise high-power-consumption components, and a through hole is formed in the connecting position of the high-power-consumption components and the FPC. According to the module component heat radiation structure, the copper layer is arranged in the FPC, the through holes are formed in the vicinity of the high-power-consumption components in the components and correspond to the through holes formed in the vicinity of the reinforcing steel sheet connected with the other side of the FPC, and the copper layer is exposed out of the through holes, so that heat generated after the high-power-consumption components are electrified can be conducted to the other side of the FPC to be radiated through the through holes, and the module component heat radiation structure can achieve the purposes of rapidly conducting and radiating the heat in the vicinity of the FPC components, and therefore the purposes of rapidly radiating and preventing the components from overheating and necrosis are achieved.

Description

Module components and parts heat radiation structure

Technical Field

The utility model relates to the technical field of display modules, in particular to a module component heat dissipation structure.

Background

At present, the FPC of the existing display module can generate a large amount of heat when being electrified to work, especially on components of the FPC, so that heat is required to be discharged when the display module works, and once the heat is accumulated, the components are not rapidly led out to be nearby, the components are easily overheated and necrotized, so that the normal operation of products can be influenced.

Disclosure of utility model

The utility model aims to overcome the defects in the prior art and provides a heat dissipation structure of a module component.

The aim of the utility model is realized by the following technical scheme:

A module component radiating structure comprises an FPC and components, wherein the FPC comprises FPCIC and a copper layer, the copper layer is arranged in FPCIC, the components are arranged at the central position of the left side of the FPC, the components comprise high-power-consumption components, and a through hole is formed in the connecting position of the high-power-consumption components and the FPC.

In one embodiment, the copper layer is disposed in an interlayer of the FPC, and the length and width of the copper layer are adapted to the length and width of the front surface of the FPC.

In one embodiment, the thickness of the copper layer is between 0.5mm and 1.5 mm.

In one embodiment, a reinforcing steel sheet is arranged at the center of the right side of the FPC, and the reinforcing steel sheet corresponds to the high-power-consumption component on the left side of the FPC.

In one embodiment, the via is disposed around the high power consumption component, and extends onto the FPC up to the surface of the copper layer.

In one embodiment, a plurality of through holes are formed in one side, close to the reinforcing steel sheet, of the FPC.

In one embodiment, the via hole on the side of the FPC close to the reinforcing steel sheet corresponds to the via hole on the side of the FPC close to the component.

In one embodiment, a heat-conducting adhesive is disposed in the via hole on one side of the FPC, which is close to the reinforcing steel sheet.

In one embodiment, the corners around the FPC are rounded.

In one embodiment, a plurality of heat dissipation holes are formed at the connection positions of the FPC, the components and the reinforcing steel sheet.

Compared with the prior art, the utility model has at least the following advantages:

According to the module component radiating structure, the copper layer is arranged in the FPC, the through holes are formed in the vicinity of the high-power-consumption components in the components and the through holes are mutually corresponding to the through holes formed in the vicinity of the reinforcing steel sheet connected with the other side of the FPC, and the through holes can expose the copper layer, so that heat generated after the high-power-consumption components are electrified can be conducted to the other side of the FPC to be radiated, the through holes close to the reinforcing steel sheet at one time are required to be sealed by the heat conducting glue to avoid forming air thermal resistance, and meanwhile, the heat transfer is quickened, so that the radiating effect of the module component radiating structure is faster, and the purposes of quickly radiating and preventing the overheat necrosis of the components can be achieved.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic side-stacking view of a heat dissipating structure for a module component according to the present utility model;

Fig. 2 is a schematic view of a part of a component of the heat dissipation structure of a module component of the present utility model.

In the figure, 1, FPC, 11, copper layers, 12, FPCIC, 2, components, 21, high-power-consumption components, 3, reinforcing steel sheets, 4, through holes and 5, and heat-conducting glue.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

In the description of the present application, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

Unless specifically stated or limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interactive relationship between two elements.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

1-2, The module component heat dissipation structure comprises an FPC1 and a component 2, wherein the FPC1 comprises FPCIC and a copper layer 11, the copper layer 11 is arranged in FPCIC, the component 2 is arranged in the center of the left side of the FPC1, the component 2 comprises a high-power-consumption component 21, and a through hole 4 is formed in the connecting position of the high-power-consumption component 21 and the FPC 1. It should be noted that, this design scheme not only can design on FPC1, also can design on the PCB board to when FPC1 or PCB assemble to backlight, note that radiating element district back need not design has the enclosure space, avoids the air thermal resistance, leads to the heat to pile up.

As shown in fig. 1-2, in one embodiment, a copper layer 11 is disposed in the interlayer of the FPC1, and the length and width of the copper layer 11 are adapted to the length and width of the front surface of the FPC 1. The thickness of the copper layer 11 is 0.5mm to 1.5 mm. It should be noted that, the thickness of the copper layer 11 is increased compared with the thickness in the original design, so that heat can be dissipated and conducted more quickly.

As shown in fig. 1-2, in one embodiment, a reinforcing steel sheet 3 is disposed at the center of the right side of the FPC1, and the reinforcing steel sheet 3 corresponds to a high-power consumption component 21 on the left side of the FPC 1. The reinforcing steel sheet 3 is made of steel sheet and has heat dissipation capability.

As shown in fig. 1-2, in one embodiment, the via 4 is disposed around the high power device 21, and the via 4 extends onto the FPC1 and up to the surface of the copper layer 11. It should be noted that this design allows the copper layer 11 to be exposed, thereby allowing for faster conduction of heat from the component 2 into the copper layer 11.

As shown in fig. 1-2, in one embodiment, a plurality of vias 4 are disposed on one side of the FPC1 near the reinforcing steel sheet 3. The position of the through hole 4 on the side of the FPC1 close to the reinforcing steel sheet 3 corresponds to the position of the through hole 4 on the side of the FPC1 close to the component 2. It should be noted that, the corresponding design of the vias 4 on both sides of the FPC1 can better dissipate heat and conduct heat.

As shown in fig. 1-2, in one embodiment, a heat conductive paste 5 is disposed in the via hole 4 on the side of the FPC1 near the reinforcing steel sheet 3. It should be noted that, when the heat-conducting glue 5 is set, the bottom of the via hole 4 is not required to be separately left, so that the formation of air thermal resistance is avoided.

As shown in fig. 1-2, in one embodiment, the corners around the FPC1 are rounded.

As shown in fig. 1-2, in one embodiment, a plurality of heat dissipation holes are formed at the connection positions between the FPC1 and the components 2 and between the reinforcing steel sheet 3. The heat dissipation capability of the FPC1 can be enhanced by this design.

The above examples illustrate only a few embodiments of the utility model, which are described in detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. A module component heat radiation structure is characterized by comprising:

FPC (1) and components (2);

An FPC (1), wherein the FPC (1) comprises FPCIC (12) and a copper layer (11), and the copper layer (11) is arranged in the FPCIC (12);

Component (2), component (2) set up the central point in FPC (1) left side puts, component (2) are including high-power consumption components and parts (21), high-power consumption components and parts (21) with the hookup location department between FPC (1) is provided with via hole (4).

2. The module component heat dissipation structure according to claim 1, wherein the copper layer (11) is disposed in an interlayer of the FPC (1), and a length and a width of the copper layer (11) are adapted to a length and a width of a front surface of the FPC (1).

3. The heat dissipation structure as defined in claim 1, wherein the thickness of the copper layer (11) is between 0.5mm and 1.5 mm.

4. The module component heat radiation structure according to claim 1, wherein a reinforcing steel sheet (3) is provided at a right central position of the FPC (1), and the reinforcing steel sheet (3) corresponds to the high-power consumption component (21) on a left side of the FPC (1).

5. The module component heat dissipation structure as defined in claim 1, wherein the via hole (4) is disposed around the high power consumption component (21), and the via hole (4) extends onto the FPC (1) and extends to the surface of the copper layer (11).

6. The heat dissipation structure of module components according to claim 4, wherein a plurality of through holes (4) are provided on a side of the FPC (1) close to the reinforcing steel sheet (3).

7. The heat dissipation structure of module components according to claim 6, wherein the via hole (4) on the side of the FPC (1) close to the reinforcing steel sheet (3) corresponds to the via hole (4) on the side of the FPC (1) close to the component (2).

8. The heat dissipation structure of module components according to claim 6, wherein a heat-conducting glue (5) is disposed in the via hole (4) on one side of the FPC (1) close to the reinforcing steel sheet (3).

9. The heat dissipation structure of module components according to claim 1, wherein corners around the FPC (1) are rounded.

10. The module component heat radiation structure according to claim 4, wherein a plurality of heat radiation holes are provided at the connection positions between the FPC (1) and the component (2) and the reinforcing steel sheet (3).