CN218851207U

CN218851207U - Heat dissipation circuit board

Info

Publication number: CN218851207U
Application number: CN202222881294.6U
Authority: CN
Inventors: 费伟伟
Original assignee: Suzhou Hankun Electronic Technology Co ltd
Current assignee: Suzhou Hankun Electronic Technology Co ltd
Priority date: 2022-10-31
Filing date: 2022-10-31
Publication date: 2023-04-11
Anticipated expiration: 2032-10-31

Abstract

The utility model discloses a heat dissipation circuit board, include: the mainboard, the chip, a plurality of components and parts, the chip, components and parts set up the lower surface at the mainboard, and be provided with a connection structure at this lower surface edge, the upper surface of mainboard is provided with a fin board, it has heat conduction cream to fill between this mainboard and the fin board, a circulation chamber board that the inside is filled with phase change medium is the annular and wraps up the mainboard, and have the clearance between this circulation chamber board and the mainboard both sides, the bottom and the chip lower surface bonding of circulation chamber board, connection structure further includes long supporting legs, short supporting legs, the both ends that are located mainboard one side are provided with long supporting legs respectively, the opposite side is provided with two short supporting legs, thereby make circulation chamber board slope. The utility model discloses both realized dispelling the heat with a large amount of heat transfer that the chip produced, the chip dispels the heat with the components and parts that the surrounding air heating influences the homonymy between avoiding, increased the area of mainboard with the air contact that flows again to holistic radiating efficiency has been improved greatly.

Description

Heat radiation circuit board

Technical Field

The utility model relates to a mainboard heat dissipation technical field especially relates to a heat dissipation circuit board.

Background

In recent years, electronic technology has been rapidly advanced, electronic devices have become more precise, and the temperature of the circuit board is high due to more and more heat generated by the operation of the electronic components, so that the heat dissipation requirement of the circuit board is also higher.

In the design of the circuit main board, in order to improve the heat dissipation capacity of the circuit main board, components with high power consumption such as a power transistor and a large-scale integrated circuit are arranged at the edge of the circuit main board as far as possible, the main control chip of the main control chip needs to consider that the wiring length is always arranged at the middle position of the circuit main board, and the position between the middle part and the edge of the circuit main board is always provided with the components with low power consumption.

However, in the prior art, after the heat generated by the chip is conducted to the heat dissipation plate, the heat of the heat dissipation plate diffuses to the periphery and easily heats the surrounding air, so that the heat dissipation of the components of the circuit main board around the chip is poor, and the overall heat dissipation is affected.

Disclosure of Invention

The utility model aims at providing a heat dissipation circuit board, this heat dissipation circuit board had both realized the a large amount of heat transfer that produce the chip, avoided the chip to carry out the radiating condition with the components and parts that ambient air heating influences the homonymy, had increased the area of mainboard with the air contact that flows again to holistic radiating efficiency has been improved greatly.

In order to achieve the above purpose, the utility model adopts the technical scheme that: a heat dissipating circuit board comprising: the heat-conducting cooling module comprises a main board, a chip and a plurality of components, wherein the chip and the components are arranged on the lower surface of the main board, a connecting structure is arranged on the edge of the lower surface, a fin plate is arranged on the upper surface of the main board, heat-conducting paste is filled between the main board and the fin plate, a circulation cavity plate filled with a phase-change medium is annularly wrapped on the main board, gaps are formed between the circulation cavity plate and two sides of the main board, and the bottom of the circulation cavity plate is bonded with the lower surface of the chip;

the connecting structure further comprises long supporting legs and short supporting legs, the two ends of one side of the main board are respectively provided with the long supporting legs, and the other side of the main board is provided with the two short supporting legs, so that the circulating cavity plate is inclined.

The further improved scheme in the technical scheme is as follows:

1. in the above scheme, the chip is located at the center of the lower surface of the main board.

2. In the above scheme, the heat conducting paste is heat conducting silicone grease or heat conducting gel.

3. In the above scheme, the middle part of the fin plate is provided with an opening, and a plurality of mounting posts are arranged in the opening and between the circulating current cavity plate and the main plate.

4. In the scheme, a positioning block is arranged between the two sides of the main plate and the circulating cavity plate.

Because of above-mentioned technical scheme's application, compared with the prior art, the utility model have the following advantage:

the utility model discloses heat dissipation circuit board, its lower surface edge that is located the mainboard is provided with a connection structure, the upper surface of mainboard is provided with a fin board, it has the heat conduction cream to fill between this mainboard and the fin board, inside packing has the circulation chamber board of phase change medium to be the annular and wraps up the mainboard, the bottom and the chip lower surface bonding of circulation chamber board, connection structure further includes long supporting legs, short supporting legs, the both ends that are located mainboard one side are provided with long supporting legs respectively, the opposite side is provided with two short supporting legs, thereby make circulation chamber board slope set up, mainboard through the slope setting, the cooperation of circulation chamber board, can realize that phase change medium circulates the flow in circulation chamber inboard portion, thereby realize shifting the great amount of heat that produces the chip to the mainboard top and dispel the heat, the chip carries out the radiating condition with the components and parts that ambient air heating influences the homonymy between avoiding, the mainboard that still will install the fin board is raised simultaneously, the area of mainboard with mobile air contact has been increased, thereby holistic radiating efficiency has been improved greatly.

Drawings

Fig. 1 is a schematic view of an overall structure of a first view angle of the circuit board of the present invention;

fig. 2 is a schematic view of the overall structure of a second viewing angle of the circuit board of the present invention;

fig. 3 is a cross-sectional front view of the heat dissipating circuit board of the present invention.

In the above drawings: 1. a main board; 2. a chip; 3. a component; 4. a connecting structure; 41. a long supporting leg; 42. short supporting legs; 5. a fin plate; 6. a circulation chamber plate; 7. an opening; 8. mounting a column; 9. positioning blocks; 10. and (4) heat conducting paste.

Detailed Description

In the description of this patent, it is noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, merely for convenience of description and simplification of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the invention; the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance; furthermore, unless expressly stated or limited otherwise, the terms "mounted," "connected," and "coupled" are to be construed broadly and encompass, for example, both fixed and removable coupling as well as integral coupling; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The meaning of the above terms in this patent may be specifically understood by those of ordinary skill in the art.

The invention will be further described with reference to the following examples:

example 1: a heat dissipating circuit board comprising: the chip-based heat dissipation module comprises a main board 1, a chip 2 and a plurality of components 3, wherein the chip 2 and the components 3 are arranged on the lower surface of the main board 1, a connecting structure 4 is arranged on the edge of the lower surface, a fin plate 5 is arranged on the upper surface of the main board 1, heat conducting paste 10 is filled between the main board 1 and the fin plate 5, a circulation cavity plate 6 filled with a phase change medium is annularly wrapped on the main board 1, gaps are formed between the circulation cavity plate 6 and two sides of the main board 1, and the bottom of the circulation cavity plate 6 is bonded with the lower surface of the chip 2;

the phase change medium is diethyl ether.

The connecting structure 4 further comprises a long supporting leg 41 and a short supporting leg 42, wherein the two ends of one side of the main plate 1 are respectively provided with the long supporting leg 41, and the other side is provided with the two short supporting legs 42, so that the circulation cavity plate 6 is inclined.

Due to the arrangement of the long supporting legs 41 and the short supporting legs 42, the main board 1 is inclined, when ether at the position of the chip 2 evaporates and absorbs heat, gaseous ether flows towards the direction of the long supporting legs 41 along the inside of the circular flow cavity plate 6, and is condensed and releases heat when flowing to the upper part of the main board 1, and the liquefied ether flows back to the position of the chip 2 from one side close to the short supporting legs 42 under the action of gravity, so that ether circulation is formed.

The chip 2 is located at the center of the lower surface of the main board 1.

The heat conductive paste 10 is a heat conductive silicone grease.

The middle part of the fin plate 5 is provided with an opening 7, and a plurality of mounting columns 8 are arranged in the opening 7 and between the circulation cavity plate 6 and the main plate 1.

A positioning block 9 is arranged between the two sides of the main plate 1 and the circular flow cavity plate 6.

Example 2: a heat dissipating circuit board comprising: the chip-based heat dissipation module comprises a main board 1, a chip 2 and a plurality of components 3, wherein the chip 2 and the components 3 are arranged on the lower surface of the main board 1, a connecting structure 4 is arranged on the edge of the lower surface, a fin plate 5 is arranged on the upper surface of the main board 1, heat conducting paste 10 is filled between the main board 1 and the fin plate 5, a circulation cavity plate 6 filled with a phase change medium is annularly wrapped on the main board 1, gaps are formed between the circulation cavity plate 6 and two sides of the main board 1, and the bottom of the circulation cavity plate 6 is bonded with the lower surface of the chip 2;

can realize that phase change medium carries out the circulation flow in circulation chamber intralamellar part to the realization shifts the components and parts that ambient air heating influences the homonymy to the mainboard top and dispels the heat with a large amount of heats that the chip produced between avoiding, still will install the mainboard of fin board simultaneously and raise, has increased the area of mainboard with the air contact that flows, thereby has improved holistic radiating efficiency greatly.

The chip 2 is located at the center of the lower surface of the main board 1.

The thermal conductive paste 10 is a thermal conductive gel.

A positioning block 9 is arranged between the two sides of the main plate 1 and the circulating cavity plate 6.

The utility model discloses the theory of operation does: when the heat dissipation device is used, due to the arrangement of the long supporting legs 41 and the short supporting legs 42, the main board 1 is inclined, when the phase change medium at the position of the chip 2 evaporates and absorbs heat, the heat flows towards the direction of the long supporting legs 41 along the inside of the circulation cavity plate 6, the heat is condensed and released when the heat flows to the upper side of the main board 1, the liquefied phase change medium is subjected to gravity and flows back to the position of the chip 2 from one side close to the short supporting legs 42, the circulation of the phase change medium is formed, a large amount of heat generated by the chip 2 can be taken away in the circulation process of the phase change medium, in addition, on the basis that the fin plate 5 is arranged on the surface of the main board 1, the main board 1 is lifted through the long supporting legs 41 and the short supporting legs 42, the contact area of the main board 1 and the chip 2 with flowing air is increased, the contact area of the main board and the flowing air is increased, and the integral heat dissipation efficiency is greatly improved.

When the heat dissipation circuit board is adopted, the phase change medium can circularly flow inside the circulating cavity plate, so that a large amount of heat generated by the chip is transferred to the upper portion of the main board to be dissipated, the situation that the surrounding air is heated by the chip to affect components on the same side is avoided, the main board provided with the fin plate is lifted up, the contact area of the main board and the flowing air is increased, and the overall heat dissipation efficiency is greatly improved.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered in the protection scope of the present invention.

Claims

1. A heat dissipating circuit board comprising: mainboard (1), chip (2), a plurality of components and parts (3), its characterized in that: the chip (2) and the component (3) are arranged on the lower surface of the main board (1), a connecting structure (4) is arranged on the edge of the lower surface, a fin plate (5) is arranged on the upper surface of the main board (1), heat conducting paste (10) is filled between the main board (1) and the fin plate (5), a circulation cavity plate (6) filled with a phase change medium is annularly wrapped on the main board (1), a gap is formed between the circulation cavity plate (6) and two sides of the main board (1), and the bottom of the circulation cavity plate (6) is bonded with the lower surface of the chip (2);

the connecting structure (4) further comprises long supporting legs (41) and short supporting legs (42), the two ends of one side of the main board (1) are respectively provided with the long supporting legs (41), and the other side of the main board is provided with the two short supporting legs (42), so that the circulation cavity plate (6) is inclined.

2. The heat dissipating circuit board of claim 1, wherein: the chip (2) is positioned in the center of the lower surface of the main board (1).

3. The heat dissipating circuit board of claim 1, wherein: the heat-conducting grease (10) is heat-conducting silicone grease or heat-conducting gel.

4. The heat dissipating circuit board of claim 1, wherein: an opening (7) is formed in the middle of the fin plate (5), and a plurality of mounting columns (8) are arranged in the opening (7) and between the circulation cavity plate (6) and the main plate (1).

5. The heat dissipating circuit board of claim 1, wherein: and a positioning block (9) is arranged between the two sides of the main plate (1) and the circulating cavity plate (6).