CN223039911U - Inverter and energy storage power supply - Google Patents
Inverter and energy storage power supply Download PDFInfo
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- CN223039911U CN223039911U CN202421769120.3U CN202421769120U CN223039911U CN 223039911 U CN223039911 U CN 223039911U CN 202421769120 U CN202421769120 U CN 202421769120U CN 223039911 U CN223039911 U CN 223039911U
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- circuit board
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Abstract
本实用新型属于储能技术领域，公开了一种逆变器及储能电源，逆变器用于储能电源，储能电源包括散热基板、电路板和导热件，散热基板限定出安装腔，安装腔的底壁上设有至少一个散热件，电路板安装于安装腔，电路板上设有功率元器件，导热件与功率元器件对应设置，且止抵于安装腔的底壁。该逆变器的散热基板，既是整个逆变器的支撑板，同时也是整个逆变器的散热板，既能满足力学性能，也能满足热学性能，在确保整个逆变器具有良好的散热能力的同时，无需使用现有技术中的散热风扇，有利于储能电源的轻量化以及小型化设计。
The utility model belongs to the field of energy storage technology, and discloses an inverter and an energy storage power supply. The inverter is used for the energy storage power supply, and the energy storage power supply includes a heat dissipation substrate, a circuit board and a heat conductor. The heat dissipation substrate defines an installation cavity, and at least one heat dissipation component is provided on the bottom wall of the installation cavity. The circuit board is installed in the installation cavity, and power components are provided on the circuit board. The heat conductor is arranged corresponding to the power components and stops at the bottom wall of the installation cavity. The heat dissipation substrate of the inverter is not only a support plate of the entire inverter, but also a heat dissipation plate of the entire inverter. It can meet both mechanical properties and thermal properties. While ensuring that the entire inverter has good heat dissipation capacity, there is no need to use the heat dissipation fan in the prior art, which is conducive to the lightweight and miniaturized design of the energy storage power supply.
Description
Technical Field
The utility model relates to the technical field of energy storage, in particular to an inverter and an energy storage power supply.
Background
In the energy storage power supply, the inverter is one of core components in the energy storage power supply with the advantages of convenience in installation, high conversion efficiency and low-voltage safety. In the working process of the energy storage power supply, the working heating of the inverter is an important source of the working heating of the energy storage power supply, so that the heat dissipation efficiency of the inverter is an important working parameter of the energy storage power supply. In the existing energy storage power supply, the inverter is usually mounted on a heat dissipation bracket, and then heat is dissipated through a fan mounted on the heat dissipation bracket, so that the heat dissipation of the inverter can be realized, but the whole size is large, the protection level is low, and the light weight and the miniaturization design of the energy storage power supply are not facilitated.
Disclosure of utility model
A first object of the present utility model is to provide an inverter which has high heat dissipation efficiency and small volume, and is advantageous for the light weight and small design of the energy storage power supply.
A second object of the present utility model is to provide an energy storage power source, which has high heat dissipation efficiency, light weight and small volume.
To achieve the purpose, the utility model adopts the following technical scheme:
The utility model discloses an inverter which is used for an energy storage power supply and comprises a heat dissipation substrate, a circuit board and a heat conduction piece, wherein the heat dissipation substrate is used for limiting a mounting cavity, at least one heat dissipation piece is arranged on the bottom wall of the mounting cavity, the circuit board is mounted in the mounting cavity and is provided with a power component, and the heat conduction piece is arranged corresponding to the power component and is abutted against the bottom wall of the mounting cavity.
In some embodiments, the power component includes at least one transformer, the transformer is disposed through the circuit board, and the heat conducting member is disposed between the transformer and the bottom wall of the mounting cavity.
In some embodiments, the power component includes at least one inductor, the inductor is disposed through the circuit board, and the heat conducting member is sandwiched between the inductor and the bottom wall of the mounting cavity.
In some embodiments, the power component comprises a plurality of patch MOS tubes, the patch MOS tubes are mounted on one side of the circuit board, which is away from the bottom wall of the mounting cavity, and the heat conducting member is mounted on one side of the circuit board, which is towards the bottom wall of the mounting cavity, and is arranged in one-to-one correspondence with the patch MOS tubes.
In some embodiments, the power component comprises a plurality of packaging MOS tubes arranged close to the side wall of the mounting cavity, the packaging MOS tubes are mounted on one side of the circuit board, which is away from the bottom wall of the mounting cavity, the circuit board is further provided with a plurality of heat dissipation sleeves, and the heat dissipation sleeves are sleeved on the packaging MOS tubes in a one-to-one correspondence manner.
In some specific embodiments, the inverter further comprises a heat dissipation fixing plate, wherein the heat dissipation fixing plate is arranged at intervals with the side wall of the installation cavity and is connected with the side wall of the installation cavity through a fixing piece, and the heat dissipation fixing plate is abutted to one side, away from the side wall of the installation cavity, of the heat dissipation sleeve so as to compress one side, close to the side wall of the installation cavity, of the heat dissipation sleeve on the side wall of the installation cavity.
In some embodiments, at least one mounting groove is formed in the bottom wall of the mounting cavity, a heat dissipation member is disposed in each mounting groove, the heat dissipation member is abutted to the heat conduction member, and the heat conductivity of the heat dissipation member is greater than that of the heat dissipation substrate.
In some embodiments, the heat dissipation substrate includes a bottom plate and two side plates, the two side plates are respectively connected to two sides of the bottom plate opposite to each other, and one side of the two side plates facing away from each other is provided with a heat dissipation fin.
In some embodiments, the inverter further comprises an insulating member, the insulating member is mounted in the mounting cavity, the insulating member is located between the circuit board and the bottom wall of the mounting cavity, and a avoiding hole for avoiding the heat conducting member is formed in the insulating member.
The utility model also discloses an energy storage power supply, which comprises a shell, a battery module and the inverter, wherein the inverter and the battery module are both arranged in the shell, and the inverter is electrically connected with the battery module.
The inverter has the beneficial effects that in the actual working process, heat generated in the working process of the power components on the circuit board can be transferred to the bottom wall of the installation cavity through the heat transfer of the circuit board and the heat conducting piece, the heat radiating substrate has good heat radiating capacity, and at least one heat radiating piece is arranged on the bottom wall of the installation cavity, and the heat generated in the working process of the power components can be radiated to the environment through the heat radiation of the heat radiating substrate and the heat radiating piece. Therefore, the radiating substrate of the inverter of the embodiment is not only the supporting plate of the whole inverter, but also the radiating plate of the whole inverter, not only can the mechanical property be met, but also the thermal property can be met, and the radiating fan in the prior art is not required to be used while the whole inverter is ensured to have good radiating capacity, so that the lightweight and miniaturized design of the energy storage power supply are facilitated.
The energy storage power supply has the beneficial effects that the inverter is provided, so that the energy storage power supply has higher heat dissipation efficiency, lighter weight and smaller volume.
Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.
Drawings
Fig. 1 is a schematic configuration diagram of an inverter according to an embodiment of the present utility model;
fig. 2 is an exploded schematic view of one form of an inverter of an embodiment of the utility model;
fig. 3 is an exploded schematic view of another form of inverter of an embodiment of the utility model;
Fig. 4 is an exploded view of a heat dissipating substrate of an inverter according to an embodiment of the present utility model;
reference numerals:
100. A heat dissipation base plate 110, a bottom plate 111, a mounting groove 112, a heat dissipation piece 120, a side plate 121 and a heat dissipation fin;
200. A circuit board; 201, a transformer, 202, an inductor, 203, a patch MOS tube, 204, a packaging MOS tube, 205, a heat dissipation sleeve;
300. 400 parts of heat conduction piece, 500 parts of heat dissipation fixing plate;
600. insulation member 610, avoiding hole.
Detailed Description
The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.
In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.
The specific structure of the inverter according to the embodiment of the present utility model is described below with reference to the drawings.
The utility model discloses an inverter, which is used for an energy storage power supply, and is shown with reference to fig. 1 and 3, wherein the energy storage power supply comprises a heat dissipation substrate 100, a circuit board 200 and a heat conduction member 300, the heat dissipation substrate 100 defines a mounting cavity, at least one heat dissipation member 112 is arranged on the bottom wall of the mounting cavity, the circuit board 200 is mounted in the mounting cavity, a power component is arranged on the circuit board 200, and the heat conduction member 300 is correspondingly arranged with the power component and is abutted against the bottom wall of the mounting cavity. It can be understood that, in the actual working process, the heat generated in the working process of the power component on the circuit board 200 can be transferred to the bottom wall of the mounting cavity through the heat transfer between the circuit board 200 and the heat conducting member 300, the heat dissipation substrate 100 has good heat dissipation capability, and at least one heat dissipation member 112 is arranged on the bottom wall of the mounting cavity, and the heat generated in the working process of the power component can be dissipated to the environment through the heat dissipation of the heat dissipation substrate 100 and the heat dissipation member 112. Therefore, the heat dissipation substrate 100 of the inverter of the embodiment is not only the support plate of the whole inverter, but also the heat dissipation plate of the whole inverter, not only can the mechanical property be met, but also the thermal property can be met, and the heat dissipation fan in the prior art is not required to be used while the whole inverter is ensured to have good heat dissipation capability, thereby being beneficial to the light weight and miniaturized design of the energy storage power supply.
Optionally, the heat conducting member 300 is a silicone member. It can be understood that the silica gel piece is adopted as the heat dissipation piece 112, and the power component can ensure the insulation setting of the power component and the heat dissipation substrate 100 through the silica gel piece and the heat bottom heat dissipation substrate 100, thereby ensuring the working stability of the inverter.
Alternatively, the heat dissipation substrate 100 can be machined by profile machining, die casting is not needed, machining is simple, and manufacturing cost is low.
Optionally, the heat dissipation substrate 100 is a metal piece. Thus, the heat dissipation substrate 100 has good heat dissipation capability, thereby ensuring high heat dissipation efficiency of the entire inverter.
Referring to fig. 3, the power component includes at least one transformer 201, the transformer 201 is disposed through the circuit board 200, and the heat conducting member 300 is sandwiched between the transformer 201 and the bottom wall of the mounting cavity. It can be appreciated that in the actual working process, the heat generated by the transformer 201 is large, if the transformer 201 is directly mounted on the surface of the circuit board 200, the heat dissipation effect of the heat conducting member 300 on the transformer 201 may be reduced, in this embodiment, the transformer 201 is arranged on the circuit board 200 in a penetrating manner, the heat conducting member 300 is directly abutted to the transformer 201, and the heat generated by the working of the transformer 201 is not required to pass through the circuit board 200, and can be directly transferred to the bottom wall of the mounting cavity through the heat conducting member 300 and then dissipated, thereby being beneficial to ensuring the heat dissipation effect on the transformer 201.
Referring to fig. 3, the power component includes at least one inductor 202, the inductor 202 is disposed through the circuit board 200, and the heat conducting member 300 is sandwiched between the inductor 202 and the bottom wall of the mounting cavity. It can be appreciated that in the actual working process, the heat generated by the inductor 202 is large, if the inductor 202 is directly mounted on the surface of the circuit board 200, the heat dissipation effect of the heat conducting member 300 on the inductor 202 may be reduced, in this embodiment, the inductor 202 is arranged on the circuit board 200 in a penetrating manner, the heat conducting member 300 is directly abutted to the inductor 202, and the heat generated by the working of the inductor 202 is not required to pass through the circuit board 200, and can be directly transferred to the bottom wall of the mounting cavity through the heat conducting member 300 and then dissipated, so that the heat dissipation effect on the inductor 202 is guaranteed.
Referring to fig. 3, the power component includes a plurality of patch MOS tubes 203, the patch MOS tubes 203 are mounted on a side of the circuit board 200 facing away from the bottom wall of the mounting cavity, and the heat conducting member 300 is mounted on a side of the circuit board 200 facing toward the bottom wall of the mounting cavity and is disposed in one-to-one correspondence with the patch MOS tubes 203. It can be appreciated that, due to the characteristics of the patch MOS tube 203, the patch MOS tube 203 must be attached to the circuit board 200, the patch MOS tube 203 and the heat conducting member 300 are respectively disposed at two ends of the circuit board 200, and the patch MOS tube 203 and the heat conducting member 300 are correspondingly disposed, in the actual working process, the heat generated by the working of the patch MOS tube 203 can be transferred to the bottom wall of the mounting cavity through the circuit board 200 and the heat conducting member 300, thereby improving the heat dissipation efficiency of the patch MOS tube 203.
Alternatively, the heat conductive member 300 has a structure in which a thermal conductivity coefficient of a silicone gasket, a silicone gel, or the like is greater than 2W/m·k and is in contact with the bottom wall of the mounting chamber. Therefore, heat generated by the operation of the transformer 201, the inductor 202 and the patch MOS tube 203 can be quickly transferred to the bottom wall of the mounting cavity, and the heat dissipation effect on the transformer 201 is improved.
Alternatively, the contact position between the surface-mounted MOS tube 203 and the circuit board 200 may be copper-plated in a large area, so as to improve the transfer efficiency of heat from the surface-mounted MOS tube 203 to the heat conducting member 300.
Referring to fig. 2, the power component further includes a plurality of packaging MOS tubes 204 disposed adjacent to a side wall of the mounting cavity, the plurality of packaging MOS tubes 204 are mounted on a side of the circuit board 200 away from a bottom wall of the mounting cavity, a plurality of heat dissipation sleeves 205 are further disposed on the circuit board 200, and the plurality of heat dissipation sleeves 205 are sleeved on the packaging MOS tubes 204 in a one-to-one correspondence manner. It can be appreciated that the plurality of heat dissipation sleeves 205 are sleeved on the packaged MOS tube 204 in a one-to-one correspondence manner, so that heat dissipation on both sides of the packaged MOS tube 204 can be realized, and the heat dissipation effect on the packaged MOS tube 204 is improved.
Optionally, the inverter further includes a heat dissipation fixing plate 400, where the heat dissipation fixing plate 400 is disposed at intervals with the side wall of the installation cavity, and is connected with the heat dissipation fixing plate through a fixing member 500, and the heat dissipation fixing plate 400 abuts against one side of the heat dissipation sleeve 205 away from the side wall of the installation cavity, so that one side of the heat dissipation sleeve 205 close to the side wall of the installation cavity is pressed on the side wall of the installation cavity. It can be appreciated that the added heat dissipation fixing plate 400 and the fixing piece 500 can compress the heat dissipation sleeve 205 on the side wall of the installation cavity, and the heat generated during the operation of the packaged MOS tube 204 can be rapidly transmitted to the side wall of the installation cavity through the heat dissipation sleeve 205, thereby being beneficial to improving the heat dissipation effect on the packaged MOS tube 204.
It should be noted that, in the prior art, the TO-type MOS (corresponding TO the package MOS tube 204 of the present embodiment) is simultaneously locked on both sides of the circuit board of the inverter, but in the actual assembly process, one side is locked, and the other side is deformed, so that it is very difficult TO install the TO-type MOS on the other side. In this embodiment, the packaging MOS tube 204 and the patch MOS tube 203 are adopted at the same time, and the packaging MOS tube 204 is only arranged on one side of the circuit board 200, and the packaging MOS tube 204 is not arranged on the other side, so that deformation of the circuit board 200 is not caused, and the circuit design of the inverter can be satisfied.
Referring to fig. 4, at least one mounting groove 111 is formed in the bottom wall of the mounting cavity, a heat dissipation member 112 is disposed in each mounting groove 111, the heat dissipation member 112 abuts against the heat conduction member 300, and the heat conduction coefficient of the heat dissipation member 112 is greater than that of the heat dissipation substrate 100. It can be understood that, since the power components (the inductor 202 and the transformer 201) are relatively concentrated and the heat density is high, if the first heat conducting member 300 corresponding to the transformer 201 and the second heat conducting member 300 corresponding to the inductor 202 are directly contacted with the bottom wall of the mounting cavity, local hot spots on the heat dissipating substrate 100 are caused, so that the utilization efficiency of the heat dissipating substrate 100 is reduced, in this embodiment, the mounting groove 111 is processed on the bottom wall of the heat dissipating substrate 100, and the heat dissipating member 112 is disposed in the mounting groove 111, and the heat conductivity of the heat dissipating member 112 can reach 5000W/m·k to 20000W/m·k. The heat conductivity coefficient is far greater than that of metal, so that the bottom wall of the whole heat dissipation substrate 100 can be guaranteed to be uniform in heat quantity, local hot spots are avoided, and the heat dissipation efficiency of the heat dissipation substrate 100 is greatly improved.
Alternatively, the heat sink 112 is a heat pipe and is ultrasonically welded within the mounting groove 111. Thus, the heat dissipation member 112 can be conveniently mounted, and the heat dissipation of the heat dissipation substrate 100 can be further improved greatly.
Alternatively, two heat dissipation elements 112 are provided, and each heat dissipation element 112 forms a U-shaped structure, and openings of the two U-shaped structures are arranged in opposite directions. Therefore, the bottom wall of the whole heat dissipation substrate 100 can be further ensured to have uniform heat, local hot spots are avoided, and the heat dissipation efficiency of the heat dissipation substrate 100 is greatly improved. Of course, in other embodiments of the present utility model, the number, shape and arrangement of the heat dissipation elements 112 may be selected according to actual needs, and are not limited to the above.
Referring to fig. 4, the heat dissipation substrate 100 includes a bottom plate 110 and two side plates 120, the two side plates 120 are respectively connected to two opposite sides of the bottom plate 110, and a side of the two side plates 120 facing away from each other is provided with a heat dissipation fin 121. It can be appreciated that the heat dissipation substrate 100 is formed into a U-shaped structure, which can facilitate air flow through the power components disposed on the circuit board 200, thereby facilitating improvement of heat dissipation efficiency of the inverter. The two side plates 120 are provided with the radiating fins 121 at one side facing away from each other, and the radiating fins 121 can improve the radiating efficiency of the radiating substrate 100, thereby being beneficial to improving the radiating efficiency of the inverter. It should be noted that, according to the foregoing description, the packaging MOS tube 204 is locked on one side wall of the mounting cavity, so that the size of the heat dissipation fin 121 on the side plate 120 of the packaging MOS tube 204 can be larger, and the size of the heat dissipation fin 121 without power components on the other side is smaller, so as to meet the light design requirement of the heat dissipation fin 121.
Referring to fig. 2, the inverter further includes an insulating member 600, the insulating member 600 is installed in the installation cavity, and the insulating member 600 is located between the circuit board 200 and the bottom wall of the installation cavity, and a relief hole 610 for relieving the heat conductive member 300 is formed in the insulating member 600. It can be understood that, in order to improve the heat dissipation efficiency of the heat dissipation substrate 100, the heat dissipation substrate 100 may be made of a metal material with high thermal conductivity, and has no insulating property, in this embodiment, an insulating member 600 is added below the circuit board 200 to ensure that the circuit board 200 is insulated from the heat dissipation substrate 100, so that the working reliability of the inverter is ensured.
The utility model also discloses an energy storage power supply which comprises a shell, a battery module and the inverter, wherein the inverter and the battery module are both arranged in the shell, and the inverter is electrically connected with the battery module. With the inverter, the heat dissipation efficiency of the energy storage power supply is higher, the weight is lighter, and the volume is smaller.
In the description of the present specification, reference to the term "some embodiments," "other embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.
Claims (9)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421769120.3U CN223039911U (en) | 2024-07-24 | 2024-07-24 | Inverter and energy storage power supply |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421769120.3U CN223039911U (en) | 2024-07-24 | 2024-07-24 | Inverter and energy storage power supply |
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| Publication Number | Publication Date |
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| CN223039911U true CN223039911U (en) | 2025-06-27 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202421769120.3U Active CN223039911U (en) | 2024-07-24 | 2024-07-24 | Inverter and energy storage power supply |
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